TWI326117B - Mapping sensor system - Google Patents

Mapping sensor system Download PDF

Info

Publication number
TWI326117B
TWI326117B TW094143310A TW94143310A TWI326117B TW I326117 B TWI326117 B TW I326117B TW 094143310 A TW094143310 A TW 094143310A TW 94143310 A TW94143310 A TW 94143310A TW I326117 B TWI326117 B TW I326117B
Authority
TW
Taiwan
Prior art keywords
signal
sensor
light
mapping
detection
Prior art date
Application number
TW094143310A
Other languages
English (en)
Chinese (zh)
Other versions
TW200709326A (en
Inventor
Saitou Yoshitane
Nishikido Kenji
Original Assignee
Anywire Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anywire Corp filed Critical Anywire Corp
Publication of TW200709326A publication Critical patent/TW200709326A/zh
Application granted granted Critical
Publication of TWI326117B publication Critical patent/TWI326117B/zh

Links

Classifications

    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C15/00—Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path
    • G08C15/06—Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path successively, i.e. using time division
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/137—Storage devices mechanical with arrangements or automatic control means for selecting which articles are to be removed
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW094143310A 2005-08-25 2005-12-08 Mapping sensor system TWI326117B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005274634A JP2007059856A (ja) 2005-08-25 2005-08-25 マッピングセンサシステム

Publications (2)

Publication Number Publication Date
TW200709326A TW200709326A (en) 2007-03-01
TWI326117B true TWI326117B (en) 2010-06-11

Family

ID=37771333

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094143310A TWI326117B (en) 2005-08-25 2005-12-08 Mapping sensor system

Country Status (5)

Country Link
JP (1) JP2007059856A (ja)
KR (1) KR100976194B1 (ja)
CN (1) CN101238498B (ja)
TW (1) TWI326117B (ja)
WO (1) WO2007023575A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5008764B2 (ja) * 2008-03-14 2012-08-22 株式会社 エニイワイヤ 伝送制御システム
US9308305B2 (en) * 2014-06-18 2016-04-12 Ch Biomedical (Usa) Inc. Implantable blood pump with integrated controller

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0830654B2 (ja) * 1990-08-10 1996-03-27 三菱電機株式会社 位置測定器
JP3131750B2 (ja) * 1992-10-20 2001-02-05 東京エレクトロン株式会社 被処理体検出装置及び方法
AU6419798A (en) * 1997-03-19 1998-10-12 Omron Corporation Transmitting photoelectric sensor array
JP2005217440A (ja) 1998-03-26 2005-08-11 Tokyo Electron Ltd 基板処理装置
US6492650B1 (en) * 1999-10-25 2002-12-10 Omron Corporation Sensor unit for use in a multiple sensor unit array
JP3477709B2 (ja) * 1999-10-29 2003-12-10 オムロン株式会社 センサシステム
DE10059815A1 (de) * 2000-12-01 2002-06-13 Grieshaber Vega Kg Elektronische Messvorrichtung zur Erfassung einer Prozessvariablen, insbesondere Radar- oder Ultraschall-Füllstandsmessvorrichtung und Verfahren zum Betreiben einer solchen Messvorrichtung
JP4294985B2 (ja) * 2003-03-26 2009-07-15 株式会社キーエンス 連設型センサシステム、マスタユニット、センサユニット並びにセンサ中継ユニット
KR100642517B1 (ko) 2005-09-06 2006-11-03 삼성전자주식회사 이송로봇의 티칭장치

Also Published As

Publication number Publication date
TW200709326A (en) 2007-03-01
CN101238498B (zh) 2013-03-27
CN101238498A (zh) 2008-08-06
KR100976194B1 (ko) 2010-08-17
JP2007059856A (ja) 2007-03-08
WO2007023575A1 (ja) 2007-03-01
KR20080038249A (ko) 2008-05-02

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