TWI309866B - - Google Patents

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Publication number
TWI309866B
TWI309866B TW093103740A TW93103740A TWI309866B TW I309866 B TWI309866 B TW I309866B TW 093103740 A TW093103740 A TW 093103740A TW 93103740 A TW93103740 A TW 93103740A TW I309866 B TWI309866 B TW I309866B
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TW
Taiwan
Prior art keywords
circuit
current
voltage
discharge
transformer
Prior art date
Application number
TW093103740A
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English (en)
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TW200428544A (en
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200428544A publication Critical patent/TW200428544A/zh
Application granted granted Critical
Publication of TWI309866B publication Critical patent/TWI309866B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Description

!3〇9866 狄、發明說明： 【發明所屬之技術領域】 本發明，係有關打線裝置之球體形成裝置。 【先前技術】 習知之打線裝置之球體形成裝置，係具備：變壓整流 電路，用以對商用電源變壓整流；電晶體元件，藉由串聯 的自激脈衝振盪器的輸出而導通、斷開（ON、OFF);脈衝 變壓器，由此電晶體元件導通、斷開的輸出而獲得高電壓 輪出；以及脈衝調變波產生電路，反饋高電壓輪出端子（放 電電極）與接地（引線）間的電氣信號，俾連續控制振盪脈寬 。例如’參考專利文獻1及2。 (專利文獻1) 曰本專利特開平5 — 235078號公報 (專利文獻2) 曰本專利特開平7— 183322號公報 【發明内容】 ^由於上述習知技術，係反覆導通、斷開電晶體元件， 藉脈衝變壓器獲得高電壓輸出’故如帛3(a)、（b)圖所示， 輪出鋸齒狀之放電電壓及放電電流至放電電極與引線前端 間。因此，停止放電的位置變成峰部或谷部，所形成球體 位不I疋會出現偏差。亦即，每次放電的放電時間及放 電電抓的穩疋性不佳。特別是在例如形成引線徑的丄·5倍 以下的球體徑的情形’其影響很顯著。 本發月在於提供，可穩定形成均一球體徑之打線裝置 1309866 之球體形成裝置。 用以解決上述問題之本發明申請專利範圍第^項之打 =置之球體形成裳置，係施加高電壓於插通毛細管的引 線=與放電電極之間進行放電，以於引線前端形成球體 n徵在於具備.電壓指令脈衝電路，用以輸出電壓指 二丄㈣：脈衝電路’以預設時間來輸出電流指令 升壓變壓态’藉輪入該電壓指令脈衝而升壓定電 廢電路’反饋該升壓變麗器的放電電壓，以進行定電壓控 制’切換電路’以於檢測出放電時的電流時，將 脈衝輸入升塵變壓器的方式來進行切換；以及定電流電路 ，以該電流指令脈衝時間來輸出放電電流。 用以解決上述問題之本發明申請專利範圍第2項，係 於上述u㈣圍第丨項中，該升壓變壓器，係具有定 電壓功此及定電流功能二功能的線性輸出型變墨器。 【實施方式】 :藉f 1圖及第2圖說明本發明之打線裝置之球體形 之一實施形態。如第1圖所示，用來形成球體2a於 毛細管1的引線2前端的放電電極3,係連接於升壓 變塵器4輸出側之一端子。升塵變壓“輸出側之另= 子連接於具有電流檢測電阻Rl的電流檢測電路 變壓器4輸入側之—端子施加一定之電壓ν“，、：如 DC20V的電壓，於升壓變壓器4輸入側之另一端子，透過 後述之電路而連接電壓指令脈衝電路1〇及電流指令脈衝 電路11。 1309866 間’定電流自放電電極3流至引線2,而形成球體2a，故 可獲得常保均一的既定大小的球體2a。於此情形下，藉電 壓指令脈衝10a給與第2(b)圖所示放電電壓的波峰值（電壓 值）’在預設的放電電流流出後’將流出定電流的時間控制 為電流指令脈衝11a的輸入時間，藉此，可自由控制球體 2a之徑。於本實施形態中，在形成球體情形下特別有效果 〇 又，使用具有定電壓功能及定電流功能二功能的線性 輸出型變壓器作為升壓變壓H 由於其對指令的輸出特 性的線性非常高，複製性亦佳，故每次放電的球體徑的穩 定性佳。 ~ 由於本發明之打線裝置之球體形成裝置，係施加高電 壓於插通毛細管的引線前端與放電電極之間進行放電，以 於引線前端形成球體，其具備：電壓指令脈衝電路，用以 輸出電壓指令脈衝；電流指令脈衝電&，以預設時間來輪 出電流指令脈衝；升壓變壓器’藉輸入該電壓指令脈衝二 升壓；定電壓電路’反饋該升壓變壓器的放電電壓，以進 仃疋電壓控制；切換電路，以於檢測出放電時的電流時， 2電f指令脈衝輸入升壓變壓器的方式來進行切換；以及 定電流電路，以該電流指令脈衝時間來輸出放電電流 可穩定形成均—之球體徑。 【圖式簡單說明】 (一）圖式部分 第1圖係表示本發明打線裝置之球體形成裝置之—實 1309866 施形態之方塊圖。 第2(a)〜（d)圖係電壓指令脈衝、放電電壓、電流指令 脈衝、放電電流之波形及輸出時序圖。 第3(a)、（b)圖係習知打線裝置之球體形成裝置之放電 電壓及放電電流之波形說明圖。 (二）元件代表符號 1 :毛細管 2 :引線 2a :球體 3 :放電電極 4 :升壓變壓器 5 :電流檢測電路 10:電壓指令脈衝電路 10a :電壓指令脈衝 11 :電流指令脈衝電路 11 a :電流指令脈衝 12 :脈寬設定電路 13 :定電壓電路 14 :放電電壓檢測電路 1 5 :定電流電路 20 :切換電路 21 :驅動器 22 :放電電流檢測電路 23 :放電電流檢測位準設定電路 12

Claims (1)

1309866 拾、申請專利範圍： 通 月IJ 、種打線裝置之球體形成裝置，係施加高電壓於插 :細管的引線前端與放電電極之間進行放電，以於弓丨線 4形成球體’其特徵在於具備： " 電壓指令脈衝電路，用以輸出電壓指令脈衝； 電流指令脈衝電路’以預設時間來輸出電流指令脈衝 升壓變壓器，藉輸入該電壓指令脈衝而升壓； 定電壓電路，反饋該升壓變壓器的放 定電壓控制； 电全Μ進行 切換電路，以於檢測出放電時的電流時，將電流匕入 脈衝輸入升壓變壓器的方式來進行切換；以及 机牦令 定電流電路，以該電流指令脈衝時間來榦 ^ β Μ出放電電流 Α如甲請專利範圍第 Μ I、咪體形成 功能的線性輸出型變壓器。 ，其中該升壓變壓器，係具有定電壓功能及 置 味钵沾綠从絡山瓜,^ αi ^工力能二 拾壹、圖式： 如次頁 13
TW093103740A 2003-04-16 2004-02-17 Ball forming device for wire-bonding device TW200428544A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003111616A JP3813134B2 (ja) 2003-04-16 2003-04-16 ワイヤボンディング装置におけるボール形成装置

Publications (2)

Publication Number Publication Date
TW200428544A TW200428544A (en) 2004-12-16
TWI309866B true TWI309866B (zh) 2009-05-11

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Family Applications (1)

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TW093103740A TW200428544A (en) 2003-04-16 2004-02-17 Ball forming device for wire-bonding device

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JP (1) JP3813134B2 (zh)
KR (1) KR100546476B1 (zh)
TW (1) TW200428544A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7896218B2 (en) * 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
JP5069631B2 (ja) * 2008-07-31 2012-11-07 株式会社フォーエム技術研究所 ワイヤボンダーにおけるボール形成装置
TWI528481B (zh) * 2014-02-13 2016-04-01 新川股份有限公司 球形成裝置、打線裝置以及球形成方法

Also Published As

Publication number Publication date
JP3813134B2 (ja) 2006-08-23
TW200428544A (en) 2004-12-16
KR20040090408A (ko) 2004-10-22
KR100546476B1 (ko) 2006-01-26
JP2004319756A (ja) 2004-11-11

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