1309145 九、發明說明： 【發明所屬之技術領域】 本發明係提供一種晶片元件用的自動植入裝 置尤才曰種以震動方式將要沾銀之晶片電子元件自 動植入载板内的褒置。 【先前技術】 按，陶曼電容器或電阻等晶片式電子元件係廣泛 • 帛在田7各類的電子產品上，所需數量相當龐大，而 製作該等晶片電子元件的製程以及自動化設備直接 關連到它們的產量與質量。 ' 冑使晶片元件的内部電極能連接，傳統上是使用 • 自動沾銀機在該元件的兩端頭塗佈銀漿以形成連接 電極。而要使沾銀機能便利地在晶片電子元件的兩端 頭塗佈銀裝，習用技術係將該要進行沾銀的多數晶片 • 元件2先以陣列植人在第-圖所示的載板1上，即在 該载板1上設有呈陣列佈置的複數貫穿孔11用以提 供晶片元件2群呈直立型態對應插入，並在該載板i 的-端面貼上膠帶12用以支持該等晶片元件2的一 端頭2卜如第二圖所示，另在該载板i的上方蓋合 -導板13,該導板上具有可與貫穿孔u對準的筛孔 13卜使得晶片元件2群能以直立姿勢個別通過筛孔 131，再植入下方的貫穿孔丨〗内而為膠帶a支持。 5 1309145 在我國公告第467470號「晶片料入料機」及第 528275號「晶片元件電極沾附自動植入機」等新型 案中，分別揭示以自動化設備將晶片電子元件植入載 板之貫穿孔内的技術内容。然而，該二習用的晶片元 件自動植入機（入料機）在構造上複雜且價袼昂貴疋 此外，在將晶片元件填入載板内的速度及精確度上， 都有待改善。 又1309145 IX. Description of the Invention: [Technical Field] The present invention provides an automatic implantation apparatus for a wafer component, in particular, a device for automatically implanting a wafer electronic component to be silver-doped into a carrier in a vibrating manner. [Prior Art] According to the wide range of wafer-type electronic components such as Tauman capacitors or resistors, the number of electronic products used in various types of fields is quite large, and the processes for making electronic components of such chips and the automation equipment are directly related. To their production and quality. '胄 The internal electrodes of the wafer components can be connected, which is conventionally used. • Automatic silver staining machine applies silver paste to the ends of the components to form the connection electrodes. In order to make the silver-coated machine conveniently apply silver on both ends of the chip electronic component, the conventional technology is to apply the majority of the wafers to be silver-plated. The component 2 is first implanted in the array as shown in the figure. 1 , that is, the carrier board 1 is provided with a plurality of through holes 11 arranged in an array for providing the wafer element 2 group in an upright type corresponding insertion, and a tape 12 is attached on the end surface of the carrier board i for supporting The one end of the wafer element 2 is as shown in the second figure, and the upper side of the carrier i is covered with a guide plate 13 having a mesh hole 13 aligned with the through hole u. The wafer element 2 group can be individually passed through the mesh hole 131 in an upright posture, and then implanted in the lower through hole 而 to support the tape a. 5 1309145 In the new cases of China's Announcement No. 467470 "Wafer Feeder" and No. 528275 "Disc Component Electrode Adhesion Automatic Implanter", respectively, the disclosure of the insertion of chip electronic components into the carrier board by automated equipment is disclosed. Technical content within the hole. However, the conventional wafer element automatic implanter (feeder) is complicated in construction and expensive. In addition, there is room for improvement in speed and accuracy of filling the wafer components into the carrier. also
【發明内容】 緣此，本發明之主要目的在提供一種晶片元件用 的自動植人裝置，該裝置能以震動方式將要沾銀之晶 片几件自動植人載板内，並具有構造簡單的優點。 本發明之另—目的在提供—種晶片元件用的自 動植入裝置’該裝置能使晶片元件更精確且迅速地填 入載板上所有的貫穿孔内，以提高晶片元件的產量與 良率。 依據本發明形成的自動植人裝置，係包含一基 座、=在該基座上方的—植人箱、將該植人箱支持成 可在前後與上下方向相對該基座做彈性運動的複數 支撐件及二組以上用以致動該植入箱的電磁驅動 器；該植人箱内部以―等待區用以承接晶片元件及 一植^區用財接触，並在該植人箱上裝設一可活 蓋在該載板上方的導板，藉由該等電磁驅動器與 6 該等支撐件的合作，使得該植入箱内的晶片元件能在 等待區與植入區間做前進及退回的往復運動，達成要 沾銀之晶片元件能精確且迅速地植入載板内。 上述基座係透過墊圈安裝在一機體頂面的工作 台上，該工作台上最好並設有載板搬送機構用以將載 板搬入植入箱内部的植入區，及設有晶片供應機構用 以將晶片元件送入植入箱内部的等待區。 上述植入箱係一具有底板與周圍邊壁的箱體，而 導板最好設在一框架底部，該框架以軸桿樞接在該植 入箱的相對邊壁之間，且該軸桿連接一可在前後方向 伸縮的氣壓缸，該氣壓缸的前後進退會帶動該框架翻 轉，進而使該導板可向上掀起或是向下蓋合。 上述支撐件最好包含四支個別配置在該植入箱 四角落邊壁附近的支撐件，各支撐件最好係包含一可 撓曲的金屬板，並具有連接在基座上的第一端、連接 在植入箱上的第二端及一朝板厚方向彎摺凸出的中 間部。 上述電磁驅動器最好包含一後電磁驅動器、一前 電磁驅動器及一中間電磁驅動器；其中，後電磁驅動 器包含裝設在植入箱後側邊壁的電磁鋼片及與該電 磁鋼片呈相向配置的線圈，前電磁驅動器包含裝設在 1309145 孝目别側邊壁的電磁鋼片及與該電磁鋼片呈相向 配置的線圈，中間電磁驅動器包含裝設在植入箱底板 下方令間附近的電磁鋼片及與該電磁鋼片呈相向配 的線圈田則、後電磁驅動器作動時，將對植入箱 施加前後方向的致動磁力，使得該植入箱會以支樓件 為支點沿水平方向做往復運動，而當中間電磁驅動器 作動時，將對植入箱施加上下方向的致動磁力，使得 該植入箱會以支擇件為支點沿垂直方向做往復運動。 關於本發明之其他目的、優點及特徵，將可由以 下較佳實施例的詳細說明並參照所附圖式。 【實施方式】 可有多種不同的結構來實施本發明。現將僅為例 子但非用以限制的-具體實施例’並參照所附圖式就 本發明之較佳結構内容說明如下： 請參閱第三圖、第四圖所示，為依據本發明形成 的植入裝置之立體圖與剖視圖，顯示該植入裝置一且 體實施例的整個構造；本發明係包含-基座3、位2 =基座3上方的一植入箱4、將該植入箱4支持成可 在前後與上下方向㈣縣座3轉性運動的複數 支撑件5及至少二纪可致動該植入箱的電磁驅動 器’在本實施例中，包含一後電磁驅動器6卜一前 電磁驅動器62及-中間電磁驅動器… 1309145 在本實施例中’該基座3係一 體’具有一頂Φ30,如第五圖所示，該基座3底部 係可透過橡膠㈣32安裝在-機體7頂面的工作台 71上。SUMMARY OF THE INVENTION Accordingly, it is a primary object of the present invention to provide an automatic implanting device for a wafer component that can automatically implant a plurality of wafers to be implanted into a carrier plate in a vibrating manner, and has the advantages of simple structure. . Another object of the present invention is to provide an automatic implant device for a wafer component that enables the wafer component to be more accurately and quickly filled into all of the through holes of the carrier to improve the yield and yield of the wafer component. . The automatic implanting device formed according to the present invention comprises a base, an implanting box above the base, and the implanting box is supported as a plurality of elastically movable relative to the base in the front-rear direction and the up-and-down direction. a support member and two or more sets of electromagnetic actuators for actuating the implant box; the interior of the implant box is configured to receive the wafer components and a planting area for contact, and a device is mounted on the implant box The guide plate can be covered over the carrier plate, and the electromagnetic components of the electromagnetic actuator cooperate with the support members to enable the wafer components in the implantation box to advance and retreat in the waiting area and the implantation interval. Movement, the wafer components that are to be silvered can be accurately and quickly implanted into the carrier. The base is mounted on a table on the top surface of the body through a gasket. Preferably, the table is provided with a carrier transport mechanism for carrying the carrier into the implanted area inside the implant box, and a wafer supply is provided. The mechanism is used to feed the wafer components into a waiting area inside the implant box. The implant box is a box having a bottom plate and a peripheral side wall, and the guide plate is preferably disposed at a bottom of the frame, the frame is pivotally connected between the opposite side walls of the implant box, and the shaft is A pneumatic cylinder that can be extended and contracted in the front-rear direction is connected, and the forward and backward movement of the pneumatic cylinder drives the frame to be turned over, so that the guide plate can be lifted up or closed downward. Preferably, the support member comprises four support members respectively disposed adjacent to the corner walls of the four corners of the implant box, and each support member preferably includes a flexible metal plate and has a first end connected to the base. a second end connected to the implant box and an intermediate portion bent toward the thickness of the plate. Preferably, the electromagnetic driver comprises a rear electromagnetic driver, a front electromagnetic driver and an intermediate electromagnetic driver; wherein the rear electromagnetic driver comprises an electromagnetic steel piece disposed on a side wall of the rear side of the implantation box and disposed opposite to the electromagnetic steel sheet The coil, the front electromagnetic drive comprises an electromagnetic steel piece mounted on the side wall of the 1309145 filial eye and a coil arranged opposite to the electromagnetic steel piece, and the intermediate electromagnetic drive comprises an electromagnetic device installed near the lower side of the bottom of the implant box When the steel sheet and the coil field which is opposite to the electromagnetic steel sheet and the rear electromagnetic actuator actuate, the actuating magnetic force of the front and rear direction is applied to the implant box, so that the implant box will be horizontally oriented with the branch member as a fulcrum The reciprocating motion is performed, and when the intermediate electromagnetic actuator is actuated, the actuating magnetic force in the up and down direction is applied to the implant box, so that the implant box reciprocates in the vertical direction with the support member as a fulcrum. Other objects, advantages and features of the invention will be set forth in the <RTIgt; [Embodiment] The present invention can be implemented in a variety of different configurations. The preferred structural content of the present invention will now be described by way of example only and not by way of limitation, and reference to the accompanying drawings in which: FIG. A perspective view and a cross-sectional view of the implant device, showing the entire configuration of the implant device and the body embodiment; the present invention comprises a base 3, a position 2 = an implant box 4 above the base 3, the implant The box 4 supports a plurality of support members 5 capable of three-rotation movement in the front and rear and up-and-down directions (four) county seats, and at least two electromagnetic drives that can actuate the implant box. In this embodiment, a rear electromagnetic drive 6 is included. A front electromagnetic drive 62 and an intermediate electromagnetic drive... 1309145 In the present embodiment, the base 3 is integrally provided with a top Φ 30. As shown in the fifth figure, the bottom of the base 3 is permeable to the rubber (four) 32. The top of the body 7 is on the table 71.
該植入箱4係一具有底板41與周圍邊壁42的箱 體，在該植人箱4内部界定—等待區43用以承接晶 片元件2及-植人區44用以承接—預備植入晶片元 件2的載板卜該載板上設有呈陣列佈置的複數貫穿The implant box 4 is a box having a bottom plate 41 and a peripheral side wall 42 defined inside the implant box 4 - a waiting area 43 for receiving the wafer component 2 and an implanting area 44 for receiving - preparing for implantation The carrier of the wafer component 2 is provided with a plurality of interleaving arrays arranged in an array
概呈矩形狀的板 孔11及位在兩侧的定位孔14(如第六圖所示），並 在該载板1下端面貼有膠帶12;在本實施例中，該 植入區44係位在該植入箱4的前侧（第四圖右側）， 並在内部裝設-托板45用以承接餘丨，㈣等待 區43係位在該植入箱4的後侧，並具有一較托板託 頂部略高的底δ 4 31用以提供晶片元件2置放。 該植入箱4上裝設一如第二圖所示的導板13，在 本實施例中’該導板13係設在__框架46的底部，該 框架46以軸桿461樞接在該植入箱4的相對邊壁42 之間，該軸桿461 it接-可在前後方向伸縮的氣壓缸 47，該氣壓缸47的前後進退會帶動該框架46翻轉， 進而使該導板13可如第四圖所示的向上掀起或是如 第七圖所示的向下蓋合；再者’在該框架46的前端 1309145 耗2内側設有出風口 463,該出風口⑽經由設置 在框架46内的氣道464連通至一供氣源（未圖示）。 上述各支撐件5係包含一可繞曲的金屬板，其具 3 _L㈣n連接在植入箱4上 的第二端52及一朝板厚方向彎摺凸出的中間部π ; 在本實施例中’具有配置在該植人箱4四角落邊壁 42附近的四支支撐件5，各支撐件的凸出中間部53 • 係概呈截頭錐狀型態地具有兩邊的斜面531及一頂 面532 ’且第-# 51係個別結合在基座頂面3〇所安 裝的一結合座33上；又組裝在植入箱4同一侧之前、 ' 後端的二支稽件5係以中間部53朝内地相對配置， 如第四圖所示，使得該等支樓件5能以第一端51為 支點而在前後與上下方向產生節奏感的撓曲，進而促 使該植入粕4可在前後與上下方向做相對該基座3的 _ 往復震動。 各電磁驅動器61、62、63分別包含一電磁鋼片 64(矽鋼片）及一與該電磁鋼片藉著空隙呈相向配置 的激磁線圈65，當電流通過線圈65時會產生吸引或 排斥該電磁鋼片64的磁力；在本實施例中，後電磁 驅動器61包含裝設在植入箱後側邊壁42的電磁鋼片 64及與該電磁鋼片64呈相向配置的線圈65，前電磁 1309145 驅動器62包含裝設在植入箱前側邊壁42的電磁鋼片 64及與該電磁鋼片呈相向配置的線圈65，中間電磁 驅動器63包含裝設在植入箱底板41下方中間附近的 電磁鋼片64及與該電磁鋼片呈相向配置的線圈65， 虽電磁驅動盗61或62作動時，將對植入箱4施加前 後方向的致動磁力，使得該植入箱4會以支撐件5為 支點沿水平方向做往復運動，而當電磁驅動器63作 動時，將對植入箱4施加上下方向的致動磁力，使得 該植入箱會以支撐件為支點沿垂直方向做往復運 動；另各線圈65係裝設在一線圈支持座⑼上，各支 持座66固定在基座頂面3〇上。 參閱第五圖，顯示提供本發明植入裝置安裝的機 體工作台71上安裝有—载板搬送機構81用以將載板 1搬入植人相4内部的植人區44、—晶片供應機構 82用以將晶片元件2送人植人箱内部的等待區、 一滾壓機構83及-傳送機構84;關於該等機構大抵 上係屬習用技術，概要說明如下。 該載板搬送機構81係一使用二支平行氣壓缸 81卜812的夾爪’於各氣壓紅的下端有吸附板813， 各吸附板底部裝有吸嘴814，各吸嘴連接管路至一真 空源（未圖不）；其中’由第一支氣壓紅811構成的 1309145 夾爪係可在一載板料倉85及該植入箱4之植入區44 之間來回位移，而從堆疊有載板1的料倉85内搬出 載板1並放入植入區44内，又由第二支氣壓缸812 構成的夾爪係可在該植入箱4之植入區44及一滾輪 輸送執道86之間來回位移，而將植入區44内的載板 1取出並搬到輸送執道86上。The rectangular plate hole 11 and the positioning holes 14 on both sides (as shown in FIG. 6) are attached with a tape 12 on the lower end surface of the carrier plate 1; in the embodiment, the implantation region 44 Tied to the front side of the implant box 4 (on the right side of the fourth figure), and internally mounted with a tray 45 for receiving the embers, and (4) a waiting area 43 for the rear side of the implant box 4, and A bottom δ 4 31 having a slightly higher top than the top of the tray is provided to provide placement of the wafer component 2. The implant box 4 is provided with a guide plate 13 as shown in the second figure. In the present embodiment, the guide plate 13 is attached to the bottom of the frame 46, and the frame 46 is pivotally connected by the shaft 461. Between the opposite side walls 42 of the implant box 4, the shaft 461 is connected to a pneumatic cylinder 47 that can be extended and contracted in the front-rear direction. The forward and backward advancement and retreat of the pneumatic cylinder 47 causes the frame 46 to be turned over, thereby causing the guide plate 13 to be turned over. It can be lifted up as shown in the fourth figure or downwardly as shown in the seventh figure; in addition, the air outlet 463 is provided on the inner side of the front end 1309145 of the frame 46, and the air outlet (10) is disposed through The air passage 464 in the frame 46 is connected to a supply air source (not shown). Each of the support members 5 includes a flexible metal plate having a second end 52 connected to the implant box 4 and a middle portion π bent toward the thickness direction of the plate. In this embodiment, The middle portion has four support members 5 disposed in the vicinity of the four corner side walls 42 of the implant box 4, and the convex intermediate portion 53 of each support member has a beveled surface 531 having a two-sided shape and a frustoconical shape. The top surface 532 'and the first - # 51 are individually combined on a coupling seat 33 mounted on the top surface 3 of the base; and before being assembled on the same side of the implant box 4, the two rear parts of the rear cover 5 are in the middle The portions 53 are arranged inwardly opposite to each other, as shown in the fourth figure, so that the branch members 5 can use the first end 51 as a fulcrum to generate a rhythmic sensation in the front and rear and the up and down direction, thereby facilitating the implantation of the 粕4. The _ reciprocating vibration of the susceptor 3 is made in the front and rear and the up and down direction. Each of the electromagnetic actuators 61, 62, 63 includes an electromagnetic steel sheet 64 (a silicon steel sheet) and an exciting coil 65 disposed opposite to the electromagnetic steel sheet by a gap, which attracts or repels the electromagnetic current when passing through the coil 65. The magnetic force of the steel sheet 64; in the present embodiment, the rear electromagnetic actuator 61 includes an electromagnetic steel sheet 64 mounted on the rear side wall 42 of the implantation box and a coil 65 disposed opposite to the electromagnetic steel sheet 64, the front electromagnetic 1309145 The driver 62 includes an electromagnetic steel sheet 64 mounted on the front side wall 42 of the implant box and a coil 65 disposed opposite to the electromagnetic steel sheet. The intermediate electromagnetic drive 63 includes an electromagnetic device disposed near the middle of the bottom of the implant box bottom plate 41. The steel sheet 64 and the coil 65 disposed opposite to the electromagnetic steel sheet, when the electromagnetic driving thief 61 or 62 is actuated, will apply an actuating magnetic force to the implant box 4 in the front-rear direction, so that the implant box 4 will be supported. 5 is a reciprocating motion of the fulcrum in the horizontal direction, and when the electromagnetic actuator 63 is actuated, an actuating magnetic force of the up and down direction is applied to the implant box 4, so that the implant box reciprocates in the vertical direction with the support member as a fulcrum; Another coil 65 The system is mounted on a coil support (9), and each of the support seats 66 is fixed to the top surface 3 of the base. Referring to the fifth figure, it is shown that the body table 71 on which the implant device of the present invention is mounted is mounted with a carrier transport mechanism 81 for carrying the carrier 1 into the implanting area 44 inside the implanted phase 4, the wafer supply mechanism 82. A waiting area for feeding the wafer element 2 to the inside of the implant box, a rolling mechanism 83, and a transfer mechanism 84; and the conventional techniques for such a mechanism are generally described below. The carrier transport mechanism 81 is a clamper 813 using two parallel pneumatic cylinders 81 812 at the lower end of each air pressure