TW200532829A - Wire- bonding apparatus - Google Patents
Wire- bonding apparatus Download PDFInfo
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- TW200532829A TW200532829A TW094101992A TW94101992A TW200532829A TW 200532829 A TW200532829 A TW 200532829A TW 094101992 A TW094101992 A TW 094101992A TW 94101992 A TW94101992 A TW 94101992A TW 200532829 A TW200532829 A TW 200532829A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J27/00—Cooking-vessels
- A47J27/56—Preventing boiling over, e.g. of milk
- A47J27/58—Cooking utensils with channels or covers collecting overflowing liquid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
- B23K20/007—Ball bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J27/00—Cooking-vessels
- A47J27/002—Construction of cooking-vessels; Methods or processes of manufacturing specially adapted for cooking-vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S220/00—Receptacles
- Y10S220/912—Cookware, i.e. pots and pans
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Food Science & Technology (AREA)
- Wire Bonding (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Description
200532829 九、發明說明: 【發明所屬之技術領域】 特別係關於在引線前端形 本發明,係關於打線裝置 成球體之裝置。 l无前技術】
打線裝置,如圖2所+,按M 夕一# 〃 斤不捲繞於線軸(未圖示)之引線1 之一编’係經過夾具2而插
M . , 棚通於毛細官3。引線1之另一端, 糟由接地線5連接於高電壓雷 . 、 L冤/原4之接地側之端子。用以 、之刖端形成球體之放電裝置6,藉由電壓供應線7 於後述之定電流電路!^電流電路Μ則連接於高電 £電源4之高電壓側。 定電流電路10,具有高電壓控制電路η與電流檢測電 路12。在高電壓控制電路u之正極側輸人端子⑴連接$ 電_ 4之高電壓側,在高電壓控制電路η之負極側輪 入端子㈠連接電流檢測電路12之輸出端。高電廢控制Μ 之輸出知係透過電阻丨3連接於電壓供應線7。流通於電 阻13之電流則藉由電流檢測電路來檢測。又,此種才' 線裝置,可列舉如專利文獻1及2。 1 專利文獻1 :曰本特開平2·298874號(發明專利第 2617351號)公報 專利文獻2 :日本特開2000-208550號公報 其次說明作用。球體形成時高電壓電源4所輸出之高 電壓,通過高電壓控制電路丨丨施加於放電裝置6與弓丨線^ 5 200532829 w端之間,使其放電而產生電流。此電流,當作電阻13之 兩端間之檢測電壓E1被檢測,將此檢測電壓E1與來自電 流檢測電路12之控制電壓E2的差值以高電壓控制電路η 放大,藉此控制流過引線!之電流。在高電壓控制電路^ ^, 將正極側輸入端子(+)與負極側輸入端子㈠之電麼控制成大 致相等。即,引線1與放電裝置6之間所流通之輸出電流, 係藉由控制電壓Ε2控制成一定值。 ® 【發明内容】 在接地線5斷線5a之情形,從高電壓電源4之高電壓 側通過電壓供應線7、放電袭置6、引線i、接地線5流= 南電壓電源4之接地側之電流,因被遮斷,故不會對引線j 產生放電,不應該會形成球體。但是,高電壓電源4,其放 電電壓係高至例如-3000V,有時候會經過導引引線丨之未 圖不之引線導件之絕緣使電流流至接地。放電結束後,因 φ接地線5已斷線5a,故此電流則無流通之途徑,而在引線i 及引線途徑部會殘留放電時之電荷。此帶電之電荷,在下 一步驟之對第1接合點之接合會向半導體元件放電,有使 半導體元件損傷之虞。 為了解決如上述之問題,可考慮設置用以檢測接地線5 之斷線5a之斷線檢測機構。又,若電壓供應線7斷線之情 形,不會從放電裝置6對引線丨放電,而不會產生如前述 之問題。 本發明之課題,在於提供一種打線裝置,其不需設置 6 200532829 用以檢測接地線斷線之斷線檢測機構,能不增加裝置成本 而檢測接地線之斷線。 用以解決上述課題之本發明之請求工頁卜其特徵在於: 係將高電壓電源之高電塵側透過電摩供應線連接於放電装 置,並將引線透過接地線連接於高電慶電源之接地側,而、 以該高電壓電源於引線之前端與放電裝置之間施加高電壓 使其放電,藉此使引線之前端形成球體,為將此時之 電流控制為一定值,係具備定電流電路,該定電流電路, 電:㈣流檢測電路、及根據該放電電流控 制同電昼之尚電麼控制電路,該定電流電路之電流檢測電 二係檢測流過該接地線之電流、並將該檢測 :電流電路之高電隸制電路4在放電時從該電流_ 电路無輸出,則判定為接地線斷線。 用以解決上述課題之本發明之請求項2,係如請 I ’其特徵在於:該高電壓控制 、 放電裝置,於正極側輪入”二V將輸出端連接於該 側,而於負極::=連接該高電壓電源之高電壓 員㈣1輸人端子則連接該電流檢測電 端,該電流檢測電路待 1 月'j出 流,若在放電時從二:^檢測流過該接地線之電 線斷線。技測電路無輸出,則判定為接地 用以解決上述課題之本發明之請求項 項1及2,其特微力认. 係如睛求 :從該電流檢測電路無輸出而判定為接地線斷線時::電 來檢測該接地線之導 M , L ^ 動作, 之導通,错由此接地線導通檢測機構所實 7 200532829 把之v通檢測來判定是接地線斷線或是誤放電。 _依W求項1及2,藉由以定電流電路之電流檢測電路, 檢測從接地線流過高電壓電源之電流,在從電流檢測電路 無輸出時能檢測接地線之斷線。即,因不需設置用以檢測 接地線斷線的特別之斷線檢測機構,故不會增加裝置成 本。依申請專利範圍第3及4項,因設置能自動判定是接 地線斷線或是誤放電之接地線導通檢測機構,故從電流檢 測私路無輸出呀能藉由接地線導通檢測機構判斷是接地線 馨斷線或是誤放電,作業者能立即採取因應之對策。 【實施方式】 依圖1說明本發明之一實施形態。又,圖2與其相同 或相當構件係使用相同符號,並省略其詳細說明。本實施 形悲,定電流電路10之高電壓控制電路丨丨之連接雖與習 知者相同’但定電流電路10之電流檢測電路12之連接則 與習知者不相同。即,電流檢測電路12係構成為檢測通過 接地線5流至高電壓電源4之接地側之電流。在接地線$ 之高電壓電源4側之端子係連接電阻13而接地,將流至此 電阻1 3之電流藉由電流檢測電路1 2而檢測。 其次說明作用。在接地線5未斷線5a之情形,藉由與 習知大致同樣之作用在引線丨之前端形成球體。即,球體 形成時高電壓電源4所輸出之高電壓,係通過高電壓控制 電路11而施加於放電裝置6與引線丨前端之間使其放電而 產生電流。此電流,係作為電阻13兩端間之檢測電壓ei 8 200532829 而,檢測,將此檢測電a E1與來自t流檢測電路12之控 制電« E2之差值以高電壓控制電路u放大,藉此控制流 過引線1之電流。在高電壓控制電路U,將正極側輸入端 子(+)契負極側輸入端子㈠之電壓控制成大致相等。即,引 線1與放電裝置6之間所流通之輸出電流,藉由控制電壓 Ε2控制成一定值。 在接地線5斷線5a之情形,從高電壓電源4之高電壓 •側通過電壓供應線7、放電裝置6、引線i、接地線5流至 ’高電壓電源4之接地側之電流由於被遮斷,故不會對引線丨 產生放電。即,因在接地線5未流通電流,故電流檢測電 路12則不會輸出。因此,當無由電流檢測電路12之輸出 柒12a之輸出時,未圖示之電腦則判斷為接地線$之斷線 5a。並且,為表示接地線5已斷線&,輸出使裝置停止之 ^號。藉此,防止引線丨所帶電之電荷對半導體元件放電, 不會損傷半導體元件。 , 如上述,藉由以定電流電路10之電流檢測電路12,檢 測^接地線5流過高電壓電源4之電流,能檢測接地線$ 之斷線5 a即,因不需設置用以檢測接地線5之斷線5 a的 特別之斷線檢測機構,故裝置成本不會增加。 然而,產生機率雖少,但有時候在球體形成時會引起 k放私炱置6向半導體元件放電之誤放電。在此種情形, 因在引線1沒有電流流通,故在本實施形態之情形,如前 述,則判斷為接地線5之斷線5a,而使裝置停止。藉此, 作業人員,檢查接地線5之斷線5a,若接地線5未斷線h 9 200532829 時則判斷誤放電。 因此,本實施形態,將接地線導通檢測機構20(能自動 判定接地線5之斷線5a或誤放電)連接於接地線5之兩端 部。接地線導通檢測機構20,由直流電源2 1與開關22所 構成’如如述右無由電流檢測電路12之輸出端12 a之輸出 時’藉由電腦之指令使開關22關閉,來檢測接地線5之導 通。若接地線5導通時判斷為誤放電,並顯示此訊息。藉 此’能判斷接地線5之斷線5a或誤放電,作業人員能立即 鲁採取其對策。 【圖式簡單說明】 圖1 ’係表示本發明之打線裝置之一實施形態的要部構 成圖。 圖2 ’係習知之打線裝置的要部構成圖。 _ 【主要元件符號說明】 1 引線 2 夾具 3 毛細管 4 高電壓電源 5 接地線 5a 斷線 6 放電裝置 7 電壓供應線 10 .200532829 10 定電流電路 11 高電壓控制電路 12 電流檢測電路 12a 輸出端 13 電阻 20 接地線導通檢測機構 21 直流電源 22 開關 El 檢測電壓 E2 控制電壓 11
