TWI324369B - - Google Patents

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Publication number
TWI324369B
TWI324369B TW094101992A TW94101992A TWI324369B TW I324369 B TWI324369 B TW I324369B TW 094101992 A TW094101992 A TW 094101992A TW 94101992 A TW94101992 A TW 94101992A TW I324369 B TWI324369 B TW I324369B
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TW
Taiwan
Prior art keywords
high voltage
current
circuit
wire
discharge
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TW094101992A
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English (en)
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TW200532829A (en
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Shinkawa Kk
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • AHUMAN NECESSITIES
    • A47FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47JKITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J27/00Cooking-vessels
    • A47J27/56Preventing boiling over, e.g. of milk
    • A47J27/58Cooking utensils with channels or covers collecting overflowing liquid
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004Wire welding
    • B23K20/005Capillary welding
    • B23K20/007Ball bonding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • AHUMAN NECESSITIES
    • A47FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47JKITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J27/00Cooking-vessels
    • A47J27/002Construction of cooking-vessels; Methods or processes of manufacturing specially adapted for cooking-vessels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009Pre-treatment of the connector or the bonding area
    • H01L2224/8503Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01023Vanadium [V]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19043Component type being a resistor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S220/00Receptacles
    • Y10S220/912Cookware, i.e. pots and pans

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Food Science & Technology (AREA)
  • Wire Bonding (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Description

1^^4369 • \ · 九、發明說明: 【發明所屬之技術領域】 本發明,係關於打線裝置,特別係關於在引線前端形 成球體之裝置》 【先前技術】 打線裝置,如圖2所示,捲繞於線軸(未圖示)之引線i 之—端,係經過夾具2而插通於毛細管3。引線丨之另一端, 藉由接地線5連接於高電壓電源4之接地側之端子。用以 在引線1之前端形成球體之放電裝f 6,藉纟電壓供應線7 連接於後述之定電流電路丨〇,定電流電路丨〇則連接於高電 屋電源4之高電壓側。
定電流電路10,具有高電壓控制電路U與電流檢測電 =2。在高電壓控制電路u之正極側輸人端子⑴連接高 $ 電源4之问電壓側’在高電壓控制電路^ ^之負極側輸 入端子㈠連接電流檢測電路12之輸出端。高電壓控制電路 11端係透過電m 13連接於電壓供應線7。流通於電 阻13之電流則藉由電流檢測電路12來檢測。又,此種打 線裝置,可列舉如專利文獻1及2。 專利文獻1 ♦日本特開彳2-298874號(發明專利第 261 735 1號)公報 J文獻2 .曰本特開2〇〇〇-2〇85 50號公報 其次說明作"體形成時高電壓電源、4所輸出之高 …通過南電壓控制電路11施加於放電裝置6與引線i 5 1324369 , · 前端之間,使其放電而產生電流》此電流,當作電阻13之 兩端間之檢測電壓E1被檢測’將此檢測電壓e1與來自電 流檢測電路12之控制電壓E2的差值以高電壓控制電路1 i 放大,藉此控制流過引線1之電流。在高電壓控制電路i j, 將正極側輸入端子(+)與負極側輸入端子(-)之電壓控制成大 致相等。即,引線丨與放電裝置6之間所流通之輸出電流, 係藉由控制電壓E2控制成一定值。 •【發明内容】 在接地線5斷線5 a之情形,從高電壓電源4之高電壓 側通過電壓供應線7、放電裝置6、引線丨、接地線5流過 向電壓電源4之接地側之電流,因被遮斷,故不會對引線1 產生放電,不應該會形成球體。但是’高電壓電源4,其放 電電壓係高至例如-3000V,有時候會經過導引引線i之未 圖不之引線導件之絕緣使電流流至接地。放電結束後,因 • 接地線5已斷線5a ’故此電流則無流通之途徑,而在引線i 及引線途經部會殘留放電時之電荷。此帶電之電荷,在下 —步驟之對第1接合點之接合會向半導體元件放電,有使 半導體元件損傷之虞。 為了解決如上述之問題,可考慮設置用以檢測接地線5 之斷線5a之斷線檢測機構。又,若電壓供應線7斷線之情 形,不會從放電裝置6對引線丨放電,而不會產生如前述 之問題。 本發明之課題,在於提供一種打線裝置,其不需設置 6 1324369 .·. · 被檢’則’將此檢測電壓E1與來自電流檢測電路12之控 制電壓E2之差值以高電壓控制電路u放大,藉此控制流 ^引線1之電流。在高電壓控制電路1 1,將正極側輸入端 子(Μ與負極側輸入端子㈠之電壓控制成大致相等。即,引 線1與放電裝置6之間所流通之輸出電流,藉由控制電壓 E2控制成一定值。 在接地線5斷線5a之情形,從高電壓電源4之高電壓 側通過電壓供應線7、放電裝置6、引線1、接地線5流至 尚電壓電源4之接地側之電流由於被遮斷,故不會對引線j 產生放電。即,因在接地線5未流通電流,故電流檢測電 路12則不會輸出。因此,當無由電流檢測電路12之輸出 端12a之輸出時,未圖示之電腦則判斷為接地線5之斷線 5a。並且,為表示接地線5已斷線5a,輸出使裝置停止之 h號。藉此’防止引線丨所帶電之電荷對半導體元件放電, 不會損傷半導體元件。 如上述’藉由以定電流電路1 〇之電流檢測電路12,檢 ’則從接地線5流過高電壓電源4之電流,能檢測接地線5 之斷線5 a。即,因不需設置用以檢測接地線5之斷線&的 特別之斷線檢測機構,故裝置成本不會增加。 然而,產生機率雖少,但有時候在球體形成時會引起 從放電裝置6向半導體元件放電之誤放電。在此種情形, 因在引線1沒有電流流通,故在本實施形態之情形,如前 述,則判斷為接地線5之靳線5a,而使裝置停止。藉此, 作業人員,檢查接地線5之斷線5a,若接地線5未斷線5a 9 1324369 .·· ♦ 時則判斷誤放電。 因此,本實施形態,將接地線導通檢測機構2〇(能自動 判定接地線5之斷線5a或誤放電)連接於接地線5之兩蠕 部。接地線導通檢測機構20,由直流電源2丨與開關22所 構成,如前述若無由電流檢測電路12之輸出端12a之輪出 時,藉由電腦之指令使開關22關閉,來檢測接地線5之導 通。若接地線5導通時判斷為誤放電,並顯示此訊息。藉 此,能判斷接地線5之斷線5a或誤放電,作業人員能立即 採取其對策。 【圖式簡單說明】 圖1 ’係表示本發明之打線裝置之一實施形態的要部構 成圖β 圖2,係習知之打線裝置的要部構成圖。 [ 主要元件符號說明】 1 引線 2 夹具 3 毛細管 4 高電壓電源 5 接地線 5a 斷線 6 放電裝置 7 電壓供應線 10 1324369 10 定電流電路 11 高電壓控制電路 12 電流檢測電路 12a 輸出端 13 電阻 20 接地線導通檢測機構 21 直流電源 22 開關 El 檢測電壓 E2 控制電壓

Claims (1)

1324369 ,· 第094101992號申請案申請專利範園替換頁98年n q 十、申請專利範圍: 痄年心月釦曰修(巧正替換頁 ' 1 · 一種打線裝置,係將高電壓電源之高電壓側透過電壓 . 供應線連接於放電裝置,並將引線透過接地線連接於高電 壓電源之接地側,而以該高電壓電源於引線前端與放電裝 置之間施加高電壓使其放電,藉此使引線之前端形成球 體,為將此時之放電電流控制成一定值,其具備定電流電 路,該定電流電路,具有檢測放電電流之電流檢測電路、 及根據該放電電流控制高電壓之高電壓控制電路,其特徵 Φ 在於: . 該疋電流電路之電流檢測電路’係檢測流過該接地線 . 之電流、並將該檢測電流輸入該定電流電路之高電壓控制 電路’連接於若在放電時從該電流檢測電路無輸出,則判 定為接地線斷線之電腦。 2_如申請專利範圍第1項之打線裝置,其中,該高電壓 控制電路’係將輸出端連接於該放電裝置,於正極側輸入 端子連接該高電壓電源之高電壓侧;該電流檢測電路以其 ^ 輸入端檢測流至該接地線之電流,輸出端子則連接於該高 電壓控制電路之負極側輸入端子,連接於若在放電時從該 電流檢測電路無輸出時則判定為接地線斷線之電腦。 3 _ —種打線裝置’係將高電壓電源之高電壓側透過電壓 供應線連接於放電裝置,並將引線透過接地線連接於高電 壓電源之接地側,而以該高電壓電源高電壓於引線前端與 放電裝置之間施加高電壓使其放電,藉此使引線之前端形 成球體,為將此時之放電電流控制為一定值,其具備定電 12 1324369 •、 %年^月3。日修(g)正替換頁 流電路,該定電流電路,具有檢測放電電流之電流檢測電 • 路、及以該放電電流控制向電壓之高電壓控制電路,其特 * 徵在於: 該疋電流電路之電流檢測電路,係檢測流過該接地線 之電流、並將該檢測電流輸入該定電流電路之高電壓控制 電路;並設置接地線導通檢測機構,連接於當在放電時從 β亥電檢測電路無輸出而判定為接地線斷線之電腦,該電 胳在判疋為接地線斷線時使其動作,以檢測該接地線之導 ^ 通,藉由此接地線導通檢測機構所實施之導通檢測,來判 • 定是接地線斷線或是誤放電。 - 4.如申請專利範圍第3項之打線裝置,其中,該高電壓 控制電路,係將輸出端連接於該放電裝置,於正極側輸入 端子連接該高電壓電源之高電壓側,;該電流檢測電路係 以其輸入端檢測流過該接地線之電流,輸出端子則連接於 該高電壓控制電路之負極側輸入端子;並設置接地線導通 __ 檢測機構,連接於若在放電時從該電流檢測電路無輸出而 判定為接地線斷線之電腦,該電腦在判定為接地線斷線時 使其動作,以檢測該接地線之導通,藉由此接地線導通檢 測機構所實施之導通檢測,來判定是接地線斷線或是誤放 電。 十一、圓式: 如次頁 13
TW094101992A 2004-03-30 2005-01-24 Wire- bonding apparatus TW200532829A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004097401A JP4176671B2 (ja) 2004-03-30 2004-03-30 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
TW200532829A TW200532829A (en) 2005-10-01
TWI324369B true TWI324369B (zh) 2010-05-01

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TW094101992A TW200532829A (en) 2004-03-30 2005-01-24 Wire- bonding apparatus

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US (1) US20050219777A1 (zh)
JP (1) JP4176671B2 (zh)
KR (1) KR100628702B1 (zh)
TW (1) TW200532829A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008187066A (ja) * 2007-01-31 2008-08-14 Oki Electric Ind Co Ltd パワートランジスタ
CN104813457B (zh) * 2012-11-16 2017-08-04 株式会社新川 打线装置以及打线方法
US10629563B2 (en) * 2015-05-03 2020-04-21 Kaijo Corporation Ball forming device for wire bonder

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2835989B2 (ja) * 1991-05-24 1998-12-14 株式会社新川 ワイヤボンダ用ボール形成装置
JP2714339B2 (ja) * 1993-01-19 1998-02-16 ローム株式会社 ワイヤボンディング装置
JP3057631B2 (ja) * 1995-11-24 2000-07-04 株式会社新川 被覆ワイヤのワイヤボンディングツールの清浄方法
JP3370543B2 (ja) * 1997-02-24 2003-01-27 株式会社新川 ワイヤボンディング装置用放電異常検出装置及びその方法
US6667625B1 (en) * 2001-12-31 2003-12-23 Charles F. Miller Method and apparatus for detecting wire in an ultrasonic bonding tool

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Publication number Publication date
KR100628702B1 (ko) 2006-09-28
JP2005286080A (ja) 2005-10-13
US20050219777A1 (en) 2005-10-06
KR20060043250A (ko) 2006-05-15
TW200532829A (en) 2005-10-01
JP4176671B2 (ja) 2008-11-05

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