TWI333499B - - Google Patents

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Publication number
TWI333499B
TWI333499B TW095132758A TW95132758A TWI333499B TW I333499 B TWI333499 B TW I333499B TW 095132758 A TW095132758 A TW 095132758A TW 95132758 A TW95132758 A TW 95132758A TW I333499 B TWI333499 B TW I333499B
Authority
TW
Taiwan
Prior art keywords
resin composition
carboxylic acid
resin
mass
group
Prior art date
Application number
TW095132758A
Other languages
English (en)
Chinese (zh)
Other versions
TW200728379A (en
Inventor
Yoko Shibazaki
Masao Arima
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200728379A publication Critical patent/TW200728379A/zh
Application granted granted Critical
Publication of TWI333499B publication Critical patent/TWI333499B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW095132758A 2005-09-06 2006-09-05 Resin composition, cured product of the same, and printed circuit board made of the same TW200728379A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005257525 2005-09-06

Publications (2)

Publication Number Publication Date
TW200728379A TW200728379A (en) 2007-08-01
TWI333499B true TWI333499B (ko) 2010-11-21

Family

ID=37858091

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132758A TW200728379A (en) 2005-09-06 2006-09-05 Resin composition, cured product of the same, and printed circuit board made of the same

Country Status (4)

Country Link
JP (1) JP5567543B2 (ko)
KR (1) KR100787341B1 (ko)
CN (1) CN1927944B (ko)
TW (1) TW200728379A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI510858B (zh) * 2011-12-05 2015-12-01 Hitachi Chemical Co Ltd 觸控式面板用電極的保護膜的形成方法及觸控式面板的製造方法
US9348223B2 (en) 2011-12-05 2016-05-24 Hitachi Chemical Company, Ltd. Method for forming resin cured film pattern, photosensitive resin composition, photosensitive element, method for producing touch panel, and resin cured film

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4663679B2 (ja) * 2007-05-08 2011-04-06 太陽ホールディングス株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物、及びプリント配線板
JP5291893B2 (ja) * 2007-05-08 2013-09-18 太陽ホールディングス株式会社 光硬化性樹脂組成物およびその硬化物
JP4975579B2 (ja) * 2007-10-01 2012-07-11 太陽ホールディングス株式会社 組成物、ドライフィルム、硬化物及びプリント配線板
JP5513711B2 (ja) * 2007-10-01 2014-06-04 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物
JP5376793B2 (ja) * 2007-11-07 2013-12-25 太陽ホールディングス株式会社 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板
WO2009078407A1 (ja) * 2007-12-19 2009-06-25 Toyo Ink Mfg. Co., Ltd. 着色組成物、カラーフィルタの製造方法およびカラーフィルタ
WO2012165259A1 (ja) * 2011-05-31 2012-12-06 電気化学工業株式会社 エネルギー線硬化性樹脂組成物
JP2014006499A (ja) * 2012-05-29 2014-01-16 Taiyo Ink Mfg Ltd 感光性組成物及びその硬化層を有するプリント配線板
JP5523642B1 (ja) * 2013-07-26 2014-06-18 太陽インキ製造株式会社 プリント配線板製造用光硬化性組成物、その硬化物およびプリント配線板
KR101835500B1 (ko) * 2014-12-24 2018-03-07 삼성에스디아이 주식회사 감광성 수지 조성물 및 이를 이용한 컬러필터
JP6783600B2 (ja) * 2016-09-20 2020-11-11 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、プリント配線板、および、プリント配線板の製造方法
KR101840584B1 (ko) 2017-01-17 2018-03-20 동우 화인켐 주식회사 착색 감광성 수지 조성물, 컬러필터 및 화상표시장치
CN113025202B (zh) * 2021-02-25 2022-04-15 长沙市湘鼎涂料有限公司 一种丙烯酸改性环氧化有机硅光固化涂料及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0755925B2 (ja) 1986-02-28 1995-06-14 旭化成工業株式会社 新規なオキシムエステル化合物及びその合成法
JPS62286961A (ja) 1986-06-05 1987-12-12 Asahi Chem Ind Co Ltd 新規なオキシムエステル化合物及びその製造方法
JP3782134B2 (ja) * 1995-07-20 2006-06-07 旭化成エレクトロニクス株式会社 プリント配線板の製造方法
TW494276B (en) * 1999-05-06 2002-07-11 Solar Blak Water Co Ltd Solder resist ink composition
NL1016815C2 (nl) * 1999-12-15 2002-05-14 Ciba Sc Holding Ag Oximester-fotoinitiatoren.
WO2002100903A1 (en) * 2001-06-11 2002-12-19 Ciba Specialty Chemicals Holding Inc. Oxime ester photoinitiators having a combined structure
JP4008273B2 (ja) * 2002-03-26 2007-11-14 太陽インキ製造株式会社 アルカリ現像型感光性樹脂組成物及びそれを用いたプリント配線基板
JP4087650B2 (ja) * 2002-07-12 2008-05-21 太陽インキ製造株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物
TW200417294A (en) * 2002-11-28 2004-09-01 Taiyo Ink Mfg Co Ltd Photo- and thermo-setting resin composition and printed wiring boards made by using the same
JP4437651B2 (ja) * 2003-08-28 2010-03-24 新日鐵化学株式会社 感光性樹脂組成物及びそれを用いたカラーフィルター
JP4489566B2 (ja) * 2003-11-27 2010-06-23 太陽インキ製造株式会社 硬化性樹脂組成物、その硬化物、およびプリント配線板
JP2005232195A (ja) * 2004-02-05 2005-09-02 Taiyo Ink Mfg Ltd 熱硬化性樹脂組成物、及びその硬化塗膜
JP2005221739A (ja) * 2004-02-05 2005-08-18 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、フォトレジストパターンの製造法及びプリント配線板の製造法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI510858B (zh) * 2011-12-05 2015-12-01 Hitachi Chemical Co Ltd 觸控式面板用電極的保護膜的形成方法及觸控式面板的製造方法
US9348223B2 (en) 2011-12-05 2016-05-24 Hitachi Chemical Company, Ltd. Method for forming resin cured film pattern, photosensitive resin composition, photosensitive element, method for producing touch panel, and resin cured film
US9488912B2 (en) 2011-12-05 2016-11-08 Hitachi Chemical Company, Ltd. Method of forming protective film for touch panel electrode, photosensitive resin composition and photosensitive element, and method of manufacturing touch panel
US9964849B2 (en) 2011-12-05 2018-05-08 Hitachi Chemical Company, Ltd. Method for forming resin cured film pattern, photosensitive resin composition, photosensitive element, method for producing touch panel, and resin cured film
US10042254B2 (en) 2011-12-05 2018-08-07 Hitachi Chemical Company, Ltd. Method of forming protective film for touch panel electrode photosensitive resin composition and photosensitive element, and method of manufacturing touch panel
US10386719B2 (en) 2011-12-05 2019-08-20 Hitachi Chemical Company, Ltd. Method for forming resin cured film pattern, photosensitive resin composition, photosensitive element, method for producing touch panel, and resin cured film
US10663861B2 (en) 2011-12-05 2020-05-26 Hitachi Chemical Company, Ltd. Method for forming resin cured film pattern, photosensitive resin composition, photosensitive element, method for producing touch panel, and resin cured film

Also Published As

Publication number Publication date
KR20070027459A (ko) 2007-03-09
CN1927944B (zh) 2010-05-12
CN1927944A (zh) 2007-03-14
JP5567543B2 (ja) 2014-08-06
JP2012103703A (ja) 2012-05-31
TW200728379A (en) 2007-08-01
KR100787341B1 (ko) 2007-12-18

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