TWI315607B - Surface acoustic wave filter element, surface acoustic wave filter and communication device using the same - Google Patents

Surface acoustic wave filter element, surface acoustic wave filter and communication device using the same

Info

Publication number
TWI315607B
TWI315607B TW091132018A TW91132018A TWI315607B TW I315607 B TWI315607 B TW I315607B TW 091132018 A TW091132018 A TW 091132018A TW 91132018 A TW91132018 A TW 91132018A TW I315607 B TWI315607 B TW I315607B
Authority
TW
Taiwan
Prior art keywords
acoustic wave
surface acoustic
wave filter
communication device
same
Prior art date
Application number
TW091132018A
Other languages
English (en)
Other versions
TW200300308A (en
Inventor
Hiroyuki Nakamura
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of TW200300308A publication Critical patent/TW200300308A/zh
Application granted granted Critical
Publication of TWI315607B publication Critical patent/TWI315607B/zh

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/0023—Balance-unbalance or balance-balance networks
    • H03H9/0028—Balance-unbalance or balance-balance networks using surface acoustic wave devices
    • H03H9/0033—Balance-unbalance or balance-balance networks using surface acoustic wave devices having one acoustic track only
    • H03H9/0038—Balance-unbalance or balance-balance networks using surface acoustic wave devices having one acoustic track only the balanced terminals being on the same side of the track
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/0023—Balance-unbalance or balance-balance networks
    • H03H9/0028—Balance-unbalance or balance-balance networks using surface acoustic wave devices
    • H03H9/0033—Balance-unbalance or balance-balance networks using surface acoustic wave devices having one acoustic track only
    • H03H9/0042—Balance-unbalance or balance-balance networks using surface acoustic wave devices having one acoustic track only the balanced terminals being on opposite sides of the track
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02874—Means for compensation or elimination of undesirable effects of direct coupling between input and output transducers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02952—Means for compensation or elimination of undesirable effects of parasitic capacitance
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
TW091132018A 2001-10-29 2002-10-28 Surface acoustic wave filter element, surface acoustic wave filter and communication device using the same TWI315607B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001330435 2001-10-29

Publications (2)

Publication Number Publication Date
TW200300308A TW200300308A (en) 2003-05-16
TWI315607B true TWI315607B (en) 2009-10-01

Family

ID=19146156

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091132018A TWI315607B (en) 2001-10-29 2002-10-28 Surface acoustic wave filter element, surface acoustic wave filter and communication device using the same

Country Status (6)

Country Link
US (3) US6930570B2 (zh)
EP (1) EP1315297A3 (zh)
JP (2) JP2008306773A (zh)
KR (1) KR100865613B1 (zh)
CN (1) CN1265666C (zh)
TW (1) TWI315607B (zh)

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JP2005203889A (ja) * 2004-01-13 2005-07-28 Fujitsu Media Device Kk 弾性表面波デバイス
JP4548418B2 (ja) * 2004-04-16 2010-09-22 エプソントヨコム株式会社 平衡型弾性表面波フィルタ
CN1965477B (zh) * 2004-06-30 2011-08-31 株式会社村田制作所 平衡声波滤波器及声波滤波器件
DE112005000043B4 (de) * 2004-07-23 2013-01-17 Murata Manufacturing Co., Ltd. Oberflächenwellenbauelement
US7446629B2 (en) * 2004-08-04 2008-11-04 Matsushita Electric Industrial Co., Ltd. Antenna duplexer, and RF module and communication apparatus using the same
US7059196B1 (en) * 2004-11-22 2006-06-13 Honeywell International Inc. Disposable wireless pressure sensor
JP4811409B2 (ja) * 2005-11-14 2011-11-09 株式会社村田製作所 弾性表面波装置の製造方法
EP1976118A4 (en) * 2006-01-18 2011-12-14 Murata Manufacturing Co ACOUSTIC SURFACE WAVE DEVICE AND LIMIT ACOUSTIC WAVE DEVICE
KR101027593B1 (ko) * 2007-05-29 2011-04-06 가부시키가이샤 무라타 세이사쿠쇼 탄성파 분파기
CN101971496B (zh) * 2008-03-14 2013-11-06 松下电器产业株式会社 弹性波滤波器、使用其的双工器以及电子设备
WO2010029657A1 (ja) 2008-09-09 2010-03-18 株式会社村田製作所 弾性波装置
JP5814498B2 (ja) * 2008-12-25 2015-11-17 サムソン エレクトロ−メカニックス カンパニーリミテッド． 高周波モジュール
KR101052721B1 (ko) * 2009-05-12 2011-07-29 전자부품연구원 초광대역 필터 구조물 및 이를 구비한 인쇄 회로 기판
JP5418091B2 (ja) * 2009-09-11 2014-02-19 パナソニック株式会社 弾性波フィルタ装置及びこれを用いたデュプレクサ及び電子機器
JP5325729B2 (ja) * 2009-09-28 2013-10-23 太陽誘電株式会社 弾性波フィルタ
WO2011089906A1 (ja) * 2010-01-20 2011-07-28 パナソニック株式会社 弾性波装置
JP5333403B2 (ja) 2010-10-12 2013-11-06 株式会社村田製作所 弾性表面波フィルタ装置
JP5833102B2 (ja) * 2011-03-28 2015-12-16 京セラ株式会社 弾性波素子およびそれを用いた弾性波装置
WO2015155984A1 (en) * 2014-04-08 2015-10-15 Skyworks Panasonic Filter Solutions Japan Co., Ltd. Acoustic wave resonators, acoustic wave filters, antenna duplexers, modules and communication devices using the same
US9634639B2 (en) * 2015-09-10 2017-04-25 Harris Corporation Tunable electronic circuit which converts balanced signals to unbalanced signals
WO2018151146A1 (ja) 2017-02-16 2018-08-23 株式会社弾性波デバイスラボ 弾性波素子およびその製造方法

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JP2002141771A (ja) * 2000-08-21 2002-05-17 Murata Mfg Co Ltd 弾性表面波フィルタ装置

Also Published As

Publication number Publication date
US7579931B2 (en) 2009-08-25
CN1265666C (zh) 2006-07-19
TW200300308A (en) 2003-05-16
US20050255824A1 (en) 2005-11-17
US6930570B2 (en) 2005-08-16
US20030107454A1 (en) 2003-06-12
JP2008306773A (ja) 2008-12-18
KR100865613B1 (ko) 2008-10-27
EP1315297A3 (en) 2010-02-17
US7075391B2 (en) 2006-07-11
US20050237133A1 (en) 2005-10-27
JP2011130513A (ja) 2011-06-30
CN1418031A (zh) 2003-05-14
EP1315297A2 (en) 2003-05-28
KR20030035991A (ko) 2003-05-09

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