TW200709326A - Mapping sensor system - Google Patents

Mapping sensor system

Info

Publication number
TW200709326A
TW200709326A TW094143310A TW94143310A TW200709326A TW 200709326 A TW200709326 A TW 200709326A TW 094143310 A TW094143310 A TW 094143310A TW 94143310 A TW94143310 A TW 94143310A TW 200709326 A TW200709326 A TW 200709326A
Authority
TW
Taiwan
Prior art keywords
sensor
signal line
sensor system
common
mapping
Prior art date
Application number
TW094143310A
Other languages
Chinese (zh)
Other versions
TWI326117B (en
Inventor
Yoshitane Saitou
Kenji Nishikido
Original Assignee
Anywire Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anywire Corp filed Critical Anywire Corp
Publication of TW200709326A publication Critical patent/TW200709326A/en
Application granted granted Critical
Publication of TWI326117B publication Critical patent/TWI326117B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C15/00—Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path
    • G08C15/06—Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path successively, i.e. using time division
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/137—Storage devices mechanical with arrangements or automatic control means for selecting which articles are to be removed
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The monitor signal line is common use with power supply line, and overlay common-signal line, then the connection of the power supply and the signal line are decreased. The amount of electric power of mapping sensor system is decreased at time-sharing the operation time of each sensor branch. And it can be easier adjustment at the installation. The mapping sensor system has plural sensor branch (9 and 7a-7h). These sensor branches (9, 7a-7h) are connected to the common data signal line (11, 12). It is connected to common data signal route (11,12), and these sensor branches (9, 7a~7h) transmit a sensor signal from a sensor part to a control unit.
TW094143310A 2005-08-25 2005-12-08 Mapping sensor system TWI326117B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005274634A JP2007059856A (en) 2005-08-25 2005-08-25 Mapping sensor system

Publications (2)

Publication Number Publication Date
TW200709326A true TW200709326A (en) 2007-03-01
TWI326117B TWI326117B (en) 2010-06-11

Family

ID=37771333

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094143310A TWI326117B (en) 2005-08-25 2005-12-08 Mapping sensor system

Country Status (5)

Country Link
JP (1) JP2007059856A (en)
KR (1) KR100976194B1 (en)
CN (1) CN101238498B (en)
TW (1) TWI326117B (en)
WO (1) WO2007023575A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101953118B (en) * 2008-03-14 2014-08-27 株式会社恩尼怀尔 Transmission control system
US9308305B2 (en) * 2014-06-18 2016-04-12 Ch Biomedical (Usa) Inc. Implantable blood pump with integrated controller

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0830654B2 (en) * 1990-08-10 1996-03-27 三菱電機株式会社 Position measuring device
JP3131750B2 (en) * 1992-10-20 2001-02-05 東京エレクトロン株式会社 Object detection apparatus and method
US6528808B1 (en) * 1997-03-19 2003-03-04 Omron Corporation Transmitting photoelectric sensor array
JP2005217440A (en) 1998-03-26 2005-08-11 Tokyo Electron Ltd Substrate processing apparatus
DE60043884D1 (en) * 1999-10-25 2010-04-08 Omron Tateisi Electronics Co ADJUSTABLE FIXING UNIT
JP3477709B2 (en) * 1999-10-29 2003-12-10 オムロン株式会社 Sensor system
DE10059815A1 (en) * 2000-12-01 2002-06-13 Grieshaber Vega Kg Electronic measuring device for detecting a process variable, in particular radar or ultrasonic level measuring device and method for operating such a measuring device
JP4294985B2 (en) * 2003-03-26 2009-07-15 株式会社キーエンス Continuous sensor system, master unit, sensor unit and sensor relay unit
KR100642517B1 (en) 2005-09-06 2006-11-03 삼성전자주식회사 Teaching apparatus of transfer robot

Also Published As

Publication number Publication date
CN101238498A (en) 2008-08-06
TWI326117B (en) 2010-06-11
WO2007023575A1 (en) 2007-03-01
CN101238498B (en) 2013-03-27
JP2007059856A (en) 2007-03-08
KR20080038249A (en) 2008-05-02
KR100976194B1 (en) 2010-08-17

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