JP2015108881A - Method for manufacturing touch panel substrate with cured film, photosensitive resin composition, photosensitive element, and touch panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a touch panel substrate with a cured film, which has a cured film having sufficient antirust property even in a thin film state and having excellent alkali developability on a predetermined touch panel substrate.SOLUTION: A photosensitive layer 20 comprising the following photosensitive resin composition is disposed on a touch panel substrate 100: the photosensitive resin composition comprises a binder polymer having a carboxyl group and having an acid value of 80 to 100 mgKOH/g, a photopolymerizable compound, and a photopolymerization initiator. A predetermined part of the photosensitive layer 20 is cured by irradiation with actinic rays L, and then the photosensitive layer 20 other than the predetermined part is removed so as to form a cured film 22 in the predetermined part of the photosensitive layer 20, covering a part of or the whole of the substrate 100.

Description

  The present invention relates to a method for producing a substrate for a touch panel with a cured film, a photosensitive resin composition and a photosensitive element used therein, and a touch panel.

  Liquid crystal display elements or touch panels (touch sensors) are used in large electronic devices such as personal computers and televisions, small electronic devices such as car navigation systems, mobile phones, and electronic dictionaries, and display devices such as OA / FA devices. These liquid crystal display elements or touch panels are provided with electrodes made of a transparent conductive electrode material. As the transparent conductive electrode material, indium tin oxide (Indium-Tin-Oxide: ITO), indium oxide or tin oxide is known. Since these materials exhibit high visible light transmittance, they are mainly used as electrode materials used for substrates for liquid crystal display elements.

  Various types of touch panels have already been put to practical use. In recent years, the use of capacitive touch panels has progressed. In a capacitive touch panel, when a fingertip that is a conductor comes into contact with a touch input surface, capacitance is coupled between the fingertip and the conductive film to form a capacitor. For this reason, the capacitive touch panel detects the coordinates by capturing the change in charge at the contact position of the fingertip.

  In particular, the projected capacitive touch panel can detect multiple points on the fingertip, and thus has good operability such that a complicated instruction can be given. Projection capacitive touch panels are increasingly used as input devices on display surfaces in devices having small display devices such as mobile phones and portable music players because of their good operability.

  In general, in a projected capacitive touch panel, a plurality of X electrodes and a plurality of Y electrodes orthogonal to the X electrodes have a two-layer structure in order to express two-dimensional coordinates based on the X axis and the Y axis. Is forming.

  By the way, since the frame region of the touch panel is a region where the touch position cannot be detected, reducing the area of the frame region is an important element for improving the product value. In the frame area, metal wiring is required to transmit a touch position detection signal, but in order to reduce the frame area, it is necessary to reduce the width of the metal wiring. Generally, copper is used for metal wiring.

  However, in the touch panel as described above, corrosive components such as moisture and salt may intrude into the inside from the sensing region when touching the fingertip. When a corrosive component enters the inside of the touch panel, the metal wiring is corroded, and there is a risk of an increase in electrical resistance between the electrode and the drive circuit, or disconnection.

  In order to prevent corrosion of metal wiring, a method is known in which a photosensitive layer made of a highly transparent photosensitive resin composition is provided on the metal wiring, and exposure and development are performed (for example, Patent Documents 1 to 3).

International Publication No. 2013/084873 International Publication No. 2013/084886 International Publication No. 2013/084883

  However, the methods described in the above patent documents have room for improvement in achieving both rust prevention and developability.

  An object of the present invention is to provide a method for producing a base material for a touch panel with a cured film having a cured film having sufficient rust prevention properties and excellent alkali developability on a base material for a touch panel. And Moreover, an object of this invention is to provide the touchscreen provided with the photosensitive resin composition and photosensitive element which can form such a cured film, and the base material for touchscreens with a cured film.

  As a result of intensive investigations by the present inventors to solve the above problems, a photosensitive resin composition containing a specific binder polymer, a photopolymerizable compound, and a photopolymerization initiator has sufficient developability, and light It has been found that even if the film formed by curing is a thin film (for example, 15 μm or less), it exhibits sufficient rust prevention properties and can sufficiently prevent corrosion of metals such as copper, and has completed the present invention. Specific embodiments are shown below.

<1> A photosensitive resin composition containing a binder polymer having a carboxyl group and an acid value of 80 to 100 mgKOH / g, a photopolymerizable compound, and a photopolymerization initiator on a touch panel substrate. The photosensitive layer is provided with a photosensitive layer comprising a product, and a predetermined portion of the photosensitive layer is cured by irradiation with actinic rays, and then the photosensitive layer is removed except for the predetermined portion to cover a part or all of the substrate. The manufacturing method of the base material for touchscreens with a cured film which forms the cured film of the said predetermined part.
The manufacturing method of the touchscreen with a cured film as described in <1> whose glass transition temperature of <2> binder polymer is 60 degreeC or more.
<3> A trifunctional or higher (meth) acrylate compound having a trimethylolpropane skeleton, a trifunctional or higher (meth) acrylate compound having a ditrimethylolpropane skeleton, and a trifunctional or higher functional having a pentaerythritol skeleton. (Meth) acrylate compounds, trifunctional or higher functional (meth) acrylate compounds having a dipentaerythritol skeleton, trifunctional or higher functional (meth) acrylate compounds having a glycerol skeleton, trifunctional or higher functional (meth) acrylate compounds having a diglycerin skeleton, and For a touch panel with a cured film according to <1> or <2>, comprising at least one (meth) acrylate compound having 3 or more (meth) acryloyl groups selected from the group consisting of these alkylene oxide-modified compounds A method for producing a substrate.
<4> The photosensitive resin composition according to any one of <1> to <3>, further including at least one compound selected from the group consisting of a triazole compound, a thiadiazole compound, and a tetrazole compound. Of manufacturing a base material for a touch panel with a cured film.
The manufacturing method of the base material for touchscreens with a cured film as described in any one of <1>-<4> in which a <5> photosensitive resin composition further contains a phosphate ester compound.
The manufacturing method of the base material for touchscreens with a cured film as described in any one of <1>-<5> in which a <6> photoinitiator contains an oxime ester compound or a phosphine oxide compound.
<7> A photosensitive element comprising a support film and a photosensitive layer made of the photosensitive resin composition provided on the support film is prepared, and the photosensitive layer of the photosensitive element is transferred onto the substrate. And the manufacturing method of the base material for touchscreens with a cured film as described in any one of <1>-<6> which provides the said photosensitive layer.
<8> A cured film is formed on a touch panel substrate containing a binder polymer having a carboxyl group and an acid value of 80 to 100 mgKOH / g, a photopolymerizable compound, and a photopolymerization initiator. A photosensitive resin composition.
<9> The photosensitive resin composition according to <8>, wherein the binder polymer has a glass transition temperature of 60 ° C. or higher.
<10> A trifunctional or higher-functional (meth) acrylate compound having a trimethylolpropane skeleton, a trifunctional or higher functional (meth) acrylate compound having a ditrimethylolpropane skeleton, or a trifunctional or higher functional (having a pentaerythritol skeleton). (Meth) acrylate compounds, trifunctional or higher functional (meth) acrylate compounds having a dipentaerythritol skeleton, trifunctional or higher functional (meth) acrylate compounds having a glycerol skeleton, trifunctional or higher functional (meth) acrylate compounds having a diglycerin skeleton, and The photosensitive resin composition according to <8> or <9>, comprising at least one (meth) acrylate compound having 3 or more (meth) acryloyl groups selected from the group consisting of these alkylene oxide-modified compounds. .
<11> The photosensitive resin composition according to any one of <8> to <10>, further containing at least one compound selected from the group consisting of a triazole compound, a thiadiazole compound, and a tetrazole compound.
<12> The photosensitive resin composition according to any one of <8> to <11>, further containing a phosphate ester compound.
The photosensitive resin composition as described in any one of <8>-<12> in which a <13> photoinitiator contains an oxime ester compound or a phosphine oxide compound.
A photosensitive element provided with a <14> support film and the photosensitive layer which consists of the photosensitive resin composition as described in any one of <8>-<13> provided on this support film.
<15> The photosensitive element according to <14>, wherein the photosensitive layer has a thickness of 15 μm or less.
<16> A touch panel provided with the base material for touchscreens with a cured film obtained by the method as described in any one of <1>-<7>.

  ADVANTAGE OF THE INVENTION According to this invention, on the base material for touchscreens, while having transparency, sufficient developability, even if it is a thin film, the manufacturing method of the base material for touchscreens with a cured film which has a cured film excellent in rust prevention property Can be provided. Moreover, according to this invention, a touch panel provided with the photosensitive resin composition and photosensitive element which can form such a cured film, and the base material for touch panels with a cured film can be provided.

  Moreover, according to this invention, the metal electrode of an electrostatic capacitance type touch panel can be protected. Furthermore, according to this invention, it can also be used in order to insulate between a metal electrode.

It is a schematic cross section which shows one Embodiment of the photosensitive element of this invention. It is a schematic cross section for demonstrating one Embodiment of the manufacturing method of the base material for touchscreens with a cured film of this invention. It is a model top view which shows an example of an electrostatic capacitance type touch panel. It is a schematic top view which shows another example of an electrostatic capacitance type touch panel. (A) is the fragmentary sectional view in alignment with the VV line | wire of C part shown by FIG. 3, (b) is a fragmentary sectional view which shows another aspect. It is a top view which shows an example of the electrostatic capacitance type touch panel in which a transparent electrode exists in the same plane. It is a partially cutaway perspective view showing an example of a capacitive touch panel in which transparent electrodes are present on the same plane. FIG. 8 is a partial cross-sectional view taken along line VIII-VIII in FIG. 7. It is a figure for demonstrating an example of the manufacturing method of the capacitive touch panel in which a transparent electrode exists in the same plane, (a) is a partially notched perspective view which shows the board | substrate provided with a transparent electrode, (b) FIG. 3 is a partially cutaway perspective view showing the obtained capacitive touch panel. It is a figure for demonstrating an example of the manufacturing method of the electrostatic capacitance type touch panel in which a transparent electrode exists in the same plane, (a) is a fragmentary sectional view along the Xa-Xa line | wire in FIG. ) Is a partial cross-sectional view showing a step of providing an insulating film, and (c) is a partial cross-sectional view taken along line Xc-Xc in FIG. 9. It is a partial top view which shows an example of the touchscreen which provided the insulating film on the transparent electrode wiring, provided the lead-out wiring on it, and the transparent electrode and the lead-out wiring were connected by the opening part.

  Hereinafter, embodiments for carrying out the present invention will be described in detail. However, the present invention is not limited to the following embodiments.

  In the present specification, “(meth) acrylic acid” means acrylic acid or methacrylic acid, “(meth) acrylate” means acrylate or methacrylate, and “(meth) acryloyl group” An acryloyl group or a methacryloyl group is meant. “Alkylene oxide modification” means having a (poly) oxyalkylene chain, and “(poly) oxyalkylene chain” means an oxyalkylene chain or a polyoxyalkylene chain. “(EO) modified” means having a (poly) oxyethylene chain.

  In this specification, the term “process” is not limited to an independent process, and is included in the term if the intended action of the process is achieved even when it cannot be clearly distinguished from other processes. . Moreover, the numerical value range shown using "to" in this specification shows the range which includes the numerical value described before and behind "to" as a minimum value and a maximum value, respectively.

  In the present specification, the content of each component in the composition is the total amount of the plurality of substances present in the composition unless there is a specific notice when there are a plurality of substances corresponding to each component in the composition. means.

In this specification, the cured film of the base material for touch panels can be provided as a protective film in the sensing area | region which has an electrode, the frame area | region which has metal wiring, or another area | region. The protective film of the base material for touch panels may be provided only in one of the regions, or may be provided in a plurality of regions. Furthermore, the position and range of providing the protective film, such as being provided on a part of the electrode formed in the sensing region, can be appropriately selected according to the purpose of use.
Further, in this specification, the cured film of the base material for a touch panel can be provided as an insulating film in a region where insulation between the electrodes is desired.

  FIG. 1 is a schematic cross-sectional view showing an embodiment of the photosensitive element of the present invention. A photosensitive element 1 shown in FIG. 1 includes a support film 10, a photosensitive layer 20 made of the photosensitive resin composition according to the present invention provided on the support film, and the opposite side of the photosensitive layer 20 from the support film 10. It is comprised from the protective film 30 provided in.

  The photosensitive element of this embodiment can be used suitably for formation of the protective film of the base material for touchscreens.

  Examples of the support film 10 include a film made of polyethylene terephthalate, polycarbonate, polyethylene, polypropylene, or polyether sulfone.

  The thickness of the support film 10 is preferably 5 to 100 μm, more preferably 10 to 70 μm, from the viewpoint of ensuring coverage and suppressing a decrease in resolution when exposed through the support film. More preferably, it is 15-60 micrometers.

  The photosensitive resin composition according to the present invention constituting the photosensitive layer 20 includes a specific binder polymer (hereinafter also referred to as (A) component), a photopolymerizable compound (hereinafter also referred to as (B) component), light A polymerization initiator (hereinafter also referred to as component (C)).

  According to the photosensitive resin composition according to the present embodiment, a protective film having sufficient rust prevention property is formed even when the thickness is, for example, 15 μm or less, while ensuring developability and adhesion to a substrate. Can do.

  In the present embodiment, the binder polymer as the component (A) is not particularly limited as long as it has a specific acid value, but (a1) a structural unit derived from (meth) acrylic acid, and (a2) ( A copolymer containing a structural unit derived from a (meth) acrylic acid alkyl ester is preferred.

  (A2) Examples of (meth) acrylic acid alkyl esters include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and (meth) acrylic. The acid hydroxyethyl is mentioned.

  The copolymer may further contain a monomer copolymerizable with the component (a1) or the component (a2) in the structural unit.

  Examples of the monomer copolymerizable with the component (a1) or the component (a2) include, for example, tetrahydrofurfuryl (meth) acrylate, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, (meth ) Glycidyl acrylate, benzyl (meth) acrylate, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate, acrylamide, acrylonitrile, diacetone acrylamide, Styrene and vinyl toluene are mentioned. When synthesizing the binder polymer as the component (A), the above monomers may be used alone or in combination of two or more.

  The molecular weight of the binder polymer as component (A) is not particularly limited, but from the viewpoint of coating properties, coating film strength, and developability, it is usually a weight average molecular weight (a value measured in terms of standard polystyrene using GPC). ) Is preferably 10,000 to 200,000, more preferably 30,000 to 150,000, still more preferably 50,000 to 100,000, and 50,000 to 70,000. It is very preferable that In addition, the measurement conditions of a weight average molecular weight shall be the same measurement conditions as the Example of this-application specification.

  The acid value of the binder polymer as component (A) is 80 to 100 mgKOH / g, preferably 85 to 100 mgKOH / g, and more preferably 90 to 100 mgKOH / g. When the acid value of the component (A) is 80 mgKOH / g or more, in the step of selectively removing the photosensitive resin composition layer in the development step to form a pattern, development is easily performed with various known developers. It is possible. Moreover, when the acid value of the component (A) is 100 mgKOH / g or less, resistance to corrosive components such as moisture and salt when functioning as a protective film for a substrate, an electrode and the like can be sufficiently improved.

The acid value of the binder polymer can be measured as follows. That is, first, 1 g of a binder polymer whose acid value is to be measured is precisely weighed, then 30 g of acetone is added, and this is uniformly dissolved. In addition, when volatile matters, such as a synthesis solvent and a dilution solvent, are contained in a binder polymer, it heats for about 1 to 4 hours at about 10 degreeC higher than the boiling point of a volatile matter beforehand, and removes a volatile matter. Next, an appropriate amount of phenolphthalein as an indicator is added to the solution, and titration is performed using a 0.1N potassium hydroxide (KOH) aqueous solution. The acid value is determined by calculating the number of mg of KOH required to neutralize the acetone solution of the binder polymer to be measured.
When a solution obtained by mixing vaninda polymer with a synthetic solvent, a diluting solvent, or the like is an object to be measured, the acid value is calculated by the following formula.
Acid value = 0.1 × Vf × 56.1 / (Wp × I / 100)
In the formula, Vf represents the titration amount (mL) of KOH, Wp represents the weight (g) of the solution containing the measured binder polymer, and I represents the ratio of the nonvolatile content in the solution containing the measured binder polymer ( Mass%).

  The component (A) of the present invention preferably has a glass transition temperature of 60 to 100 ° C, more preferably 62 to 99 ° C, and more preferably 62 to 85 ° C from the viewpoint of achieving both rust prevention and developability. It is particularly preferable that the temperature is 65 to 79 ° C.

  In the case of a cured film of 15 μm or less, corrosive components such as moisture and salt are easily contained in the film, so that it is difficult to obtain sufficient rust prevention properties. On the other hand, it is difficult to ensure transparency, sufficient developability and adhesion to a substrate only by keeping the acid value low in order to improve rust prevention. By using this, it is possible to achieve both developability and rust prevention at a higher level.

  The photopolymerizable compound as component (B) is a (meth) acrylate compound having a trimethylolpropane skeleton, a (meth) acrylate compound having a ditrimethylolpropane skeleton, a (meth) acrylate compound having a pentaerythritol skeleton, or dipentaerythritol. At least one (meth) selected from the group consisting of a (meth) acrylate compound having a skeleton, a (meth) acrylate compound having a glycerin skeleton, a (meth) acrylate compound having a diglycerin skeleton, and these alkylene oxide-modified compounds. It preferably contains an acrylate compound (hereinafter also referred to as component (b)). The (meth) acrylate compound is preferably a bifunctional or higher functional (meth) acrylate compound having two or more (meth) acryloyl groups, and has a trifunctional or higher functionality having 3 or more (meth) acryloyl groups. More preferred is a (meth) acrylate compound.

  Examples of the (meth) acrylate compound having a skeleton derived from ditrimethylolpropane include a compound represented by the following general formula (1).

In the general formula (1), R ¹ represents a hydrogen atom or a (meth) acryloyl group, and L ¹ represents an alkyleneoxy group. n represents an integer of 0 or 1. The four R ¹ groups may be the same or different, but at least two of them are (meth) acryloyl groups. As the alkyleneoxy group, an ethyleneoxy group or a propyleneoxy group is preferable.

  Examples of the (meth) acrylate compound having a skeleton derived from diglycerin include a compound represented by the following general formula (2).

In the general formula (2), R ² represents a hydrogen atom or a (meth) acryloyl group, and L ² represents an alkyleneoxy group. n represents an integer of 0 or 1. The four R ² groups may be the same or different, but at least two of them are (meth) acryloyl groups. As the alkyleneoxy group, an ethyleneoxy group or a propyleneoxy group is preferable.

  As the compound represented by the general formula (1), ditrimethylolpropane tetraacrylate represented by the following formula (3) is most preferable. Ditrimethylolpropane tetraacrylate is commercially available as T-1420 (T) (trade name, manufactured by Nippon Kayaku Co., Ltd.).

  Here, the (meth) acrylate compound having a skeleton derived from ditrimethylolpropane is obtained by, for example, a method of esterifying ditrimethylolpropane and (meth) acrylic acid, or a transesterification method using a neutral catalyst. Can do. The compound also includes a compound modified with an alkyleneoxy group. In the above compound, the number of ester bonds in one molecule is preferably 2 or more, and a compound having 2 to 4 ester bonds may be mixed.

  The (meth) acrylate compound having a skeleton derived from diglycerin can be obtained by, for example, a method of esterifying diglycerin and (meth) acrylic acid or a transesterification method using a neutral catalyst. The compound also includes a compound modified with an alkyleneoxy group. In the above compound, the number of ester bonds in one molecule is preferably 2 or more, and a compound having 2 to 4 ester bonds may be mixed.

  As the (meth) acrylate compound having a skeleton derived from ditrimethylolpropane and the (meth) acrylate compound having a skeleton derived from diglycerin, from the viewpoint of further improving the resistance to electrode corrosion and the ease of development, alkylene oxide modification Ditrimethylolpropane di (meth) acrylate compound, alkylene oxide modified ditrimethylolpropane tri (meth) acrylate compound, alkylene oxide modified ditrimethylolpropane tetra (meth) acrylate compound, alkylene oxide modified diglycerin di (meth) acrylate compound, alkylene oxide modified di At least selected from glycerin tri (meth) acrylate compounds and alkylene oxide modified diglycerin tetra (meth) acrylate compounds Preferably comprises one compound, and more preferably contains at least one compound selected from alkylene oxide-modified ditrimethylolpropane tetra (meth) acrylate compound and alkylene oxide-modified diglycerin tetra (meth) acrylate compound.

  Examples of the (meth) acrylate having a skeleton derived from dipentaerythritol include dipentaerythritol di (meth) acrylate, dipentaerythritol tri (meth) acrylate, dipentaerythritol tetra (meth) acrylate, and dipentaerythritol penta (meth). ) Acrylates, and these alkylene oxide modified compounds. Of these, dipentaerythritol hexa (meth) acrylate and alkylene oxide-modified dipentaerythritol hexa (meth) acrylate are preferred.

Examples of the (meth) acrylate compound having a skeleton derived from trimethylolpropane include trimethylolpropane di (meth) acrylate, trimethylolpropane tri (meth) acrylate, and these alkylene oxide-modified compounds. Of these, trimethylolpropane tri (meth) acrylate and alkylene oxide-modified trimethylolpropane tri (meth) acrylate are preferred.
Examples of the (meth) acrylate compound having a skeleton derived from pentaerythritol include pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, and alkylene oxide-modified compounds thereof. Of these, pentaerythritol tetra (meth) acrylate and alkylene oxide-modified pentaerythritol tetra (meth) acrylate are preferred.
Examples of the (meth) acrylate compound having a glycerin-derived skeleton include glycerin di (meth) acrylate, glycerin tri (meth) acrylate, and alkylene oxide-modified compounds thereof. Of these, glycerol tri (meth) acrylate and alkylene oxide-modified glycerol tri (meth) acrylate are preferred.

  Said compound can be used individually by 1 type or in combination of 2 or more types.

  The content of the component (A) and the component (B) in the photosensitive resin composition of the present embodiment is such that the component (A) is 40 to 80 with respect to 100 parts by mass of the total amount of the components (A) and (B). It is preferable that a mass part and (B) component are 20-60 mass parts, It is more preferable that (A) component is 50-70 mass parts, (B) component is 30-50 mass parts, (A) More preferably, the component is 55 to 65 parts by mass, and the component (B) is 35 to 45 parts by mass.

  By making content of (A) component into the said range, sensitivity and photocurability can fully be ensured, ensuring sufficient coating property or the film property in a photosensitive element.

  The photosensitive resin composition of this embodiment can contain a photopolymerizable compound other than the component (b). As the photopolymerizable compound, for example, the component (b) can be used in combination with one or more of a monofunctional monomer and a polyfunctional monomer. Examples of the monofunctional monomer include (meth) acrylic acid, (meth) acrylic acid alkyl ester and monomers copolymerizable therewith exemplified as monomers used for the synthesis of the binder polymer of the component (A).

  Examples of the polyfunctional monomer include polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, polyethylene polypropylene glycol di (meth) acrylate, 2,2-bis (4-acryloxypolyethoxyphenyl) propane, 2 , 2-bis (4-methacryloxypolypropoxyphenyl) propane, 2,2-bis (4-acryloxypolyethoxypolypropoxyphenyl) propane, bisphenol A diglycidyl ether di (meth) acrylate.

  When the photopolymerizable compound as component (b) and a monofunctional monomer or a polyfunctional monomer other than component (b) are used in combination, there is no particular limitation on the blending ratio of these monomers, but photocurability and electrode corrosion From the viewpoint of obtaining an inhibitory power, the proportion of the photopolymerizable compound as the component (b) is 30 parts by mass or more with respect to 100 parts by mass of the total amount of the photopolymerizable compound contained in the photosensitive resin composition. It is preferably 50 parts by mass or more, and more preferably 75 parts by mass or more.

  As the photopolymerization initiator as component (C), benzophenone, N, N, N ′, N′-tetramethyl-4,4′-diaminobenzophenone (Michler ketone), N, N, N ′, N′-tetraethyl -4,4'-diaminobenzophenone, 4-methoxy-4'-dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, 2-methyl-1- [4 Aromatic ketones such as-(methylthio) phenyl] -2-morpholino-propanone-1; 2-ethylanthraquinone, phenanthrenequinone, 2-tert-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3- Benzanthraquinone, 2-phenylanthraquinone, 2,3-diphenylanthraquino Quinones such as 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthraquinone, 2-methyl-1,4-naphthoquinone, 2,3-dimethylanthraquinone; benzoin methyl ether Benzoin ether compounds such as benzoin ethyl ether and benzoin phenyl ether, benzoin compounds such as benzoin, methyl benzoin and ethyl benzoin; 1,2-octanedione, 1- [4- (phenylthio) phenyl-, 2- (O-benzoyl) Oxime)], ethanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (O-acetyloxime) and the like; benzyldimethyl ketal and the like A benzyl derivative of 2- (o-chloro) Enyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5-di (methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole 2,4,5-tria such as dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer Reel imidazole dimer; acridine derivatives such as 9-phenylacridine, 1,7-bis (9,9′-acridinyl) heptane; N-phenylglycine, N-phenylglycine derivatives, coumarin compounds, oxazole compounds, etc. .

  By the way, when forming a cured film on a base material that requires transparency, such as a touch panel base material, it is preferable that the transparency of the cured film is higher in view of visibility or aesthetics. However, on the other hand, the present inventors have found that when patterning a thin photosensitive layer having high transparency, the resolution tends to decrease. The present inventors consider that the reason is that when the thickness of the photosensitive layer is reduced, it is easily affected by light scattering from the base material and halation occurs.

  In addition to the base material for touch panels, the base material for which transparency is required includes base materials for plasma display panels (PDP), liquid crystal display (LCD) modules, and flat panel displays (FPD).

  On the other hand, when the photopolymerization initiator contains an oxime ester compound or a phosphine oxide compound, it is possible to form a pattern with a further sufficient resolution.

  The reason why the above effect can be obtained is that the oxime moiety contained in the oxime ester compound or the phosphine oxide moiety contained in the phosphine oxide compound has a relatively high photolysis efficiency but does not decompose with slight light leakage. The present inventors infer that the influence of leakage light is suppressed because of having a large threshold.

  Among these, an oxime ester compound or a phosphine oxide compound is preferable from the transparency of the cured film to be formed and the pattern forming ability when the film thickness is 15 μm or less. Examples of the oxime ester compound include a compound represented by the following general formula (4), a compound represented by the following general formula (5), and a compound represented by the following general formula (6).

In Formula (4), R ₃ and R ₄ each represent an alkyl group having 1 to 12 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or a phenyl group, and an alkyl group having 1 to 8 carbon atoms or 4 carbon atoms. Is preferably a cycloalkyl group having 6 to 6 carbon atoms or a phenyl group, more preferably an alkyl group having 1 to 4 carbon atoms, a cycloalkyl group having 4 to 6 carbon atoms or a phenyl group, and a methyl group, cyclopentyl group or phenyl group. More preferably, it is a group.
R ₅ represents OH, COOH, O (CH ₂ ) OH, O (CH ₂ ) ₂ OH, COO (CH ₂ ) OH or COO (CH ₂ ) ₂ OH, and O (CH ₂ ) OH, O (CH ₂ ) ₂ OH, COO (CH ₂ ) OH or COO (CH ₂ ) ₂ OH is preferred, and O (CH ₂ ) ₂ OH or COO (CH ₂ ) ₂ OH is more preferred. The aromatic ring may have a substituent other than R ₅ . The compound represented by formula (4) may not have have a R _5.

Wherein (5), R ₆ are each an alkyl group having 1 to 6 carbon atoms, it is preferably a propyl group. R ₇ represents NO ₂ or ArCO (wherein Ar represents an aryl group), and Ar is preferably a tolyl group. R ₈ and R ₉ each represent an alkyl group having 1 to 12 carbon atoms, a phenyl group or a tolyl group, and preferably a methyl group, a phenyl group or a tolyl group. The aromatic ring may have a substituent other than R ₇ .

In Formula (6), R ₁₀ represents an alkyl group having 1 to 6 carbon atoms, and is preferably an ethyl group. R ₁₁ is an organic group having an acetal bond, and is preferably a substituent corresponding to R ₁₁ in the compound represented by the following formula (9). R ₁₂ and R ₁₃ each represents an alkyl group having 1 to 12 carbon atoms, a phenyl group or a tolyl group, preferably a methyl group, a phenyl group or a tolyl group, and more preferably a methyl group. The aromatic ring may have a substituent other than R ₁₁ .

As a compound represented by the said Formula (4), the compound represented by following formula (7) is mentioned, for example. This is available as Adeka Cruise NCI-930 (trade name, manufactured by ADEKA Corporation).

As a compound represented by the said Formula (5), the compound represented by following formula (8) is mentioned, for example. This compound is available as DFI-091 (trade name, manufactured by Daito Chemix Co., Ltd.).

  As a compound represented by the said Formula (6), the compound represented by following formula (9) is mentioned, for example. It is available as Adekaoptomer N-1919 (manufactured by ADEKA, trade name).

  Examples of the phosphine oxide compound include compounds represented by the following general formula (10) and general formula (11). From the viewpoint of fast curability and transparency, a compound represented by the following general formula (10) is preferred.

In said general formula (10), R <_14> , R < ₁₅ > and R < ₁₆ > show a C1-C20 alkyl group or an aryl group each independently. In said general formula (11), R <_17> , R <_18> and R < ₁₉ > show a C1-C20 alkyl group or an aryl group each independently.

When R ₁₄ , R ₁₅ and R ₁₆ in the general formula (10) are alkyl groups having 1 to 20 carbon atoms, the alkyl group may be any of linear, branched and cyclic, Moreover, it is more preferable that carbon number of this alkyl group is 5-10. When R ₁₇ , R ₁₈ and R ₁₉ in the general formula (11) are an alkyl group having 1 to 20 carbon atoms, the alkyl group may be linear, branched or cyclic, More preferably, the alkyl group has 5 to 10 carbon atoms.

When R ₁₄ , R ₁₅ and R ₁₆ in the general formula (10) are an aryl group, the aryl group may have a substituent. Examples of the substituent include an alkyl group having 1 to 6 carbon atoms and an alkoxy group having 1 to 4 carbon atoms. When R ₁₇ , R ₁₈ and R ₁₉ in the general formula (11) are an aryl group, the aryl group may have a substituent. Examples of the substituent include an alkyl group having 1 to 6 carbon atoms and an alkoxy group having 1 to 4 carbon atoms.

Among these, in the general formula (10), R ₁₄ , R ₁₅ and R ₁₆ are preferably aryl groups, and the compound represented by the general formula (11) has R ₁₇ , R ₁₈ and R ₁₉ as aryl. It is preferably a group.

  As the compound represented by the general formula (10), 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide is obtained from the transparency of the cured film to be formed and the pattern forming ability when the film thickness is 15 μm or less. preferable. 2,4,6-Trimethylbenzoyl-diphenyl-phosphine oxide is commercially available, for example, as DAROCUR-TPO (trade name, manufactured by BASF Japan).

  The content of the photopolymerization initiator that is the component (C) is preferably 0.1 to 20 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B), and 0.5 to More preferably, it is 10 mass parts, and it is still more preferable that it is 1.0-3 mass parts.

  By making the content of the component (C) within the above range, the photosensitivity becomes sufficient, and the increase in absorption on the surface of the composition during exposure is suppressed, and the internal photocurability is improved. Can do.

  The photosensitive resin composition of this embodiment is at least one compound selected from the group consisting of a triazole compound, a thiadiazole compound, and a tetrazole compound (hereinafter referred to as (D)) from the viewpoint of achieving both rust prevention and developability. It is preferable to further contain a component).

  Examples of the triazole compound include benzotriazole, 1H-benzotriazole-1-acetonitrile, benzotriazole-5-carboxylic acid, 1H-benzotriazole-1-methanol, carboxybenzotriazole, triazole containing a mercapto group such as 3-mercaptotriazole. Examples thereof include triazole compounds containing an amino group such as compounds and 3-amino-5-mercaptotriazole.

  Examples of the thiadiazole compound include 2-amino-5-mercapto-1,3,4-thiadiazole, 2,1,3-benzothiadiazole and the like.

  Examples of the tetrazole compound include compounds represented by the following general formula (12).

R ₂₀ and R ₂₁ in the general formula (12) are each independently hydrogen, an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a phenyl group, an aminophenyl group, or 7 carbon atoms. A C-20 alkylphenyl group, an amino group, a mercapto group, a C1-C10 alkyl mercapto group, or a C2-C10 carboxyalkyl group is shown.

  As the alkyl group, methyl group, ethyl group, propyl group, iso-propyl group, butyl group, sec-butyl group, tert-butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, Examples include an undecyl group, a tridecyl group, a tetradecyl group, a pentadecyl group, an octadecyl group, a nonadecyl group, and an icosyl group.

  Examples of the cycloalkyl group include a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group. Examples of the alkylphenyl group include a methylphenyl group and an ethylphenyl group.

  Examples of the alkyl mercapto group include a methyl mercapto group and an ethyl mercapto group. Examples of the carboxyalkyl group include a carboxymethyl group and a carboxyethyl group.

  Specific examples of the tetrazole compound represented by the general formula (12) include 1H-tetrazole, 5-amino-1H-tetrazole, 5-methyl-1H-tetrazole, 1-methyl-5-ethyl-tetrazole, 1- Methyl-5-mercapto-tetrazole, 5- (2-aminophenyl) -1H-tetrazole, 1-cyclohexyl-5-mercapto-tetrazole, 1-phenyl-5-mercapto-tetrazole, 1-carboxymethyl-5-mercapto- Examples include tetrazole, 5-phenyl-1H-tetrazole, and 1-phenyl-tetrazole.

  The tetrazole compound represented by the general formula (12) may be a water-soluble salt thereof. Specific examples include alkali metal salts of 1-carboxymethyl-5-mercapto-tetrazole such as sodium, potassium and lithium.

  Among these, 1H-tetrazole, 5-amino-1H-tetrazole, or 1-methyl-5-mercapto-1H-tetrazole from the viewpoints of the ability to suppress electrode corrosion, adhesion to metal electrodes, ease of development, and transparency Is preferred.

  These tetrazole compounds and water-soluble salts thereof may be used alone or in combination of two or more.

  Moreover, when the electrode surface which provides a protective layer has metals, such as copper, silver, and nickel, from a viewpoint which further improves developability, the photosensitive resin composition should further contain the tetrazole compound which has an amino group. Is preferred. In this case, development residue can be reduced, and it becomes easy to form a cured film with a good pattern. The reason for this may be that the balance between the solubility in the developer and the adhesion between the metal and the metal is improved by blending the tetrazole compound having an amino group.

  When the tetrazole compound having an amino group is contained, the above effect can be obtained. Therefore, the photosensitive resin composition and the photosensitive element according to the present embodiment form a metal layer such as copper to improve conductivity. It is suitable for forming a protective film for protecting the electrode in the frame region of the touch panel.

  Content of (D) component in the photosensitive resin composition of this embodiment shall be 0.05-10.0 mass parts with respect to 100 mass parts of total amounts of (A) component and (B) component. Preferably, it is more preferable to set it as 0.1-2.0 mass parts, and it is still more preferable to set it as 0.2-1.0 mass part.

  By setting the content of the component (D) within the above range, it is possible to sufficiently obtain the effect of improving the resistance to electrode corrosion and the adhesion to the metal electrode while maintaining developability or resolution.

  The photosensitive resin composition of the present embodiment preferably further contains a phosphate ester compound from the viewpoint of adhesion to the metal electrode. Examples of the phosphoric acid ester compound include 2-methacryloyloxyethyl acid phosphate (manufactured by Kyoeisha Chemical Co., Ltd., trade names “light ester P-1M” and “light ester P-2M”), ethylene oxide-modified phosphoric acid dimethacrylate. (Nippon Kayaku Co., Ltd., trade name “PM-21”), Acid Phosphooxyethyl methacrylate (Uni Chemical Co., trade name “Phosmer M”), Phosphoric acid-containing epoxy methacrylate (Daiichi Kogyo Seiyaku Co., Ltd.) , Trade name "New Frontier S-23A") and other phosphoric acid (meth) acrylate compounds; vinyl phosphonic acid (BASF Corporation, trade names "VPA-90", "VPA-100") and other vinyl phosphate compounds And phosphoric acid compounds having a carbon-carbon double bond in the molecule.

  The photosensitive resin composition of the present embodiment includes a silane coupling agent, a leveling agent, a plasticizer, a filler, an antifoaming agent, a flame retardant, a stabilizer, an antioxidant, a fragrance, and a thermal crosslinking agent as necessary. The polymerization inhibitor and the like can be contained in an amount of about 0.01 to 20 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B). These can be used alone or in combination of two or more.

  The photosensitive resin composition of this embodiment preferably has a minimum visible light transmittance of 90% or more, more preferably 92% or more, and still more preferably 95% or more.

  If the minimum value of the transmittance in the wavelength range of 400 to 700 nm, which is a light beam in a general visible light wavelength range, is 90% or more, for example, when the transparent electrode of the display portion of the touch panel (touch sensor) is also protected, the touch panel Display on the display part when the protective layer is visible from the edge of the display part when the metal layer (for example, a layer in which a copper layer is formed on the ITO electrode) of the frame area of the (touch sensor) is protected It is possible to suppress a decrease in quality, hue, or luminance.

In the photosensitive resin composition of the present embodiment, from the viewpoint of further improving the visibility of the touch panel, b ^* in the CIELAB color system is preferably −0.2 to 1.0, and −0. It is more preferably 0 to 0.7, and still more preferably 0.1 to 0.4. When b ^* is 0.8 or more or −0.2 or less, the display quality and color tone in the display portion tend to be reduced as in the case where the visible light transmittance is less than 90%. In addition, the measurement of b ^* in the CIELAB color system uses, for example, a Konica Minolta spectrocolorimeter “CM-5”, and a glass with a thickness of 0.7 mm and b ^* of 0.1 to 0.2. It is obtained by forming a photosensitive resin composition layer having a thickness of 5 μm on a substrate, photo-curing the photosensitive resin composition layer by irradiating ultraviolet rays, and then measuring by setting a D65 light source and a viewing angle of 2 °.

  The photosensitive layer 20 can be formed by using the photosensitive resin composition of the present embodiment as a coating solution, and applying and drying this on a support film. The coating liquid can be obtained by uniformly dissolving or dispersing each component constituting the photosensitive resin composition of the present embodiment described above in a solvent.

  The solvent is not particularly limited and known ones can be used. For example, acetone, methyl ethyl ketone, methyl isobutyl ketone, toluene, methanol, ethanol, propanol, butanol, methylene glycol, ethylene glycol, propylene glycol, ethylene glycol monomethyl ether, Examples include ethylene glycol monoethyl ether, propylene glycol monomethyl ether, chloroform, and methylene chloride. These solvents may be used alone or as a mixed solvent composed of two or more solvents.

  Application methods include, for example, doctor blade coating method, Meyer bar coating method, roll coating method, screen coating method, spinner coating method, inkjet coating method, spray coating method, dip coating method, gravure coating method, curtain coating method, die coating Examples thereof include a coating method.

  Although there is no restriction | limiting in particular in drying conditions, It is preferable that drying temperature shall be 60-130 degreeC, and it is preferable that drying time shall be 0.5-30 minutes.

  The thickness of the photosensitive layer is 15 μm or less in terms of the thickness after drying in order to exhibit a sufficient effect as a protective film and to sufficiently reduce the level difference on the surface of the touch panel (touch sensor) caused by the formation of a partial electrode protective film. It is preferable that it is 2-10 micrometers, and it is still more preferable that it is 3-8 micrometers.

In the present embodiment, the photosensitive layer 20 preferably has a visible light transmittance of 90% or more, more preferably 92% or more, and still more preferably 95% or more. The photosensitive layer 20 is preferably adjusted so that b ^* in the CIELAB color system is −0.2 to 1.0.

  Examples of the protective film 30 (cover film) include polyethylene, polypropylene, polyethylene terephthalate, polycarbonate, polyethylene-vinyl acetate copolymer, and a film made of a laminated film of polyethylene-vinyl acetate copolymer and polyethylene.

As described above, the photosensitive element has been described. In the present invention, the photosensitive resin composition coating liquid of the present embodiment described above is applied onto a base material for a touch panel, dried, and then from the photosensitive resin composition. A photosensitive layer may be provided. In this case, examples of the coating method include the same methods as those for the photosensitive layer in the photosensitive element described above. Also in this application, it is preferable that the photosensitive layer satisfies the above-described conditions of film thickness, visible light transmittance, and b ^* in the CIELAB color system.

  Next, the manufacturing method of the base material for touchscreens with a cured film which concerns on this invention is demonstrated. FIG. 2 is a schematic cross-sectional view for explaining an embodiment of the method for producing a base material for a touch panel with a cured film of the present invention.

  The manufacturing method of the base material for touchscreens with a cured film of this embodiment is the 1st process which provides the photosensitive layer 20 which consists of said photosensitive resin composition on the base material 100 for touchscreens which has the electrodes 110 and 120 for touchscreens. A second step of curing a predetermined portion of the photosensitive layer 20 by irradiation with actinic rays; and from a cured product of the photosensitive resin composition that removes the photosensitive layer other than the predetermined portion after exposure and covers a part or all of the electrode And a third step of forming a cured film (protective film) 22. In this way, the base material for touchscreens with a cured film is obtained. The base material for touch panels with a cured film obtained can be used as the touch panel (touch sensor) 200 with a cured film.

  There is no restriction | limiting in particular in the base material used by this embodiment, Substrates, such as a glass plate, a plastic plate, a ceramic board, generally used for touchscreens (touch sensor) are mentioned. A touch panel electrode is provided on the substrate. Examples of the electrode include electrodes such as ITO, Cu, Al, Mo, and Ag, and TFT. Further, an insulating layer may be provided over the substrate.

  The base material 100 for touch panels which has the electrodes 110 and 120 for touch panels shown by FIG. 2 can be obtained in the following procedures, for example. A metal film is formed on a substrate such as a PET film by sputtering in the order of ITO and Cu, and then a photosensitive film for etching is pasted on the metal film to form a desired resist pattern, and unnecessary Cu is chlorinated. After removing with an etching solution such as an iron aqueous solution, the resist pattern is peeled off.

  In the first step of the present embodiment, after removing the protective film 30 of the photosensitive element 1 of the present embodiment, the touch panel electrodes 110 and 120 of the touch panel substrate 100 are provided while heating the photosensitive element. The photosensitive layer 20 is laminated on the existing surface by pressure bonding (see FIG. 2A).

  Examples of the pressing means include a pressing roll. The pressure roll may be provided with a heating means so that it can be heat-pressure bonded.

  The heating temperature for thermocompression bonding is preferably 10 to 180 ° C. so that the components of the photosensitive layer are not easily cured or thermally decomposed while ensuring sufficient adhesion between the photosensitive layer and the touch panel substrate. It is more preferable to set it as 20-160 degreeC, and it is still more preferable to set it as 30-150 degreeC.

In addition, the pressure during thermocompression bonding is 50 to 1 × 10 ⁵ N / m in terms of linear pressure from the viewpoint of suppressing deformation of the base material while ensuring sufficient adhesion between the photosensitive layer and the touch panel base material. It is preferable to set it as 2.5 * 10 < ² > -5 * 10 < ⁴ > N / m, and it is still more preferable to set it as 5 * 10 < ² > -4 * 10 < ⁴ > N / m.

  If the photosensitive element 1 is heated as described above, it is not necessary to pre-heat the base material. However, in order to further improve the adhesion between the photosensitive layer and the base material, the base material may be pre-heated. preferable. The preheating temperature at this time is preferably 30 to 180 ° C.

  In the present embodiment, instead of using the photosensitive element, the photosensitive resin composition of the present embodiment is applied as a coating liquid to the surface of the substrate 100 where the touch panel electrodes 110 and 120 are provided and dried. The photosensitive layer 20 can be formed.

  In the second step of the present embodiment, the photosensitive layer 20 is exposed to an actinic ray L in a pattern via a photomask 130 (see FIG. 2B).

  At the time of exposure, when the support film 10 on the photosensitive layer 20 is transparent, it can be exposed as it is, and when it is opaque, it is removed and then exposed. From the viewpoint of protecting the photosensitive layer, it is preferable to use a transparent polymer film as the support film, and expose the polymer film while leaving the polymer film remaining.

  As a light source of actinic light used for exposure, a known actinic light source can be used, and examples thereof include a carbon arc lamp, an ultrahigh pressure mercury lamp, a high pressure mercury lamp, and a xenon lamp.

The irradiation amount of actinic rays at this time is usually 1 × 10 ² to 1 × 10 ⁴ J / m ² , and heating can be accompanied during irradiation. If the irradiation amount of actinic rays is less than 1 × 10 ² J / m ² , the photocuring effect tends to be insufficient, and if it exceeds 1 × 10 ⁴ J / m ² , the photosensitive layer tends to discolor. is there.

  In the third step of the present embodiment, the exposed photosensitive layer is developed with a developer to remove the unexposed portion, and the cured product of the photosensitive resin composition of the present embodiment that covers a part or all of the substrate. A protective film 22 made of is formed. The formed protective film 22 can have a predetermined pattern.

  In addition, after exposure, when the support film is laminated | stacked on the photosensitive layer, after removing it, the image development which removes the unexposed part by a developing solution is performed.

  As a development method, development is performed by a known method such as spraying, showering, rocking dipping, brushing, scraping, etc., using a known developing solution such as an alkaline aqueous solution, an aqueous developer, or an organic solvent, and unnecessary portions are removed. The method of doing is mentioned. Among these, it is preferable to use an alkaline aqueous solution from the viewpoint of environment and safety.

  Examples of the base of the alkaline aqueous solution include alkali hydroxide (lithium, sodium or potassium hydroxide, etc.), alkali carbonate (lithium, sodium or potassium carbonate or bicarbonate, etc.), alkali metal phosphate (potassium phosphate, etc.) , Sodium phosphate, etc.), alkali metal pyrophosphates (sodium pyrophosphate, potassium pyrophosphate, etc.), tetramethylammonium hydroxide, triethanolamine and the like. Among these, sodium carbonate or tetramethylammonium hydroxide is preferable.

  The development temperature and time can be adjusted according to the developability of the photosensitive resin composition of the present embodiment.

  Further, a surfactant, an antifoaming agent, a small amount of an organic solvent for accelerating development, and the like can be mixed in the alkaline aqueous solution.

  Further, the base of the alkaline aqueous solution remaining in the photosensitive layer after development and photocuring is converted into an acid by a known method such as spraying, rocking immersion, brushing or scraping using an organic acid, an inorganic acid or an aqueous acid solution thereof. It can be treated (neutralized).

  Furthermore, after the acid treatment (neutralization treatment), a step of washing with water can be performed.

After development, the cured product may be further cured by exposure (for example, 5 × 10 ³ to 2 × 10 ⁴ J / m ² ) as necessary. Note that the photosensitive resin composition of the present embodiment exhibits excellent adhesion to a metal even without a heating step after development, but if necessary, instead of exposure after development or in combination with exposure. Heat treatment (80 to 250 ° C.) may be performed.

  As described above, the photosensitive resin composition and the photosensitive element of the present embodiment are suitable for use for forming a cured film of a base material for a touch panel.

  Moreover, this invention can provide the formation material of the cured film containing the photosensitive resin composition which concerns on this invention. The material for forming the cured film can contain the photosensitive resin composition of the present embodiment described above, and is preferably a coating solution containing the solvent described above.

  Next, an example of the place where the cured film according to the present invention is used will be described with reference to FIGS. FIG. 3 is a schematic top view illustrating an example of a capacitive touch panel. The touch panel shown in FIG. 3 has a touch screen 102 for detecting touch position coordinates on one surface of the transparent substrate 101, and the transparent electrode 103 and the transparent electrode 104 for detecting a change in capacitance in this region are the substrate 101. It is provided above. The transparent electrode 103 and the transparent electrode 104 detect a change in electrostatic capacitance at the touch position, respectively, and set it as an X position coordinate and a Y position coordinate.

  On the transparent substrate 101, a lead-out wiring 105 for transmitting a touch position detection signal from the transparent electrode 103 and the transparent electrode 104 to an external circuit is provided. The lead-out wiring 105 is connected to the transparent electrode 103 and the transparent electrode 104 by a connection electrode 106 provided on the transparent electrode 103 and the transparent electrode 104. A connection terminal 107 for connecting to an external circuit is provided at the end of the lead-out wiring 105 opposite to the connection portion between the transparent electrode 103 and the transparent electrode 104. The photosensitive resin composition of the present invention can be suitably used for forming a cured film pattern as the protective film 122 for the lead-out wiring 105, the connection electrode 106, and the connection terminal 107. At this time, the electrodes in the sensing region can be protected at the same time. In FIG. 3, the lead-out wiring 105, the connection electrode 106, a part of the sensing region electrode, and a part of the connection terminal 107 are protected by the protective film 122, but the location where the protective film is provided may be changed as appropriate. For example, as shown in FIG. 4, a protective film 123 may be provided so as to protect the entire touch screen 102.

  With reference to FIG. 5, a cross-sectional structure of a connection portion between the transparent electrode and the lead-out wiring in the touch panel shown in FIG. 3 will be described. FIG. 5 is a partial cross-sectional view taken along the line VV of the portion C shown in FIG. 3 and is a diagram for explaining a connection portion between the transparent electrode 104 and the lead-out wiring 105. As shown in FIG. 5A, the transparent electrode 104 and the lead wiring 105 are electrically connected via the connection electrode 106. As shown in FIG. 5A, a part of the transparent electrode 104, the lead-out wiring 105, and the connection electrode 106 are all covered with a cured film pattern as the protective film 122. Similarly, the transparent electrode 103 and the lead wiring 105 are electrically connected via the connection electrode 106. As shown in FIG. 5B, the transparent electrode 104 and the lead-out wiring 105 may be directly electrically connected. The photosensitive resin composition and photosensitive element of this invention can be used conveniently in order to form the cured film pattern as a protective film of the said structure part.

  The manufacturing method of the touch panel in this embodiment is demonstrated. First, a transparent electrode (X position coordinate) 103 is formed on a transparent substrate 101 that is a base material for a touch panel. Subsequently, a transparent electrode (Y position coordinate) 104 is formed through an insulating layer (not shown). The transparent electrode 103 and the transparent electrode 104 can be formed by a method of etching the transparent electrode layer formed on the transparent substrate 101.

  Next, on the surface of the transparent substrate 101, a lead-out wiring 105 for connecting to an external circuit and a connection electrode 106 for connecting the lead-out wiring with the transparent electrode 103 and the transparent electrode 104 are formed. The lead-out wiring 105 and the connection electrode 106 may be formed after the transparent electrode 103 and the transparent electrode 104 are formed, or may be formed at the same time as each transparent electrode is formed. The lead-out wiring 105 and the connection electrode 106 can be formed by etching after metal sputtering. The lead-out wiring 105 can be formed at the same time as the connection electrode 106 is formed by screen printing using a conductive paste material containing flaky silver, for example. Next, a connection terminal 107 for connecting the lead wiring 105 and an external circuit is formed.

  The photosensitive element 1 according to this embodiment is pressure-bonded so as to cover the transparent electrode 103, the transparent electrode 104, the lead-out wiring 105, the connection electrode 106, and the connection terminal 107 formed by the above process, and a photosensitive layer is formed on the electrode. 20 is provided. Next, the actinic ray L is irradiated to the transferred photosensitive layer 20 in a desired shape through a photomask. After irradiating the actinic ray L, development is performed to remove portions other than the predetermined portion of the photosensitive layer 20, thereby forming a protective film 122 made of a cured product of the predetermined portion of the photosensitive layer 20. In this manner, a touch panel including the protective film 122, that is, a touch panel including the touch panel base material (transparent substrate 101) with the protective film 122 can be manufactured.

  Next, the use location of the cured film which concerns on this invention is demonstrated using FIGS. The cured film of the present invention can be suitably used, for example, as the insulating film 124 in FIGS.

  FIG. 6 is a plan view showing an example of a capacitive touch panel in which the transparent electrode (X position coordinate) 103 and the transparent electrode (Y position coordinate) 104 exist on the same plane. FIG. 7 is a partially cutaway perspective view thereof. 8 is a partial cross-sectional view taken along line VIII-VIII in FIG. The capacitive touch panel includes a transparent electrode 103 that detects a change in capacitance and uses X position coordinates, and a transparent electrode 104 uses Y position coordinates on a transparent substrate 101. Each of the transparent electrodes 103 and 104 having the X and Y position coordinates has lead-out wirings 105a and 105b for connecting to a control circuit of a driver element circuit (not shown) that controls an electrical signal as a touch panel. .

  An insulating film 124 is provided at a portion where the transparent electrode (X position coordinate) 103 and the transparent electrode (Y position coordinate) 104 intersect.

  A method of manufacturing a capacitive touch panel in which the transparent electrode (X position coordinates) 103 and the transparent electrode (Y position coordinates) 104 are present on the same plane will be described.

  A method for manufacturing a capacitive touch panel is, for example, a known method using a transparent conductive material, and a part of a transparent electrode that becomes a transparent electrode (X position coordinate) 103 and a transparent electrode 104 that later detects a Y position coordinate. Alternatively, a substrate formed in advance on the transparent substrate 101 may be used. FIG. 9 is a diagram for explaining an example of a method for manufacturing a capacitive touch panel in which transparent electrodes are present on the same plane, and (a) is a partially cutaway perspective view showing a substrate provided with transparent electrodes. (B) is a partially cutaway perspective view showing the obtained capacitive touch panel. FIG. 10 is a diagram for explaining an example of a method for manufacturing a capacitive touch panel in which transparent electrodes exist on the same plane.

  First, as shown in FIG. 9A and FIG. 10A, a substrate on which a transparent electrode (X position coordinate) 103 and a part 104a of the transparent electrode are formed in advance is prepared. An insulating film 124 is provided on a part (a part sandwiched by a part 104a of the transparent electrode) ((b) of FIG. 10). Thereafter, a conductive pattern is formed by a known method. With this conductive pattern, the bridge portion 104b of the transparent electrode can be formed (FIG. 10C). By this transparent electrode bridge portion 104 b, a part of the transparent electrodes 104 a formed in advance can be connected to each other, and a transparent electrode (Y position coordinate) 104 is formed.

  The previously formed transparent electrode may be formed by a known method using ITO or the like, for example. The lead wires 105a and 105b can be formed by a known method using a metal such as Cu or Ag in addition to the transparent conductive material. Alternatively, a substrate on which the lead wirings 105a and 105b are formed in advance may be used.

  FIG. 11 is a partial plan view showing an example of another capacitive touch panel. The configuration described in FIG. 11 is intended to narrow the frame of the touch panel. In FIG. 11, the transparent insulating film 125 is provided on the transparent electrode wiring 104 c extending from the transparent electrode 104 on the transparent substrate 101, and the lead-out wiring 105 is further provided on the transparent insulating film 125. Openings 108 are provided above and below the necessary portion of the transparent insulating film 125, and the transparent electrode 104 and the lead-out wiring 105 are connected and conducted. The photosensitive resin composition and photosensitive element of the present invention are suitable for use for forming a cured resin film pattern as a partial insulating film having the above structure.

  Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to the following examples.

[Preparation of Binder Polymer Solution (A1)]
A flask equipped with a stirrer, a reflux condenser, an inert gas inlet and a thermometer was charged with (1) shown in Table 1, heated to 80 ° C. in a nitrogen gas atmosphere, and the reaction temperature was 80 ° C. ± 2 While maintaining the temperature, (2) shown in Table 1 was added dropwise uniformly over 4 hours. After the dropwise addition of (2), stirring was continued at 80 ° C. ± 2 ° C. for 6 hours, a solution of a binder polymer having a weight average molecular weight of 60,000, an acid value of 91 mgKOH / g, and a glass transition temperature of 70 ° C. (solid content: 45 mass) %) (A1) was obtained.

The weight average molecular weight (Mw) was measured by gel permeation chromatography (GPC), and was derived by conversion using a standard polystyrene calibration curve. The GPC conditions are shown below.
GPC conditions Pump: Hitachi L-6000 type (manufactured by Hitachi, Ltd., product name)
Column: Gelpack GL-R420, Gelpack GL-R430, Gelpack GL-R440 (above, manufactured by Hitachi Chemical Co., Ltd., product name)
Column specifications: Diameter 10.7mm x 300mm
Eluent: Tetrahydrofuran Sample concentration: Collecting 120 mg of NV (non-volatile content) 50% by weight resin solution and dissolving in 5 mL of THF Injection volume: 200 μL
Pressure: 4.9 MPa
Measurement temperature: 40 ° C
Flow rate: 2.05 mL / min Detector: Hitachi L-3300 type RI (manufactured by Hitachi, Ltd., product name)

[Measurement method of acid value]
The acid value was measured as follows. First, the binder polymer solution was heated at 130 ° C. for 1 hour to remove volatile components to obtain a solid content. Then, after precisely weighing 1.0 g of a polymer whose acid value is to be measured, 30 g of acetone was added to the polymer and dissolved uniformly. Next, an appropriate amount of an indicator, phenolphthalein, was added to the solution, and titration was performed using a 0.1N aqueous KOH solution. Then, the number of mg of KOH required to neutralize the acetone solution of the binder polymer was calculated according to the following formula to determine the acid value. Acid value = 0.1 × Vf × 56.1 / (Wp × I / 100) In the formula, Vf represents the titration amount (mL) of KOH, Wp represents the weight (g) of the measured polymer solution, and I Indicates the ratio (% by mass) of the non-volatile content in the measured polymer solution.

[Measurement method of glass transition temperature]
The glass transition temperature (° C.) is calculated from the following Fox equation.
Tg (° C.) = (W1 / Tg1 + w2 / Tg2 +... + Wk / Tgk) -273
Where Tg is the glass transition temperature of the copolymer, Tg1, Tg2,... Tgk is the glass transition temperature of the homopolymer of each monomer component, w1, w2. wk represents the molar fraction of each monomer component, and w1 + w2 +... wk = 1.

(Example 1) [Preparation of photosensitive resin composition solution (V-1) for forming a cured film]
The materials shown in Table 2 were mixed for 15 minutes using a stirrer to prepare a photosensitive resin composition solution (V-1) for forming a cured film.

[Production of photosensitive element (E-1) for forming a cured film]
A polyethylene terephthalate film having a thickness of 50 μm was used as the support film, and the photosensitive resin composition solution (V-1) was uniformly applied on the support film using a comma coater, and 3 in a hot air convection dryer at 100 ° C. The solvent was removed by drying for minutes to form a photosensitive layer (photosensitive resin composition layer) made of the photosensitive resin composition. The resulting photosensitive layer had a thickness of 5 μm.

  Next, a polyethylene film having a thickness of 25 μm was laminated as a cover film on the obtained photosensitive layer to produce a photosensitive element (E-1) for forming a cured film.

[Measurement of transmittance of cured film]
While peeling the polyethylene film of the obtained photosensitive element (E-1), a laminator (manufactured by Hitachi Chemical Co., Ltd., trade name HLM-3000) is used so that the photosensitive layer is in contact with a 1 mm thick glass substrate. In this case, a substrate having a roll temperature of 120 ° C., a substrate feed speed of 1 m / min, and a pressure bonding pressure (cylinder pressure) of 4 × 10 ⁵ Pa (thickness of 1 mm, length of 10 cm × width of 10 cm is used. 8 × 10 ³ N / m) was laminated to prepare a laminate in which a photosensitive layer and a support film were laminated on a glass substrate.

Next, a parallel light exposure machine (EXM1201 manufactured by Oak Manufacturing Co., Ltd.) was used for the photosensitive layer of the obtained laminate, and the exposure amount was 5 × 10 ² J / m ² from the photosensitive layer side (i-line (wavelength The measured value at 365 nm) was irradiated with ultraviolet rays, and then the support film was removed to obtain a transmittance measurement sample having a cured film composed of a photosensitive layer having a thickness of 5.0 μm.

  Next, the visible light transmittance of the obtained sample was measured in a measurement wavelength range of 400 to 700 nm using an ultraviolet-visible spectrophotometer (U-3310) manufactured by Hitachi Instrument Service Co., Ltd. The transmittance of the obtained photosensitive layer at a wavelength of 400 nm is 97% at a wavelength of 700 nm, 96% at a wavelength of 550 nm, and 94% at a wavelength of 400 nm, and the minimum value of the transmittance at 400 to 700 nm is 94%. The transmittance was secured.

[Measurement of b ^* of cured film]
While peeling the polyethylene film of the obtained photosensitive element (E-1), a laminate ([[ ^*] ) is placed so that the photosensitive layer is in contact with a 0.7 mm thick glass substrate (b ^* : 0.1 to 0.2). The same conditions as described in Measurement of transmittance of cured film] were prepared, and a substrate in which a photosensitive layer and a support film were laminated on a glass substrate was produced.

Next, the obtained photosensitive layer was subjected to an exposure amount of 5 × 10 ² J / m ² from the photosensitive layer side (i-line (wavelength 365 nm)) using a parallel light exposure machine (EXM1201 manufactured by Oak Manufacturing Co., Ltd.). Measurement value) After irradiating with ultraviolet rays, the support film is removed, and further, irradiated with ultraviolet rays at an exposure amount of 1 × 10 ⁴ J / m ² (measured value at i-line (wavelength 365 nm)) from the upper side of the photosensitive layer. A b ^* measurement sample having a protective film (photocured cured film) made of a cured product of a photosensitive layer having a thickness of 5.0 μm was obtained.

Next, the obtained sample was measured for b ^* in the CIELAB color system using a spectrocolorimeter (CM-5) manufactured by Konica Minolta Co., Ltd. with a light source setting of D65 and a viewing angle of 2 °. The b ^* of the layer was 0.44 and was confirmed to have good b ^* .

[Alkali developability test of photosensitive layer]
While peeling off the polyethylene film of the obtained photosensitive element (E-1), a laminate ([Measurement of transmittance of cured film] is made so that the photosensitive layer comes into contact with a polyimide film with sputtered copper (manufactured by Toray Film Processing Co., Ltd.). To obtain a laminate in which a photosensitive layer and a support film are laminated on sputtered copper.

Next, the support film laminated on the photosensitive layer is removed, and an aqueous solution of 1.0% by weight sodium carbonate (manufactured by Wako Pure Chemical Industries, Ltd.) is sprayed from the photosensitive layer side at a pressure of 0.75 MPa. The developing time was evaluated by observing the time until complete removal and the shape of the photosensitive layer after removal.
A: The time until the photosensitive layer is removed is within 15 seconds, and the photosensitive layer is dissolved.
B: The time until the photosensitive layer is removed is within 30 seconds, and the photosensitive layer is completely dissolved.
C: The time until the photosensitive layer is removed is within 30 seconds, but the photosensitive layer remains in a peeled state without being dissolved.
D: The time until removal of the photosensitive layer is longer than 30 seconds, and the photosensitive layer remains in a peeled state without being dissolved.
When the sample for evaluation was observed, the time until the photosensitive layer was removed was 14 seconds, and the evaluation was A because the photosensitive layer was dissolved.

[Salt spray test of cured film]
While peeling off the polyethylene film of the obtained photosensitive element (E-1), the laminate ([Measurement of transmittance of cured film] was made so that the photosensitive layer was in contact with the polyimide film with sputtered copper (manufactured by Toray Film Processing Co., Ltd.). To produce a laminate in which a photosensitive layer and a support film are laminated on sputtered copper.

Next, a parallel light exposure machine (EXM1201 manufactured by Oak Manufacturing Co., Ltd.) was used for the photosensitive layer of the obtained laminate, and the exposure amount was 5 × 10 ² J / m ² from the photosensitive layer side (i-line (wavelength (Measured value at 365 nm) After irradiating with ultraviolet rays, the support film was removed, and the photosensitive layer side was irradiated with ultraviolet rays (measured value at i-line (wavelength 365 nm)) with an exposure amount of 1 × 10 ⁴ J / m ² to obtain a thickness. A sample for evaluating salt water resistance in which a protective film made of a cured product of a photosensitive layer having a thickness of 5.0 μm was formed.

Next, referring to the JIS standard (Z 2371), using a salt spray tester (STP-90V2 manufactured by Suga Test Instruments Co., Ltd.), the above-mentioned sample was placed in the test tank, and the salt water (concentration 50 g / L) ( pH = 6.7) was sprayed for 48 hours at a test bath temperature of 35 ° C. and a spraying amount of 1.5 mL / h. After spraying, the salt water was wiped off, the surface state of the sample for evaluation was observed, and evaluation was performed according to the following scores.
A: No change on the surface of the protective film.
B: Slight traces are visible on the surface of the protective film, but copper remains unchanged.
C: Traces are visible on the surface of the protective film, but copper is unchanged.
D: There is a trace on the surface of the protective film, and copper is discolored.
When the surface state of the sample for evaluation was observed, the evaluation was A with no change on the surface of the protective film.

(Examples 2 to 10)
Using the components shown in Table 1, A2-A5 binder polymer solutions were obtained in the same manner as A1. A photosensitive element was prepared in the same manner as in Example 1 except that each photosensitive resin composition solution obtained using the components shown in Table 2 (in the table, the numerical unit of each component is part by mass) was used. The alkali developability test, the salt spray test, and the transmittance and b ^* were measured (Examples 2 to 10). As shown in Table 2, also in Examples 2 to 10, both the alkali developability and the salt water resistance evaluation were good results. In Examples 2 to 10, the visible light transmittance was 90% or more in the measurement wavelength range of 400 to 700 nm, and b ^* sufficiently satisfied the range of -0.2 to 1.0.

光重合性化合物：
Ｔ−１４２０（Ｔ）：ジトリメチロールプロパンテトラアクリレート（日本化薬株式会社製）、
ＲＰ−１０４０：ＥＯ変性ペンタエリスリトールテトラアクリレート（日本化薬株式会社製）
光重合開始剤：
ＯＸＥ−０１：１，２−オクタンジオン，１−［４−（フェニルチオ）−，２−（ｏ−ベンゾイルオキシム）］（ＢＡＳＦ株式会社製、商品名：ＩＲＧＡＣＵＲＥ ＯＸＥ ０１）、
Ｄ−ＴＰＯ：２，４，６−トリメチルベンゾイル−ジフェニル−ホスフィンオキサイド（ＢＡＳＦ株式会社製、商品名：ＤＡＲＯＣＵＲ−ＴＰＯ）
その他：
ＰＭ−２１：２−ヒドロキシエチルメタクリレートの６−ヘキサノリド付加重合物と無水リン酸との反応生成物（日本化薬株式会社製）、
ＡＷ−５００：２，２’−メチレン−ビス（４−エチル−６−Ｔｅｒｔ−ブチルフェノール）（アンテージＷ−５００、川口化学株式会社製）、
Ｂ６０３０：５−アミノ−１Ｈ−テトラゾール（千代田ケミカル株式会社製、商品名：チオエールＢ−６０３０）、
ＡＤＤＩＴＩＶＥ８０３２：有機変性シリコーンオイル（東レ・ダウコーニング株式会社製）、
ＭＥＫ：メチルエチルケトン（東燃化学株式会社製）

Photopolymerizable compound:
T-1420 (T): ditrimethylolpropane tetraacrylate (manufactured by Nippon Kayaku Co., Ltd.),
RP-1040: EO-modified pentaerythritol tetraacrylate (manufactured by Nippon Kayaku Co., Ltd.)
Photopolymerization initiator:
OXE-01: 1,2-octanedione, 1- [4- (phenylthio)-, 2- (o-benzoyloxime)] (manufactured by BASF Corporation, trade name: IRGACURE OXE 01),
D-TPO: 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide (manufactured by BASF Corporation, trade name: DAROCUR-TPO)
Other:
PM-21: reaction product of 6-hexanolide addition polymer of 2-hydroxyethyl methacrylate and phosphoric anhydride (manufactured by Nippon Kayaku Co., Ltd.),
AW-500: 2,2′-methylene-bis (4-ethyl-6-tert-butylphenol) (Antage W-500, manufactured by Kawaguchi Chemical Co., Ltd.)
B6030: 5-amino-1H-tetrazole (manufactured by Chiyoda Chemical Co., Ltd., trade name: thioale B-6030),
ADDITIVE 8032: Organically modified silicone oil (manufactured by Toray Dow Corning Co., Ltd.),
MEK: Methyl ethyl ketone (manufactured by Tonen Chemical Corporation)

(Comparative Examples 1-8)
Using the components shown in Table 1, A6 to A10 binder polymer solutions were obtained in the same manner as A1. A photosensitive element was prepared in the same manner as in Example 1 except that the photosensitive resin composition solution obtained using the components shown in Table 3 (in the table, the numerical unit of each component is part by mass) was used. An alkali developability test and a salt spray test were performed (Comparative Examples 1 to 8). As shown in Table 3, in Comparative Examples 1 to 8, the alkali developability and the salt water resistance evaluation were both inferior.

  DESCRIPTION OF SYMBOLS 1 ... Photosensitive element, 10 ... Support film, 20 ... Photosensitive layer, 22 ... Protective film, 30 ... Protective film, 100 ... Base material for touch panels, 101 ... Transparent substrate, 102 ... Touch screen, 103 ... Transparent electrode (X position) (Coordinates), 104 ... transparent electrode (Y position coordinates), 104a ... part of the transparent electrode, 104b ... bridge portion of the transparent electrode, 104c ... transparent electrode wiring, 105, 105a, 105b ... extraction wiring, 106 ... connection electrode, 107 DESCRIPTION OF SYMBOLS ... Connection terminal, 108 ... Opening part, 110, 120 ... Electrode for touch panels, 122, 123 ... Protective film, 124, 125 ... Insulating film, 130 ... Photomask, 200 ... Base material for touch panels with cured film.

Claims (16)

  It consists of a photosensitive resin composition containing a binder polymer having a carboxyl group and an acid value of 80 to 100 mgKOH / g, a photopolymerizable compound, and a photopolymerization initiator on a touch panel substrate. A photosensitive layer is provided, and a predetermined portion of the photosensitive layer is cured by irradiation with actinic rays, and then the photosensitive layer that covers a part or all of the base material is removed by removing other than the predetermined portion of the photosensitive layer. The manufacturing method of the base material for touchscreens with a cured film which forms the cured film of a part.   The manufacturing method of the base material for touchscreens with a cured film of Claim 1 whose glass transition temperature of the said binder polymer is 60 degreeC or more.   The photopolymerizable compound is a trifunctional or higher functional (meth) acrylate compound having a trimethylolpropane skeleton, a trifunctional or higher functional (meth) acrylate compound having a ditrimethylolpropane skeleton, or a trifunctional or higher functional (meta) having a pentaerythritol skeleton. ) Acrylate compounds, trifunctional or higher functional (meth) acrylate compounds having a dipentaerythritol skeleton, trifunctional or higher functional (meth) acrylate compounds having a glycerol skeleton, trifunctional or higher functional (meth) acrylate compounds having a diglycerin skeleton, and the like The base material for touchscreens with a cured film of Claim 1 or 2 containing the (meth) acrylate compound which has at least 1 sort (s) of 3 or more (meth) acryloyl groups selected from the group which consists of an alkylene oxide modification compound of these. Production method.   4. The cured film according to claim 1, wherein the photosensitive resin composition further contains at least one compound selected from the group consisting of a triazole compound, a thiadiazole compound, and a tetrazole compound. Manufacturing method of base material for touch panels.   The manufacturing method of the base material for touchscreens with a cured film as described in any one of Claims 1-4 in which the said photosensitive resin composition further contains a phosphate ester compound.   The manufacturing method of the base material for touchscreens with a cured film as described in any one of Claims 1-5 in which the said photoinitiator contains an oxime ester compound or a phosphine oxide compound.   Preparing a photosensitive element comprising a support film and a photosensitive layer made of the photosensitive resin composition provided on the support film, transferring the photosensitive layer of the photosensitive element onto the substrate, The manufacturing method of the base material for touchscreens with a cured film as described in any one of Claims 1-6 which provides a photosensitive layer.   For forming a cured film on a substrate for a touch panel, which contains a binder polymer having a carboxyl group and an acid value of 80 to 100 mgKOH / g, a photopolymerizable compound, and a photopolymerization initiator. , Photosensitive resin composition.   The photosensitive resin composition of Claim 8 whose glass transition temperature of the said binder polymer is 60 degreeC or more.   The photopolymerizable compound is a tri- or higher-functional (meth) acrylate compound having a trimethylolpropane skeleton, a tri- or higher-functional (meth) acrylate compound having a ditrimethylolpropane skeleton, or a tri- or higher-functional (meth) having a pentaerythritol skeleton. Acrylate compound, trifunctional or higher functional (meth) acrylate compound having dipentaerythritol skeleton, trifunctional or higher functional (meth) acrylate compound having glycerin skeleton, trifunctional or higher functional (meth) acrylate compound having diglycerin skeleton, and these The photosensitive resin composition of Claim 8 or 9 containing the (meth) acrylate compound which has at least 1 sort (s) of 3 or more (meth) acryloyl groups selected from the group which consists of an alkylene oxide modification compound.   The photosensitive resin composition as described in any one of Claims 8-10 which further contains the at least 1 sort (s) of compound selected from the group which consists of a triazole compound, a thiadiazole compound, and a tetrazole compound.   The photosensitive resin composition as described in any one of Claims 8-11 which further contains a phosphate ester compound.   The photosensitive resin composition as described in any one of Claims 8-12 in which the said photoinitiator contains an oxime ester compound or a phosphine oxide compound.   A photosensitive element comprising: a support film; and a photosensitive layer made of the photosensitive resin composition according to any one of claims 8 to 13 provided on the support film.   The photosensitive element of Claim 14 whose thickness of the said photosensitive layer is 15 micrometers or less.   A touch panel provided with the base material for touchscreens with a cured film obtained by the method as described in any one of Claims 1-7.

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