TWI346718B - Process for the production of shaped articles of niobium or tantalum by electrochemical etching - Google Patents

Process for the production of shaped articles of niobium or tantalum by electrochemical etching

Info

Publication number
TWI346718B
TWI346718B TW092136065A TW92136065A TWI346718B TW I346718 B TWI346718 B TW I346718B TW 092136065 A TW092136065 A TW 092136065A TW 92136065 A TW92136065 A TW 92136065A TW I346718 B TWI346718 B TW I346718B
Authority
TW
Taiwan
Prior art keywords
niobium
tantalum
production
shaped articles
electrochemical etching
Prior art date
Application number
TW092136065A
Other languages
English (en)
Other versions
TW200424366A (en
Inventor
Marianne Gottschling
Josua Loffelholz
Mathias Albert
Gunter Sadowski
Original Assignee
Starck H C Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Starck H C Gmbh filed Critical Starck H C Gmbh
Publication of TW200424366A publication Critical patent/TW200424366A/zh
Application granted granted Critical
Publication of TWI346718B publication Critical patent/TWI346718B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/12—Etching of semiconducting materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H9/00—Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/08—Etching of refractory metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • ing And Chemical Polishing (AREA)
TW092136065A 2002-12-20 2003-12-19 Process for the production of shaped articles of niobium or tantalum by electrochemical etching TWI346718B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10259934A DE10259934B3 (de) 2002-12-20 2002-12-20 Verfahren zur Herstellung von Formteilen aus Niob oder Tantal durch elektrochemisches Ätzen und so erhältliche Formteile

Publications (2)

Publication Number Publication Date
TW200424366A TW200424366A (en) 2004-11-16
TWI346718B true TWI346718B (en) 2011-08-11

Family

ID=32519178

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092136065A TWI346718B (en) 2002-12-20 2003-12-19 Process for the production of shaped articles of niobium or tantalum by electrochemical etching

Country Status (10)

Country Link
US (1) US7090763B2 (zh)
EP (1) EP1441049A1 (zh)
JP (1) JP4473561B2 (zh)
KR (1) KR101083489B1 (zh)
CN (1) CN100510198C (zh)
DE (1) DE10259934B3 (zh)
HK (1) HK1068927A1 (zh)
IL (1) IL158979A (zh)
MX (1) MXPA03011443A (zh)
TW (1) TWI346718B (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6921551B2 (en) 2000-08-10 2005-07-26 Asm Nutool, Inc. Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
GB0210397D0 (en) 2002-05-07 2002-06-12 Ferring Bv Pharmaceutical formulations
US8500985B2 (en) 2006-07-21 2013-08-06 Novellus Systems, Inc. Photoresist-free metal deposition
DE102006047713B3 (de) * 2006-10-09 2008-03-27 Poligrat Gmbh Elektropolierverfahren für Niob und Tantal und Elektrolyt
CA2695634C (en) 2007-08-06 2018-01-23 Serenity Pharmaceuticals Corporation Methods and devices for desmopressin drug delivery
DE102007043066A1 (de) 2007-09-10 2009-03-12 Robert Bosch Gmbh Verfahren und Vorrichtung zur elektrochemischen Bearbeitung
JP5034863B2 (ja) * 2007-10-23 2012-09-26 パナソニック株式会社 電解コンデンサ用電極箔の製造方法
US20100286045A1 (en) 2008-05-21 2010-11-11 Bjarke Mirner Klein Methods comprising desmopressin
US11963995B2 (en) 2008-05-21 2024-04-23 Ferring B.V. Methods comprising desmopressin
LT3225250T (lt) * 2008-05-21 2019-11-11 Ferring Bv Burnoje disperguojamas desmopresinas, skirtas nikturijos nepertraukiamo miego pirminio periodo pailginimui
DE202008011646U1 (de) * 2008-09-02 2010-01-28 BECKMANN-INSTITUT für Technologieentwicklung e.V. Einrichtung zum Plasmapolieren unter Verwendung eines flüssigen Elektrolyten
KR101719606B1 (ko) * 2009-11-23 2017-03-24 메트콘, 엘엘씨 전해질 용액 및 전해 연마 방법
KR101139555B1 (ko) * 2010-09-02 2012-04-27 인하대학교 산학협력단 전해 커패시터용 니오븀 박막의 전기화학적 표면 확대 방법
KR20170043668A (ko) * 2010-11-22 2017-04-21 메트콘, 엘엘씨 전해질 용액 및 전기화학적 표면 개질 방법
CN103988270B (zh) * 2011-12-14 2018-01-02 英特尔公司 克服叠层电容器中的偏差
CN107414221B (zh) * 2017-04-14 2019-04-30 哈尔滨工业大学 一种三维微纳结构电化学诱导加工方法
CN108441936A (zh) * 2018-04-19 2018-08-24 湖南工业大学 一种海绵状钽片的制备方法
CN108456917A (zh) * 2018-04-19 2018-08-28 湖南工业大学 一种多孔钽片的制备方法
CN109440179A (zh) * 2019-01-04 2019-03-08 中南大学 一种表面粗化的金属钽基体及其制备方法
DE102019007362A1 (de) * 2019-10-23 2021-04-29 AMtopus GmbH & Co. KG Verfahren und Anlage zum Plasmapolieren
CN113077987B (zh) * 2020-01-03 2022-07-22 深圳先进电子材料国际创新研究院 一种片式钽电解电容器及其制备方法
DE102021000850B3 (de) 2021-02-18 2022-03-03 AMtopus GmbH & Co. KG Elektrolyt und Verfahren zum Plasmapolieren von Edelmetallen

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2775553A (en) * 1952-12-31 1956-12-25 Sprague Electric Co Electrolytic etching process for electrolytic capacitors
US3314867A (en) * 1963-11-01 1967-04-18 James K Gore Method of etching tantalum and niobium for electroplating
DE2027156C3 (de) * 1970-06-03 1975-05-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum anodischen Polieren von Niobteilen
US3689288A (en) 1970-06-18 1972-09-05 Ralston Purina Co High protein pudding
SU662624A1 (ru) * 1976-05-27 1979-05-15 Институт Неорганической Химии Ан Латвийской Сср Способ подготовки поверхности металлов перед нанесением гальванических покрытий
US4266008A (en) * 1979-11-23 1981-05-05 The United States Of America As Represented By The United States Department Of Energy Method for etching thin films of niobium and niobium-containing compounds for preparing superconductive circuits
SU876808A1 (ru) 1979-11-29 1981-10-30 Харьковский Государственный Педагогический Институт Им.Г.С.Сковороды Раствор дл электрохимического полировани изделий из ниоби
JPS5681680A (en) * 1979-12-07 1981-07-03 Matsushita Electric Ind Co Ltd Etching method for niobium
US5690807A (en) * 1995-08-03 1997-11-25 Massachusetts Institute Of Technology Method for producing semiconductor particles
AT410043B (de) 1997-09-30 2003-01-27 Sez Ag Verfahren zum planarisieren von halbleitersubstraten
TW571005B (en) * 2000-06-29 2004-01-11 Ebara Corp Method and apparatus for forming copper interconnects, and polishing liquid and polishing method
US6736952B2 (en) * 2001-02-12 2004-05-18 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece

Also Published As

Publication number Publication date
EP1441049A1 (de) 2004-07-28
US7090763B2 (en) 2006-08-15
KR20040055683A (ko) 2004-06-26
TW200424366A (en) 2004-11-16
IL158979A0 (en) 2004-05-12
HK1068927A1 (en) 2005-05-06
IL158979A (en) 2007-08-19
KR101083489B1 (ko) 2011-11-16
DE10259934B3 (de) 2004-10-14
CN1521288A (zh) 2004-08-18
JP2004207718A (ja) 2004-07-22
JP4473561B2 (ja) 2010-06-02
US20040178081A1 (en) 2004-09-16
CN100510198C (zh) 2009-07-08
MXPA03011443A (es) 2005-04-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees