TWI351439B - - Google Patents

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TWI351439B
TWI351439B TW096108678A TW96108678A TWI351439B TW I351439 B TWI351439 B TW I351439B TW 096108678 A TW096108678 A TW 096108678A TW 96108678 A TW96108678 A TW 96108678A TW I351439 B TWI351439 B TW I351439B
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TW
Taiwan
Prior art keywords
copper alloy
alloy
hot workability
ratio
precipitate
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TW096108678A
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Chinese (zh)
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TW200741019A (en
Inventor
Masatoshi Eto
Satoru Endou
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Jx Nippon Mining & Metals Corp
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Priority claimed from JP2006100338A external-priority patent/JP4937628B2/en
Priority claimed from JP2006233750A external-priority patent/JP2008056974A/en
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW200741019A publication Critical patent/TW200741019A/en
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Publication of TWI351439B publication Critical patent/TWI351439B/zh

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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/06Alloys based on copper with nickel or cobalt as the next major constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/40Electric properties
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C2202/00Physical properties

Description

1351439 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種高強度、高導電 电卞機态零件用 具優異熱加工性之銅合金;尤其是關於—種小型、古 化半導體機器引線用及端子連接器用銅合 门集積 曲加工性之前提下特別具優異強 了於無知彎 加工性。 m生,且具優異熱 【先前技術】 銅及銅合金為廣泛地利用於連接器、引線 零件及可撓性線路基板諸用途之材料,為因應急速進展之 貝則支術化所須之資訊機器的高性能化及小型&、薄化之 需求’須更加提升其特性(強度、·f曲加卫性、導電性卜 又’隨著ic之高集積化,消耗電力高的半導體元件使 =日益增多’半導體機器之引線框材料多使用散熱性(導電 性 Η圭之 Cu_Ni_Si 系、、Cu_Fe_p、Cu_Cr_Sn、Cu-Ni p 等之 析出型合金。上述Cu_Ni_P系合金係藉由Ν“ρ系化合物之 微細析出而強化,於專利文獻1中曾提出調整合金中之Ni、1351439 IX. Description of the invention: [Technical field of the invention] The present invention relates to a copper alloy excellent in hot workability of a high-strength, high-conductivity electro-mechanical part tool; in particular, for a small-sized, ancient semiconductor machine lead And the copper fittings for the terminal connectors are excellent in strength and ignorant bending workability before being machined. m raw, and has excellent heat [Prior Art] Copper and copper alloys are widely used in connectors, lead parts and flexible circuit boards, and are required for the progress of the emergency. The high performance of the machine and the need for small size and thinning have to be improved. (Strength, · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · = Increasingly, the lead frame materials for semiconductor devices are often made of heat-dissipating (precipitating alloys such as Cu_Ni_Si, Cu_Fe_p, Cu_Cr_Sn, Cu-Ni p, etc.). The Cu_Ni_P alloy is made of ρ" Finely precipitated and strengthened, and in Patent Document 1, it has been proposed to adjust Ni in the alloy,

Mg成分里以製得兼具強度、導電性及对應力緩和性的 合金之報告。 [專利文獻1]曰本專利特開2000-273562號公報 【發明内容】 L吊,於銅口金之鑄造(例如,於連續或半連續鑄造) 1351439The Mg component is reported to have an alloy that combines strength, electrical conductivity, and stress relaxation. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2000-273562. SUMMARY OF THE INVENTION L-hanging, casting in copper mouth gold (for example, in continuous or semi-continuous casting) 1351439

中’鑄錠係藉由鑄模而散熱,除了鱗錠表層數難以外, 内部會需要若干時間凝固。此時,於凝固時或凝固後之冷 ::私中,含有量超過界限之合金元素會晶析或析出於晶 或結晶粒内。含有1爲以上的Ni及〇.2%以上的p 之銅合金,具有高強度與高導電性之優點,然而,於室溫 下,由於在母相CU中含有大量之固熔限度以上之Ni-P成 故於製造鑄錠時’通常Ni_p系化合物會析出或晶析於 曰曰粒界面。因纟Cu_Ni_p系合金所析出或晶析之㈣系化 合物之炫點較母相Cu之㈣低,故此等銅合金之凝固會 不均-,致發生内部變形,因其應力或外力會使射系化 合物的部分受到破壞,而於鑄造、冷卻階段發生破裂。又, 於熱乳之加熱時’由於财系化合物會較母相先軟化或液 化而同樣地會發生破裂。 然而,專利文獻1中之Cu_Ni_P系合金的組成中,Ni 為0.01〜1·0%、Ρ為0·01〜〇.2%,故未特別意識到上述問題。 本發明之目的,在於提供一種可防止於鑄造、冷卻、 熱加工中所發生之破裂,高溫延性優異、且熱加工性良好 之Cu-Ni-P系合金。 本發明者·#,為達成上述目的而深入研究之結果,發 現藉由特定於下述構成,可得到熱加工性優異且強度、導 電性亦優異之Cu-Ni-P-Mg系合金。 本發明係關於一種具優異熱加工性之銅合金,其特徵 在於,由含有Ni·· 1.00%〜2.〇〇%(本說明書中表示成分比例 之〇/。為質量%)、?:0.10%〜0.50。/〇、^^:0.01〇/〇〜0 20%,出 1351439 與p之含有量比例Ni/P為4.0〜6 s 。人一 且含有 Cr:〇 〇3% 〜0.45〇/〇 或B : 0.005〜0.070%,其餘為Γ ....... U及不可避免之雜質所構 成。上述銅合金,有關最終冷軋 乳則之Nl-p-Mg系析出物之 大小與形狀,於以a為長徑、以u ^ 以短徑時,有長寬比a/b 為2〜50且短徑b為10〜25nm之批φ ^ E ^ 析出物(A),上述析出物(A) 與長九比a/b未滿2且長徑a為 达认此 20〜50nm之析出物(B)之面 積的總和’佔銅合金中之全部析 7出物之面積的總和之80% 以上。本發明較佳者為,具有把 八负孜伸強度為700MPa以上, 且導電率為40%IACS以上之牿„丄 一 .生值的具有優異熱加工性、 尚強度高導電電子機器用之銅合 』口兔。更佳者為,於上述 为組成中並含有Sn及In中之 v 1種其合計為〇 〇1〇/〇以 上、U0。/。以T,則可顯示拉伸強度為75〇Mpa以上,且導 電率為40%IACS以上之特性值。 本發明’藉由於Cu-Ni-P-Me条入a * r Mg糸合金中添加特定量之 或B,可抑制Ni_P_Mg系化合物析出或晶析於晶粒界面, 更佳者為藉由控制冷卻速度以抑制生成粗大的Ni_p_Mg-B 系及Ρ-β系化合物。藉由接用 _ 稽田抹用上述構成,可期改善粒界之 高溫脆性並提高熱加工性。 本發明之具優異熱加工性之銅合金,作為高強度高導 電電子機器可發揮優異的效果。 【實施方式】 接著’就本發明中界定銅合金成分組成之數值範圍的 理由與其作用一併作說明。 UM439 [Ni 量] 川有確保合金強度及耐熱性之作用,並有助於後述之 與P所开:成之Ν“Ρ系化合物的析出與提高合金強度。然而, 其含有量若未滿1 ·〇〇%則蛊法值 只J .“、沄侍到所要之強度,另一方面, 若含有Ni超過2 00%,目|丨, 2 ·。0 /。貞!熱加1性會降低且製品之脊曲加 工性及導電率會明顯地降低。 - 而且’會使得長徑大的Ni- P-Mg系析出物之面葙率掷士 囟積羊增加,故非良好。Ni及P之含有 量合計(Νι + Ρ)若超過2 5〇% J粗大粒子之晶析量會增加, 且於時效處理之析出會較g , . 較”"員者’致難以控制50nm以下之 微細Ni-P-Mg的析出。田品丄 而本發明之合金之Ni含有量定 為1.00〜2.00%,並以】1Λ 淡以1.10〜1.80%為佳。 [ρ量] Ρ ’係與Ni以化合物 w p ^ ^ Gσ物形式析出而可提高合金之強度及 耐熱性。Ρ之含有量若夫 / 0·10%,化合物之析出會不足, 致使無法得到所要之%存 戈疋強度。另一方面,ρ含有 過 0.50。/。,貝ij熱加工性备 ^ ^ ^ ^ H ^ B 他’且導電率也會顯著地降低。 而且,長役大的Ni-p系批山 因而本發明之合金之、p出物之面積率增加,故非良好。 0.20〜0.40%為佳。 纟有量定為G.H)〜0.50%’並以 [Mg 量]In the middle of the ingot, the heat is dissipated by the mold. In addition to the difficulty in the number of scales, the interior will take some time to solidify. At this time, in the cold at the time of solidification or after solidification, the alloying elements having a content exceeding the limit may be crystallized or precipitated in the crystal or crystal grains. A copper alloy containing 1 or more of Ni and more than 2% of p has advantages of high strength and high electrical conductivity. However, at room temperature, it contains a large amount of Ni in the mother phase CU. -P is the reason why the Ni_p-based compound is precipitated or crystallized at the interface of the granules when the ingot is produced. Since the bright point of the (4)-based compound precipitated or crystallized by the Cu_Ni_p-based alloy is lower than that of the parent phase Cu (four), the solidification of the copper alloy may be uneven, causing internal deformation, and the stress or external force may cause the radiation system. Part of the compound is destroyed and cracks occur during the casting and cooling stages. Further, when the hot milk is heated, the cracking occurs similarly because the chemical compound softens or liquefies earlier than the parent phase. However, in the composition of the Cu_Ni_P-based alloy in Patent Document 1, Ni is 0.01 to 1.0%, and Ρ is 0·01 to 〇2%. Therefore, the above problem is not particularly recognized. An object of the present invention is to provide a Cu-Ni-P-based alloy which is capable of preventing cracking occurring during casting, cooling, and hot working, is excellent in high-temperature ductility, and is excellent in hot workability. In the inventors of the present invention, in order to achieve the above object, it has been found that a Cu-Ni-P-Mg-based alloy which is excellent in hot workability and excellent in strength and electrical conductivity can be obtained by the following configuration. The present invention relates to a copper alloy having excellent hot workability, which is characterized in that it contains Ni·· 1.00% to 2.% by weight (% of the component ratio in the present specification is % by mass). : 0.10%~0.50. /〇, ^^: 0.01〇/〇~0 20%, the ratio of the content of 1351439 to p Ni/P is 4.0~6 s. Humans contain Cr: 〇 〇 3% ~ 0.45 〇 / 〇 or B: 0.005 ~ 0.070%, and the rest are Γ .... U and inevitable impurities. In the above copper alloy, the size and shape of the Nl-p-Mg precipitates in the final cold-rolled milk have an aspect ratio a/b of 2 to 50 when a is a long diameter and u ^ is a short diameter. And the short diameter b is a batch of φ ^ E ^ precipitates (A) of 10 to 25 nm, and the precipitates (A) and the long nine ratio a/b are less than 2 and the long diameter a is such that the precipitates of 20 to 50 nm are recognized. The sum of the areas of (B) accounts for 80% or more of the total area of all the 7 precipitates in the copper alloy. Preferably, the present invention has copper having excellent eight-negative tensile strength of 700 MPa or more and a conductivity of 40% IACS or more, which has excellent hot workability and high strength for conductive electronic equipment. In addition, in the above composition, the total of v1 species of Sn and In is 〇〇1〇/〇 or more, and U0./. With T, the tensile strength is 75 〇Mpa or more, and the conductivity is a characteristic value of 40% IACS or more. The present invention can suppress the Ni_P_Mg compound by adding a specific amount or B to the Cu*Ni-P-Me strip into the a*r Mg糸 alloy. Precipitating or crystallization at the grain boundary, and more preferably by controlling the cooling rate to suppress the formation of coarse Ni_p_Mg-B and Ρ-β compounds. By using _ The high-temperature brittleness of the boundary and the improvement of the hot workability. The copper alloy having excellent hot workability of the present invention exhibits an excellent effect as a high-strength and high-conductivity electronic device. [Embodiment] Next, the composition of the copper alloy is defined in the present invention. The reason for the numerical range is explained along with its effect. UM 439 [Ni amount] Chuan has the effect of ensuring the strength and heat resistance of the alloy, and contributes to the following. It is opened with P: "The precipitation of lanthanide compounds and the improvement of alloy strength." However, if the content is less than 1 · 〇〇 %, the 蛊 method is only J. ", 沄 到 to the desired strength, on the other hand, if Ni contains more than 200%, 目 | 丨, 2 · · 0 /贞!The addition of heat will reduce the product and the electrical conductivity of the product will be significantly reduced. - And 'will make the long-diameter Ni-P-Mg system precipitates the rate of throwing hoarding sheep Increased, it is not good. If the total content of Ni and P (Νι + Ρ) exceeds 2 5〇%, the amount of crystallization of coarse particles will increase, and the precipitation of aging treatment will be better than g, . It is difficult to control the precipitation of fine Ni-P-Mg of 50 nm or less. The amount of Ni contained in the alloy of the present invention is 1.00 to 2.00%, and preferably 1.10 to 1.80% by weight. The [ρ amount] Ρ ′ and Ni are precipitated as a compound w p ^ ^ Gσ to improve the strength and heat resistance of the alloy. If the content of strontium is 0 / 10%, the precipitation of the compound will be insufficient, resulting in the inability to obtain the desired %. On the other hand, ρ contains more than 0.50. /. , Beij heat processing is prepared ^ ^ ^ ^ H ^ B he' and the conductivity is also significantly reduced. Further, since the Ni-p type mountain of the long-term operation is large, the area ratio of the p-out product of the alloy of the present invention is increased, which is not good. 0.20 to 0.40% is preferred.纟The amount is set to G.H)~0.50%’ and in [Mg amount]

Mg ’係與Ni及p、 拽存75 βW W 4匕合物的形式析出而提高合金之 強度及耐熱性。又,若 維狀析出物’與未添加M 到更高之強度。再者, 缺你姑*铷,你1〜、加Mg,會生成Ni-P_Mg系之纖 g之Cu-Ni-P系合金相比,可得The Mg' is precipitated in the form of Ni and p, and the 7575βW W 4 chelate, thereby improving the strength and heat resistance of the alloy. Further, if the shaped precipitates are not added with M to a higher strength. Furthermore, if you lack 姑, you can add 1 to Mg, which will produce Ni-P_Mg-based fiber, which is comparable to Cu-Ni-P alloy.

Mg固熔於母相中所得之強度 1351439 it南有更大效果〇惟,人士曰ΑThe strength of Mg solid-melting in the mother phase 1351439 it has a greater effect in the south, people 曰Α

Mg 3有里右未滿〇·〇1%,則無法得 到所要之強度及耐鈦性。 & +旦# *''' 1 另一方面,Mg含有量若超過 0.20% ’則熱加工性合顯荽 s顯者地降低,且導電性也會顯著地 降低。而且會產峰細士 & &,,, 生祖大的析出物,並妨礙強度之提高。因 而本發明合金之Me冬古θ — * 8 s 有 ΐ 定為 〇.〇ι〇/0〜0.20%,以 0.02% 〜0·15°/。為佳。 [Ni/P 比]When Mg 3 is less than %·〇1%, the desired strength and titanium resistance cannot be obtained. & + 旦# *''' 1 On the other hand, if the Mg content exceeds 0.20%', the hot workability is significantly lowered, and the electrical conductivity is remarkably lowered. Moreover, it will produce peaks &&&,,, and the precipitation of the ancestors, and hinder the improvement of strength. Therefore, the alloy of the present invention has a temperature of θ.〇ι〇/0~0.20% to 0.02% 〜0·15°/. It is better. [Ni/P ratio]

即使Nl與P之含有量在上述範圍内,若Ni與P之含 有比例Ni/P偏離Ni_p系化合物之適當的化學計量組成比, 亦即,於未滿4.0的情況下p之固熔量會增大,超過㈠ 的情況下 非良好。因Even if the content of N1 and P is within the above range, if the Ni/P ratio of Ni to P deviates from the appropriate stoichiometric composition ratio of the Ni_p-based compound, that is, the solid-solution amount of p may be less than 4.0. Increase, not more than (a) is not good. because

Nl之固熔量會增大,致導電率顯著地降低,故 而本發明之合金之Ni/P比為4.0〜6.5,以4.5〜6 〇 為佳。 [Ni-P-Mg系析出物之大小與面積率] 若以Ni-P-Mg系析出物之長徑為a—、以短徑為 b(nm),藉由長寬比a/b來分類,於該合金中可生成a/b=2〇〜 的程度之長寬比大的針狀及纖維狀之析出物(A)、與未 滿2之粒狀析出物(B)兩種。藉由使時效加工處理前之加工 變形“乍成為未滿0.4(以未滿〇」為佳),會生成針狀及纖 維狀析出物;藉由使時效加工處理前之加工變形^作成為 0 · 4以上,會生成粒狀析出物。 對析出物之大小加以規定之理由如下: 最終冷軋前之短徑b為未滿10nm之析出物,若進行 加工變形"以上之乳製加工,析出物會破壞、分解而再 1351439 固熔於銅中,致導電率降低 、人*丨儿 R对另—方面,最終 冷軋則之短徑為1 0nm以上 、 丄々析出物,即使於加工變 之軋製加工申亦難以再固 物之π吁十士 而u 10nm以上的析出 物之开> 態存在。尤其短徑b為? n 為20nm以上之析出物於軋製 别後之大小變化小,經由A^ ^ ^ 熔。再4去w 7車析出物亦難以被破壞、固 之析出你m制 超過5〇nm,且短徑超過25nm (析出物’於軋製後雖可伴梏 體積大保持其大小’惟,個別析出物之 >大’故鋼合金t之析出物之分散間隔會 热法得到析出強化及加工強化之效果。 又,長徑a及短徑b,為將最終冷軋前 行於乾製方向方向以直角裁切厚度方 二:以平 像解析裝置對所有的長徑…nm以=:像以影 定,分別得到全部析出物之長徑及短徑行測 以乾製前之板厚為t〇、喝後之板厚二值;又,於 m „ .,. ~ L < if 況,加工 戈形β係以e=ln(tO/t)表示。 析出述,本發明之合金之最終冷乾前的N“P-Mg系 析出Ια寬比Μ為2〜5°且短徑 與長寬比a/b未滿2且長徑a為2() 出物(B)。 仗仏a為2〇〜5〇nm之析 欲使本發明銅合金之最終冷軋前之Ni_p_ 作成為异宮a & g系析出物 …、長寬比a/b為2〜50且短徑b為1〇〜2 理前夕λ τ μ 5nm,於時效處 力口工良形π為未滿〇.4(以未滿〇」為 適當妯哺致n± ,石 7丨王X It况,須 凋整時效處理時之溫度及時間等。又, 寬比a/b Λ夫翥?曰且欲作成為長 為未滿2且長…20〜50nm,於時效處理前之 1351439 加工變形77為ο.4以上(以Μ之程度為佳)之情況,須適當 地調整時效處理時之溫度及時間等。 然而,由於欲使全部的析出物在上述a及a/b之較佳 範圍内會有困難,故在上述^a/b的範㈧The amount of solid solution of Nl is increased, and the electrical conductivity is remarkably lowered. Therefore, the alloy of the present invention has a Ni/P ratio of 4.0 to 6.5, preferably 4.5 to 6 Torr. [Size and Area Ratio of Ni-P-Mg-Based Precipitates] When the long diameter of the Ni-P-Mg-based precipitate is a-, and the short diameter is b (nm), the aspect ratio a/b is used. In the alloy, there are two kinds of needle-like and fibrous precipitates (A) having a large aspect ratio and a granular precipitate (B) having a degree of a/b=2〇~. By causing the processing deformation before the aging processing to "become less than 0.4 (to be less than full)", needle-like and fibrous precipitates are formed; by processing deformation before the aging processing becomes 0 · 4 or more, granular precipitates are formed. The reason for specifying the size of the precipitate is as follows: The short diameter b before the final cold rolling is a precipitate of less than 10 nm, and if the processing is performed, the precipitate is destroyed and decomposed and then solidified by 1351439. In copper, the conductivity is lowered, and the R is the other side. In the final cold rolling, the short diameter is more than 10 nm, and the precipitates are decomposed. Even if the processing is changed, the rolling process is difficult to rebuild. The π 十 士 士 and u 10 nm or more of the precipitates open > Especially the short diameter b is? The precipitate having n of 20 nm or more has a small change in size after rolling, and is melted by A^^. It is difficult to be destroyed in the 4th car, and the solid solution is more than 5〇nm, and the short diameter exceeds 25nm. (The precipitate 'can be kept in size after rolling, although it is large enough to maintain its size.' The dispersion interval of the precipitates of the precipitates of the large steel alloy t is thermally enhanced by precipitation strengthening and processing strengthening. Further, the long diameter a and the short diameter b are in the dry direction before final cold rolling. The direction is cut at a right angle. The square of the thickness is determined by the flat image analysis device. For all the long diameters...nm, the image is determined by the shadow and the length and the short diameter of all the precipitates are measured. 〇, the plate thickness after drinking is double; in addition, in the case of m „ .,. ~ L < if, the processing of the Go-shaped β system is represented by e = ln(tO / t). The final description of the alloy of the present invention The N "P-Mg system precipitated Ια width ratio 前 before cold-drying is 2 to 5° and the short-diameter and aspect ratio a/b is less than 2 and the long-path a is 2 () (B). The decomposition of 2〇~5〇nm is such that the Ni_p_ before the final cold rolling of the copper alloy of the present invention becomes a heterologous a & g system precipitate..., the aspect ratio a/b is 2 to 50 and the short diameter b is 1〇~2 eve λ τ μ 5nm, at the time The effect is that the good shape π is not full 〇.4 (to the full 〇 为 为 为 妯 n n n n n n n n n n ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± Width ratio a/b Λ 翥 曰 欲 欲 欲 欲 欲 长 长 长 长 长 长 长 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 135 The temperature and time during the aging treatment should be appropriately adjusted. However, since it is difficult to make all the precipitates in the preferred range of a and a/b, the above-mentioned ^a/b (8)

以及(B)佔全部析出物中之比例是重要的。因此,於以在上 述…/b的較佳範圍之析出物㈧及(B)的面積總和,對 合金中之全部析出物的面積總和之比例作為面積率C時, 本發明之面積率…〇%以上…「全部析出物」抑 長徑3為5請以上之Ni-P-Mg系析出物。 曰 於面積率c未滿80%之情況,為a超過5〇請且師 b超過25nm之析出物或長徑a未滿—、或短 1 Onm之析出物多夕棒 ^ 物夕之清況。例如,於a超過5〇nm且短徑b °、ηΠ1的析出物與料鑄造時所產生之晶析物、或 於:Γ造時所產生之晶析物於熱札或溶體化處理未固; 而殘存的l〇〇〇nm以μ夕Μ. η Λ u ^ 丸^ 以上之Ν1·ρ·Μβ粒子(晶析物)大量存在 時,由於對提高強度有助益之本發 在 物的個數少,且析…Ά 月規疋範圍之微細析出 乳製加工之力散間隔變得較大,故無法藉由 = 化來得到所要之強度。另-方面,長徑 a未滿20nm或短徑b去雀1 η ^ 工而合再固垃 之析出物,由於因軋製加 曰再固熔,故無法得到所要的導電率。 為::發明銅合金於最終冷乾前,長寬比And (B) is important in the proportion of all precipitates. Therefore, when the ratio of the total area of the precipitates (8) and (B) in the preferred range of the above-mentioned //b is the ratio of the total area of all the precipitates in the alloy as the area ratio C, the area ratio of the present invention...〇 % or more... "All precipitates" Ni-P-Mg-based precipitates having a long diameter of 3 or more. In the case where the area ratio c is less than 80%, the precipitation of a exceeds 5 〇 and the division b exceeds 25 nm or the long diameter a is not full — or the precipitate of 1 Onm is short. . For example, a precipitate having a diameter of more than 5 〇 nm and a short diameter b °, η Π 1 and a crystallization product generated during casting, or a crystallization product generated during the casting is not subjected to heat treatment or solution treatment. The remaining l〇〇〇nm is in the presence of a large amount of Ν · ^ u ^ 丸 ^ The number of the particles is small, and the analysis of the range of the fine gauge of the milky process has become large, so the desired strength cannot be obtained by =. On the other hand, the long diameter a is less than 20 nm or the short diameter b is the same as that of the precipitated material. Since the precipitate is re-solidified by rolling, the desired conductivity cannot be obtained. For:: Invention of copper alloy before final chilling, aspect ratio

Ni-P,系析出物⑷、及長寬" A金…析:a為20〜5〇nm之析出物⑻的總和,對銅 錢出物面積之總和,# _以上,於時效處理 1351439 前之加工變形77為0〜1.5的程度之情況,須適當地調整時 效處理時之溫度及時間。 [Cr 量] 通常’於Cu-Ni-p_Mg系合金之凝固時的冷卻速度慢 日寸,例如,自1100C至95〇t之冷卻速度未滿30。(:/分鐘 時,Ni-P-Mg系化合物於晶粒界面會集中化、粗大化,並 晶析,故非良好。Ni-P, is the precipitate (4), and the length and width of the "A gold...": a is the sum of the precipitates (8) of 20~5〇nm, the sum of the areas of the copper coins, #__, before the aging treatment 1351439 In the case where the processing deformation 77 is 0 to 1.5, the temperature and time during the aging treatment must be appropriately adjusted. [Cr amount] Normally, the cooling rate at the time of solidification of the Cu-Ni-p_Mg-based alloy is slow, for example, the cooling rate from 1100C to 95〇t is less than 30. At (:/min), the Ni-P-Mg-based compound is concentrated, coarsened, and crystallized at the grain boundary, which is not good.

Cr,可抑制於Cu-Ni-P-Mg系合金凝固時與凝固後之 冷卻過程及熱加工之加熱時之Ni_p_Mg系化合物往晶粒界 面晶析或析出,可提高合金之熱加工性。然而,其含有量 若未滿0·03 /〇’並無法得到熱加工性之改善效果;另一方 面若3有Cr超過0·45%,於熔解中或凝固中會產生州 P Mg-Cr、Cr-P等之化合物,或產生&之晶析物。此等含 有Cr之化合物及晶析物於熔體化處理中不會固熔於母 相中,因此於時效處理時析出之Ni_p_Mg系化合物會減少, 2致合金強度降低。再者,Ni_p_Mg_Cr、Cr_p等之化合物, 玲乂長“ 5 y m以上之晶析物或析出物的形式殘存於製品 中,成為製品之表面缺陷、彎曲加工時之破裂的起點,或 鍍敷處理時之缺陷的起點,故非良好。因而本發明之合金 之。含有量定為0.03%〜〇.45%以下,以〇 〇5%〜〇鄕為佳。 [B量] B可抑制於Cu-Ni-P-Mg系合金凝固時與凝固後之冷卻 =及熱加工之加熱時4 Ni_p_Mg系化合物往晶粒界面晶 ’析出’故可提高合金之熱加工性。然而,其含有量若 12 1351439 未滿0.005 /〇’並無法得到熱加工性之改善效果;另一方面, 右含有B超過0.070%,則Ni_p_Mg_B、B-P等化合物會以 失雜物的形式於炫解中或凝固中產生。此等含有B之化合 物’通$於晶粒界面會集中化、粗大化而晶析或析出,於 溶體化處理中不會固熔於Cu母相中’故於時效處理時析 出之Ni P-Mg系化合物會減少導致合金強度降低。再者,Cr can suppress the crystallization or precipitation of the Ni_p_Mg-based compound to the grain boundary during solidification and solidification of the Cu-Ni-P-Mg-based alloy during solidification, thereby improving the hot workability of the alloy. However, if the content is less than 0·03 /〇', the hot workability improvement effect cannot be obtained. On the other hand, if 3 has Cr more than 0.45%, state P Mg-Cr is generated during melting or solidification. a compound such as Cr-P or a crystallization of & Since these Cr-containing compounds and crystallizations are not solid-melted in the mother phase during the melt treatment, the Ni_p_Mg-based compound precipitated during the aging treatment is reduced, and the alloy strength is lowered. Further, a compound such as Ni_p_Mg_Cr or Cr_p, which is in the form of a crystallization or a precipitate of 5 μm or more, remains in the product, and becomes a surface defect of the product, a starting point of cracking during bending processing, or a plating treatment. The starting point of the defect is not good. Therefore, the alloy of the present invention has a content of 0.03% to 45.45% or less, preferably 〇〇5% to 〇鄕. [B amount] B can be suppressed in Cu- When the Ni-P-Mg-based alloy is solidified and cooled after solidification = and during the heating of the hot metal, 4 Ni_p_Mg-based compound precipitates toward the grain boundary crystal, so that the hot workability of the alloy can be improved. However, if the content is 12 1351439 If the content of B is more than 0.070%, the compound containing Ni_p_Mg_B or BP will be produced in the form of decontamination or solidification in the form of less than 0.005 / 〇 '. The compound containing B will be concentrated and coarsened at the grain boundary to crystallize or precipitate, and will not solidify in the Cu matrix during the solution treatment. Therefore, Ni P- precipitated during aging treatment. The reduction of the Mg-based compound leads to a decrease in the strength of the alloy.

Ni P-Mg-B、Β·ρ等之化合物會以長徑5从爪以上之失雜 物形式殘存於製品中,成為製品之表面缺陷、蠻曲加工時 之破裂的起點,或鍍敷處理時之缺陷的起點,故非良好。 因而本發明之合金之B含有量定為0.005%〜0.070%以下, 以 0.007%〜〇_〇6〇%為佳。 [夾雜物] 曰,本發明之「失雜物」係指於Cu-Ni-P-M“合金中之 晶粒界面及/或結晶粒内所晶析或析出之主成分為犯七Compounds such as Ni P-Mg-B, Β·ρ, etc. will remain in the product in the form of long-diameter 5 from the excess of the claws, which may become the starting point of the product, the starting point of cracking during the bending process, or the plating treatment. The starting point of the defect is not good. Therefore, the B content of the alloy of the present invention is set to be 0.005% to 0.070% or less, preferably 0.007% to 〇_〇6〇%. [Inclusions] 曰, the "miscellaneous matter" of the present invention means that the principal component of the crystal grain interface and/or crystallization or precipitation in the Cu-Ni-P-M "alloy" is a crime.

Mg-B化合物、B_p化合物等之晶析物不含於結 晶析或析出之微細Ni_P_M $ 、 曰, 於乾…… Mg系化合物。夾雜物之長徑係指 於軋…截面大小為5 —上之夹雜物的平均長徑。 若有長徑超過50 之a躲榀产—a a* . , ^ 夾雜物存在,會成為彎曲加工 1=破裂之起點’致製品弯曲加工性劣化。因而本發明 之鋼合金中長徑超過50 月 A “的夾雜物之個數,須為每lmm2 為0個。X,若存在有長徑5 ^ 中含有^ ^ m的失雜物,則失雜物 h有之Β ϊ會增加,致無法得到抑制往 的晶:界面之晶析之效果’亦即無法達到添加二物 因而本發明之銅合金以長徑 的目的。 之夾雜物個數每by 1351439 為100個以下為佳,以50個以下為更佳。 [Sn、In 量]The crystallization of the Mg-B compound, the B_p compound or the like is not contained in the fine Ni_P_M$, 曰, Zn, etc. which are crystallized or precipitated. The long diameter of the inclusions refers to the average long diameter of the inclusions having a cross-sectional size of 5 mm. If there is a long diameter of more than 50, the abundance of a a*. , ^ inclusions will become a bending process 1 = the starting point of cracking, causing deterioration of the bending workability of the product. Therefore, in the steel alloy of the present invention, the number of inclusions having a long diameter exceeding 50 A" shall be 0 per lmm2. X, if there is a missing matter having a long diameter of 5 ^ containing ^ ^ m, then If there is any impurity h, the enthalpy will increase, so that the crystal which is suppressed can not be obtained: the effect of crystallization at the interface, that is, the addition of two materials cannot be achieved, so that the copper alloy of the present invention has a long diameter. By 1351439 is preferably 100 or less, and more preferably 50 or less. [Sn, In amount]

要 少 藉 過 低To borrow less

Sn及In量,具有於不會降低合金導電性的前提下主 藉由固熔強化以提高強度之作用。因而可視需要添加至 1種此等金屬,其含有量總量若未滿〇 〇丨%,無法得到 由固溶強化提高強度之效果’另一方面’若添加總量超 1.0%以上,則合金之導電率及f曲加工性會顯著地降 。因此單獨添加或至少2種之複合添加之Sn及In量定 0.01%〜1.0% ,總量以0.05%〜0 8%為佳。又,此等元素, 於本發明中為刻意添加之元素,非不可避免之雜質[〇量]The amount of Sn and In has the effect of enhancing the strength by solid-solution strengthening without lowering the conductivity of the alloy. Therefore, if it is necessary to add to one of these metals, if the total amount of the metal is less than 〇〇丨%, the effect of improving the strength by solid solution strengthening cannot be obtained. On the other hand, if the total amount is more than 1.0%, the alloy is added. The electrical conductivity and f-mechanism are significantly reduced. Therefore, the amounts of Sn and In which are added alone or in combination of at least two kinds are 0.01% to 1.0%, and the total amount is preferably 0.05% to 8%. Moreover, these elements are deliberately added elements in the present invention, and are not inevitable impurities [quantity]

“ 〇於合金中易與Cr反應,0於合金中若以氧化物之狀 心存在則無法得到Cr添加之效果。又,p、b亦容易氧化, 尤其P若氧化,Ni-P系之析出物會減少,致強度降低。因 而本發明合金之〇含有量定為〇 〇〇5〇%以下以〇⑼儿% 以下為更佳。 [拉伸強度及導電率] 本發明之鋼合金有優異之熱加工性,並兼具優異之導 電性、拉伸強度、彎曲加工性。本發明之銅合金之拉伸強 度=70〇MPa以上為佳,以75〇斷以上為更佳其上限 通吊為950MPa之程度。又,導電率以4〇%IACS為佳以 45%IACS為更佳,其上限通常為65%IAcs之程度。 [凝固時之冷卻速度與夾雜物之大小] 滿足上述本發明之要件之Cu-Ni-P-Mg系合金,可採 14 1^^1439 用通吊此業界所採用的方法製造,其為:於錠塊鑄造、熱 I熔體化處理、中間冷軋、時效處理、最終冷軋、去應 =退火等中,選擇適當的加熱溫度、時間、冷卻速度、軋 製加工度等製造;而於添加B: 0.005%〜0.070%之Cu-Ni-P Mg-B系合金中’通常施行之連續或半連續鑄造中之凝固 速度會由於凝固階段所採用之装置、方式而異,且於非採 用均勻冷部機構之靜注式等之情況,鑄錠的外側與内側會 有差異例如’於鐵製之鑄模(φ7〇〇χ1ι 1500mm)中注入炫銅 使其凝固之靜注式之情況,自丨1〇〇(>c至95〇<>c之平均冷卻 速度為1°C/分鐘之程度。 本發明之銅合金鑄造時之凝固溫度範圍以丨1〇(rc至 950 C為佳’於此冷卻溫度範圍之冷卻速度若慢,Ni_p_Mg_ B系及/或Ρ·Β系化合物於凝固階段容易粗大生成,致有無 法得到添加B以提高延展性的效果之顧慮。 上述主成分為Ni-P-Mg-B系及/或P-B系化合物之夾雜 物個數與熱延展性有下述之相關性。使鑄造、凝固階段之 自ll〇〇°C至950〇c之冷卻速度為30〇c/分鐘未滿之铸鍵於 8 5 〇 C下加熱1小時後,進行水冷卻所得之試樣,測量其 夹雜物之結果,於長徑5〜5〇" m之夾雜物個數每為 1〇〇個以上,或長徑超過⑼口之失雜物個數每1〇^2為i 個以上之情況,即使為添加有既定量的B之合金,於 °C之熱軋也會產生破裂。因而鑄造、凝固階段自丨i〇〇(>c至 950°C之冷卻速度以3(rc/分鐘以上為佳。再者,為避免合 金之彎曲加工性劣化而抑制Ni_P_B系化合物、p_B系化合 15 1351439 物之粗大析出化’錄造、凝固階段自丨1〇〇。〇至95〇。〇之冷 卻速度以85°C/分鐘以上為佳。又,超過15〇〇ec/分鐘之冷 部速度,會使炫銅無法及時供給到凝固收縮部,氣孔所導 致之缺陷會增加,故非良好。 添加有Cr之本發明之銅合金,於鑄造時,凝固溫度範 圍為1100°C至950°C之範圍,在此冷卻速度範圍内之冷卻 速度右較慢,則Νι-Ρ系及/或Ni_p_Mg系化合物於凝固階 段容易粗大生成,致有無法得到添加以提高熱延展性 的效果之顧慮。 [實施例]“It is easy to react with Cr in the alloy. If the alloy is in the shape of an oxide, the effect of Cr addition cannot be obtained. Moreover, p and b are also easily oxidized, especially if P is oxidized, and Ni-P is precipitated. The content of the alloy of the present invention is reduced to 〇〇〇5〇% or less, preferably 〇(9)% or less. [Tensile Strength and Electrical Conductivity] The steel alloy of the present invention is excellent. The hot workability is excellent in electrical conductivity, tensile strength, and bending workability. The tensile strength of the copper alloy of the present invention is preferably 70 〇 MPa or more, and more preferably 75 〇 or more. The degree of conductivity is 950 MPa. Further, the conductivity is preferably 4% IACS, and 45% IACS is more preferable, and the upper limit is usually 65% IAcs. [Cooling speed at the time of solidification and the size of inclusions] satisfying the above invention The Cu-Ni-P-Mg alloy of the requirements can be manufactured by the method used in the industry by the method of ingot casting, hot I melt treatment, intermediate cold rolling, In the aging treatment, final cold rolling, de- ing = annealing, etc., select the appropriate heating temperature, time, cooling Degree, rolling degree, etc.; and in the addition of B: 0.005% to 0.070% of the Cu-Ni-P Mg-B alloy, the solidification speed in the continuous or semi-continuous casting which is usually performed will be adopted due to the solidification stage. The device and the method are different, and in the case of a static injection type or the like which does not use a uniform cold portion mechanism, there is a difference between the outer side and the inner side of the ingot, for example, injecting bright copper into a mold made of iron (φ7〇〇χ1ι 1500 mm). In the case of the static injection type in which it is solidified, the average cooling rate from 丨1〇〇(>c to 95〇<>c is 1 °C/min. The solidification temperature of the copper alloy of the present invention during casting The range is 丨1〇 (rc to 950 C is preferable) If the cooling rate in this cooling temperature range is slow, the Ni_p_Mg_B system and/or the lanthanum-based compound are easily coarsened during the solidification stage, so that the addition of B cannot be obtained. The effect of the ductility is as follows: The number of inclusions in which the main component is a Ni-P-Mg-B system and/or a PB compound has the following correlation with the hot ductility. The cooling rate of 〇°C to 950〇c is 30〇c/min. The casting key is less than 8 5 〇C. After the time, the sample obtained by water cooling is measured, and the result of the inclusion is measured. The number of inclusions in the long diameter of 5 to 5 〇" m is more than one, or the length exceeds (9) When the number of the impurities is one or more per 〇^2, even if it is an alloy to which a certain amount of B is added, the hot rolling at °C may cause cracking. Therefore, the casting and solidification stages are 丨i〇〇(&gt The cooling rate of c to 950 ° C is preferably 3 (rc/min or more. Further, in order to avoid deterioration of the bending workability of the alloy, it is possible to suppress the coarse precipitation of the Ni_P_B-based compound and the p_B-based compound 15 1351439. The solidification stage is self-contained. 〇 to 95〇. The coldness of the crucible is preferably 85 ° C / min or more. Further, if the cold portion speed exceeds 15 〇〇 ec/min, the bright copper cannot be supplied to the solidification shrinkage portion in time, and the defects caused by the pores increase, which is not good. The copper alloy of the present invention to which Cr is added, the solidification temperature ranges from 1100 ° C to 950 ° C during casting, and the cooling rate in the cooling rate range is slower right, then Νι-Ρ and/or Ni_p_Mg The compound is likely to be coarsely formed during the solidification stage, and there is a concern that the effect of addition to improve the hot ductility cannot be obtained. [Examples]

Cu-Ni-P-Mg-Cr 系合金(奉 1) 試樣之製造: 以電解銅或無氧銅為主原料,以鎳(Ni)、I5%p-Cu母 合金(P)、1〇%Mg-Cu 母合金(Mg)、1〇%CrCu 母合金(cr)、 锡㈣、銦⑽為副原料,以高頻溶解爐於真空中或氬環境 氣氛中熔解’使用鑄鐵製之鑄模鑄造45x45x9〇mm之鑄錠。 進行鑄鍵之熱軋試驗,於熱軋下未發生裂痕之鑄鍵’在 850〜90(TC下加熱〇.5〜12小時,於使鱗造時產生之心系、 Wg彡晶析物固熔後進行熱乾。於熱軋終了時益法得 到材料溫度7〇0〜85〇°C以上之材料溫度之情況,再度於 加熱0·5小時以上後,進行水冷卻,充分進行炫 體化。錢’依序施行時效處理、中間冷軋、時效處理、 最終冷軋、去應力退火’製作成厚度〇1一平 得到之各種板材採取試驗片進行試驗,進行「強度」及「導 1351439 電率」之評估。 鑄錠之熱加工性評估: ^ ^加"性」係、藉由熱軋進行評估。亦即,將铸錠裁 行t二Μ5·,於㈣下加熱1小時後,以3階段進 及= 至5_之熱軋試驗。對熱軋後之試樣表面 及逯緣以目視可辨認出裂痕者評估為「 η ιΑ ^ ’裂痕」’於表面 及邊緣無裂痕,為平滑者,評估為「無裂痕」。 試驗片之物性評估: 「強度」係依據JISZ 2241中規定之拉伸試驗,用Η 破B S式驗片進行,測定拉伸強度。 「導電率」係用4端子法測定試驗片之電阻,以%1奶 表示。 「彎曲加工性」係以90度w f曲試驗進行評估。 驗係依據CES-M0002-6,使用㈣lmm之爽具,以5〇咖 之負荷進行90度弯曲加工。彎曲部之評估,係以 微鏡觀察中央部隆起表面的狀況,發生破裂者作為「X , 發生級摺者竹兔「Λ ώ 4- tu it. r 有作為△」,良好者作為「〇」。彎曲軸 軋製方向為直角(Good way)。Cu-Ni-P-Mg-Cr alloy (1) Preparation of sample: Electrolytic copper or oxygen-free copper as main raw material, nickel (Ni), I5% p-Cu master alloy (P), 1〇 %Mg-Cu master alloy (Mg), 1〇% CrCu master alloy (cr), tin (tetra), indium (10) as auxiliary materials, melted in a high-frequency melting furnace in a vacuum or in an argon atmosphere. 45x45x9〇mm ingot. The hot rolling test of the cast bond is carried out, and the cast bond which has not cracked under hot rolling is heated at 850 to 90 (heated for 5 to 12 hours under TC, and the core system, Wg crystallization, and solids produced when the scale is formed) After melting, heat-drying is carried out. At the end of hot rolling, the material temperature of the material temperature is 7〇0~85〇°C or more, and after heating for more than 0.5 hours, water cooling is performed to fully blizzle. The money 'sequential aging treatment, intermediate cold rolling, aging treatment, final cold rolling, stress relief annealing' was made into a thickness of 一1 flat. The various sheets were tested by test strips, and the "strength" and "1351439 electric conductivity" were carried out. Evaluation of the hot workability of the ingot: ^ ^ Plus "Sexity" is evaluated by hot rolling. That is, the ingot is cut to t2Μ5·, after heating under (4) for 1 hour, The hot rolling test of the 3rd stage = to 5_. The surface of the sample after hot rolling and the edge of the crucible are visually recognized as cracks. The evaluation is "η ιΑ ^ 'crack"' without cracks on the surface and edges. The evaluation was “no cracks.” Physical property evaluation of the test piece: “Strength” According to the tensile test specified in JIS Z 2241, the tensile strength was measured by breaking the BS test piece. The "electrical conductivity" was measured by the 4-terminal method and the resistance of the test piece was expressed by %1 milk. "Bending workability" It is evaluated by the 90 degree wf curve test. The system is based on CES-M0002-6, using (4) lmm of the coolness, and the 90 degree bending process is carried out with the load of 5 〇 coffee. The evaluation of the bending part is observed by the microscopic mirror. In the case of the surface, the person who has broken the rupture is "X, the bamboo stalker of the grade is "Λ ώ 4- tu it. r has △", and the good one is "〇". The bending direction of the bending axis is a right angle (Good way).

Ni-P-Mg系析出物之評估: 將最終冷軋前之合金條依平行於軋製方向將厚度直角 地切斷’使用掃描型電子顯微鏡及穿透型電子顯微鏡 截面之析出物作10視野觀察。於析出物之大小為5〜5〇⑽ 之凊况,以50萬倍〜70萬倍的視野(約1.4 χ ι〇ι〇〜2()χ 1〇l〇nm2)進行攝影,於析出物之大小為100〜2000nm之情" 17 上439 況,以5萬倍〜ι〇萬倍的視野(約i 〇 χ ι〇13〜2 〇 χ ι〇ι;2) 進行攝影。攝影之照片影像,以影像解析裝置(尼列可(股) 製,商品名:盧杰克斯)對長徑a為5nm卩上之析出物全 #逐敎·^徑a、短徑b及面積。自此等析出物隨機選 取1〇〇個,以相對於以長徑a為5nm以上之全部析出物之 面積的總和,長寬比a/b為2〜5〇且短徑b為ι〇〜25⑽之 析出物⑷的面積與長寬比a/b為未滿2且長徑a為2〇〜5〇⑽ 之析出物(B)的面積之總和’佔其之比例作為面積率c(%)。 又,經確認得知:藉由最終冷軋(通常加工變形” 以上),冷軋前之析出物之短徑b較1〇nm小之Ni p_Mg系 析出物因固熔而未觀察到’而短徑b為i〇nm以上之析出 物,於最終冷軋後亦保持其長徑、短徑及長寬比。又,析 出物之面積率C亦同樣地於最終冷軋後幾乎未改變。 兹以表1所示之成分組成之銅合金,以本發明之熱加 工性優異之高強度高導電性銅合金之實施例,與比較例相 較作說明。 又,於實施例1 & 2中,係以時效處理前之加工變形 ”為〇,對時效處理時之溫度及時間等適當地調整,得到 析出物之大部分為析出物(A)之合金(標準偏差i5〜25請)。 於實施例3〜5及比較例15'16及2〇中,以時效處理前之 加工變形”為1.4,對時效處理時之溫度及時間等適當地 調整,得到析出物之大部分為析出物(Β)之合金(標準偏差 3〜W)。另一方面,比較例17叫8及19,係分別以時效 處理前之加工變“為Μ肖Q,對時效處理時之溫度及 1351439 •時間等適當地調整,析出物之大部分為具有平均長徑、平 .均短徑以及平均長寬比之合金(標準偏差:比較例17為 8nm ’比較例18為2nm及比較例19為23nm) 〇 本發明之合金實施例卜5 ’於熱軋時不會發生裂痕, 具備優異之強度及導電率。另—方面,就比㈣6〜2Q之 結果作檢討,比較例6〜9’由於未添加。或未達規定量, 故於熱軋時發生裂痕。由於比較例1G中p之添加量超過 〇_50%’比較例11中以與In之添加量合計超過i 〇〇%, 比較例12中Sn之添加量超過i 〇〇%,比較例13中犯添 加量超過2_00%,比較例14中Mg添加量超過㈣故 分別於熱軋時發生裂痕。比較例15之Ni添加量、比較例 16之P添加量皆低於本發明所規^之範圍,故強度低。比 •較例16之Ni/P比則高於規定之範圍’故Ni之固熔量增大 致導電率降低。比較例17,由於析出物之平均長徑大,故 強度低。比較例18,由於析出物之平均長徑小,於冷軋時 • 析出物發生固熔,故導電率低且彎曲加工性亦不佳7比較 例1 9,雖生成纖維狀析出物(長寬比a/b為2〜,且短秤b 為10〜25nm之析出物(A)),但短徑較規定範圍大,故強度 低。比較例20,由於Cr添加量超過0.45〇/〇,因Ni_p_Cr、Evaluation of Ni-P-Mg-based precipitates: The alloy strips before the final cold-rolling were cut at right angles parallel to the rolling direction. Using a scanning electron microscope and a penetrating electron microscope cross-section precipitate for 10 fields of view. Observed. In the case where the size of the precipitate is 5 to 5 〇 (10), the image is taken at a magnification of 500,000 to 700,000 times (about 1.4 〇 ι〇ι〇~2() χ 1〇l〇nm2). The size is 100~2000nm. In the case of 439, the picture is taken at 50,000 times to 10,000 times (about i 〇χ ι〇13~2 〇χ ι〇ι; 2). Photograph of photography, using image analysis device (manufactured by Nileco Co., Ltd., trade name: Lujax), the long diameter a is 5 nm, and the precipitates are all #敎敎·^ diameter a, short diameter b and area . From the above, the precipitates are randomly selected from the total of the areas of all the precipitates having a long diameter a of 5 nm or more, and the aspect ratio a/b is 2 to 5 Å and the short diameter b is ι 〇 〜 The ratio of the area of the precipitate (4) of 25(10) to the aspect ratio a/b of less than 2 and the long diameter a of 2〇~5〇(10) is the sum of the areas of the precipitates (B) as the area ratio c (%) ). In addition, it was confirmed that the final cold-rolled (normally processed deformation) or higher, and the Ni p_Mg-based precipitate having a short diameter b of less than 1 〇 nm before the cold rolling was not observed by solid solution. The precipitate having a short diameter b of i〇nm or more retains its long diameter, short diameter, and aspect ratio after the final cold rolling. Further, the area ratio C of the precipitate is similarly unchanged after the final cold rolling. The copper alloy having the composition shown in Table 1 is compared with the comparative example by the embodiment of the high-strength high-conductivity copper alloy excellent in hot workability of the present invention. Further, in Example 1 & In the middle, the processing deformation before the aging treatment is 〇, and the temperature and time during the aging treatment are appropriately adjusted to obtain an alloy in which most of the precipitates are precipitates (A) (standard deviation i5 to 25). In Examples 3 to 5 and Comparative Examples 15'16 and 2, the processing deformation before the aging treatment was 1.4, and the temperature and time during the aging treatment were appropriately adjusted to obtain a large amount of precipitates as precipitates. (Β) alloy (standard deviation 3~W). On the other hand, Comparative Example 17 is called 8 and 19, and the processing changes before the aging treatment are respectively "for the QQ, the temperature for the aging treatment and the 1351439 • time When appropriately adjusted, most of the precipitates are alloys having an average major axis, a flat average short diameter, and an average aspect ratio (standard deviation: 8 nm for Comparative Example 17 and 2 nm for Comparative Example 18 and 23 nm for Comparative Example 19)实施In the alloy example of the present invention, 5' does not crack during hot rolling, and has excellent strength and electrical conductivity. On the other hand, it was reviewed based on the results of (4) 6 to 2Q, and Comparative Examples 6 to 9' were not added. Or the specified amount is not reached, so cracks occur during hot rolling. In the comparative example 1G, the amount of addition of p exceeded 〇_50%. In Comparative Example 11, the amount of addition of more than i 〇〇% in total of In, the amount of addition of Sn in Comparative Example 12 exceeded i 〇〇%, in Comparative Example 13 When the amount of addition was more than 2_00%, and the amount of Mg added in Comparative Example 14 exceeded (4), cracks occurred during hot rolling. The amount of addition of Ni in Comparative Example 15 and the amount of addition of P in Comparative Example 16 were all lower than the range of the present invention, so the strength was low. The ratio of Ni/P in Comparative Example 16 is higher than the specified range. Therefore, the amount of solid solution of Ni increases, resulting in a decrease in electrical conductivity. In Comparative Example 17, since the average long diameter of the precipitate was large, the strength was low. In Comparative Example 18, since the average long diameter of the precipitates was small, the precipitates were solid-melted during cold rolling, so that the electrical conductivity was low and the bending workability was also poor. 7 Comparative Example 1 9 produced fibrous precipitates (length and width) The ratio a/b is 2 to, and the short scale b is a precipitate (A) of 10 to 25 nm), but the short diameter is larger than the predetermined range, so the strength is low. In Comparative Example 20, since the amount of addition of Cr exceeds 0.45 Å/〇, Ni_p_Cr,

Cr_P等之化合物或Cr於凝固時會晶析或析出致析出物 及晶析物之平均長徑a偏離本發明之範圍,析出物之面積 率C低’故強度與導電率皆低,且彎曲加工性差。 19 1351439The compound such as Cr_P or Cr is crystallized or precipitated upon solidification, and the average long diameter a of the precipitate and the crystallization is deviated from the range of the present invention, and the area ratio C of the precipitate is low, so the strength and the electrical conductivity are both low and curved. Poor workability. 19 1351439

【1<〕 導觉率 1 %IACS 卜 卜· 5 »r> fS oj :45.0 I oo VO 〇\ 00 r*· <> *T) 寸 ri cs wS <〇 m m S. 套Σ 4 一 •Ο 0C Ό (Ν 00 s 00 o 卜 o V-i 00 % •o <N v〇 ο «η U-J 3 •o */> 卜 § v> § •n 彎曲 加工性 〇 〇 〇 〇 〇 ※ ※ 〇 〇 〇 < 〇 <1 Ni-P系析出物 面積率c (%) 5; 00 Os 〇\ OS 5; ※ ※ ※ 00 σ\ 〇 o o U-) 長寬比 a/b 〇 (N ν~) (Ν ΓΟ fS ※ ※ ※ <Ν 二 o 00 平均短徑 b(nm) 00 TJ- oo m 00 οο (N ΓΛ m σί o SO m |平均長徑 ! a(nm) 沄 τί* Ο ν〇 00 CN fO 卜 ro ※ ※ m iN CN fS o W-i \〇 熱礼 加工性 無裂痕 無裂痕 無裂痕 無裂痕 1無裂痕 I 有裂痕 有裂痕 1有裂痕 1 有裂痕 1有裂痕 I 有裂痕 有裂痕 有裂痕 有裂痕 無裂痕 無裂痕 無裂痕 無裂痕 無裂痕 無裂痕 化學組成(質量。/〇) Sn+ln 1 1 1 «〇 »r> o g d 1 1 1 (N 〇 1 <Ν m v-> «η 1 1 1 1 1 1 1 1 Ni/P 卜 00 <τΐ \〇 rt v-> 〇 (Ν Ό vS Ο vS (Ν wS 〇 »n v〇 23.6 CN vS ΓΟ <τΐ — oo — 5 1其餘1 I其餘I 1其餘1 1其餘I 1其餘| 1其餘1 1其餘I 1其餘I 1其餘I 1其餘I 1其餘1 1其餘1 1其餘I 1其餘I 1其餘1 1其餘ι 1其餘I 1其餘ι 1其餘I 1其餘I 1 I 1 1 〇\ ΓΟ o 1 1 1 〇\ 〇 1 fS VO o 1 1 1 1 I 1 I 1 1 1 ! 1 •n o m d 1 1 1 m Ο 1 o o *η 1 1 1 1 1 ι 1 1 u 00 (N Ο m s o 00 o ON <s o 1 1 〇 s ο is d 00 fS o w-> ο 00 rs 〇 (N <N 〇 00 ο in ο 〇\ CM 〇 O «η fs o P o s ο S Ο S o s o s o S 〇 〇 S 〇 ο 艺 d o S ο S 〇 ro Ο s ο g ο o s o g o | 0.09 1 CL (Ν (Ν Ο CN 〇 ΡΊ ίΝ 〇 习 o »〇 (N 〇 00 (N 〇 00 (N 〇 ο Ό ο fN o m m ο 卜 τΤ 〇 fN Ο <— g ο (N 〇 习 o o (N o o <Ν 00 ON Ό ΓΛ •η (Ν 00 <N Ό ν〇 !〇 CS νΊ ΓΟ W-) 〇 v-> VO <7n <N A ° ;〇 d — (N ΓΛ <n VO 卜 00 ΟΝ ο 一 ίΝ m v〇 卜 00 〇\ 本發 明例 比較 例 。举^<-^^咮鹖丧碟长嵴「※」:^^燃名痪<长<「丨」·-fr-啭 1351439[1<] Perception rate 1% IACS Bub·5 »r> fS oj : 45.0 I oo VO 〇\ 00 r*· <> *T) Inch ri cs wS <〇mm S. Packing 4一•Ο 0C Ό (Ν 00 s 00 o 卜o Vi 00 % •o <N v〇ο «η UJ 3 •o */> 卜 v> § •n Bending workability〇〇〇〇〇※ ※ 〇〇〇<〇<1 Ni-P type precipitate area ratio c (%) 5; 00 Os 〇\ OS 5; ※ ※ ※ 00 σ\ 〇oo U-) Aspect ratio a/b 〇 ( N ν~) (Ν ΓΟ fS ※ ※ ※ <Ν 2 o 00 Average short diameter b (nm) 00 TJ- oo m 00 οο (N ΓΛ m σί o SO m | average long diameter! a(nm) 沄τί * Ο ν〇00 CN fO 卜ro ※ ※ m iN CN fS o Wi \〇Hot work processing no cracks no cracks no cracks no cracks no cracks I cracks cracks 1 cracks 1 cracks 1 cracks I Cracks have cracks, cracks, cracks, cracks, no cracks, no cracks, no cracks, no cracks, no cracks, no cracks, chemical composition (mass. /〇) Sn+ln 1 1 1 «〇»r> ogd 1 1 1 (N 〇1 <Ν m V-> « η 1 1 1 1 1 1 1 1 Ni/P 00 <τΐ \〇rt v-> 〇(Ν Ό vS Ο vS (Ν wS 〇»nv〇23.6 CN vS ΓΟ <τΐ — oo — 5 1 The remaining 1 I remaining I 1 remaining 1 1 remaining I 1 remaining | 1 remaining 1 1 remaining I 1 remaining I 1 remaining I 1 remaining I 1 remaining 1 1 remaining 1 1 remaining I 1 remaining I 1 remaining 1 1 remaining ι 1 remaining I 1 rest ι 1 rest I 1 rest I 1 I 1 1 〇 \ ΓΟ o 1 1 1 〇 \ 〇 1 fS VO o 1 1 1 1 I 1 I 1 1 1 ! 1 • nomd 1 1 1 m Ο 1 oo * η 1 1 1 1 1 ι 1 1 u 00 (N Ο mso 00 o ON <so 1 1 〇s ο is d 00 fS o w-> ο 00 rs 〇(N <N 〇00 ο in ο 〇\ CM 〇O «η fs o P os ο S Ο S ososo S 〇〇S 〇ο 艺 do S ο S 〇ro Ο s ο g ο osogo | 0.09 1 CL (Ν (Ν Ο CN 〇ΡΊ Ν 〇 o » 〇(N 〇00(N 〇00 (N 〇ο Ό ο fN omm ο 卜τΤ 〇fN Ο <- g ο (N 〇 oo (N oo <Ν 00 ON Ό ΓΛ •η (Ν 00 < N Ό ν〇!〇CS νΊ ΓΟ W-) 〇v-> VO <7n <NA ° ;〇d — (N ΓΛ <n VO 卜 00 ΟΝ ο aίΝ mv〇卜00 〇\ This example compares the example. ^^^^^咮鹖咮鹖碟长嵴"※":^^燃名痪<长<"丨"·-fr-啭 1351439

Cu-Ni-P-Mg-B 系合舍 發明例1〜6及比較例7〜20(表2) 試樣之製造(a): 以電解銅或無氧銅為主原料,以鎳(Ni)、1 5%P-Cu母 合金(P)、10%Mg-Cu母合金(Mg)、2%B-Cu母合金(B)、錫Cu-Ni-P-Mg-B series Inventive Examples 1 to 6 and Comparative Examples 7 to 20 (Table 2) Production of Samples (a): Electrolytic copper or oxygen-free copper as a main raw material, nickel (Ni) ), 1 5% P-Cu master alloy (P), 10% Mg-Cu master alloy (Mg), 2% B-Cu master alloy (B), tin

(Sn)、銦(In)為副原料’用高頻熔解爐於真空或氬環境氣氛 中熔解,使用鑄鐵材質之鑄模鑄造45x45x9〇mm之鑄錠。 進行鑄錠之熱軋試驗,於熱軋下未發生裂痕之鑄錠,依序 施行熱軋、熔體化處理、時效處理、中間冷軋、時效處理、 最終冷軋、去應力退火,製作成厚度〇15mm之平板。對 得到之各種板材採取試驗片進行試驗’進行「強度」、「導 電率」及「彎曲加工性」之評估。 輪鍵之熱加工性評估(a): ,、,、加工性」耗由熱乾進行評估。料,將缚鍵: 切成45x45x25mm,於850°C下加埶!,此从 扞“ h L卜加熱1小時後,以3 P皆段: 及 = 5_之熱軋試驗。對熱軋後之試樣表, =緣以目視可辨認出裂痕者評估為「有裂痕」 二邊緣無裂痕,為平滑者,評估為「無裂痕」。、1 °式驗片之物性評估(a):(Sn) and indium (In) were used as the auxiliary materials. The high-frequency melting furnace was melted in a vacuum or an argon atmosphere, and a 45x45x9 mm ingot was cast using a casting mold of cast iron. The hot rolling test of the ingot is carried out, and the ingot which has not cracked under the hot rolling is sequentially subjected to hot rolling, melt treatment, aging treatment, intermediate cold rolling, aging treatment, final cold rolling, stress relief annealing, and the like. A plate with a thickness of 15 mm. Test pieces were taken for each of the obtained sheets, and the evaluations of "strength", "conductivity" and "bending workability" were performed. Hot workability evaluation of wheel keys (a): , , ,, and processability are evaluated by heat drying. Material, will bond: Cut into 45x45x25mm, add at 850 °C! This is from the h" h L Bu heating for 1 hour, with 3 P are: and = 5_ hot rolling test. For the hot-rolled sample table, = edge visually recognizable cracks are evaluated as "have The crack has no crack on the edge and is smooth. It is evaluated as “no crack”. Physical property evaluation of 1 ° type test piece (a):

「強度」係依據JIS Z 2241中楣宁今t 號B試驗w干規夂之拉伸試驗,用】 $驗片進打,測定拉伸強度β π J 「導電率」係用4端子法測定 表示》 〈冤阻,以。/〇lAc 彎曲加工性」"Strength" is based on the tensile test of the dry test of the T-B test in JIS Z 2241, using the test piece. The tensile strength β π J "conductivity" is determined by the 4-terminal method. Representation" /〇lAc bending workability"

係以90度W 彎曲試驗進行評估 試 21 1351439 驗係依據CES-M0002-6,使用R=〇 lmIt is evaluated by a 90 degree W bending test. 21 1351439 The test is based on CES-M0002-6, using R=〇 lm

a 处,、,以 5〇kN 之負何進仃90度彎曲加工。彎曲部 微鏡觀察中央部隆起表面的狀況,發生破:者二以咐 : = =「△」,良好者作為「〇」。彎二 乳裏方向為直角(Good way)。a,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Bending section Micromirror observes the condition of the raised surface of the central part, and breaks it: the second is =: = = "△", and the good one is "〇". Bend 2 The direction of the milk is right angle (Good way).

Ni-P-Mg系析出物之評估(a):Evaluation of Ni-P-Mg system precipitates (a):

將最終冷軋前之合金條依平行於乾製方向將厚 地切斷,使用掃描型電子顯微鏡及穿透型電子顯微= 截面之析出物作10視野觀察。於析出物之大小為5〜5〇⑽ 之情況’以50萬倍〜70萬倍的視野(約i 4 X 1〇1。〜心The alloy strips before the final cold rolling were cut thickly in parallel with the dry direction, and were observed using a scanning electron microscope and a penetrating electron microscope = cross-section precipitate for 10 fields of view. In the case where the size of the precipitate is 5 to 5 〇 (10), the field of view is 500,000 to 700,000 times (about i 4 X 1〇1.

