TW200516347A - Radiation-sensitive resin composition, interlayer insulating film and microlens - Google Patents
Radiation-sensitive resin composition, interlayer insulating film and microlensInfo
- Publication number
- TW200516347A TW200516347A TW093132623A TW93132623A TW200516347A TW 200516347 A TW200516347 A TW 200516347A TW 093132623 A TW093132623 A TW 093132623A TW 93132623 A TW93132623 A TW 93132623A TW 200516347 A TW200516347 A TW 200516347A
- Authority
- TW
- Taiwan
- Prior art keywords
- radiation
- insulating film
- interlayer insulating
- microlens
- forming
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
Abstract
The present invention provides a radiation-sensitive resin composition which is safe for a living body, which has favorable coating property even for a large substrate, high sensitivity, sufficient development margin, high solvent resistance, high heat resistance and high transmittance, and in particular, which is useful for forming an interlayer insulating film and a microlens, and to provide an interlayer insulating film and a microlens formed from the composition, and a method for forming them. The radiation-sensitive resin composition contains (A) an alkali-soluble resin, (B) a radiation-sensitive acid generating agent and (C) an organic solvent represented by 1-methoxy-2-(2-methoxypropoxy)propane, 1-methyl-2-methoxyethyl propionate, 2-n-propoxypropyl acetate or the like. The method for forming an interlayer insulating film and a microlens includes the steps of: (i) forming a coating film of the above composition on a substrate; (ii) exposing to radiation; (iii) developing; and (iv) heating.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003367211A JP4363161B2 (en) | 2003-10-28 | 2003-10-28 | Radiation-sensitive resin composition, and method for forming interlayer insulating film and microlens |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200516347A true TW200516347A (en) | 2005-05-16 |
TWI338190B TWI338190B (en) | 2011-03-01 |
Family
ID=34645279
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093132623A TW200516347A (en) | 2003-10-28 | 2004-10-27 | Radiation-sensitive resin composition, interlayer insulating film and microlens |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4363161B2 (en) |
KR (1) | KR101057883B1 (en) |
TW (1) | TW200516347A (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050113351A (en) * | 2004-05-27 | 2005-12-02 | 주식회사 동진쎄미켐 | Photosensitive resin composition |
CN1904736B (en) * | 2005-07-25 | 2012-06-13 | 日产化学工业株式会社 | Positive-type photosensitive resin composition and cured film manufactured therefrom |
JP4696761B2 (en) * | 2005-08-02 | 2011-06-08 | 住友化学株式会社 | Radiation sensitive resin composition |
JP2008105999A (en) | 2006-10-25 | 2008-05-08 | Idemitsu Kosan Co Ltd | Adamantane derivative, method for producing the same, resin composition and its cured product |
EP2109001B1 (en) | 2007-01-22 | 2012-01-11 | Nissan Chemical Industries, Ltd. | Positive photosensitive resin composition |
JP4905700B2 (en) * | 2007-05-16 | 2012-03-28 | Jsr株式会社 | Radiation-sensitive resin composition, interlayer insulating film, microlens and method for forming them |
KR102069746B1 (en) * | 2012-11-30 | 2020-01-23 | 롬엔드하스전자재료코리아유한회사 | Positive-type photosensitive resin composition and cured film prepared therefrom |
US20140240645A1 (en) * | 2013-02-27 | 2014-08-28 | Samsung Display Co., Ltd. | Photosensitive resin composition, display device using the same and method of manufacturing the display device |
JP6218393B2 (en) * | 2013-02-28 | 2017-10-25 | 東京応化工業株式会社 | Photosensitive resin composition for interlayer insulation film |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5919597A (en) * | 1997-10-30 | 1999-07-06 | Ibm Corporation Of Armonk | Methods for preparing photoresist compositions |
JP4524944B2 (en) * | 2001-03-28 | 2010-08-18 | Jsr株式会社 | Radiation sensitive resin composition, its use for forming interlayer insulating film and microlens, and interlayer insulating film and microlens |
JP3838626B2 (en) * | 2001-09-07 | 2006-10-25 | 東京応化工業株式会社 | Photosensitive resin composition and pattern forming method using the same |
-
2003
- 2003-10-28 JP JP2003367211A patent/JP4363161B2/en not_active Expired - Lifetime
-
2004
- 2004-10-27 KR KR1020040086075A patent/KR101057883B1/en active IP Right Grant
- 2004-10-27 TW TW093132623A patent/TW200516347A/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR20050040747A (en) | 2005-05-03 |
TWI338190B (en) | 2011-03-01 |
JP4363161B2 (en) | 2009-11-11 |
KR101057883B1 (en) | 2011-08-19 |
JP2005134440A (en) | 2005-05-26 |
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