TWI324369B - - Google Patents
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- TWI324369B TWI324369B TW094101992A TW94101992A TWI324369B TW I324369 B TWI324369 B TW I324369B TW 094101992 A TW094101992 A TW 094101992A TW 94101992 A TW94101992 A TW 94101992A TW I324369 B TWI324369 B TW I324369B
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J27/00—Cooking-vessels
- A47J27/56—Preventing boiling over, e.g. of milk
- A47J27/58—Cooking utensils with channels or covers collecting overflowing liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
- B23K20/007—Ball bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J27/00—Cooking-vessels
- A47J27/002—Construction of cooking-vessels; Methods or processes of manufacturing specially adapted for cooking-vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S220/00—Receptacles
- Y10S220/912—Cookware, i.e. pots and pans
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Food Science & Technology (AREA)
- Wire Bonding (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Description
1^^4369 • \ · 九、發明說明: 【發明所屬之技術領域】 本發明,係關於打線裝置,特別係關於在引線前端形 成球體之裝置》 【先前技術】 打線裝置,如圖2所示,捲繞於線軸(未圖示)之引線i 之—端,係經過夾具2而插通於毛細管3。引線丨之另一端, 藉由接地線5連接於高電壓電源4之接地側之端子。用以 在引線1之前端形成球體之放電裝f 6,藉纟電壓供應線7 連接於後述之定電流電路丨〇,定電流電路丨〇則連接於高電 屋電源4之高電壓側。
定電流電路10,具有高電壓控制電路U與電流檢測電 =2。在高電壓控制電路u之正極側輸人端子⑴連接高 $ 電源4之问電壓側’在高電壓控制電路^ ^之負極側輸 入端子㈠連接電流檢測電路12之輸出端。高電壓控制電路 11端係透過電m 13連接於電壓供應線7。流通於電 阻13之電流則藉由電流檢測電路12來檢測。又,此種打 線裝置,可列舉如專利文獻1及2。 專利文獻1 ♦日本特開彳2-298874號(發明專利第 261 735 1號)公報 J文獻2 .曰本特開2〇〇〇-2〇85 50號公報 其次說明作"體形成時高電壓電源、4所輸出之高 …通過南電壓控制電路11施加於放電裝置6與引線i 5 1324369 , · 前端之間,使其放電而產生電流》此電流,當作電阻13之 兩端間之檢測電壓E1被檢測’將此檢測電壓e1與來自電 流檢測電路12之控制電壓E2的差值以高電壓控制電路1 i 放大,藉此控制流過引線1之電流。在高電壓控制電路i j, 將正極側輸入端子(+)與負極側輸入端子(-)之電壓控制成大 致相等。即,引線丨與放電裝置6之間所流通之輸出電流, 係藉由控制電壓E2控制成一定值。 •【發明内容】 在接地線5斷線5 a之情形,從高電壓電源4之高電壓 側通過電壓供應線7、放電裝置6、引線丨、接地線5流過 向電壓電源4之接地側之電流,因被遮斷,故不會對引線1 產生放電,不應該會形成球體。但是’高電壓電源4,其放 電電壓係高至例如-3000V,有時候會經過導引引線i之未 圖不之引線導件之絕緣使電流流至接地。放電結束後,因 • 接地線5已斷線5a ’故此電流則無流通之途徑,而在引線i 及引線途經部會殘留放電時之電荷。此帶電之電荷,在下 —步驟之對第1接合點之接合會向半導體元件放電,有使 半導體元件損傷之虞。 為了解決如上述之問題,可考慮設置用以檢測接地線5 之斷線5a之斷線檢測機構。又,若電壓供應線7斷線之情 形,不會從放電裝置6對引線丨放電,而不會產生如前述 之問題。 本發明之課題,在於提供一種打線裝置,其不需設置 6 1324369 .·. · 被檢’則’將此檢測電壓E1與來自電流檢測電路12之控 制電壓E2之差值以高電壓控制電路u放大,藉此控制流 ^引線1之電流。在高電壓控制電路1 1,將正極側輸入端 子(Μ與負極側輸入端子㈠之電壓控制成大致相等。即,引 線1與放電裝置6之間所流通之輸出電流,藉由控制電壓 E2控制成一定值。 在接地線5斷線5a之情形,從高電壓電源4之高電壓 側通過電壓供應線7、放電裝置6、引線1、接地線5流至 尚電壓電源4之接地側之電流由於被遮斷,故不會對引線j 產生放電。即,因在接地線5未流通電流,故電流檢測電 路12則不會輸出。因此,當無由電流檢測電路12之輸出 端12a之輸出時,未圖示之電腦則判斷為接地線5之斷線 5a。並且,為表示接地線5已斷線5a,輸出使裝置停止之 h號。藉此’防止引線丨所帶電之電荷對半導體元件放電, 不會損傷半導體元件。 如上述’藉由以定電流電路1 〇之電流檢測電路12,檢 ’則從接地線5流過高電壓電源4之電流,能檢測接地線5 之斷線5 a。即,因不需設置用以檢測接地線5之斷線&的 特別之斷線檢測機構,故裝置成本不會增加。 然而,產生機率雖少,但有時候在球體形成時會引起 從放電裝置6向半導體元件放電之誤放電。在此種情形, 因在引線1沒有電流流通,故在本實施形態之情形,如前 述,則判斷為接地線5之靳線5a,而使裝置停止。藉此, 作業人員,檢查接地線5之斷線5a,若接地線5未斷線5a 9 1324369 .·· ♦ 時則判斷誤放電。 因此,本實施形態,將接地線導通檢測機構2〇(能自動 判定接地線5之斷線5a或誤放電)連接於接地線5之兩蠕 部。接地線導通檢測機構20,由直流電源2丨與開關22所 構成,如前述若無由電流檢測電路12之輸出端12a之輪出 時,藉由電腦之指令使開關22關閉,來檢測接地線5之導 通。若接地線5導通時判斷為誤放電,並顯示此訊息。藉 此,能判斷接地線5之斷線5a或誤放電,作業人員能立即 採取其對策。 【圖式簡單說明】 圖1 ’係表示本發明之打線裝置之一實施形態的要部構 成圖β 圖2,係習知之打線裝置的要部構成圖。 [ 主要元件符號說明】 1 引線 2 夹具 3 毛細管 4 高電壓電源 5 接地線 5a 斷線 6 放電裝置 7 電壓供應線 10 1324369 10 定電流電路 11 高電壓控制電路 12 電流檢測電路 12a 輸出端 13 電阻 20 接地線導通檢測機構 21 直流電源 22 開關 El 檢測電壓 E2 控制電壓
Claims (1)
1324369 ,· 第094101992號申請案申請專利範園替換頁98年n q 十、申請專利範圍: 痄年心月釦曰修(巧正替換頁 ' 1 · 一種打線裝置,係將高電壓電源之高電壓側透過電壓 . 供應線連接於放電裝置,並將引線透過接地線連接於高電 壓電源之接地側,而以該高電壓電源於引線前端與放電裝 置之間施加高電壓使其放電,藉此使引線之前端形成球 體,為將此時之放電電流控制成一定值,其具備定電流電 路,該定電流電路,具有檢測放電電流之電流檢測電路、 及根據該放電電流控制高電壓之高電壓控制電路,其特徵 Φ 在於: . 該疋電流電路之電流檢測電路’係檢測流過該接地線 . 之電流、並將該檢測電流輸入該定電流電路之高電壓控制 電路’連接於若在放電時從該電流檢測電路無輸出,則判 定為接地線斷線之電腦。 2_如申請專利範圍第1項之打線裝置,其中,該高電壓 控制電路’係將輸出端連接於該放電裝置,於正極側輸入 端子連接該高電壓電源之高電壓侧;該電流檢測電路以其 ^ 輸入端檢測流至該接地線之電流,輸出端子則連接於該高 電壓控制電路之負極側輸入端子,連接於若在放電時從該 電流檢測電路無輸出時則判定為接地線斷線之電腦。 3 _ —種打線裝置’係將高電壓電源之高電壓側透過電壓 供應線連接於放電裝置,並將引線透過接地線連接於高電 壓電源之接地側,而以該高電壓電源高電壓於引線前端與 放電裝置之間施加高電壓使其放電,藉此使引線之前端形 成球體,為將此時之放電電流控制為一定值,其具備定電 12 1324369 •、 %年^月3。日修(g)正替換頁 流電路,該定電流電路,具有檢測放電電流之電流檢測電 • 路、及以該放電電流控制向電壓之高電壓控制電路,其特 * 徵在於: 該疋電流電路之電流檢測電路,係檢測流過該接地線 之電流、並將該檢測電流輸入該定電流電路之高電壓控制 電路;並設置接地線導通檢測機構,連接於當在放電時從 β亥電檢測電路無輸出而判定為接地線斷線之電腦,該電 胳在判疋為接地線斷線時使其動作,以檢測該接地線之導 ^ 通,藉由此接地線導通檢測機構所實施之導通檢測,來判 • 定是接地線斷線或是誤放電。 - 4.如申請專利範圍第3項之打線裝置,其中,該高電壓 控制電路,係將輸出端連接於該放電裝置,於正極側輸入 端子連接該高電壓電源之高電壓側,;該電流檢測電路係 以其輸入端檢測流過該接地線之電流,輸出端子則連接於 該高電壓控制電路之負極側輸入端子;並設置接地線導通 __ 檢測機構,連接於若在放電時從該電流檢測電路無輸出而 判定為接地線斷線之電腦,該電腦在判定為接地線斷線時 使其動作,以檢測該接地線之導通,藉由此接地線導通檢 測機構所實施之導通檢測,來判定是接地線斷線或是誤放 電。 十一、圓式: 如次頁 13
