TWI321967B - Top-emitting electroluminescent devices comprising cathode bus bars - Google Patents
Top-emitting electroluminescent devices comprising cathode bus bars Download PDFInfo
- Publication number
- TWI321967B TWI321967B TW095118038A TW95118038A TWI321967B TW I321967 B TWI321967 B TW I321967B TW 095118038 A TW095118038 A TW 095118038A TW 95118038 A TW95118038 A TW 95118038A TW I321967 B TWI321967 B TW I321967B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- metal
- display device
- well
- light
- Prior art date
Links
- 239000010410 layer Substances 0.000 claims description 282
- 229910052751 metal Inorganic materials 0.000 claims description 96
- 239000002184 metal Substances 0.000 claims description 96
- 239000000463 material Substances 0.000 claims description 60
- 229920002120 photoresistant polymer Polymers 0.000 claims description 58
- 238000000034 method Methods 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 27
- 238000000151 deposition Methods 0.000 claims description 16
- 238000000059 patterning Methods 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 12
- 238000007641 inkjet printing Methods 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 8
- 229910052760 oxygen Inorganic materials 0.000 claims description 8
- 239000001301 oxygen Substances 0.000 claims description 8
- 238000002834 transmittance Methods 0.000 claims description 7
- 230000004888 barrier function Effects 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 6
- 229920000547 conjugated polymer Polymers 0.000 claims description 6
- 239000003989 dielectric material Substances 0.000 claims description 6
- 229910003437 indium oxide Inorganic materials 0.000 claims description 6
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 229920002098 polyfluorene Chemical class 0.000 claims description 6
- 238000004528 spin coating Methods 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 5
- 238000005286 illumination Methods 0.000 claims description 5
- 229910001512 metal fluoride Inorganic materials 0.000 claims description 5
- 239000000565 sealant Substances 0.000 claims description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 238000005566 electron beam evaporation Methods 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 238000002207 thermal evaporation Methods 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 150000001768 cations Chemical class 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 229910052727 yttrium Inorganic materials 0.000 claims description 3
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 229920000417 polynaphthalene Polymers 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000002356 single layer Substances 0.000 claims description 2
- 239000002689 soil Substances 0.000 claims description 2
- 238000012360 testing method Methods 0.000 claims description 2
- 229910001887 tin oxide Inorganic materials 0.000 claims description 2
- 238000001039 wet etching Methods 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- -1 alkaline earth metal cation Chemical class 0.000 claims 1
- 125000003609 aryl vinyl group Chemical class 0.000 claims 1
- 238000003776 cleavage reaction Methods 0.000 claims 1
- 230000007017 scission Effects 0.000 claims 1
- 238000005201 scrubbing Methods 0.000 claims 1
- 230000006870 function Effects 0.000 description 14
- 239000011159 matrix material Substances 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 7
- 238000010276 construction Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 150000001342 alkaline earth metals Chemical class 0.000 description 4
- 230000006378 damage Effects 0.000 description 4
- 230000005525 hole transport Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 4
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 150000001555 benzenes Chemical class 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011575 calcium Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- RICKKZXCGCSLIU-UHFFFAOYSA-N 2-[2-[carboxymethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]ethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]acetic acid Chemical compound CC1=NC=C(CO)C(CN(CCN(CC(O)=O)CC=2C(=C(C)N=CC=2CO)O)CC(O)=O)=C1O RICKKZXCGCSLIU-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- OYLGJCQECKOTOL-UHFFFAOYSA-L barium fluoride Chemical compound [F-].[F-].[Ba+2] OYLGJCQECKOTOL-UHFFFAOYSA-L 0.000 description 2
- 229910001632 barium fluoride Inorganic materials 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 2
- 229910001634 calcium fluoride Inorganic materials 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000010406 cathode material Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 239000000412 dendrimer Substances 0.000 description 2
- 229920000736 dendritic polymer Polymers 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 150000003384 small molecules Chemical class 0.000 description 2
- 239000011775 sodium fluoride Substances 0.000 description 2
- 235000013024 sodium fluoride Nutrition 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 241000237858 Gastropoda Species 0.000 description 1
- 229910003023 Mg-Al Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052728 basic metal Inorganic materials 0.000 description 1
- 150000003818 basic metals Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004768 lowest unoccupied molecular orbital Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- YCWSUKQGVSGXJO-NTUHNPAUSA-N nifuroxazide Chemical group C1=CC(O)=CC=C1C(=O)N\N=C\C1=CC=C([N+]([O-])=O)O1 YCWSUKQGVSGXJO-NTUHNPAUSA-N 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- AFNRRBXCCXDRPS-UHFFFAOYSA-N tin(ii) sulfide Chemical compound [Sn]=S AFNRRBXCCXDRPS-UHFFFAOYSA-N 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/824—Cathodes combined with auxiliary electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/828—Transparent cathodes, e.g. comprising thin metal layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80522—Cathodes combined with auxiliary electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80524—Transparent cathodes, e.g. comprising thin metal layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0510282.7A GB0510282D0 (en) | 2005-05-20 | 2005-05-20 | Top-electroluminescent devices comprising cathode bus bars |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200704272A TW200704272A (en) | 2007-01-16 |
| TWI321967B true TWI321967B (en) | 2010-03-11 |
Family
ID=34834345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095118038A TWI321967B (en) | 2005-05-20 | 2006-05-19 | Top-emitting electroluminescent devices comprising cathode bus bars |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20090066229A1 (enExample) |
| JP (1) | JP2008541393A (enExample) |
| DE (1) | DE112006001268T5 (enExample) |
| GB (3) | GB0510282D0 (enExample) |
| TW (1) | TWI321967B (enExample) |
| WO (1) | WO2006123126A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI459587B (zh) * | 2012-02-02 | 2014-11-01 | Chunghwa Picture Tubes Ltd | 主動式發光元件 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2454867B (en) * | 2007-11-09 | 2010-02-03 | Cambridge Display Tech Ltd | Electroluminescent devices comprising bus bar |
| KR101254748B1 (ko) * | 2009-05-06 | 2013-04-15 | 엘지디스플레이 주식회사 | 유기전계발광표시장치 및 이의 제조방법 |
| DE102013110449B4 (de) * | 2013-09-20 | 2019-10-24 | Osram Oled Gmbh | Bauelement und Verfahren zum Herstellen eines Bauelementes |
| CN106129103B (zh) * | 2016-09-20 | 2023-06-30 | 合肥京东方光电科技有限公司 | 一种显示基板、其制作方法、显示面板及镀膜装置 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4539507A (en) * | 1983-03-25 | 1985-09-03 | Eastman Kodak Company | Organic electroluminescent devices having improved power conversion efficiencies |
