DE60231091D1 - Oberflächenwellenelement und Kommunikationsgerät - Google Patents

Oberflächenwellenelement und Kommunikationsgerät

Info

Publication number
DE60231091D1
DE60231091D1 DE60231091T DE60231091T DE60231091D1 DE 60231091 D1 DE60231091 D1 DE 60231091D1 DE 60231091 T DE60231091 T DE 60231091T DE 60231091 T DE60231091 T DE 60231091T DE 60231091 D1 DE60231091 D1 DE 60231091D1
Authority
DE
Germany
Prior art keywords
communication device
surface wave
wave element
communication
wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60231091T
Other languages
English (en)
Inventor
Hiroki Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Application granted granted Critical
Publication of DE60231091D1 publication Critical patent/DE60231091D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/0023—Balance-unbalance or balance-balance networks
    • H03H9/0028—Balance-unbalance or balance-balance networks using surface acoustic wave devices
    • H03H9/0033—Balance-unbalance or balance-balance networks using surface acoustic wave devices having one acoustic track only
    • H03H9/0042—Balance-unbalance or balance-balance networks using surface acoustic wave devices having one acoustic track only the balanced terminals being on opposite sides of the track
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/0023—Balance-unbalance or balance-balance networks
    • H03H9/0028—Balance-unbalance or balance-balance networks using surface acoustic wave devices
    • H03H9/0047—Balance-unbalance or balance-balance networks using surface acoustic wave devices having two acoustic tracks
    • H03H9/0052—Balance-unbalance or balance-balance networks using surface acoustic wave devices having two acoustic tracks being electrically cascaded
    • H03H9/0057—Balance-unbalance or balance-balance networks using surface acoustic wave devices having two acoustic tracks being electrically cascaded the balanced terminals being on the same side of the tracks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/0023—Balance-unbalance or balance-balance networks
    • H03H9/0028—Balance-unbalance or balance-balance networks using surface acoustic wave devices
    • H03H9/0085—Balance-unbalance or balance-balance networks using surface acoustic wave devices having four acoustic tracks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14544—Transducers of particular shape or position
    • H03H9/14576—Transducers whereby only the last fingers have different characteristics with respect to the other fingers, e.g. different shape, thickness or material, split finger
    • H03H9/14582—Transducers whereby only the last fingers have different characteristics with respect to the other fingers, e.g. different shape, thickness or material, split finger the last fingers having a different pitch
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14544—Transducers of particular shape or position
    • H03H9/14588—Horizontally-split transducers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
DE60231091T 2001-03-09 2002-03-07 Oberflächenwellenelement und Kommunikationsgerät Expired - Lifetime DE60231091D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001067676A JP3414387B2 (ja) 2001-03-09 2001-03-09 弾性表面波装置、通信装置

Publications (1)

Publication Number Publication Date
DE60231091D1 true DE60231091D1 (de) 2009-03-26

Family

ID=18925991

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60231091T Expired - Lifetime DE60231091D1 (de) 2001-03-09 2002-03-07 Oberflächenwellenelement und Kommunikationsgerät

Country Status (6)

Country Link
US (1) US6771003B2 (de)
EP (1) EP1239589B1 (de)
JP (1) JP3414387B2 (de)
KR (1) KR100511221B1 (de)
CN (1) CN1232148C (de)
DE (1) DE60231091D1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10013861A1 (de) * 2000-03-21 2001-09-27 Epcos Ag Dualmode-Oberflächenwellenfilter mit verbesserter Symmetrie und erhöhter Sperrdämpfung
JP3419402B2 (ja) * 2001-04-16 2003-06-23 株式会社村田製作所 弾性表面波装置、通信装置
JP3729081B2 (ja) * 2000-06-27 2005-12-21 株式会社村田製作所 弾性表面波装置
JP3800504B2 (ja) * 2001-05-15 2006-07-26 Ｔｄｋ株式会社 フロントエンドモジュール
JP3922163B2 (ja) * 2001-12-25 2007-05-30 株式会社村田製作所 弾性表面波装置
JP3838128B2 (ja) 2002-03-18 2006-10-25 株式会社村田製作所 弾性表面波装置、および、これを搭載した通信装置
JP2004128928A (ja) * 2002-10-03 2004-04-22 Murata Mfg Co Ltd 弾性表面波フィルタ装置、通信装置
EP1429460A1 (de) * 2002-12-09 2004-06-16 Evolium S.A.S. Schaltungsanordnung mit einem Filter und einem Analog-Digital-Wandler
KR100763763B1 (ko) 2004-04-19 2007-10-04 가부시키가이샤 무라타 세이사쿠쇼 탄성파 필터 및 그것을 사용한 통신기
CN1842961B (zh) * 2004-07-23 2010-10-20 株式会社村田制作所 声表面波器件
KR100649497B1 (ko) * 2004-09-23 2006-11-28 삼성전기주식회사 불평형-평형 입출력 구조의 ｆｂａｒ필터
DE102006057340B4 (de) * 2006-12-05 2014-05-22 Epcos Ag DMS-Filter mit verbesserter Anpassung
WO2010052969A1 (ja) * 2008-11-04 2010-05-14 株式会社村田製作所 弾性波フィルタ装置および、それを備えるモジュール
WO2014021042A1 (ja) * 2012-08-02 2014-02-06 株式会社村田製作所 弾性波装置及び分波装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05160664A (ja) 1991-12-04 1993-06-25 Fujitsu Ltd 弾性表面波素子及びその製造方法及び弾性表面波デバイス
JP3433430B2 (ja) 1992-09-14 2003-08-04 富士通株式会社 分波器
JPH08195645A (ja) 1995-01-17 1996-07-30 Shinko Electric Ind Co Ltd 素子搭載用パッケージ
JP3301262B2 (ja) 1995-03-28 2002-07-15 松下電器産業株式会社 弾性表面波装置
EP0809357B1 (de) * 1996-05-23 1999-12-15 Matsushita Electric Industrial Co., Ltd. Akustischer Oberflächenwellenfilter und mehrstufiger akustischer Oberflächenwellenfilter
US5838089A (en) * 1997-02-18 1998-11-17 Kobe Steel Usa Inc. Acoustic wave devices on diamond with an interlayer
JP3982876B2 (ja) 1997-06-30 2007-09-26 沖電気工業株式会社 弾性表面波装置
DE69938989D1 (de) 1998-05-29 2008-08-14 Fujitsu Ltd Akustisches Oberflächenwellenfilter mit verbesserter Unterdrückung ausserhalb eines Durchlassbereichs
JP3487414B2 (ja) * 1998-05-29 2004-01-19 富士通株式会社 弾性表面波フィルタ装置
JP3729081B2 (ja) 2000-06-27 2005-12-21 株式会社村田製作所 弾性表面波装置
JP3478260B2 (ja) * 2000-10-27 2003-12-15 株式会社村田製作所 弾性表面波フィルタおよび通信機装置

Also Published As

Publication number Publication date
JP2002271168A (ja) 2002-09-20
US20020135268A1 (en) 2002-09-26
CN1376005A (zh) 2002-10-23
CN1232148C (zh) 2005-12-14
JP3414387B2 (ja) 2003-06-09
EP1239589B1 (de) 2009-02-11
KR20020072230A (ko) 2002-09-14
EP1239589A1 (de) 2002-09-11
US6771003B2 (en) 2004-08-03
KR100511221B1 (ko) 2005-08-31

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Legal Events

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