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004097401A JP4176671B2 (ja) | 2004-03-30 | 2004-03-30 | ワイヤボンディング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200532829A TW200532829A (en) | 2005-10-01 |
TWI324369B true TWI324369B (zh) | 2010-05-01 |
Family
ID=35054028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094101992A TW200532829A (en) | 2004-03-30 | 2005-01-24 | Wire- bonding apparatus |
Country Status (4)
Country | Link |
---|---|
US (1) | US20050219777A1 (zh) |
JP (1) | JP4176671B2 (zh) |
KR (1) | KR100628702B1 (zh) |
TW (1) | TW200532829A (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008187066A (ja) * | 2007-01-31 | 2008-08-14 | Oki Electric Ind Co Ltd | パワートランジスタ |
CN104813457B (zh) * | 2012-11-16 | 2017-08-04 | 株式会社新川 | 打线装置以及打线方法 |
US10629563B2 (en) * | 2015-05-03 | 2020-04-21 | Kaijo Corporation | Ball forming device for wire bonder |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2835989B2 (ja) * | 1991-05-24 | 1998-12-14 | 株式会社新川 | ワイヤボンダ用ボール形成装置 |
JP2714339B2 (ja) * | 1993-01-19 | 1998-02-16 | ローム株式会社 | ワイヤボンディング装置 |
JP3057631B2 (ja) * | 1995-11-24 | 2000-07-04 | 株式会社新川 | 被覆ワイヤのワイヤボンディングツールの清浄方法 |
JP3370543B2 (ja) * | 1997-02-24 | 2003-01-27 | 株式会社新川 | ワイヤボンディング装置用放電異常検出装置及びその方法 |
US6667625B1 (en) * | 2001-12-31 | 2003-12-23 | Charles F. Miller | Method and apparatus for detecting wire in an ultrasonic bonding tool |
-
2004
- 2004-03-30 JP JP2004097401A patent/JP4176671B2/ja not_active Expired - Lifetime
-
2005
- 2005-01-24 TW TW094101992A patent/TW200532829A/zh unknown
- 2005-02-28 KR KR1020050016596A patent/KR100628702B1/ko active IP Right Grant
- 2005-03-30 US US11/093,712 patent/US20050219777A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
KR100628702B1 (ko) | 2006-09-28 |
JP2005286080A (ja) | 2005-10-13 |
US20050219777A1 (en) | 2005-10-06 |
KR20060043250A (ko) | 2006-05-15 |
TW200532829A (en) | 2005-10-01 |
JP4176671B2 (ja) | 2008-11-05 |
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