1〇10·2)進行攝影’於析出物之大小為⑽〜2_nm之情 況,以5萬倍〜10萬倍的視野(約i 〇 χ ι〇η〜2〇 X 進行攝影。攝影之照片影像,以影像解析裝置(尼列可(股) 製’商品名:盧杰克斯)對長徑a為5nm以上之析出物全 部逐一測定長# a、短徑b及面積。自此等析出物隨機選 取1 〇〇個,以相對於以長徑a為5nm以上之全部析出物之 面積的總和,長寬比a/b為2〜5〇且短徑b為1〇〜25nm之 析出物(A)的面積與長寬比a/b為未滿2且長徑3為2〇〜5如爪 之析出物(B)的面積之總和,佔其之比例作為面積率 又,經確認得知:藉由最終冷軋(通常加工變形々=2 以上),冷軋前之析出物之短徑b較1〇nm小之Ni p_Mg系 析出物因固熔而未觀察到,而短徑b為l〇nm以上之析出 物,於最終冷乳後亦保持其長徑、短徑及長寬比。又析 出物之面積率C亦同樣地於最終冷軋後幾乎未改變。 22 13514391〇10·2) Performing photography 'When the size of the precipitate is (10) to 2_nm, the image is taken at 50,000 times to 100,000 times (about i 〇χ ι〇η~2〇X). The length of the precipitates with a long diameter a of 5 nm or more were measured by the image analysis device (product name: Lukekes), and the lengths a and the area were measured one by one. 1 选取 is selected to be a precipitate having an aspect ratio a/b of 2 to 5 Å and a short diameter b of 1 〇 to 25 nm with respect to the sum of the areas of all the precipitates having a long diameter a of 5 nm or more (A) The area and aspect ratio a/b is less than 2 and the long diameter 3 is 2〇~5, such as the sum of the area of the precipitate (B) of the claw, and the ratio is taken as the area ratio, and it is confirmed that: By the final cold rolling (normal processing deformation 々 = 2 or more), the Ni p_Mg-based precipitate having a short diameter b of less than 1 〇 nm before the cold rolling is not observed by solid solution, and the short diameter b is l. The precipitates above 〇nm retain their long diameter, short diameter and aspect ratio after the final cold milk. The area ratio C of the precipitates is also almost unchanged after the final cold rolling. 51439

【s 導電率 %IACS «ο ΓΛ cK r- «Λϊ «r> ※ ※ v〇 〆 fO trj •r» 3 ro v〇 PO m to m cn CO V*) 拉伸 強度 (MPa) 1 GO r- s 〇s 〇\ ΟΟ 00 r- 5: % (N 〇 *n v〇 Os v〇 «Ν ν〇 *Tt m 00 Ό !彎曲 1加工性 1 〇 〇 〇 〇 〇 〇 系 X 〇 〇 X 〇 〇 〇 Ni-P系析出物 * U彡 « 一 00 ON «〇 ON OS 〇\ 00 σ\ σ\ σ> % % % % o o *r^ On Ss 00 00 cs O ON 長寬比 a/b rn o (N ρ rf ※ 浓 % 00 (N m 对 xn if鄣i o 呀 m o (N o 00 fN •TJ CN «/> m % % ※ ※ <N <N v〇 «η <N 00 rn 夾雜物個數 (個/mm2) 超過50 β m o 〇 o 〇 Ο o r^) VO 二 〇 o O 〇 ο o O o Ο c IT» C l it 卜 ΓΛ CS o (N 二 s (N <Ν m § § I Ο 卜 寸 p· P; m «Ν 二 熱軋 加工性 無裂痕 無裂痕 1無裂痕I 無裂痕 1無裂痕ι 無裂痕 1有裂痕ι 有裂痕 有裂痕 1有裂痕1 有裂痕 1有裂痕I 1有裂痕1 無裂痕 無裂痕 無裂痕 無裂痕 無裂痕 無裂痕 無裂痕 1100〜950°C 冷卻速度 fc/分鐘) ο o o 〇 ο o ο s 〇 〇 〇 〇 〇 ο ο o 芝 Ο 芝 ο o 〇 ο ΓΛ 合金組成(質量%) Sn+In 1 1 1 3 〇 ο <N ΓΟ o I 1 〇 1 JQ 〇 ι 1 1 1 I 1 1 1 Ni/P ο wS V) r^i »n vS vS •r> »n cs irj *ri \〇 vS ON (N *n 寸 — »η 叶 ν-ΐ so ir! 00 Tt — rn 00 ο »η 5 1其餘1 1其餘I I其餘1 1其餘1 1其餘I 1其餘Ί 1其餘I 1其餘I 1其餘I 1其餘1 1其餘I 1其餘1 1其餘1 1其餘ι 1其餘I 1其餘ι 1其餘ι 1其餘I l其餘ι ι其餘ι c 1 1 i ο ο <N m o 1 1 1 1 1 00 VO 〇 I I 1 1 I 1 I 1 ζΛ 1 1 1 ο I 1 1 1 〇 1 in 〇 ι ι 1 I ι 1 ι 1 CQ 1 0.035 1 | 0.042 1 | 0.051 I 1 0.025 1 1 0.035 1 | 0.045 | 1 | 0.003 1 1 0.050 1 1 0.057 1 I 0.052 1 0.065 1 0.042 1 1 0.033 1 | 0.030 I 1 0.03〇n | 0.135 | | 0.060 1 | 0.057 | 1 0.009 受 ο o o d g ο ο o 艺 ο 〇 〇 〇 〇 s ο ο m rj o 〇 g o 1 o o o g d 0- (N 〇 沄 o r^i m d «η fS ο ο m 〇 艺 ο ON (N Ο 〇 8 〇 沄 ο 00 (Ν Ο s o <N 〇 ίΝ (N o ίΝ (Ν ο ro o QJ o o g d u-> v〇 jn CM g ίΝ ίΝ \〇 *η CN ίΝ <N »r> <N *r> ΓΊ Os 00 o o ό — <N rf V) 卜 00 σ\ Ο - <Ν 寸 ΙΛ» 卜 00 Os 發明 比較 。¢κ*瘅¾c¢鉍丧碟长啭「※」烯名淹-<长<「丨」,-&-< 1351439 再以表2所示之成分組成之銅合金,以本發明之熱加 工性優異之局強度高導電性銅合金之實施例,與比較例相 較作說明。 本發明之合金實施例1〜6,於熱軋時不會發生裂痕, 具備優異之強度及導電率。 另一方面,比較例7〜20為成分偏離本發明之合金組 成範圍或Ni/P比例及析出物大小之合金。比較例7〜8,由 於未添加B或未達規定量,故於熱軋中發生裂痕。由於比 較例9中Ni添加量超過2.0%,比較例1〇中p添加量超過 〇_5〇%且Ni/P比例偏離,比較例u中Sn添加量超過丄〇%, 比較例12中Sn與In之添加量合計超過丨〇%,故分別於 熱軋時發生裂痕。比較例13由於Mg添加量超過0.20%, 故於熱軋時發生裂痕。比較例14,由於析出物之長徑小(為 1 2nm)且面積率C為0,故於冷軋時析出物發生固熔,導電 率低、彎曲加工性亦差。比較例15 ’由於析出物過大,面 積率C為〇 ’故拉伸強度低。比較例16,由於未添加, 故拉伸強度偏低。比較例i 7,由於B添加量超過〇 070%, 會因Ni-P_Mg_B、B_P等之化合物於凝固時晶析或析出, 致Ni-P-Mg系之析出物量減少,使得強度與導電率降低, 彎曲加工性變差。比較例18,由於Ni/p比低於適當之組 成比,故p之固溶量增大,致導電率降低。比較W 19,由 於沁/P比高於適當之組成比,故犯之固熔量增大,致導 電率降低。比較例20 ’由於Ni及p之添加量低於本發明 所規定之範圍,故強度低。 24 1351439 發明例21〜26及比較例27〜38(表3) 試樣之製造(b): 以電解銅或無氧銅為主原料,以鎳(Ni)、1 5%P-Cu母 合金(P)、l〇%Mg-Cu母合金(Mg)、2%B-Cu母合金(B)、錫 (Sn)、銦(in)為副原料,用高頻熔解爐於真空或氬環境氣氛 中炼解’鑄造45x45x90mm或(|)50x90mm之鑄鍵。由於於 鑄造、凝固時之冷卻速度作改變,故鑄模之材質使用缚鐵、[s conductivity%IACS «ο ΓΛ cK r- «Λϊ «r> * ※ v〇〆fO trj •r» 3 ro v〇PO m to m cn CO V*) Tensile strength (MPa) 1 GO r- s 〇s 〇\ ΟΟ 00 r- 5: % (N 〇*nv〇Os v〇«Ν ν〇*Tt m 00 Ό !bend 1 processability 1 〇〇〇〇〇〇X 〇〇X 〇〇〇 Ni-P system precipitates * U彡« 00 ON «〇ON OS 〇\ 00 σ\ σ\ σ> % % % % oo *r^ On Ss 00 00 cs O ON Aspect ratio a/b rn o ( N ρ rf ※ Concentration 00 (N m to xn if鄣io 呀 mo (N o 00 fN •TJ CN «/> m % % ※ ※ <N <N v〇«η <N 00 rn inclusions Number of objects (pieces/mm2) over 50 β mo 〇o 〇Ο or^) VO 〇 O O O 〇ο o O o Ο c IT» C l it ΓΛ CS o (N s (N < Ν m § § I Ο 卜 inch p· P; m «Ν 2 hot rolling process without cracks no cracks 1 no cracks I no cracks 1 no cracks ι no cracks 1 cracks ι cracks cracks 1 cracks 1 cracks 1 Crack I 1 has cracks 1 no cracks no cracks no cracks no cracks no cracks no cracks no Trace 1100~950°C Cooling rate fc/min) ο oo 〇ο o ο s 〇〇〇〇〇ο ο o Ο Ο ο ο o 〇ο ΓΛ Alloy composition (% by mass) Sn+In 1 1 1 3 〇ο <N ΓΟ o I 1 〇1 JQ 〇ι 1 1 1 I 1 1 1 Ni/P ο wS V) r^i »n vS vS •r> »n cs irj *ri \〇vS ON (N *n Inch - »η叶ννΐ ir! 00 Tt — rn 00 ο »η 5 1 remaining 1 1 remaining II remaining 1 1 remaining 1 1 remaining I 1 remaining Ί 1 remaining I 1 remaining I 1 remaining I 1 remaining 1 1 Rest I 1 remaining 1 1 remaining 1 1 remaining ι 1 remaining I 1 remaining ι 1 remaining ι 1 remaining I l remaining ι rest ι c 1 1 i ο ο <N mo 1 1 1 1 00 VO 〇II 1 1 I 1 I 1 ζΛ 1 1 1 ο I 1 1 1 〇1 in 〇ι ι 1 I ι 1 ι 1 CQ 1 0.035 1 | 0.042 1 | 0.051 I 1 0.025 1 1 0.035 1 | 0.045 | 1 | 0.003 1 1 0.050 1 1 0.057 1 I 0.052 1 0.065 1 0.042 1 1 0.033 1 | 0.030 I 1 0.03〇n | 0.135 | | 0.060 1 | 0.057 | 1 0.009 by ο oodg ο ο o Art ο s ο ο m rj o 〇go 1 ooogd 0- (N 〇沄or^imd «η fS ο ο m 〇艺ο ON (N Ο 〇8 〇沄ο 0 0 (Ν Ο so <N 〇ίΝ (N o ίΝ (Ν ο ro o QJ oogd u-> v〇jn CM g ίΝ ίΝ \〇*η CN ΝΝ <N »r><N*r> ΓΊ Os 00 oo ό — <N rf V) 00 σ Ο & - < Ν ΙΛ ΙΛ » 00 00 Os Comparison of inventions. ¢κ*瘅3⁄4c¢铋 碟 长 长 长 " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " An example of a high-strength conductive copper alloy having excellent hot workability will be described in comparison with a comparative example. In Examples 1 to 6 of the alloy of the present invention, cracks did not occur during hot rolling, and excellent strength and electrical conductivity were obtained. On the other hand, Comparative Examples 7 to 20 are alloys in which the composition deviates from the alloy composition range or the Ni/P ratio and the precipitate size of the present invention. In Comparative Examples 7 to 8, since B was not added or a predetermined amount was not obtained, cracks occurred during hot rolling. Since the amount of addition of Ni in Comparative Example 9 exceeded 2.0%, the amount of addition of p in Comparative Example 1 exceeded 〇_5〇% and the ratio of Ni/P deviated, and the amount of addition of Sn in Comparative Example u exceeded 丄〇%, and Sn in Comparative Example 12 Since the total amount of addition with In exceeds 丨〇%, cracks occur during hot rolling. In Comparative Example 13, since the amount of Mg added exceeded 0.20%, cracks occurred during hot rolling. In Comparative Example 14, since the long diameter of the precipitate was small (12 nm) and the area ratio C was 0, the precipitate was solid-melted at the time of cold rolling, and the electrical conductivity was low and the bending workability was also poor. In Comparative Example 15, since the precipitate was too large, the area ratio C was 〇 ', so the tensile strength was low. In Comparative Example 16, since it was not added, the tensile strength was low. In Comparative Example i7, since the amount of B added exceeds 〇070%, the compounds such as Ni-P_Mg_B and B_P are crystallized or precipitated during solidification, resulting in a decrease in the amount of precipitates of the Ni-P-Mg system, resulting in a decrease in strength and electrical conductivity. , bending workability is deteriorated. In Comparative Example 18, since the Ni/p ratio was lower than the appropriate composition ratio, the solid solution amount of p was increased, and the electrical conductivity was lowered. Comparing W 19, since the 沁/P ratio is higher than the appropriate composition ratio, the amount of solid solution is increased, and the conductivity is lowered. In Comparative Example 20', since the addition amount of Ni and p was lower than the range specified in the present invention, the strength was low. 24 1351439 Inventive Examples 21 to 26 and Comparative Examples 27 to 38 (Table 3) Preparation of Samples (b): Electrolytic copper or oxygen-free copper as main raw material, nickel (Ni), 1 5% P-Cu master alloy (P), l〇%Mg-Cu master alloy (Mg), 2% B-Cu master alloy (B), tin (Sn), indium (in) as auxiliary materials, using high frequency melting furnace in vacuum or argon environment In the atmosphere, 'cast 45x45x90mm or (|) 50x90mm cast key. Since the cooling rate during casting and solidification is changed, the material of the mold is iron,

氧化紹、氧化矽製。於鑄模之中心部插入熱電偶,測定缚 造、凝固時自lioot:至95〇。(:之冷卻速度,得到鑄鐵鱗模 為340°C/分鐘、氧化鋁鑄模為85口分鐘、氧化矽鑄模為33 c/分鐘。為製作冷卻速度為20t:/分鐘以下之鑄錠,於单 方向凝固裴置中,以2〇t:/分鐘、15〇c/分鐘及1〇t/分鐘之 冷郃速度製得鑄錠。進行鑄錠之熱軋試驗,於熱軋下未發 生裂痕之鑄錠,依序施行熱軋、熔體化處理、時效處理、 中間冷軋、時效處理、最終冷軋、去應力退火,製作成厚 度0.10mm之平板。對得到之各種板材採取試驗片進行試 驗,進行「強度」、「導電率」及「彎曲加工性」之評估: 碡旋之熱加工性評估(b): 將鑄錠裁切成 45x45x45mm 或 φ50χ45ππη,於 85〇χ:_ 加熱1小時後,以4階段進行由厚度45_至12咖之$ 軋試驗,此外係以與上述鑄錠之熱加卫性評估a同樣的^ 5式驗片之夾雜物評估(b): 對鱗鍵依序施 試樣中之夾雜物之評估係如下述進行 25 1351439 行熱軋、⑮體化處理、時效處理、中間冷軋、時效處理、 最終冷軋、去應力退火’對厚度〇1。職t平板試樣之乾 製平行截面進行鏡面研磨’以電子顯微鏡讀影像於_ 倍對,小5 /z m以上之夹雜物進行5視野之觀察(約 0.3WO,算出每W之爽雜物個數。另一方面,於鎢 鍵之熱加工性評估中發生裂痕之縳錠’於8机進行加執 1小時後使其水冷卻,對得収試樣進行㈣物之評估‘。、 對试樣進订鏡面研磨,與前述 鏡進行夾雜物之觀察,算出^板騎㈣地以電子顯微 异出母lmm之夾雜物個數。 加工性良好之合金,梂孚舡4 m t 、·,,、 板式樣與使鑄錠於85〇〇c加埶 小時後進行水冷卻所得之續搞^ 土 ·、、' …式樣兩者之夾雜物個數加以比 較’付到大致同等之結果。 試驗片之物性評估(b): 「強度」係依據JIS Z 2241 Φ招—丄 ^ R ^ ^ Η ^ 中規疋之拉伸試驗,用13 :B§=:測定拉伸強度,導電率撕 η ge)式驗片之電阻,以%IACS表示。「彎曲加工 性」係以90度W彎曲 穹曲加工 M0002 6 * # p 驗進仃評估。試驗係依據CES- M0002-6,使用R=〇 lmm之夾具 度f曲加工。彎曲部之評估 《負何進行90 H: ^ A ® ^ fl* 係以光學顯微鏡觀察中央部 隆起表面的狀况,發生裂 為「△」,良好者作為「〇 ^ X」’發生敏指者作 ^ (Good way) 〇 」冑曲軸係對軋製方向為直 26 1351439Oxidation and oxidation. A thermocouple was inserted into the center of the mold, and the lioot: to 95 缚 was measured for solidification and solidification. (: The cooling rate is 340 ° C / min for the cast iron scale mold, 85 minutes for the alumina mold, and 33 c / min for the yttrium oxide mold. For the ingots with a cooling rate of 20 t: / min or less, In the direction solidification, the ingot was prepared at a cold heading speed of 2〇t:/min, 15〇c/min and 1〇t/min. The hot rolling test of the ingot was carried out, and no crack occurred under hot rolling. The ingot is sequentially subjected to hot rolling, melt treatment, aging treatment, intermediate cold rolling, aging treatment, final cold rolling, and stress relief annealing to prepare a flat plate having a thickness of 0.10 mm. Test pieces are taken for various sheets obtained. Evaluation of "strength", "conductivity" and "bending workability": Evaluation of hot workability of helium (b): The ingot was cut into 45x45x45mm or φ50χ45ππη at 85〇χ:_ after heating for 1 hour In the four-stage, the thickness test is carried out from the thickness of 45_ to 12% of the coffee, and the inclusion of the same type of test piece of the same type as the thermal evaluation of the ingot described above (b): The evaluation of the inclusions in the sample application is carried out as follows: 25 1351439 rows of hot rolling, 15 Body treatment, aging treatment, intermediate cold rolling, aging treatment, final cold rolling, stress relief annealing 'for thickness 〇 1. mirror-grinding of dry parallel sections of t-plate samples' by electron microscopy in _ times pairs 5, the observation of 5 fields or more of small inclusions (about 0.3WO, calculate the number of impurities per W. On the other hand, the crack in the hot workability evaluation of the tungsten bond in the ingot) After 8 hours of adding the machine, the water is cooled, and the obtained sample is evaluated for (4). The mirror is ground by the sample, and the inclusions are observed with the mirror to calculate the position of the board. The number of inclusions in the electron microscopy of the mother lmm. The alloy with good workability, the 4 mt, ·,,, the plate pattern and the water cooling after the ingot is added at 85 ° C for an hour. The comparison of the number of inclusions in the soil, the ', and the 'models' is roughly the same. The evaluation of the physical properties of the test piece (b): The "strength" is based on JIS Z 2241 Φ 丄 - 丄 ^ R ^ ^ Η ^ The tensile test of the standard, using 13 : B§ =: Determination of tensile strength, conductivity The resistance of the η ge) test piece is expressed in % IACS. The "bending workability" is evaluated by bending the M0002 6 * # p by 90 degree W. The test is based on CES-M0002-6, using R= 〇lmm fixture degree f-curve processing. Evaluation of the bending section "What is the negative 90 H: ^ A ® ^ fl* The condition of the central raised surface is observed by an optical microscope, and the crack is "△", which is good as " 〇^ X"' occurs in a good way ^ (Good way) 〇" 胄 crankshaft is perpendicular to the rolling direction 26 1351439

ts 導t率 %IACS 1_____ 52.2 51.5 51.8 47.6 46.7 45.8 w 38.7 36.2 5 w-> 拉伸 強度 (MPa) 00 ro CO 830 l〇 v〇 00 870 875 V) 卜 r- 5 CN (N v〇 〆·、 /·、 彎曲 加工性 〇 〇 <1 〇 〇 <3 % % 〇 X 〇 夾雜物個數 (個/mm2) 超過50 a m o ο o o o o 〇\ τΐ- <N 二 s〇 〇 ο 〇 5-50 βη\ 卜 卜 (N m tN VO 00 § ΓΊ VD (N 卜 m o s g 卜 熱軋之裂痕發 生狀況 無裂痕 無裂痕 無裂痕 無裂痕 無裂痕 無裂痕 有裂痕 1有裂痕 有裂痕 !有裂痕 有裂痕 I有裂痕 |有裂痕 有裂痕 有裂痕 有裂痕 有裂痕 無裂痕 無裂痕 無裂痕 1100〜950°(:冷 卻速度(°C/分 鐘) 340 00 ro 340 00 m Ο 340 340 j 340 340 340 340 340 340 340 340 合金組成(質量%) Sn+In 1 1 1 0.67 ] 0.65 | 0.63 I 1 1 1 0.61 | 1 1 °·54 1 1 1 1 1 !-35 1 1 1 1 Ni/P W-j VO vS m ιτί CN 卜 m >〇 m uS in 卜 卜 々· m »ri V~1 (N ON r- Tt Tt m σ< (N vS wS 其餘 其餘 其餘 1其餘 |其餘| 其餘 |其餘1 1其餘1 其餘 其餘 |其餘| 其餘 1其餘1 其餘 |其餘| 其餘 其餘 其餘 |其餘I 其餘 = 1 1 1 1 0.35 I 0.32 0.31 1 1 1 0.30 1 0.29 1 1 1 1 0.70 1 1 1 1 1 1 0.32 1 0.33 0.32 1 1 1 1 0.25 1 1 1 o CO 0.65 1 1 1 CQ 0.038 ;0.035 ! 0.034 | 0.029 ] 0.031 0.033 0.038 1 0.035 1 1 0.039 1 0.033 | 0.003 0.002 0.055 0.056 0.057 0.044 0.040 0.025 0.135 0.050 i 0.06 0.07 0.06 0.06 0.07 0.07 0.07 1 0.06 1 0.06 0.07 | 0.05 0.04 0.07 0.08 0.29 0.05 0.06 0.05 0.04 0.05 Cu 0.23 0.22 0.23 ㈣ 0.25 0.26 0.22 1 0.22 1 1 0.23 1 0.25 0.32 0.31 0.44 0.61 0.27 0.26 0.27 0.12 0.26 0.13 2 1.25 ro CN (N ίΝ 〇〇 1.35 1.35 w-> <N (N (N LL2LI 1.35 1.51 1.46 2.33 (N »r> 1.33 fN (N σ\ 二 1 1.35 0.71 6 CM (N <N <N 09 a 〇 CN m Ό r- 00 Os o 發明 例 比較 例 。^^^,^^^^^^^^「※匕:_'v"辑矣痪<长<「—」*-6-啭 1351439 再以表3所示之成分組成之銅合金,以本發明之熱加 工性優異之咼強度高導電性銅合金之實施例,與比較例相 較作說明。 本發明之合金實施例21〜26,於熱軋時不會發生裂痕, 具備優異之強度及導電率。由於本發明例23及26於鑄造 時之冷卻速度慢’為33 t /分鐘,故與其他發明例比較, 其夾雜物個數較多,彎曲加工性稍差。 另 方面’就比較例27〜38進行檢討,比較例27〜29, 由於自U00°C至950。(:之冷卻速度慢,故夾雜物個數多, 於熱軋時發生裂痕。比較例3丨〜38,為成分偏離本發明合 金組成之範圍或Ni/P比例之合金。比較例3 1〜32,由於未 添加B或未達規定量’故於熱軋時發生裂痕。由於比較例 33中Ni添加量超過2.〇0/〇,比較例34中p添加量超過 〇·5〇% ’比較例35中Mg添加量超過0.20%,比較例36〜37 中Sn與in之添加量合計超過1 〇%,故分別於熱軋時發生 裂痕。 比較例38 ’由於Ni/P比低於適當之組成比,故p之 固熔量增大致導電率降低。比較例39,由於B添加量超過 0.070%,會因Ni_p_Mg_B系、B_p系等之化合物於凝固時 晶析或析出,致Ni_P_Mg系之析出物量減少,拉伸強度與 導電率低,彎曲加工性亦差。比較例4〇,由於Ni添加量 低’故拉伸強度低。 【圖式簡單說明】 28 1351439Ts t-rate%IACS 1_____ 52.2 51.5 51.8 47.6 46.7 45.8 w 38.7 36.2 5 w-> Tensile strength (MPa) 00 ro CO 830 l〇v〇00 870 875 V) 卜r- 5 CN (N v〇〆 ·, /·, Bending workability 〇〇<1 〇〇<3 % % 〇X 〇Inclusions (number/mm2) More than 50 amo ο oooo 〇\ τΐ- <N two s〇〇ο 〇 5-50 βη\卜卜(N m tN VO 00 § ΓΊ VD (N 卜 。 mos 热 热 热 热 热 热 热 热 mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos mos Crack I has cracks | cracks cracks cracks cracks cracks no cracks no cracks no cracks 1100~950° (: cooling rate (°C / min) 340 00 ro 340 00 m Ο 340 340 j 340 340 340 340 340 340 340 340 Alloy composition (% by mass) Sn+In 1 1 1 0.67 ] 0.65 | 0.63 I 1 1 1 0.61 | 1 1 °·54 1 1 1 1 1 !-35 1 1 1 1 Ni/P Wj VO vS m Ιτί CN 卜m >〇m uS in 卜卜々· m »ri V~1 (N ON r- Tt Tt m σ&lt ; (N vS wS remaining rest remaining 1 rest | remaining | remaining | remaining 1 1 remaining 1 remaining rest | remaining | remaining 1 remaining 1 remaining | remaining | remaining rest remaining | remaining I remaining = 1 1 1 1 0.35 I 0.32 0.31 1 1 1 0.30 1 0.29 1 1 1 1 0.70 1 1 1 1 1 1 0.32 1 0.33 0.32 1 1 1 1 0.25 1 1 1 o CO 0.65 1 1 1 CQ 0.038 ;0.035 ! 0.034 | 0.029 ] 0.031 0.033 0.038 1 0.035 1 1 0.039 1 0.033 | 0.003 0.002 0.055 0.056 0.057 0.044 0.040 0.025 0.135 0.050 i 0.06 0.07 0.06 0.06 0.07 0.07 0.07 1 0.06 1 0.06 0.07 | 0.05 0.04 0.07 0.08 0.29 0.05 0.06 0.05 0.04 0.05 Cu 0.23 0.22 0.23 (4) 0.25 0.26 0.22 1 0.22 1 1 0.23 1 0.25 0.32 0.31 0.44 0.61 0.27 0.26 0.27 0.12 0.26 0.13 2 1.25 ro CN (N Ν 〇〇 1.35 1.35 w-><N (N (N LL2LI 1.35 1.51 1.46 2.33 (N »r> 1.33 fN (N σ \二1 1.35 0.71 6 CM (N < N < N < N 09 a 〇CN m Ό r- 00 Os o Comparative Example of the inventive example. ^^^,^^^^^^^^"※匕:_'v"集矣痪<长<"-"*-6-啭1351439 A copper alloy composed of the components shown in Table 3, An example of the high-strength conductive copper alloy excellent in hot workability of the present invention will be described in comparison with a comparative example. In Examples 21 to 26 of the alloy of the present invention, cracks were not generated during hot rolling, and excellent strength and electrical conductivity were obtained. Since Examples 23 and 26 of the present invention have a slow cooling rate of 33 t /min at the time of casting, compared with the other invention examples, the number of inclusions is large and the bending workability is slightly inferior. The other aspects were reviewed in Comparative Examples 27 to 38, Comparative Examples 27 to 29, since U00 ° C to 950. (: The cooling rate is slow, so the number of inclusions is large, and cracks occur during hot rolling. Comparative Examples 3 to 38 are alloys whose composition deviates from the alloy composition range of the present invention or the Ni/P ratio. Comparative Example 3 1~ 32, since no addition of B or a predetermined amount was observed, cracking occurred during hot rolling. Since the amount of Ni added in Comparative Example 33 exceeded 2. 〇0/〇, the amount of p added in Comparative Example 34 exceeded 〇·5〇%. In Comparative Example 35, the amount of addition of Mg exceeded 0.20%, and the total amount of addition of Sn and in in Comparative Examples 36 to 37 exceeded 1% by weight, so that cracks occurred during hot rolling, respectively. Comparative Example 38 'Because the Ni/P ratio is lower than appropriate In the composition ratio, the amount of solid solution of p is increased to decrease the conductivity. In Comparative Example 39, since the amount of B added exceeds 0.070%, the compound such as Ni_p_Mg_B system or B_p system is crystallized or precipitated during solidification, resulting in Ni_P_Mg system. The amount of precipitates was reduced, the tensile strength and electrical conductivity were low, and the bending workability was also poor. In Comparative Example 4, since the amount of Ni added was low, the tensile strength was low. [Simplified illustration] 28 1351439

無 【主要元件符號說明】 益 $ »*> 29None [Main component symbol description] Benefit $ »*> 29

Claims (1)

1351439 十、申請專利範圍: " i 一種具優異熱加工性之銅合金,其特徵在於,由含 % 有以質量比例計之 Ni : 1 ·〇〇〇/。〜2.00%、P : 0.10%〜〇.5〇。/0、 Mg: 0.01%〜〇.2〇%,Ni與P之含有量比例Ni/P為4.0〜6.5, 且含有Cr : 0.03%〜0.45°/。,其餘為Cu及不可避免之雜質 所構成。 2· —種具優異熱加工性之銅合金,其特徵在於,由含 有以質量比例計之Ni : 1.00%〜2.00%、P : 0.10%〜0 5〇%, • Mg: 0.〇1%〜0.20%,Ni與P之含有量比例Ni/P為4.0〜6.5, 且含有Cr . 0.03%〜0.45%,並含有Sn及In中之至少1種 合計為0.01%〜1.〇0%以下,其餘為Cu及不可避免之雜質 . 所構成。 3· 一種具優異熱加工性之銅合金,其特徵在於,由含 有以質量比例計之Ni: L0〜2.〇%、P: 〇 1〇〜〇 5〇%、Mg: 〇_〇1%〜0.20% ’ Ni與P之含有量比例Ni/p為4 〇〜6 5,且 含有B : 〇.〇ι〇〇/0〜〇 070〇/〇,苴餘為 • ,、你馮Lu及不可避免之雜質所 構成。 4· 一種具優異熱加工性之銅合金,其特徵在於,由令 有以質量比例計之Ni: i,。〜2.〇%、p: 〇1〇〜〇5〇%、Mg: 〇·㈣〜〇·鳩,Nip之含有量比例驗為4泰65,卫 含有Β: 0·005%〜〇.〇7〇% ’並含有“及化中 ” =為〇_〇1%以上、識以下,其餘為Cu 雜質所構成。 』避充之 5.如申請專利範圍第3或第4項之具優異熱加工性之 30 1351439 銅口金其中,長徑5〜5〇//m之失雜物個數每為⑽ 個以下’且長徑超過50"m之失雜物個數每⑽為〇個。 6.如申請專利範圍第i或第2項之具優異熱加工性之 銅合金’其中’最終冷軋前之Ni-P_Mg系析出物之大小斑 形狀’於以a為長徑…為短徑時,至少有長寬比^ :2:50且短" 10〜2511〇1之析出物(a),該析出物⑷ ,、長寬比a/b未滿2且長徑4 2〇〜、之析出物⑻之面 積的總和’佔銅合金中之全部析出物之面積的總和之嶋 以上。 7·如申請專利範圍第3或第4項之具優異熱加工性之 銅合金…,最終冷乳前mMg系析出物之大小斑 形狀’於以a為長徑、卩b為短徑時,至少有長寬比Μ 為2〜5〇且短徑U 10〜25_之析出物(A),該析出物⑷ 與長寬比a/b未滿2且县經a Α 9η 不兩且長佐3馮20〜5〇nm之析出物(Β)之面 全㈣出物之面積的總和之嶋 以上。 8. 如申請專利範圍第5項之具優異熱加卫性之銅合 金’其係拉伸強度為700MPa以上,且導電率為4〇%iacs 以上之於尚強度高導電電子機器所使用者。 9. 如申請專利範圍第6項之具優異熱加卫性之銅合 金’其係拉伸強度為700MPa以上,且導電率為4〇%iacs 以上之於高強度高導電電子機器所使用者。 10·如申請專利範圍第7項之具優異熱加工性之銅合 金,其係拉伸強度為700Mpa以上,且導電率為40%IACS 31 1351439 以上之於高強度高導電電子機器所使用者。 11· 一種具優異熱加工性之銅合金之製造方法,係用 以製造申請專利範圍第5項之具優異熱加工性之鋼合金; 其特徵在於:於鑄造時自丨丨⑼它至95(rCi平均冷卻速产 為30 °C/分鐘以上。 、 I2. 一種具優異熱加工性之銅合金之製i^法,係用 以製造申請專利範圍第5項之具優異熱加1351439 X. Patent application scope: " i A copper alloy with excellent hot workability, characterized in that it contains Ni in a mass ratio of Ni: 1 ·〇〇〇/. ~2.00%, P: 0.10%~〇.5〇. /0, Mg: 0.01% to 〇.2〇%, the ratio of the content of Ni to P, Ni/P is 4.0 to 6.5, and contains Cr: 0.03% to 0.45 °/. The rest is composed of Cu and unavoidable impurities. 2. A copper alloy having excellent hot workability, characterized by containing Ni in a mass ratio: 1.00% to 2.00%, P: 0.10% to 05%, and Mg: 0. 〇1% ~0.20%, Ni/P ratio of Ni and P is 4.0 to 6.5, and contains Cr. 0.03% to 0.45%, and at least one of Sn and In is 0.01% to 1. 〇0% or less. The rest is composed of Cu and unavoidable impurities. 3. A copper alloy having excellent hot workability, characterized by containing Ni: L0~2.〇%, P: 〇1〇~〇5〇%, Mg: 〇_〇1% by mass ratio ~0.20% 'The ratio of Ni to P is Ni/p is 4 〇~6 5, and contains B: 〇.〇ι〇〇/0~〇070〇/〇, 苴余为• , ,你冯Lu和It is composed of inevitable impurities. 4. A copper alloy having excellent hot workability, characterized by having Ni: i in a mass ratio. ~2.〇%, p: 〇1〇~〇5〇%, Mg: 〇·(4)~〇·鸠, the ratio of the content of Nip is 4, 65, and contains Β: 0·005%~〇.〇 7〇% 'and contains "and in the middle" = 〇 〇 〇 1% or more, the following is recognized, and the rest is composed of Cu impurities. 5. Avoiding the charge 5. If the patent application scope is 3 or 4, the excellent hot workability of 30 1351439 copper gold, of which the length of the long diameter 5~5〇//m is (10) or less. And the number of lost objects exceeding 50"m is (10) per one. 6. A copper alloy having excellent hot workability according to the i or 2 of the patent application 'in which the size and shape of the Ni-P_Mg-based precipitate before the final cold rolling' is a short diameter of a... When there is at least an aspect ratio ^: 2:50 and a short " 10~2511〇1 precipitate (a), the precipitate (4), the aspect ratio a/b is less than 2 and the long diameter is 4 2〇~ The sum of the areas of the precipitates (8) is more than or equal to the sum of the areas of all the precipitates in the copper alloy. 7. If the copper alloy having excellent hot workability in the third or fourth aspect of the patent application is applied, the size of the mMg precipitate before the cold milk is 'the size of the long diameter and the short diameter of 卩b. There is at least a precipitate (A) having an aspect ratio 2 of 2 to 5 Å and a short diameter U 10 to 25 _, and the precipitate (4) has an aspect ratio a/b of less than 2 and a county a Α 9η is not two and long. It is more than the sum of the area of the surface of the product (Β) of the surface of the product (Β) of the sho. 8. The copper alloy with excellent thermal reinforcement according to item 5 of the patent application has a tensile strength of 700 MPa or more and a conductivity of 4% or more of iacs or more for users of high-conductivity conductive electronic equipment. 9. The copper alloy with excellent thermal reinforcement according to item 6 of the patent application has a tensile strength of 700 MPa or more and a conductivity of 4 〇% iacs or more for users of high-strength and high-conductivity electronic equipment. 10. A copper alloy having excellent hot workability according to item 7 of the patent application, which has a tensile strength of 700 MPa or more and a conductivity of 40% IACS 31 1351439 or more for users of high-strength and high-conductivity electronic equipment. 11. A method for producing a copper alloy having excellent hot workability, which is used for producing a steel alloy having excellent hot workability according to item 5 of the patent application; characterized in that it is self-twisting (9) to 95 (at the time of casting) The average cooling rate of rCi is 30 °C/min or more. I2. A method for producing copper alloy with excellent hot workability, which is used to manufacture the excellent heat of the fifth application patent. :特徵在於:於禱造時自幫至〜均二 為85°c/分鐘以上。: The characteristic is: self-help in the praying to ~ the average is 85 ° c / min or more. »»>、 圖式:»»>, schema: 3232
TW096108678A 2006-03-31 2007-03-14 Copper alloy having excellent hot workability and its production method TW200741019A (en)

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JP2006100338A JP4937628B2 (en) 2006-03-31 2006-03-31 Copper alloy with excellent hot workability
JP2006233750A JP2008056974A (en) 2006-08-30 2006-08-30 Copper alloy superior in hot workability

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JPH0718356A (en) * 1993-07-01 1995-01-20 Mitsubishi Electric Corp Copper alloy for electronic equipment, its production and ic lead frame
JP3379380B2 (en) 1997-04-23 2003-02-24 日立電線株式会社 High strength and high conductivity copper alloy
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