| US5707745A (en) * | 1994-12-13 | 1998-01-13 | The Trustees Of Princeton University | Multicolor organic light emitting devices |
| US5703436A (en) * | 1994-12-13 | 1997-12-30 | The Trustees Of Princeton University | Transparent contacts for organic devices |
| JP4122554B2 (ja) * | 1998-01-21 | 2008-07-23 | 凸版印刷株式会社 | 有機エレクトロルミネッセンス素子及びその製造方法 |
| US6352777B1 (en) * | 1998-08-19 | 2002-03-05 | The Trustees Of Princeton University | Organic photosensitive optoelectronic devices with transparent electrodes |
| JP4137007B2 (ja) * | 2000-01-21 | 2008-08-20 | 株式会社リコー | 映像内容説明文生成装置およびコンピュータ読み取り可能な記録媒体 |
| KR100574486B1 (ko) * | 2000-06-30 | 2006-04-27 | 주식회사 하이닉스반도체 | 유기반사방지막 조성물 및 그의 제조방법 |
| US6664730B2 (en) * | 2001-07-09 | 2003-12-16 | Universal Display Corporation | Electrode structure of el device |
| JP4058930B2 (ja) * | 2001-10-09 | 2008-03-12 | セイコーエプソン株式会社 | 有機エレクトロルミネッセンス装置及びその製造方法、並びに電子機器 |
| JP3724725B2 (ja) * | 2001-11-01 | 2005-12-07 | ソニー株式会社 | 表示装置の製造方法 |
| SG126714A1 (en) * | 2002-01-24 | 2006-11-29 | Semiconductor Energy Lab | Light emitting device and method of manufacturing the same |
| US7291970B2 (en) * | 2002-09-11 | 2007-11-06 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting apparatus with improved bank structure |
| JP2004127933A (ja) * | 2002-09-11 | 2004-04-22 | Semiconductor Energy Lab Co Ltd | 発光装置およびその作製方法 |
| JP3705283B2 (ja) * | 2002-10-03 | 2005-10-12 | セイコーエプソン株式会社 | 表示パネル及びその表示パネルを備えた電子機器 |
| GB0224121D0 (en) * | 2002-10-16 | 2002-11-27 | Microemissive Displays Ltd | Method of patterning a functional material on to a substrate |
| JP2004296303A (ja) * | 2003-03-27 | 2004-10-21 | Seiko Epson Corp | 電気光学装置、その製造方法および電子機器 |
| JP3915734B2 (ja) * | 2003-05-12 | 2007-05-16 | ソニー株式会社 | 蒸着マスクおよびこれを用いた表示装置の製造方法、ならびに表示装置 |
| US7247986B2 (en) * | 2003-06-10 | 2007-07-24 | Samsung Sdi. Co., Ltd. | Organic electro luminescent display and method for fabricating the same |
| KR100974778B1 (ko) * | 2003-06-30 | 2010-08-06 | 삼성전자주식회사 | 유기금속 전구체 조성물 및 이를 이용한 금속 필름 또는패턴 형성방법 |
| JP4567962B2 (ja) * | 2003-07-25 | 2010-10-27 | 三洋電機株式会社 | エレクトロルミネッセンス素子及びエレクトロルミネッセンスパネル |
| KR100552972B1 (ko) * | 2003-10-09 | 2006-02-15 | 삼성에스디아이 주식회사 | 평판표시장치 및 그의 제조방법 |
| KR101026812B1 (ko) * | 2003-11-28 | 2011-04-04 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 그의 제조 방법 |
| US20050130422A1 (en) * | 2003-12-12 | 2005-06-16 | 3M Innovative Properties Company | Method for patterning films |
| KR100699998B1 (ko) * | 2004-09-23 | 2007-03-26 | 삼성에스디아이 주식회사 | 유기 전계 발광 소자 및 그의 제조 방법 |
-
2005
- 2005-05-20 GB GBGB0510282.7A patent/GB0510282D0/en not_active Ceased
-
2006
- 2006-05-12 WO PCT/GB2006/001793 patent/WO2006123126A1/en not_active Ceased
- 2006-05-12 US US11/915,133 patent/US20090066229A1/en not_active Abandoned
- 2006-05-12 DE DE112006001268T patent/DE112006001268T5/de not_active Withdrawn
- 2006-05-12 GB GB0722243A patent/GB2440865B/en not_active Expired - Fee Related
- 2006-05-12 JP JP2008511782A patent/JP2008541393A/ja active Pending
- 2006-05-19 TW TW095118038A patent/TWI321967B/zh not_active IP Right Cessation
-
2007
- 2007-11-15 GB GBGB0722541.0A patent/GB0722541D0/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI459587B (zh) * | 2012-02-02 | 2014-11-01 | Chunghwa Picture Tubes Ltd | 主動式發光元件 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200704272A (en) | 2007-01-16 |
| JP2008541393A (ja) | 2008-11-20 |
| GB2440865A (en) | 2008-02-13 |
| GB2440865B (en) | 2011-05-04 |
| GB0722541D0 (en) | 2007-12-27 |
| US20090066229A1 (en) | 2009-03-12 |
| WO2006123126A1 (en) | 2006-11-23 |
| GB0510282D0 (en) | 2005-06-29 |
| GB0722243D0 (en) | 2007-12-27 |
| DE112006001268T5 (de) | 2008-04-17 |
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