Claims (1)
- 200532829 十、申請專利範圍: 1.一種打線裝置,係將高電壓電源之高電壓側 处避電壓 供應線連接於放電裝置,並將引線透過接地線連接於言“ 壓電源之接地側’而以該高電壓電源於引線前端與放1 ^ 置之間施加高電壓使其放電,藉此使引線之前端形2球 體,為將此時之放電電流控制成一定值,其具備定#节i 路,該定電流電路,具有檢測放電電流之電流檢測電路γ 及根據該放電電流控制高電壓之高電壓控制 • 丄 ,、将徵 在於: 該定電流電路之電流檢測電路,係檢測流過該接地線 之電流、並將該檢測電流輸入該定電流電路之高電壓控制 電路,若在放電時從該電流檢測電路無輸出,則判定=接 地線斷線。 2.如申請專利範圍帛i項之打線裝置,纟中,該高電壓 ㈣電路’係將輸出端連接於該放電裝置,於正極側輸二 端子連接該高電昼電源之高電麼側,而於負極侧輸入端子 零則連接該電流檢測電路之輸出端;該電流檢測電路以其輪 〇端檢測流至該接地線之電流,若在放電時從該電流檢測 电路無輪出時則判定為接地線斷線。 丘 種打線1置,係將向電壓電源之高電壓側透過電壓 =2線連接於放電裝置,並將引線透過接地線連接於高電 壓电,之接地側,而以該高電壓電源高電壓於引線前端與 放電裝置之間施加高電壓使其放電,藉此使引線之前端形 成球體,為將此時之放電電流控制為一定值,其具備定電 12 200532829 流電路,該定電流電路,具有檢測放電電流之電流檢測電 路、及以該放電電流控制高電壓之高電壓控制電路,其特 徵在於: 該定電流電路之電流檢測電路,係檢測流過該接地、線 之電流、並將該檢測電流輸入該定電流電路之高電壓控制 電路;並設置接地線導通檢測機構,當在放電時從該電流 檢測電路無輸出而判定為接地線斷線時使其動作,以檢測 該接地線之導通,藉由此接地線導通檢測機構所實施之導 • 通檢測,來判定是接地線斷線或是誤放電。 4·如申請專利範圍第3項之打線裝置,其中,該高電壓 控制電路,係將輸出端連接於該放電裝置,於正極側輸入 端子連接該高電壓電源之高電壓側,並於在負極側輸入端 子連接該電流檢測電路之輸出端;該電流檢測電路係以其 輸入端檢測流過該接地線之電流;並設置接地線導通檢測 機構,若在放電時從該電流檢測電路無輸出而判定為接地 線斷線時使其動作,以檢測該接地線之導通,藉由此接地 線導通檢測機構所實施之導通檢測,來判定是接地線斷線 Η^一、圖式: 如次頁 13
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JP (1) | JP4176671B2 (zh) |
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SG11201503764YA (en) * | 2012-11-16 | 2015-06-29 | Shinkawa Kk | Wire-bonding apparatus and method of wire bonding |
JP6076537B1 (ja) * | 2015-05-03 | 2017-02-08 | 株式会社カイジョー | ワイヤボンダ用ボール形成装置 |
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JP2835989B2 (ja) * | 1991-05-24 | 1998-12-14 | 株式会社新川 | ワイヤボンダ用ボール形成装置 |
JP2714339B2 (ja) * | 1993-01-19 | 1998-02-16 | ローム株式会社 | ワイヤボンディング装置 |
JP3057631B2 (ja) * | 1995-11-24 | 2000-07-04 | 株式会社新川 | 被覆ワイヤのワイヤボンディングツールの清浄方法 |
JP3370543B2 (ja) * | 1997-02-24 | 2003-01-27 | 株式会社新川 | ワイヤボンディング装置用放電異常検出装置及びその方法 |
US6667625B1 (en) * | 2001-12-31 | 2003-12-23 | Charles F. Miller | Method and apparatus for detecting wire in an ultrasonic bonding tool |
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2004
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US20050219777A1 (en) | 2005-10-06 |
TWI324369B (zh) | 2010-05-01 |
KR100628702B1 (ko) | 2006-09-28 |
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