TWI340996B - Device and method for removing liquid from a surface of a disc-like article - Google Patents

Device and method for removing liquid from a surface of a disc-like article

Info

Publication number
TWI340996B
TWI340996B TW096138859A TW96138859A TWI340996B TW I340996 B TWI340996 B TW I340996B TW 096138859 A TW096138859 A TW 096138859A TW 96138859 A TW96138859 A TW 96138859A TW I340996 B TWI340996 B TW I340996B
Authority
TW
Taiwan
Prior art keywords
article
disc
removing liquid
liquid
Prior art date
Application number
TW096138859A
Other languages
English (en)
Other versions
TW200919561A (en
Inventor
Harald Kraus
Axel Wittershagen
Original Assignee
Lam Res Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Ag filed Critical Lam Res Ag
Publication of TW200919561A publication Critical patent/TW200919561A/zh
Application granted granted Critical
Publication of TWI340996B publication Critical patent/TWI340996B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Drying Of Solid Materials (AREA)
TW096138859A 2006-10-02 2007-10-17 Device and method for removing liquid from a surface of a disc-like article TWI340996B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT16422006 2006-10-02

Publications (2)

Publication Number Publication Date
TW200919561A TW200919561A (en) 2009-05-01
TWI340996B true TWI340996B (en) 2011-04-21

Family

ID=39268880

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096138859A TWI340996B (en) 2006-10-02 2007-10-17 Device and method for removing liquid from a surface of a disc-like article

Country Status (7)

Country Link
US (2) US20100206338A1 (zh)
EP (1) EP2067162B1 (zh)
JP (1) JP5523099B2 (zh)
KR (1) KR101433868B1 (zh)
CN (1) CN101542684B (zh)
TW (1) TWI340996B (zh)
WO (1) WO2008041211A2 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG176708A1 (en) 2009-07-16 2012-01-30 Lam Res Ag Method for drying a semiconductor wafer
JP5538102B2 (ja) 2010-07-07 2014-07-02 株式会社Ｓｏｋｕｄｏ 基板洗浄方法および基板洗浄装置
US9997379B2 (en) * 2010-11-30 2018-06-12 Lam Research Ag Method and apparatus for wafer wet processing
JP5820709B2 (ja) * 2011-11-30 2015-11-24 東京エレクトロン株式会社 基板処理方法、この基板処理方法を実行するためのコンピュータプログラムが記録された記録媒体、および基板処理装置
JP6007925B2 (ja) * 2013-05-28 2016-10-19 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び記憶媒体
CN104216216A (zh) * 2013-06-05 2014-12-17 中芯国际集成电路制造(上海)有限公司 涂布装置的洗边腔室和洗边方法
US10410888B2 (en) * 2014-02-27 2019-09-10 Lam Research Ag Device and method for removing liquid from a surface of a disc-like article
US10720343B2 (en) 2016-05-31 2020-07-21 Lam Research Ag Method and apparatus for processing wafer-shaped articles

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW386235B (en) * 1995-05-23 2000-04-01 Tokyo Electron Ltd Method for spin rinsing
TW402737B (en) * 1997-05-27 2000-08-21 Tokyo Electron Ltd Cleaning/drying device and method
JP3694641B2 (ja) 2000-08-09 2005-09-14 東京エレクトロン株式会社 基板処理装置、現像処理装置及び現像処理方法
JP3803913B2 (ja) * 2001-07-12 2006-08-02 大日本スクリーン製造株式会社 基板乾燥装置、基板乾燥方法および基板のシリコン酸化膜除去方法
US6858091B2 (en) * 2001-07-13 2005-02-22 Lam Research Corporation Method for controlling galvanic corrosion effects on a single-wafer cleaning system
CN101499413B (zh) * 2001-11-02 2011-05-04 应用材料股份有限公司 单个晶片的干燥装置和干燥方法
JP3993048B2 (ja) * 2002-08-30 2007-10-17 大日本スクリーン製造株式会社 基板処理装置
JP4333866B2 (ja) 2002-09-26 2009-09-16 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
KR100493849B1 (ko) * 2002-09-30 2005-06-08 삼성전자주식회사 웨이퍼 건조 장치
US6736896B2 (en) * 2002-10-10 2004-05-18 Taiwan Semiconductor Manufacturing Co., Ltd Gas spray arm for spin coating apparatus
KR20050035318A (ko) * 2003-10-10 2005-04-18 세메스 주식회사 기판 세정 건조 장치 및 방법
JP2005217226A (ja) 2004-01-30 2005-08-11 Matsushita Electric Ind Co Ltd 半導体基板の洗浄方法及び洗浄装置
JP2005217336A (ja) 2004-02-02 2005-08-11 Sony Corp 基板洗浄装置及び基板の洗浄方法
JP4324527B2 (ja) * 2004-09-09 2009-09-02 東京エレクトロン株式会社 基板洗浄方法及び現像装置
KR100672942B1 (ko) * 2004-10-27 2007-01-24 삼성전자주식회사 반도체 소자 제조에 사용되는 기판 건조 장치 및 방법
KR100589107B1 (ko) * 2005-01-19 2006-06-12 삼성전자주식회사 기판 상의 막을 베이크하는 방법 및 이를 수행하기 위한장치
JP2006245381A (ja) * 2005-03-04 2006-09-14 Semes Co Ltd 基板洗浄乾燥装置および方法
US7462246B2 (en) * 2005-04-15 2008-12-09 Memc Electronic Materials, Inc. Modified susceptor for barrel reactor
JP4527660B2 (ja) * 2005-06-23 2010-08-18 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Also Published As

Publication number Publication date
EP2067162B1 (en) 2017-12-13
JP5523099B2 (ja) 2014-06-18
US20110168213A1 (en) 2011-07-14
EP2067162A2 (en) 2009-06-10
CN101542684B (zh) 2013-10-23
JP2011501393A (ja) 2011-01-06
CN101542684A (zh) 2009-09-23
KR20100056993A (ko) 2010-05-28
WO2008041211A3 (en) 2008-08-21
WO2008041211A2 (en) 2008-04-10
KR101433868B1 (ko) 2014-08-29
TW200919561A (en) 2009-05-01
US8911561B2 (en) 2014-12-16
US20100206338A1 (en) 2010-08-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees