TWI323043B - - Google Patents

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Publication number
TWI323043B
TWI323043B TW095104850A TW95104850A TWI323043B TW I323043 B TWI323043 B TW I323043B TW 095104850 A TW095104850 A TW 095104850A TW 95104850 A TW95104850 A TW 95104850A TW I323043 B TWI323043 B TW I323043B
Authority
TW
Taiwan
Prior art keywords
light
substrate
emitting
conductive layer
emitting portion
Prior art date
Application number
TW095104850A
Other languages
English (en)
Chinese (zh)
Other versions
TW200633275A (en
Inventor
Mikio Tazima
Tetsuji Moku
Junji Sato
Yasuhiro Kamii
Arei Niwa
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Publication of TW200633275A publication Critical patent/TW200633275A/zh
Application granted granted Critical
Publication of TWI323043B publication Critical patent/TWI323043B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/832Electrodes characterised by their material
    • H10H20/835Reflective materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Devices (AREA)
TW095104850A 2005-02-28 2006-02-14 Semiconductor light emitting diode and method of manufacturing same TW200633275A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005052934A JP2006237467A (ja) 2005-02-28 2005-02-28 半導体発光素子及びその製造方法

Publications (2)

Publication Number Publication Date
TW200633275A TW200633275A (en) 2006-09-16
TWI323043B true TWI323043B (enExample) 2010-04-01

Family

ID=36931892

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095104850A TW200633275A (en) 2005-02-28 2006-02-14 Semiconductor light emitting diode and method of manufacturing same

Country Status (4)

Country Link
US (1) US7446342B2 (enExample)
JP (1) JP2006237467A (enExample)
KR (1) KR100724782B1 (enExample)
TW (1) TW200633275A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100590775B1 (ko) * 2004-12-08 2006-06-19 한국전자통신연구원 실리콘 발광 소자
JP4765916B2 (ja) 2006-12-04 2011-09-07 サンケン電気株式会社 半導体発光素子
KR101534848B1 (ko) * 2008-07-21 2015-07-27 엘지이노텍 주식회사 발광 다이오드 및 그 제조방법. 그리고 발광 소자 및 그발광 소자 제조방법
KR101039904B1 (ko) * 2010-01-15 2011-06-09 엘지이노텍 주식회사 발광 소자, 발광 소자 패키지 및 발광 소자 제조방법
CN107210335B (zh) 2015-01-30 2019-07-05 欧司朗光电半导体有限公司 用于制造半导体组件的方法及半导体组件

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5406095A (en) * 1992-08-27 1995-04-11 Victor Company Of Japan, Ltd. Light emitting diode array and production method of the light emitting diode
JP3482709B2 (ja) * 1994-10-19 2004-01-06 株式会社デンソー 半導体装置
KR100545113B1 (ko) * 1996-12-27 2006-04-14 모토로라 인코포레이티드 가시파장의수직공동표면방출레이저
US6493368B1 (en) * 1999-07-21 2002-12-10 Agere Systems Inc. Lateral injection vertical cavity surface-emitting laser
JP4054631B2 (ja) 2001-09-13 2008-02-27 シャープ株式会社 半導体発光素子およびその製造方法、ledランプ並びにled表示装置
JP4048056B2 (ja) * 2002-01-15 2008-02-13 シャープ株式会社 半導体発光素子及びその製造方法
KR20190000980A (ko) * 2017-06-26 2019-01-04 이동원 퍼스널 헬스케어 시스템

Also Published As

Publication number Publication date
US7446342B2 (en) 2008-11-04
JP2006237467A (ja) 2006-09-07
KR20060095470A (ko) 2006-08-31
KR100724782B1 (ko) 2007-06-04
TW200633275A (en) 2006-09-16
US20060193355A1 (en) 2006-08-31

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees