TWI349838B - Projective exposure device - Google Patents

Projective exposure device

Info

Publication number
TWI349838B
TWI349838B TW093112719A TW93112719A TWI349838B TW I349838 B TWI349838 B TW I349838B TW 093112719 A TW093112719 A TW 093112719A TW 93112719 A TW93112719 A TW 93112719A TW I349838 B TWI349838 B TW I349838B
Authority
TW
Taiwan
Prior art keywords
exposure device
projective exposure
projective
exposure
Prior art date
Application number
TW093112719A
Other languages
English (en)
Other versions
TW200502711A (en
Inventor
Hiromi Ishikawa
Masahiro Ohba
Norihisa Takada
Yutaka Korogi
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=33410490&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI349838(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fuji Corp filed Critical Fuji Corp
Publication of TW200502711A publication Critical patent/TW200502711A/zh
Application granted granted Critical
Publication of TWI349838B publication Critical patent/TWI349838B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details
    • G03B27/54—Lamp housings; Illuminating means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW093112719A 2003-05-07 2004-05-06 Projective exposure device TWI349838B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003128916A JP4244156B2 (ja) 2003-05-07 2003-05-07 投影露光装置

Publications (2)

Publication Number Publication Date
TW200502711A TW200502711A (en) 2005-01-16
TWI349838B true TWI349838B (en) 2011-10-01

Family

ID=33410490

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093112719A TWI349838B (en) 2003-05-07 2004-05-06 Projective exposure device

Country Status (5)

Country Link
US (2) US6930761B2 (zh)
JP (1) JP4244156B2 (zh)
KR (1) KR101152226B1 (zh)
CN (1) CN1550875A (zh)
TW (1) TWI349838B (zh)

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US6960035B2 (en) * 2002-04-10 2005-11-01 Fuji Photo Film Co., Ltd. Laser apparatus, exposure head, exposure apparatus, and optical fiber connection method
US6876494B2 (en) * 2002-09-30 2005-04-05 Fuji Photo Film Co., Ltd. Imaging forming apparatus
JP4244156B2 (ja) * 2003-05-07 2009-03-25 富士フイルム株式会社 投影露光装置
JP4500657B2 (ja) * 2004-11-30 2010-07-14 旭化成イーマテリアルズ株式会社 パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2006154622A (ja) * 2004-12-01 2006-06-15 Fuji Photo Film Co Ltd パターン形成材料及びパターン形成方法
JP4866002B2 (ja) * 2004-12-21 2012-02-01 株式会社ブイ・テクノロジー 露光装置
JP2006208432A (ja) * 2005-01-25 2006-08-10 Fuji Photo Film Co Ltd 露光方法および装置
JP2006208730A (ja) * 2005-01-27 2006-08-10 Fuji Photo Film Co Ltd パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP4520879B2 (ja) * 2005-02-16 2010-08-11 富士フイルム株式会社 パターン形成材料、及びパターン形成装置並びにパターン形成方法
JP4524213B2 (ja) * 2005-03-14 2010-08-11 富士フイルム株式会社 露光装置及び方法
JP2006261155A (ja) * 2005-03-15 2006-09-28 Fuji Photo Film Co Ltd 露光装置及び露光方法
US7403265B2 (en) * 2005-03-30 2008-07-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method utilizing data filtering
JP4786224B2 (ja) * 2005-03-30 2011-10-05 富士フイルム株式会社 投影ヘッドピント位置測定方法および露光方法
WO2006105911A2 (de) * 2005-04-02 2006-10-12 Punch Graphix Prepress Germany Gmbh Belichtungsvorrichtung für druckplatten
JP2007017721A (ja) * 2005-07-07 2007-01-25 Fujifilm Holdings Corp パターン形成方法
JP2007017722A (ja) * 2005-07-07 2007-01-25 Fujifilm Holdings Corp パターン形成方法
JP2007033973A (ja) * 2005-07-28 2007-02-08 Fujifilm Corp 露光ヘッドおよび露光装置
JP4966528B2 (ja) * 2005-09-14 2012-07-04 旭化成イーマテリアルズ株式会社 パターン形成材料、並びにパターン形成装置及びパターン形成方法
US7642020B2 (en) * 2006-08-17 2010-01-05 International Business Machines Corporation Method for separating optical and resist effects in process models
JP5623748B2 (ja) * 2007-01-09 2014-11-12 トムソン ライセンシングＴｈｏｍｓｏｎ Ｌｉｃｅｎｓｉｎｇ フィルムプリントシステム
JP4543069B2 (ja) 2007-09-26 2010-09-15 日立ビアメカニクス株式会社 マスクレス露光装置
US20090091730A1 (en) * 2007-10-03 2009-04-09 Nikon Corporation Spatial light modulation unit, illumination apparatus, exposure apparatus, and device manufacturing method
DE102008054582A1 (de) * 2007-12-21 2009-07-09 Carl Zeiss Smt Ag Mikrolithographische Projektionsbelichtungsanlage
JP5230236B2 (ja) * 2008-03-31 2013-07-10 大日本スクリーン製造株式会社 露光装置
US8115904B2 (en) * 2008-05-30 2012-02-14 Corning Incorporated Illumination system for sizing focused spots of a patterning system for maskless lithography
DE102008050446B4 (de) * 2008-10-08 2011-07-28 Carl Zeiss SMT GmbH, 73447 Verfahren und Vorrichtungen zur Ansteuerung von Mikrospiegeln
US9068952B2 (en) * 2009-09-02 2015-06-30 Kla-Tencor Corporation Method and apparatus for producing and measuring dynamically focussed, steered, and shaped oblique laser illumination for spinning wafer inspection system
DE102011001785B4 (de) * 2011-04-04 2015-03-05 Jenoptik Optical Systems Gmbh Belichtungseinrichtung zur strukturierten Belichtung einer Fläche
JP2013175344A (ja) * 2012-02-24 2013-09-05 Panasonic Corp 隔壁形成方法、それを用いた有機ｅｌ表示パネルの形成方法、および、露光装置
CN102914870A (zh) * 2012-11-08 2013-02-06 中国电子科技集团公司第十一研究所 基于楔形棱镜补偿光学焦平面的装置
KR101440874B1 (ko) 2013-07-26 2014-09-17 (주)프로옵틱스 엘이디 광원을 이용한 시준 기능을 갖는 노광용 광학모듈
JP2015102614A (ja) * 2013-11-22 2015-06-04 セイコーエプソン株式会社 表示装置
CN104950587B (zh) * 2014-03-25 2017-12-29 上海微电子装备（集团）股份有限公司 曝光装置与曝光方法
CN105549327B (zh) * 2014-10-29 2018-03-02 上海微电子装备（集团）股份有限公司 曝光装置的调整装置及调整方法
US10114224B2 (en) 2014-12-31 2018-10-30 Dolby Laboratories Licensing Corporation Discrete laser fiber inputs for image projectors
JP6668004B2 (ja) * 2015-06-09 2020-03-18 カンタツ株式会社 回路パターン製造装置、回路パターン製造方法および回路パターン製造プログラム
JP6717719B2 (ja) 2016-09-09 2020-07-01 株式会社Ｓｃｒｅｅｎホールディングス パターン露光装置、露光ヘッドおよびパターン露光方法
JP6892727B2 (ja) 2016-09-26 2021-06-23 カンタツ株式会社 パターン製造装置、パターン製造方法およびパターン製造プログラム
JP6839476B2 (ja) 2016-09-26 2021-03-10 カンタツ株式会社 パターン形成用シート
JP2018182126A (ja) 2017-04-17 2018-11-15 カンタツ株式会社 パターン形成用シート、パターン製造装置およびパターン製造方法
JP2019045836A (ja) * 2017-09-01 2019-03-22 株式会社アドテックエンジニアリング 直接描画露光装置
JP7020859B2 (ja) * 2017-10-24 2022-02-16 キヤノン株式会社 照明光学系、露光装置および物品の製造方法
CN110264877B (zh) * 2018-03-12 2022-01-11 深圳光峰科技股份有限公司 像素化波长转换装置、像素化波长转换元件及其制造方法
JP7082927B2 (ja) 2018-08-27 2022-06-09 株式会社Ｓｃｒｅｅｎホールディングス 露光装置
JP7128760B2 (ja) * 2019-03-11 2022-08-31 株式会社Ｓｃｒｅｅｎホールディングス 露光装置、露光方法およびプログラム
CN110095949A (zh) * 2019-05-07 2019-08-06 深圳市博宇佳瑞光电科技有限公司 一种数字投影直接感光成像装置及其工艺
CN111736437A (zh) * 2020-07-24 2020-10-02 苏州天准科技股份有限公司 直接成像系统
DE102020124006B3 (de) 2020-09-15 2022-01-05 Laser Imaging Systems Gmbh Belichtungssteuerung bei photolithographischen direktbelichtungsverfahren zur leiterplatten- oder schaltkreisherstellung

