SG10201401438YA - Apparatus and method for using a viscoelastic cleaning material to remove particles on a substrate - Google Patents

Apparatus and method for using a viscoelastic cleaning material to remove particles on a substrate

Info

Publication number
SG10201401438YA
SG10201401438YA SG10201401438YA SG10201401438YA SG10201401438YA SG 10201401438Y A SG10201401438Y A SG 10201401438YA SG 10201401438Y A SG10201401438Y A SG 10201401438YA SG 10201401438Y A SG10201401438Y A SG 10201401438YA SG 10201401438Y A SG10201401438Y A SG 10201401438YA
Authority
SG
Singapore
Prior art keywords
substrate
cleaning material
remove particles
viscoelastic cleaning
viscoelastic
Prior art date
Application number
SG10201401438YA
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201401438YA publication Critical patent/SG10201401438YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/04—Cleaning by suction, with or without auxiliary action
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0014—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by incorporation in a layer which is removed with the contaminants
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3723—Polyamines or polyalkyleneimines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • C11D2111/22—
SG10201401438YA 2009-04-14 2010-04-09 Apparatus and method for using a viscoelastic cleaning material to remove particles on a substrate SG10201401438YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/423,759 US20100258142A1 (en) 2009-04-14 2009-04-14 Apparatus and method for using a viscoelastic cleaning material to remove particles on a substrate

Publications (1)

Publication Number Publication Date
SG10201401438YA true SG10201401438YA (en) 2014-06-27

Family

ID=42933350

Family Applications (2)

Application Number Title Priority Date Filing Date
SG2011068244A SG174499A1 (en) 2009-04-14 2010-04-09 Apparatus and method for using a viscoelastic cleaning material to remove particles on a substrate
SG10201401438YA SG10201401438YA (en) 2009-04-14 2010-04-09 Apparatus and method for using a viscoelastic cleaning material to remove particles on a substrate

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG2011068244A SG174499A1 (en) 2009-04-14 2010-04-09 Apparatus and method for using a viscoelastic cleaning material to remove particles on a substrate

Country Status (7)

Country Link
US (1) US20100258142A1 (en)
JP (1) JP5789598B2 (en)
KR (1) KR101475994B1 (en)
CN (1) CN102387872B (en)
SG (2) SG174499A1 (en)
TW (1) TWI524401B (en)
WO (1) WO2010120654A1 (en)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9159593B2 (en) * 2008-06-02 2015-10-13 Lam Research Corporation Method of particle contaminant removal
TWI445065B (en) * 2009-12-18 2014-07-11 J E T Co Ltd Substrate processing device
JP5986591B2 (en) * 2011-03-04 2016-09-06 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Methods for cleaning contacts
CA2856196C (en) 2011-12-06 2020-09-01 Masco Corporation Of Indiana Ozone distribution in a faucet
CN103377971A (en) * 2012-04-30 2013-10-30 细美事有限公司 Apparatus and method for cleaning substrates
US9117760B2 (en) * 2013-01-30 2015-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for energized and pressurized liquids for cleaning/etching applications in semiconductor manufacturing
JP6225067B2 (en) * 2013-06-21 2017-11-01 東京エレクトロン株式会社 Substrate liquid processing apparatus and substrate liquid processing method
JP6308910B2 (en) 2013-11-13 2018-04-11 東京エレクトロン株式会社 Substrate cleaning method, substrate cleaning system, and storage medium
US10688536B2 (en) * 2014-02-24 2020-06-23 The Boeing Company System and method for surface cleaning
US10119101B2 (en) * 2014-04-28 2018-11-06 Ecolab Usa Inc. Method of minimizing enzyme based aerosol mist using a pressure spray system
CN107075411A (en) * 2014-09-18 2017-08-18 应用材料公司 The method and apparatus cleaned using CMP after the high efficiency of the viscous fluid through design
US10276469B2 (en) * 2015-04-17 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd Method for forming semiconductor device structure
US11752529B2 (en) 2015-05-15 2023-09-12 Acm Research (Shanghai) Inc. Method for cleaning semiconductor wafers
WO2017112795A1 (en) 2015-12-21 2017-06-29 Delta Faucet Company Fluid delivery system including a disinfectant device
KR102000022B1 (en) * 2016-11-28 2019-07-17 세메스 주식회사 Substrate treating apparatus and substrate treating method
KR102208754B1 (en) 2017-07-10 2021-01-28 세메스 주식회사 Substrate treating apparatus and substrate treating method
US11065654B2 (en) * 2017-07-17 2021-07-20 Lam Research Corporation In situ vapor deposition polymerization to form polymers as precursors to viscoelastic fluids for particle removal from substrates
JP7010629B2 (en) 2017-08-31 2022-01-26 株式会社Ｓｃｒｅｅｎホールディングス Substrate drying method and substrate processing equipment
JP6966899B2 (en) * 2017-08-31 2021-11-17 株式会社Ｓｃｒｅｅｎホールディングス Substrate drying method and substrate processing equipment
US11302525B2 (en) * 2017-09-22 2022-04-12 SCREEN Holdings Co., Ltd. Substrate processing method and substrate processing apparatus
KR102517663B1 (en) * 2017-11-15 2023-04-05 에이씨엠 리서치 (상하이), 인코포레이티드 How to Clean Semiconductor Wafers
KR20190086859A (en) * 2018-01-15 2019-07-24 삼성전자주식회사 Substrate Support Mechanism And Substrate Cleaning Device Including The Same
KR102046973B1 (en) * 2018-04-10 2019-12-02 세메스 주식회사 Method and apparatus for substrate cleaning
KR102639924B1 (en) * 2019-05-10 2024-02-23 주식회사 케이씨텍 Substrate receiver of substrate spinning apparatus
DE102020114854A1 (en) * 2019-09-27 2021-04-01 Taiwan Semiconductor Manufacturing Company Ltd. METHOD OF CLEANING A SUBSTRATE
CN114206516B (en) * 2020-04-30 2023-07-04 株式会社村田制作所 Cleaning device, imaging unit provided with cleaning device, and cleaning method
CN111744891B (en) * 2020-05-22 2022-06-10 西安奕斯伟材料科技有限公司 Method for cleaning surface of adsorption table of grinding machine
CN111806007B (en) * 2020-06-12 2022-09-02 中国南方电网有限责任公司超高压输电公司检修试验中心 Elastic functional membrane for removing dirt and preparation method thereof
JP2022023730A (en) * 2020-07-27 2022-02-08 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing apparatus
JP2023005188A (en) * 2021-06-28 2023-01-18 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing apparatus

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6178123A (en) * 1984-09-26 1986-04-21 Dainippon Screen Mfg Co Ltd Process and device of processing substrate surface
US4998549A (en) * 1987-04-29 1991-03-12 Verteq, Inc. Megasonic cleaning apparatus
JPH03145130A (en) * 1989-10-17 1991-06-20 Applied Materials Inc Device for removing contaminated grains from body surface and method
US5090432A (en) * 1990-10-16 1992-02-25 Verteq, Inc. Single wafer megasonic semiconductor wafer processing system
US5813087A (en) * 1995-09-08 1998-09-29 Bissell Inc. Spray nozzle for use with water extraction cleaning machine
US5839460A (en) * 1997-11-13 1998-11-24 Memc Electronic Materials, Inc. Apparatus for cleaning semiconductor wafers
JP2001179196A (en) * 1999-12-27 2001-07-03 Toshiba Microelectronics Corp Ultrasonic cleaning process and device for the same
US7364625B2 (en) * 2000-05-30 2008-04-29 Fsi International, Inc. Rinsing processes and equipment
US6719619B2 (en) * 2001-05-01 2004-04-13 Taiwan Semiconductor Manufacturing Co., Ltd Quick coupler for mounting a rotational disk
KR20040018558A (en) * 2001-08-13 2004-03-03 가부시키 가이샤 에바라 세이사꾸쇼 Semiconductor device and production method therefor, and plating solution
US8236382B2 (en) * 2002-09-30 2012-08-07 Lam Research Corporation Proximity substrate preparation sequence, and method, apparatus, and system for implementing the same
US7045018B2 (en) * 2002-09-30 2006-05-16 Lam Research Corporation Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and method, apparatus, and system for implementing the same
DE602004019061D1 (en) * 2003-03-20 2009-03-05 Sez Ag DEVICE AND METHOD FOR WET TREATMENT OF SLICED ARTICLES
US7799141B2 (en) * 2003-06-27 2010-09-21 Lam Research Corporation Method and system for using a two-phases substrate cleaning compound
TWI365491B (en) * 2003-12-24 2012-06-01 Kao Corp Composition for cleaning semiconductor device
JP4566556B2 (en) * 2003-12-25 2010-10-20 ルネサスエレクトロニクス株式会社 Single wafer chemical treatment method
JP2006005246A (en) * 2004-06-18 2006-01-05 Fujimi Inc Rinsing composition and rinsing method using the same
JP2008513200A (en) * 2004-09-15 2008-05-01 アクリオン テクノロジーズ インク Apparatus and method for moving a sonic energy source, and substrate processing using the same
DE602006004624D1 (en) * 2005-02-23 2009-02-26 Jsr Corp Chemical-mechanical polishing process
US7144299B2 (en) * 2005-05-09 2006-12-05 Intel Corporation Methods and devices for supporting substrates using fluids
JP4908879B2 (en) * 2006-02-28 2012-04-04 大日本スクリーン製造株式会社 Substrate processing method and substrate processing apparatus
JP2008177495A (en) * 2007-01-22 2008-07-31 Dainippon Screen Mfg Co Ltd Method and apparatus for processing substrate
US7981221B2 (en) * 2008-02-21 2011-07-19 Micron Technology, Inc. Rheological fluids for particle removal

Also Published As

Publication number Publication date
SG174499A1 (en) 2011-11-28
TW201104735A (en) 2011-02-01
US20100258142A1 (en) 2010-10-14
KR20120004451A (en) 2012-01-12
CN102387872B (en) 2016-01-13
TWI524401B (en) 2016-03-01
KR101475994B1 (en) 2014-12-23
JP5789598B2 (en) 2015-10-07
CN102387872A (en) 2012-03-21
JP2012524408A (en) 2012-10-11
WO2010120654A1 (en) 2010-10-21

Similar Documents

Publication Publication Date Title
SG10201401438YA (en) Apparatus and method for using a viscoelastic cleaning material to remove particles on a substrate
HK1217979A1 (en) Method for cleaning a soiled substrate in an improved cleaning apparatus
TWI368267B (en) Method and apparatus for cleaning a substrate surface
PL2291247T3 (en) Method and device for removing contaminatting particles from containers
EP2178655A4 (en) Apparatus and method for indirect surface cleaning
HK1125544A1 (en) A method for cleaning vegetables and apparatus thereof
EP2554808A4 (en) Method and device for cleaning filter for removing particulate matter
PL2684644T3 (en) Apparatus and method for removing scale
EP2235288A4 (en) Method and apparatus for removing a film from a surface
EG26081A (en) A process and a device to clean substrates
GB2473964B (en) Improved blockage removal apparatus and method
ZA201005131B (en) Method and apparatus for sorting particles
EP2514693A4 (en) Device and method for cleaning conveying surface
SI2052791T1 (en) Device and method for cleaning bulk material
PL2446246T3 (en) Device and method for selecting particles
GB0921152D0 (en) Apparatus and method for recovering material
EP2177278A4 (en) Substrate cleaning apparatus and method of cleaning substrate
GB2478197B (en) Method and apparatus for cleaning filters
ZA201205199B (en) Apparatus and method for ultrasonically cleaning industrial components
SG10201405733WA (en) Method and apparatus for showerhead cleaning
ZA201102445B (en) Process for removing asphaltenic particles
SI2445658T1 (en) Method and apparatus for making particulate material
PL2519351T3 (en) Method for removing calcium material from substrates
EP2229244A4 (en) Method and apparatus for cleaning a substantially vertical surface
ZA201200523B (en) A method and apparatus for processing nuts and seeds