TWI323290B - - Google Patents

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Publication number
TWI323290B
TWI323290B TW095105912A TW95105912A TWI323290B TW I323290 B TWI323290 B TW I323290B TW 095105912 A TW095105912 A TW 095105912A TW 95105912 A TW95105912 A TW 95105912A TW I323290 B TWI323290 B TW I323290B
Authority
TW
Taiwan
Prior art keywords
telescopic device
holder
reticle
substrate
mask
Prior art date
Application number
TW095105912A
Other languages
English (en)
Chinese (zh)
Other versions
TW200641549A (en
Inventor
Tatsuya Kataoka
Kenji Nagao
Kenichi Saito
Original Assignee
Mitsui Shipbuilding Eng
Choshu Industry Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Shipbuilding Eng, Choshu Industry Company Ltd filed Critical Mitsui Shipbuilding Eng
Publication of TW200641549A publication Critical patent/TW200641549A/zh
Application granted granted Critical
Publication of TWI323290B publication Critical patent/TWI323290B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
TW095105912A 2005-02-23 2006-02-22 Mask clamp-moving mechanism, and film deposition apparatus TW200641549A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005047812A JP4609754B2 (ja) 2005-02-23 2005-02-23 マスククランプの移動機構および成膜装置

Publications (2)

Publication Number Publication Date
TW200641549A TW200641549A (en) 2006-12-01
TWI323290B true TWI323290B (ko) 2010-04-11

Family

ID=36927384

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095105912A TW200641549A (en) 2005-02-23 2006-02-22 Mask clamp-moving mechanism, and film deposition apparatus

Country Status (5)

Country Link
JP (1) JP4609754B2 (ko)
KR (1) KR100947572B1 (ko)
CN (1) CN101090993B (ko)
TW (1) TW200641549A (ko)
WO (1) WO2006090746A1 (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101060652B1 (ko) * 2008-04-14 2011-08-31 엘아이지에이디피 주식회사 유기물 증착장치 및 이를 이용한 증착 방법
CN102686764B (zh) * 2009-12-28 2014-06-04 株式会社爱发科 成膜装置以及成膜方法
JP5783811B2 (ja) 2010-07-06 2015-09-24 キヤノン株式会社 成膜装置
CN101984135B (zh) * 2010-11-19 2013-07-10 光驰科技(上海)有限公司 成膜基板夹具及其成膜装置
KR102046563B1 (ko) * 2012-12-13 2019-11-20 삼성디스플레이 주식회사 박막 증착 장치 및 그것을 이용한 박막 증착 방법
KR101570072B1 (ko) * 2013-08-30 2015-11-19 주식회사 에스에프에이 박막 증착장치
KR102218644B1 (ko) * 2013-12-19 2021-02-23 삼성디스플레이 주식회사 증착 장치
KR102141855B1 (ko) * 2014-03-31 2020-08-07 주식회사 선익시스템 마스크 얼라인 장치
DE102016107524B4 (de) * 2016-04-22 2019-11-14 Carl Zeiss Smt Gmbh Verfahren zur Positionserfassung eines Maskenhalters auf einem Messtisch
CN105887033B (zh) * 2016-06-02 2018-10-23 京东方科技集团股份有限公司 夹持设备及其工作方法、磁控溅射装置
JP6262811B2 (ja) * 2016-07-08 2018-01-17 キヤノントッキ株式会社 真空成膜装置
KR102405438B1 (ko) * 2018-06-25 2022-06-03 캐논 톡키 가부시키가이샤 마스크 위치조정장치, 성막장치, 마스크 위치조정방법, 성막방법, 및 전자디바이스의 제조방법
KR102430361B1 (ko) * 2018-09-21 2022-08-05 캐논 톡키 가부시키가이샤 흡착장치, 성막장치, 흡착방법, 성막방법 및 전자 디바이스의 제조방법
KR102257008B1 (ko) * 2019-01-11 2021-05-26 캐논 톡키 가부시키가이샤 성막 장치, 성막 방법 및 전자 디바이스 제조방법
CN109837509B (zh) * 2019-04-04 2024-03-01 江苏集萃有机光电技术研究所有限公司 一种基片样品架、镀膜设备及控制方法
CN110172667B (zh) * 2019-06-20 2021-06-01 深圳市华星光电半导体显示技术有限公司 一种应用于溅镀设备中的夹持装置和溅镀设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2832836B2 (ja) * 1988-12-26 1998-12-09 株式会社小松製作所 真空成膜装置
JP2000238233A (ja) * 1999-02-23 2000-09-05 Fuji Mach Mfg Co Ltd スクリーン検査方法，装置およびスクリーン印刷機
JP4355428B2 (ja) * 2000-05-23 2009-11-04 株式会社ソニー・ディスクアンドデジタルソリューションズ スパッタリング装置
KR100838065B1 (ko) * 2002-05-31 2008-06-16 삼성에스디아이 주식회사 박막증착기용 고정장치와 이를 이용한 고정방법
JP2004183044A (ja) * 2002-12-03 2004-07-02 Seiko Epson Corp マスク蒸着方法及び装置、マスク及びマスクの製造方法、表示パネル製造装置、表示パネル並びに電子機器

Also Published As

Publication number Publication date
JP2006233256A (ja) 2006-09-07
CN101090993A (zh) 2007-12-19
KR20070087081A (ko) 2007-08-27
KR100947572B1 (ko) 2010-03-15
CN101090993B (zh) 2010-12-01
TW200641549A (en) 2006-12-01
JP4609754B2 (ja) 2011-01-12
WO2006090746A1 (ja) 2006-08-31

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MM4A Annulment or lapse of patent due to non-payment of fees