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US5105075A (en) * 1988-09-19 1992-04-14 Canon Kabushiki Kaisha Projection exposure apparatus
US5311362A (en) * 1989-04-20 1994-05-10 Nikon Corporation Projection exposure apparatus
JP3088148B2 (ja) 1991-10-14 2000-09-18 旭光学工業株式会社 走査式描画装置
US6304317B1 (en) * 1993-07-15 2001-10-16 Nikon Corporation Projection apparatus and method
JP3521416B2 (ja) * 1995-10-06 2004-04-19 株式会社ニコン 投影露光装置
JP3907728B2 (ja) 1996-01-23 2007-04-18 オリンパス株式会社 オートフォーカス顕微鏡装置
US6268904B1 (en) * 1997-04-23 2001-07-31 Nikon Corporation Optical exposure apparatus and photo-cleaning method
US6251550B1 (en) * 1998-07-10 2001-06-26 Ball Semiconductor, Inc. Maskless photolithography system that digitally shifts mask data responsive to alignment data
JP2001305663A (ja) 2000-04-20 2001-11-02 Noritsu Koki Co Ltd 画像焼付装置およびこれを備えた写真処理装置、ならびに画像焼付方法
US6537738B1 (en) 2000-08-08 2003-03-25 Ball Semiconductor, Inc. System and method for making smooth diagonal components with a digital photolithography system
US6624880B2 (en) * 2001-01-18 2003-09-23 Micronic Laser Systems Ab Method and apparatus for microlithography
JP4244156B2 (ja) * 2003-05-07 2009-03-25 富士フイルム株式会社 投影露光装置

Also Published As

Publication number Publication date
CN1550875A (zh) 2004-12-01
US20050185157A1 (en) 2005-08-25
KR101152226B1 (ko) 2012-06-08
JP4244156B2 (ja) 2009-03-25
KR20040095721A (ko) 2004-11-15
US6930761B2 (en) 2005-08-16
US20040223129A1 (en) 2004-11-11
TW200502711A (en) 2005-01-16
US7145639B2 (en) 2006-12-05
JP2004335692A (ja) 2004-11-25

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