TWI347650B - Substrate processing apparatus and substrate transferring method - Google Patents
Substrate processing apparatus and substrate transferring methodInfo
- Publication number
- TWI347650B TWI347650B TW096110350A TW96110350A TWI347650B TW I347650 B TWI347650 B TW I347650B TW 096110350 A TW096110350 A TW 096110350A TW 96110350 A TW96110350 A TW 96110350A TW I347650 B TWI347650 B TW I347650B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- processing apparatus
- transferring method
- substrate processing
- substrate transferring
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006089049A JP4890067B2 (ja) | 2006-03-28 | 2006-03-28 | 基板処理装置および基板搬送方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200802684A TW200802684A (en) | 2008-01-01 |
TWI347650B true TWI347650B (en) | 2011-08-21 |
Family
ID=38557001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096110350A TWI347650B (en) | 2006-03-28 | 2007-03-26 | Substrate processing apparatus and substrate transferring method |
Country Status (5)
Country | Link |
---|---|
US (1) | US8262799B2 (zh) |
JP (1) | JP4890067B2 (zh) |
KR (1) | KR100888107B1 (zh) |
CN (1) | CN101047115B (zh) |
TW (1) | TWI347650B (zh) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100914743B1 (ko) * | 2007-09-06 | 2009-08-31 | 세메스 주식회사 | 기판 처리 장치 및 상기 장치의 기판 감지 방법 |
JP4922915B2 (ja) * | 2007-12-28 | 2012-04-25 | 大日本スクリーン製造株式会社 | 基板処理装置および基板の芯合わせ方法 |
JP5352103B2 (ja) * | 2008-03-27 | 2013-11-27 | 東京エレクトロン株式会社 | 熱処理装置および処理システム |
JP2010087473A (ja) * | 2008-07-31 | 2010-04-15 | Canon Anelva Corp | 基板位置合わせ装置及び基板処理装置 |
JP2012064300A (ja) * | 2010-08-18 | 2012-03-29 | Showa Denko Kk | 引き上げ乾燥装置、これを用いた磁気記録媒体用基板又は磁気記録媒体の製造方法 |
US8567837B2 (en) | 2010-11-24 | 2013-10-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reconfigurable guide pin design for centering wafers having different sizes |
JP5451662B2 (ja) * | 2011-02-15 | 2014-03-26 | 東京エレクトロン株式会社 | 液処理装置及び液処理方法 |
JP5926086B2 (ja) * | 2012-03-28 | 2016-05-25 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
TWI636518B (zh) * | 2013-04-23 | 2018-09-21 | 荏原製作所股份有限公司 | 基板處理裝置及處理基板之製造方法 |
JP6229933B2 (ja) * | 2013-09-27 | 2017-11-15 | 株式会社Screenホールディングス | 処理カップ洗浄方法、基板処理方法および基板処理装置 |
CN106104788B (zh) * | 2014-03-25 | 2018-12-07 | 川崎重工业株式会社 | 基板角度对准装置、基板角度对准方法及基板运送方法 |
CN103943546B (zh) * | 2014-04-28 | 2018-08-28 | 北京七星华创电子股份有限公司 | 一种硅片支撑装置 |
CN106024688B (zh) * | 2015-03-27 | 2018-11-30 | 株式会社思可林集团 | 基板处理方法及基板处理装置 |
JP6674674B2 (ja) * | 2015-03-27 | 2020-04-01 | 株式会社Screenホールディングス | 基板保持方法および基板処理装置 |
JP6491044B2 (ja) * | 2015-05-29 | 2019-03-27 | Towa株式会社 | 製造装置及び製造方法 |
JP6614610B2 (ja) * | 2016-02-12 | 2019-12-04 | 株式会社Screenホールディングス | 基板処理装置 |
US10141206B2 (en) | 2016-02-17 | 2018-11-27 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus and gap washing method |
JP6929652B2 (ja) * | 2016-02-17 | 2021-09-01 | 株式会社Screenホールディングス | 基板処理装置および間隙洗浄方法 |
JP6923344B2 (ja) | 2017-04-13 | 2021-08-18 | 株式会社Screenホールディングス | 周縁処理装置および周縁処理方法 |
CN107146768B (zh) * | 2017-06-16 | 2018-03-23 | 英特尔产品(成都)有限公司 | 用于安放物品的装置和对准装置 |
JP6842391B2 (ja) * | 2017-09-07 | 2021-03-17 | キオクシア株式会社 | 半導体製造装置および半導体装置の製造方法 |
JP7116550B2 (ja) * | 2018-02-08 | 2022-08-10 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
TWI711115B (zh) * | 2019-06-26 | 2020-11-21 | 弘塑科技股份有限公司 | 基板傳送設備、半導體製程機台及基板傳送方法 |
JP7439376B2 (ja) | 2020-06-24 | 2024-02-28 | 株式会社東京精密 | ワーク処理システム |
CN111960313A (zh) * | 2020-07-21 | 2020-11-20 | 沈阳芯源微电子设备有限公司 | 基板升降机构 |
CN114486901A (zh) * | 2020-11-13 | 2022-05-13 | 深圳中科飞测科技股份有限公司 | 承载组件及检测设备 |
CN116274096A (zh) * | 2023-04-28 | 2023-06-23 | 苏州冠礼科技有限公司 | 一种夹持式晶圆清洗装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2855046B2 (ja) * | 1993-03-31 | 1999-02-10 | 大日本スクリーン製造株式会社 | 回転式基板処理装置用の基板回転保持装置 |
JPH0638447B2 (ja) * | 1987-05-29 | 1994-05-18 | テラダイン株式会社 | ウエハ位置決め方法 |
US5608446A (en) * | 1994-03-31 | 1997-03-04 | Lucent Technologies Inc. | Apparatus and method for combining high bandwidth and low bandwidth data transfer |
JPH09232405A (ja) | 1996-02-22 | 1997-09-05 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH118287A (ja) * | 1997-06-16 | 1999-01-12 | Jeol Ltd | ウエハー搬送装置 |
JP2002151577A (ja) | 2000-11-15 | 2002-05-24 | Assist Japan Kk | 基板のエッジ保持アライナー |
JP4547524B2 (ja) * | 2000-12-05 | 2010-09-22 | 川崎重工業株式会社 | ワーク処理方法、ワーク処理装置およびロボット |
JP2002264065A (ja) | 2001-03-13 | 2002-09-18 | Yaskawa Electric Corp | ウエハ搬送ロボット |
JP3980941B2 (ja) * | 2002-06-04 | 2007-09-26 | 東京エレクトロン株式会社 | 基板処理装置 |
US7018555B2 (en) * | 2002-07-26 | 2006-03-28 | Dainippon Screen Mfg. Co., Ltd. | Substrate treatment method and substrate treatment apparatus |
JP4262004B2 (ja) * | 2002-08-29 | 2009-05-13 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
JP4144000B2 (ja) * | 2002-11-11 | 2008-09-03 | 和夫 田▲邉▼ | ウエーハセンタリング装置 |
JP2004253756A (ja) | 2002-12-24 | 2004-09-09 | Hitachi High-Tech Electronics Engineering Co Ltd | 基板搭載装置、搬送アーム、半導体ウェーハの位置決め方法、基板の検査装置、及び基板の検査方法 |
JP4339615B2 (ja) | 2003-03-04 | 2009-10-07 | 株式会社ダイヘン | ワークピースの保持機構 |
CN100508159C (zh) | 2004-06-14 | 2009-07-01 | 大日本网目版制造株式会社 | 基板处理装置和基板处理方法 |
JP4446875B2 (ja) * | 2004-06-14 | 2010-04-07 | 大日本スクリーン製造株式会社 | 基板処理装置 |
-
2006
- 2006-03-28 JP JP2006089049A patent/JP4890067B2/ja not_active Expired - Fee Related
-
2007
- 2007-03-21 US US11/689,194 patent/US8262799B2/en active Active
- 2007-03-22 KR KR1020070028081A patent/KR100888107B1/ko active IP Right Grant
- 2007-03-26 TW TW096110350A patent/TWI347650B/zh not_active IP Right Cessation
- 2007-03-28 CN CN2007100914046A patent/CN101047115B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20070097320A (ko) | 2007-10-04 |
US20070227444A1 (en) | 2007-10-04 |
TW200802684A (en) | 2008-01-01 |
JP2007266287A (ja) | 2007-10-11 |
CN101047115A (zh) | 2007-10-03 |
US8262799B2 (en) | 2012-09-11 |
JP4890067B2 (ja) | 2012-03-07 |
CN101047115B (zh) | 2010-08-18 |
KR100888107B1 (ko) | 2009-03-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |