TWI347650B - Substrate processing apparatus and substrate transferring method - Google Patents

Substrate processing apparatus and substrate transferring method

Info

Publication number
TWI347650B
TWI347650B TW096110350A TW96110350A TWI347650B TW I347650 B TWI347650 B TW I347650B TW 096110350 A TW096110350 A TW 096110350A TW 96110350 A TW96110350 A TW 96110350A TW I347650 B TWI347650 B TW I347650B
Authority
TW
Taiwan
Prior art keywords
substrate
processing apparatus
transferring method
substrate processing
substrate transferring
Prior art date
Application number
TW096110350A
Other languages
English (en)
Other versions
TW200802684A (en
Inventor
Nishide Nobuhiko
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200802684A publication Critical patent/TW200802684A/zh
Application granted granted Critical
Publication of TWI347650B publication Critical patent/TWI347650B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
TW096110350A 2006-03-28 2007-03-26 Substrate processing apparatus and substrate transferring method TWI347650B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006089049A JP4890067B2 (ja) 2006-03-28 2006-03-28 基板処理装置および基板搬送方法

Publications (2)

Publication Number Publication Date
TW200802684A TW200802684A (en) 2008-01-01
TWI347650B true TWI347650B (en) 2011-08-21

Family

ID=38557001

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096110350A TWI347650B (en) 2006-03-28 2007-03-26 Substrate processing apparatus and substrate transferring method

Country Status (5)

Country Link
US (1) US8262799B2 (zh)
JP (1) JP4890067B2 (zh)
KR (1) KR100888107B1 (zh)
CN (1) CN101047115B (zh)
TW (1) TWI347650B (zh)

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* Cited by examiner, † Cited by third party
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KR100914743B1 (ko) * 2007-09-06 2009-08-31 세메스 주식회사 기판 처리 장치 및 상기 장치의 기판 감지 방법
JP4922915B2 (ja) * 2007-12-28 2012-04-25 大日本スクリーン製造株式会社 基板処理装置および基板の芯合わせ方法
JP5352103B2 (ja) * 2008-03-27 2013-11-27 東京エレクトロン株式会社 熱処理装置および処理システム
JP2010087473A (ja) * 2008-07-31 2010-04-15 Canon Anelva Corp 基板位置合わせ装置及び基板処理装置
JP2012064300A (ja) 2010-08-18 2012-03-29 Showa Denko Kk 引き上げ乾燥装置、これを用いた磁気記録媒体用基板又は磁気記録媒体の製造方法
US8567837B2 (en) * 2010-11-24 2013-10-29 Taiwan Semiconductor Manufacturing Company, Ltd. Reconfigurable guide pin design for centering wafers having different sizes
JP5451662B2 (ja) * 2011-02-15 2014-03-26 東京エレクトロン株式会社 液処理装置及び液処理方法
JP5926086B2 (ja) * 2012-03-28 2016-05-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
TWI636518B (zh) * 2013-04-23 2018-09-21 荏原製作所股份有限公司 基板處理裝置及處理基板之製造方法
JP6229933B2 (ja) 2013-09-27 2017-11-15 株式会社Ｓｃｒｅｅｎホールディングス 処理カップ洗浄方法、基板処理方法および基板処理装置
SG11201607386RA (en) * 2014-03-25 2016-10-28 Kawasaki Heavy Ind Ltd Substrate angle alignment device, substrate angle alignment method, and substrate transfer method
CN103943546B (zh) * 2014-04-28 2018-08-28 北京七星华创电子股份有限公司 一种硅片支撑装置
US10128139B2 (en) 2015-03-27 2018-11-13 SCREEN Holdings Co., Ltd. Substrate holding method and substrate processing apparatus
JP6674674B2 (ja) * 2015-03-27 2020-04-01 株式会社Ｓｃｒｅｅｎホールディングス 基板保持方法および基板処理装置
JP6491044B2 (ja) * 2015-05-29 2019-03-27 Ｔｏｗａ株式会社 製造装置及び製造方法
JP6614610B2 (ja) * 2016-02-12 2019-12-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6929652B2 (ja) * 2016-02-17 2021-09-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および間隙洗浄方法
US10141206B2 (en) 2016-02-17 2018-11-27 SCREEN Holdings Co., Ltd. Substrate processing apparatus and gap washing method
JP6923344B2 (ja) * 2017-04-13 2021-08-18 株式会社Ｓｃｒｅｅｎホールディングス 周縁処理装置および周縁処理方法
CN107146768B (zh) * 2017-06-16 2018-03-23 英特尔产品（成都）有限公司 用于安放物品的装置和对准装置
JP6842391B2 (ja) * 2017-09-07 2021-03-17 キオクシア株式会社 半導体製造装置および半導体装置の製造方法
JP7116550B2 (ja) * 2018-02-08 2022-08-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
TWI711115B (zh) * 2019-06-26 2020-11-21 弘塑科技股份有限公司 基板傳送設備、半導體製程機台及基板傳送方法
JP7439376B2 (ja) 2020-06-24 2024-02-28 株式会社東京精密 ワーク処理システム
CN111960313A (zh) * 2020-07-21 2020-11-20 沈阳芯源微电子设备有限公司 基板升降机构
CN116274096A (zh) * 2023-04-28 2023-06-23 苏州冠礼科技有限公司 一种夹持式晶圆清洗装置

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* Cited by examiner, † Cited by third party
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JP2855046B2 (ja) * 1993-03-31 1999-02-10 大日本スクリーン製造株式会社 回転式基板処理装置用の基板回転保持装置
JPH0638447B2 (ja) * 1987-05-29 1994-05-18 テラダイン株式会社 ウエハ位置決め方法
US5608446A (en) * 1994-03-31 1997-03-04 Lucent Technologies Inc. Apparatus and method for combining high bandwidth and low bandwidth data transfer
JPH09232405A (ja) 1996-02-22 1997-09-05 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH118287A (ja) * 1997-06-16 1999-01-12 Jeol Ltd ウエハー搬送装置
JP2002151577A (ja) 2000-11-15 2002-05-24 Assist Japan Kk 基板のエッジ保持アライナー
JP4547524B2 (ja) * 2000-12-05 2010-09-22 川崎重工業株式会社 ワーク処理方法、ワーク処理装置およびロボット
JP2002264065A (ja) 2001-03-13 2002-09-18 Yaskawa Electric Corp ウエハ搬送ロボット
JP3980941B2 (ja) * 2002-06-04 2007-09-26 東京エレクトロン株式会社 基板処理装置
US7018555B2 (en) * 2002-07-26 2006-03-28 Dainippon Screen Mfg. Co., Ltd. Substrate treatment method and substrate treatment apparatus
JP4262004B2 (ja) * 2002-08-29 2009-05-13 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4144000B2 (ja) * 2002-11-11 2008-09-03 和夫 田▲邉▼ ウエーハセンタリング装置
JP2004253756A (ja) 2002-12-24 2004-09-09 Hitachi High-Tech Electronics Engineering Co Ltd 基板搭載装置、搬送アーム、半導体ウェーハの位置決め方法、基板の検査装置、及び基板の検査方法
JP4339615B2 (ja) 2003-03-04 2009-10-07 株式会社ダイヘン ワークピースの保持機構
CN100508159C (zh) 2004-06-14 2009-07-01 大日本网目版制造株式会社 基板处理装置和基板处理方法
JP4446875B2 (ja) * 2004-06-14 2010-04-07 大日本スクリーン製造株式会社 基板処理装置

Also Published As

Publication number Publication date
CN101047115A (zh) 2007-10-03
CN101047115B (zh) 2010-08-18
JP4890067B2 (ja) 2012-03-07
JP2007266287A (ja) 2007-10-11
KR20070097320A (ko) 2007-10-04
US20070227444A1 (en) 2007-10-04
US8262799B2 (en) 2012-09-11
KR100888107B1 (ko) 2009-03-11
TW200802684A (en) 2008-01-01

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees