TWI309145B - - Google Patents
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- Publication number
- TWI309145B TWI309145B TW95124715A TW95124715A TWI309145B TW I309145 B TWI309145 B TW I309145B TW 95124715 A TW95124715 A TW 95124715A TW 95124715 A TW95124715 A TW 95124715A TW I309145 B TWI309145 B TW I309145B
- Authority
- TW
- Taiwan
- Prior art keywords
- implant
- box
- wafer
- electromagnetic
- carrier
- Prior art date
Links
- 239000007943 implant Substances 0.000 claims description 62
- 229910000831 Steel Inorganic materials 0.000 claims description 19
- 239000010959 steel Substances 0.000 claims description 19
- 238000002513 implantation Methods 0.000 claims description 18
- 230000007246 mechanism Effects 0.000 claims description 12
- 235000012431 wafers Nutrition 0.000 description 43
- 230000007723 transport mechanism Effects 0.000 description 9
- 238000005096 rolling process Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 208000002109 Argyria Diseases 0.000 description 1
- 229910000976 Electrical steel Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001020 rhythmical effect Effects 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95124715A TW200806110A (en) | 2006-07-06 | 2006-07-06 | Automatic implantation device for chip component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95124715A TW200806110A (en) | 2006-07-06 | 2006-07-06 | Automatic implantation device for chip component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200806110A TW200806110A (en) | 2008-01-16 |
| TWI309145B true TWI309145B (enrdf_load_stackoverflow) | 2009-04-21 |
Family
ID=44766234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95124715A TW200806110A (en) | 2006-07-06 | 2006-07-06 | Automatic implantation device for chip component |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200806110A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI657985B (zh) * | 2018-01-26 | 2019-05-01 | 鴻勁精密股份有限公司 | 電子元件承載器之整平機構及其應用之作業分類設備 |
| TWI854081B (zh) * | 2019-12-31 | 2024-09-01 | 南韓商Ulvac 韓國股份有限公司 | 用於基板的磁鐵夾 |
-
2006
- 2006-07-06 TW TW95124715A patent/TW200806110A/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI657985B (zh) * | 2018-01-26 | 2019-05-01 | 鴻勁精密股份有限公司 | 電子元件承載器之整平機構及其應用之作業分類設備 |
| TWI854081B (zh) * | 2019-12-31 | 2024-09-01 | 南韓商Ulvac 韓國股份有限公司 | 用於基板的磁鐵夾 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200806110A (en) | 2008-01-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |