TWI338190B - - Google Patents

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Publication number
TWI338190B
TWI338190B TW093132623A TW93132623A TWI338190B TW I338190 B TWI338190 B TW I338190B TW 093132623 A TW093132623 A TW 093132623A TW 93132623 A TW93132623 A TW 93132623A TW I338190 B TWI338190 B TW I338190B
Authority
TW
Taiwan
Prior art keywords
methyl
acid
propyl
ester
radiation
Prior art date
Application number
TW093132623A
Other languages
English (en)
Chinese (zh)
Other versions
TW200516347A (en
Inventor
Kimiyasu Sano
Michinori Nishikawa
Takaki Minowa
Eiji Takamoto
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200516347A publication Critical patent/TW200516347A/zh
Application granted granted Critical
Publication of TWI338190B publication Critical patent/TWI338190B/zh

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/023Macromolecular quinonediazides; Macromolecular additives, e.g. binders

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
TW093132623A 2003-10-28 2004-10-27 Radiation-sensitive resin composition, interlayer insulating film and microlens TW200516347A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003367211A JP4363161B2 (ja) 2003-10-28 2003-10-28 感放射線性樹脂組成物、並びに層間絶縁膜およびマイクロレンズの形成方法

Publications (2)

Publication Number Publication Date
TW200516347A TW200516347A (en) 2005-05-16
TWI338190B true TWI338190B (ko) 2011-03-01

Family

ID=34645279

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093132623A TW200516347A (en) 2003-10-28 2004-10-27 Radiation-sensitive resin composition, interlayer insulating film and microlens

Country Status (3)

Country Link
JP (1) JP4363161B2 (ko)
KR (1) KR101057883B1 (ko)
TW (1) TW200516347A (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050113351A (ko) * 2004-05-27 2005-12-02 주식회사 동진쎄미켐 감광성 수지 조성물
US8828651B2 (en) * 2005-07-25 2014-09-09 Nissan Chemical Industries, Ltd. Positive-type photosensitive resin composition and cured film manufactured therefrom
JP4696761B2 (ja) * 2005-08-02 2011-06-08 住友化学株式会社 感放射線性樹脂組成物
JP2008105999A (ja) 2006-10-25 2008-05-08 Idemitsu Kosan Co Ltd アダマンタン誘導体、その製造方法、樹脂組成物およびその硬化物
KR101401564B1 (ko) 2007-01-22 2014-06-03 닛산 가가쿠 고교 가부시키 가이샤 포지티브형 감광성 수지조성물
JP4905700B2 (ja) * 2007-05-16 2012-03-28 Jsr株式会社 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズならびにそれらの形成方法
KR102069746B1 (ko) * 2012-11-30 2020-01-23 롬엔드하스전자재료코리아유한회사 포지티브형 감광성 수지 조성물 및 이로부터 제조된 경화막
US20140240645A1 (en) * 2013-02-27 2014-08-28 Samsung Display Co., Ltd. Photosensitive resin composition, display device using the same and method of manufacturing the display device
JP6218393B2 (ja) * 2013-02-28 2017-10-25 東京応化工業株式会社 層間絶縁膜用感光性樹脂組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5919597A (en) * 1997-10-30 1999-07-06 Ibm Corporation Of Armonk Methods for preparing photoresist compositions
JP4524944B2 (ja) * 2001-03-28 2010-08-18 Jsr株式会社 感放射線性樹脂組成物、その層間絶縁膜およびマイクロレンズの形成への使用、ならびに層間絶縁膜およびマイクロレンズ
JP3838626B2 (ja) * 2001-09-07 2006-10-25 東京応化工業株式会社 感光性樹脂組成物及びそれを用いたパターンの形成方法

Also Published As

Publication number Publication date
KR101057883B1 (ko) 2011-08-19
KR20050040747A (ko) 2005-05-03
JP2005134440A (ja) 2005-05-26
TW200516347A (en) 2005-05-16
JP4363161B2 (ja) 2009-11-11

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