TWI319514B - Negative-type photosensitive resin composition containing epoxy-containing material - Google Patents

Negative-type photosensitive resin composition containing epoxy-containing material

Info

Publication number
TWI319514B
TWI319514B TW095106760A TW95106760A TWI319514B TW I319514 B TWI319514 B TW I319514B TW 095106760 A TW095106760 A TW 095106760A TW 95106760 A TW95106760 A TW 95106760A TW I319514 B TWI319514 B TW I319514B
Authority
TW
Taiwan
Prior art keywords
negative
resin composition
photosensitive resin
type photosensitive
composition containing
Prior art date
Application number
TW095106760A
Other languages
English (en)
Other versions
TW200700915A (en
Inventor
Kei Arao
Makoto Nomura
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW200700915A publication Critical patent/TW200700915A/zh
Application granted granted Critical
Publication of TWI319514B publication Critical patent/TWI319514B/zh

Links

Classifications

    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
    • A47L11/00—Machines for cleaning floors, carpets, furniture, walls, or wall coverings
    • A47L11/40—Parts or details of machines not provided for in groups A47L11/02 - A47L11/38, or not restricted to one of these groups, e.g. handles, arrangements of switches, skirts, buffers, levers
    • A47L11/408—Means for supplying cleaning or surface treating agents
    • A47L11/4086—Arrangements for steam generation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
    • A47L11/00—Machines for cleaning floors, carpets, furniture, walls, or wall coverings
    • A47L11/02—Floor surfacing or polishing machines
    • A47L11/20—Floor surfacing or polishing machines combined with vacuum cleaning devices
    • A47L11/201—Floor surfacing or polishing machines combined with vacuum cleaning devices with supply of cleaning agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0381—Macromolecular compounds which are rendered insoluble or differentially wettable using a combination of a phenolic resin and a polyoxyethylene resin
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
    • A47L2601/00—Washing methods characterised by the use of a particular treatment
    • A47L2601/04—Steam

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Epoxy Resins (AREA)
TW095106760A 2005-03-01 2006-03-01 Negative-type photosensitive resin composition containing epoxy-containing material TWI319514B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005056106A JP4633500B2 (ja) 2005-03-01 2005-03-01 エポキシ含有物質を含むネガ型感光性樹脂組成物

Publications (2)

Publication Number Publication Date
TW200700915A TW200700915A (en) 2007-01-01
TWI319514B true TWI319514B (en) 2010-01-11

Family

ID=36636989

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106760A TWI319514B (en) 2005-03-01 2006-03-01 Negative-type photosensitive resin composition containing epoxy-containing material

Country Status (6)

Country Link
US (1) US20060199098A1 (zh)
EP (1) EP1698935A3 (zh)
JP (1) JP4633500B2 (zh)
KR (1) KR101322389B1 (zh)
CN (1) CN1834783A (zh)
TW (1) TWI319514B (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4753040B2 (ja) * 2006-09-21 2011-08-17 日産化学工業株式会社 重合性基を有する化合物を含有するネガ型感光性樹脂組成物
JP5610794B2 (ja) * 2010-03-03 2014-10-22 東京応化工業株式会社 ポジ型感光性樹脂組成物及びその硬化物
JP5624794B2 (ja) * 2010-04-19 2014-11-12 東京応化工業株式会社 ネガ型感光性樹脂組成物、感光性ドライフィルム、及び受光装置
JP2012001690A (ja) * 2010-06-21 2012-01-05 Adeka Corp 光硬化性樹脂組成物
JP5981738B2 (ja) * 2012-03-14 2016-08-31 旭化成株式会社 感光性樹脂組成物、及び硬化レリーフパターンの製造方法
JP6099313B2 (ja) * 2012-03-14 2017-03-22 旭化成株式会社 感光性樹脂組成物、及び硬化レリーフパターンの製造方法
JP5981737B2 (ja) * 2012-03-14 2016-08-31 旭化成株式会社 感光性樹脂組成物、及び硬化レリーフパターンの製造方法
CN104718498B (zh) * 2012-10-17 2019-12-17 富士胶片株式会社 光学材料用永久膜的制造方法、硬化膜、有机el显示装置及液晶显示装置
JP6123302B2 (ja) * 2013-01-15 2017-05-10 住友ベークライト株式会社 化学増幅型のネガ型フォトレジスト用樹脂組成物、硬化物および電子装置
JP6369132B2 (ja) * 2013-06-28 2018-08-08 住友ベークライト株式会社 ネガ型感光性樹脂組成物、硬化膜、電子装置およびポリマー
KR102381904B1 (ko) * 2014-03-20 2022-03-31 제온 코포레이션 감방사선 수지 조성물 및 전자 부품
CN106687864B (zh) * 2014-11-26 2020-07-03 日立化成株式会社 感光性树脂组合物、感光性元件、固化物、半导体装置、抗蚀图案的形成方法及电路基材的制造方法
CN106716250A (zh) * 2014-11-26 2017-05-24 日立化成株式会社 感光性树脂组合物、感光性元件、固化物、半导体装置、抗蚀图案的形成方法及电路基材的制造方法
WO2016159133A1 (ja) * 2015-03-30 2016-10-06 日立化成株式会社 ドライフィルム、硬化物、半導体装置及びレジストパターンの形成方法
JP2018091878A (ja) * 2015-03-30 2018-06-14 日立化成株式会社 ドライフィルム、硬化物、半導体装置及びレジストパターンの形成方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3018262A (en) 1957-05-01 1962-01-23 Shell Oil Co Curing polyepoxides with certain metal salts of inorganic acids
US4231951A (en) * 1978-02-08 1980-11-04 Minnesota Mining And Manufacturing Company Complex salt photoinitiator
US4683317A (en) 1983-05-23 1987-07-28 General Electric Company Photopolymerizable organic compositions and diaryliodonium salts used therein
CA1307695C (en) 1986-01-13 1992-09-22 Wayne Edmund Feely Photosensitive compounds and thermally stable and aqueous developablenegative images
US5300380A (en) * 1986-08-06 1994-04-05 Ciba-Geigy Corporation Process for the production of relief structures using a negative photoresist based on polyphenols and epoxy compounds or vinyl ethers
US5210155A (en) * 1990-08-24 1993-05-11 Exxon Chemical Patents Inc. Phenol terminated diester compositions derived from dicarboxylic acids, polyester polymers or alkyd polymers, and curable compositions containing same
US5312715A (en) 1991-03-04 1994-05-17 Shipley Company Inc. Light-sensitive composition and process
US5262280A (en) * 1992-04-02 1993-11-16 Shipley Company Inc. Radiation sensitive compositions
US5514728A (en) * 1993-07-23 1996-05-07 Minnesota Mining And Manufacturing Company Catalysts and initiators for polymerization
EP0706041A1 (en) * 1994-10-07 1996-04-10 Bp Chemicals S.N.C. Chemicals property determination
US5877229A (en) * 1995-07-26 1999-03-02 Lockheed Martin Energy Systems, Inc. High energy electron beam curing of epoxy resin systems incorporating cationic photoinitiators
JPH1041633A (ja) * 1996-07-25 1998-02-13 Hitachi Ltd 多層配線板とそれに用いる感光性樹脂組成物
US5858618A (en) * 1996-12-02 1999-01-12 Nan Ya Plastics Corporation Photopolymerizable resinous composition
JPH11269349A (ja) * 1998-03-23 1999-10-05 Hitachi Chem Co Ltd 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置
JP3460820B2 (ja) * 1999-12-08 2003-10-27 日本電気株式会社 難燃性エポキシ樹脂組成物
JP2003128882A (ja) * 2001-10-30 2003-05-08 Nippon Kayaku Co Ltd 液状エポキシ樹脂混合物、エポキシ樹脂組成物及びその硬化物
US6806033B2 (en) * 2002-01-08 2004-10-19 International Business Machines Corporation Photoimaged dielectric, its manufacture and use in electronics
JP4251612B2 (ja) * 2003-01-30 2009-04-08 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． エポキシ含有物質を含むネガ型感光性樹脂組成物
JP4397601B2 (ja) * 2003-02-06 2010-01-13 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． フェノール−ビフェニレン樹脂を含むネガ型感光性樹脂組成物

Also Published As

Publication number Publication date
JP4633500B2 (ja) 2011-02-16
KR101322389B1 (ko) 2013-10-29
US20060199098A1 (en) 2006-09-07
EP1698935A2 (en) 2006-09-06
EP1698935A3 (en) 2008-07-02
TW200700915A (en) 2007-01-01
KR20060099415A (ko) 2006-09-19
CN1834783A (zh) 2006-09-20
JP2006243157A (ja) 2006-09-14

Similar Documents

Publication Publication Date Title
TWI340870B (en) Negative-type photosensitive resin composition containing epoxy-containing material
TWI319514B (en) Negative-type photosensitive resin composition containing epoxy-containing material
EP1862855A4 (en) LIGHT-SENSITIVE RESIN COMPOSITION
SG122900A1 (en) Photosensitive resin composition
EP1861749A4 (en) NEW PHOTOSENSITIVE RESIN COMPOSITIONS
EP1932879A4 (en) RESIN COMPOSITION FOR OPTICAL MATERIAL
EP1707585A4 (en) EPOXY RESIN COMPOSITION COMPRISING A COMPONENT
EP1923406A4 (en) RESIN COMPOSITION
EP1923742A4 (en) POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
SG124382A1 (en) Photosensitive resin composition
EP1829930A4 (en) PHENYLENE POLYSULFIDE RESIN COMPOSITION
EP1870436A4 (en) COMPOSITION OF POLYAMIDE POLYETHER RESIN OF PHENYLENE
IL181062A0 (en) An agricultural chemical containing resin composition having controlled releasability
EP2056163A4 (en) POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
EP1900774A4 (en) CURABLE RESIN COMPOSITION
EP2060405A4 (en) LIGHT-SENSITIVE RESIN COMPOSITION
EP2088467A4 (en) RADIATION-SENSITIVE RESIN COMPOSITION
EP1746461A4 (en) RINE COMPOSITION SENSITIVE TO NEGATIVE RADIATION
EP1795558A4 (en) MODULATION OF MODIFIED EPOXY RESIN
EP1886187A4 (en) NOVEL LIGHT-SENSITIVE RESIN COMPOSITIONS
IL188682A0 (en) Hemostatic composition containing a hemostatic material
EP1866044A4 (en) COMPOSITION
EP1840169A4 (en) THERMOPLASTIC RESIN COMPOSITION
PL1637557T3 (pl) Kompozycja żywicy poliacetalowej
TWI366586B (en) Polyacetal resin composition