red, and a suction nozzle 814 is arranged at the bottom of each adsorption plate, and each nozzle is connected to the pipeline to a vacuum source (not shown); wherein '1309145 jaws consisting of the first pressure red 811 can be displaced back and forth between a carrier silo 85 and the implanted region 44 of the implant box 4, from the stack The loading tray 1 of the carrier plate 1 is carried out of the loading tray 1 and placed in the implantation area 44, and the clamping jaw formed by the second pneumatic cylinder 812 is in the implantation area 44 of the implantation box 4 and a roller. The transport lanes 86 are displaced back and forth, and the carrier 1 in the implanted area 44 is removed and transported to the transport lane 86.
該晶片供應機構82係一振動式送料器，包括一 收納晶片元件的料斗821及將該等晶片元件搬移到 植入箱4之等待區43内的輸送道822。The wafer supply mechanism 82 is a vibratory feeder including a hopper 821 for accommodating wafer components and a transport path 822 for transporting the wafer elements into the waiting area 43 of the implantation box 4.
該滾壓機構8 3係位在輸送執道8 6下游處，其包 含上、下滚筒831，當載板1搬到輸送軌道86上後， 會輸送通過該上、下滾筒831之間而將植入載板1内 的晶片元件2壓觸整平，並使晶片元件2之端頭21 能與膠帶12有效的黏附；又傳送機構84位在滾壓機 構83下游處，其包含一對可旋轉之轉輪841，各轉 輪841外周有數凹槽842，以便將通過滚壓機構83 的載板1轉送到下游的收集箱87内收集。 依據本發明形成的植入裝置在實施上，係由載板 搬送機構81先將料倉85内最上層的載板1搬出並輸 送進到植入區44内，之後，該載板搬送機構81之氣 壓缸811、812上升，並返回初始位置；接著，氣壓 12 1309145 缸47前進帶動該框架46翻轉，使得導板i3向下蓋 合於載板1上，並㈣桿48作動愿抵框架46，如第 七圖所不，隨後，後電磁驅動器61與中間電磁驅動 器63的線圈65同時通電激磁，而對該植入箱*施加 向前與向上方向的致動磁力，使得位在植入箱等待區 43内的晶片元件2會往上跳動並沿水平方向朝植入 區44前進；當該等晶片元件2達到導板13上方後， 轉換成前電磁驅動器62與中間電磁驅動器⑽的線圈 65通電激磁（選用較慢速度），使得位在植入區 内的晶片元件2會跳動而經由導板13上的篩孔131 填入載板1的貫穿孔11内，如第八圖所示；當晶片 π件2植入作業完成後，該後電磁驅動器62與中間 電磁驅動器63的線圈65將繼續通電激磁（但選用較 快速度），並配合框架46内之出風口 463的吹氣， 使得植入區44内剩下的晶片元件2向後退回到等待 區43内；之後，氣壓缸47後退將導板13向上掀起， 載板搬送機構81的氣壓缸812下降將植入區44内的 載板1取出並搬到輸送執道86上；如此重複進行， 就能將晶片元件2迅速地植入載板1的貫穿孔11内。 為使導板13蓋合在載板1上時，該導板上的筛 孔131可對準地覆蓋在該載板的貫穿孔u上方，在 13 1309145 本實施例中，係在該框架46上設有定位柱465用以 對應插入載板1的定位孔12，如第九圖、第十圖所 示；又如第四圖、第七圖所示，在植入區44及框架 46底面上设有定位銷441、467 ’並在該框架46上設 有導引孔466用以和植入區44該等定位銷441對應 插合；另外，在該植入箱4的前端設有一可受控制而 伸縮的定位壓桿48，當導板13蓋合在載板丨上後， 該壓桿48會伸長而將框架46固定在植入區44上。 又配合第四圖、第九圖所示，為便利晶片元件2 的更換，係在托板45的頂部設有複數形成傾斜的溝 槽451，並在該托板45之一側設置一出口仏2，當要 更換植入箱4内的晶片元件2時’係可在未放置載板 1與導板13的情況下，利用後電磁驅動器61與中間 電磁驅動器63的線圈65通電激磁，使得植入箱等待 區43内的晶片元件2向前運送至該托板佔的溝槽 451内，再經由出口 452的導引而落到植入箱*下方 的儲放盒49内收集；此外，為順利將晶片元件2將 植入箱等待區43内的晶片元件2向前運送到植入區 44内，亦可在該植入箱4的後端邊壁42内設有出風 口（未圖示），該出風口同樣連通至一供氣源，而能 從該出風口吹氣用以輔助晶片元件2的前移。The rolling mechanism 8.3 is located downstream of the conveying lane 86, and includes an upper and lower rollers 831. When the carrier 1 is moved onto the conveying rail 86, it is conveyed through the upper and lower rollers 831. The wafer component 2 implanted in the carrier 1 is pressed and leveled, and the end 21 of the wafer component 2 can be effectively adhered to the tape 12; and the transport mechanism 84 is located downstream of the rolling mechanism 83, which includes a pair of The rotating wheel 841 has a plurality of grooves 842 on the outer circumference of each of the rotating wheels 841 to transfer the carrier 1 passing through the rolling mechanism 83 to the downstream collecting box 87 for collection. The implant device formed in accordance with the present invention is implemented by the carrier transport mechanism 81 to first carry out the uppermost carrier 1 in the silo 85 and transport it into the implanted region 44. Thereafter, the carrier transport mechanism 81 The pneumatic cylinders 811, 812 rise and return to the initial position; then, the air pressure 12 1309145 cylinder 47 advances the frame 46 to flip, so that the guide plate i3 is closed down on the carrier plate 1, and the (four) rod 48 is actuated to the frame 46. As shown in the seventh figure, the rear electromagnetic actuator 61 and the coil 65 of the intermediate electromagnetic actuator 63 are simultaneously energized, and the actuating magnetic force of the forward and upward directions is applied to the implant box* so that the implant is placed in the implant box. The wafer elements 2 in the waiting area 43 will jump upward and advance in the horizontal direction toward the implantation area 44; when the wafer elements 2 reach above the guide 13, they are converted into the coils 65 of the front electromagnetic driver 62 and the intermediate electromagnetic driver (10). Power-on excitation (slower speed is selected), so that the wafer component 2 located in the implanted region will jump and be filled into the through-hole 11 of the carrier 1 through the mesh 131 on the guide 13 as shown in the eighth figure; When the wafer π 2 is implanted, The rear electromagnetic drive 62 and the coil 65 of the intermediate electromagnetic drive 63 will continue to be energized (although faster) and cooperate with the blow of the air outlet 463 in the frame 46 such that the remaining wafer component 2 in the implanted region 44 is rearward. Returning to the waiting area 43; thereafter, the air cylinder 47 retreats to lift the guide 13 upward, and the pneumatic cylinder 812 of the carrier transport mechanism 81 descends to take out the carrier 1 in the implanted area 44 and move it to the transport lane 86; By repeating this, the wafer component 2 can be quickly implanted into the through hole 11 of the carrier 1. In order to cover the guide plate 13 on the carrier plate 1, the mesh opening 131 of the guide plate can be aligned over the through hole u of the carrier plate, in the case of 13 1309145 in this embodiment, A positioning post 465 is disposed on the positioning hole 12 for inserting the carrier board 1 as shown in FIG. 9 and FIG. 10; and as shown in FIG. 4 and FIG. 7 , in the implantation area 44 and the bottom surface of the frame 46. The positioning pin 441, 467' is disposed on the frame 46, and the guiding hole 466 is disposed on the frame 46 for corresponding insertion of the positioning pin 441; and the front end of the implantation box 4 is provided with a The controlled telescoping positioning bar 48, when the guide 13 is capped over the carrier, will extend to secure the frame 46 to the implanted region 44. Further, in conjunction with the fourth and ninth drawings, in order to facilitate the replacement of the wafer component 2, a plurality of inclined grooves 451 are formed on the top of the pallet 45, and an outlet is provided on one side of the pallet 45. 2. When the wafer component 2 in the implant box 4 is to be replaced, the coil 65 of the intermediate electromagnetic driver 63 and the intermediate electromagnetic driver 63 can be energized by the electromagnetic actuator 61 without the carrier plate 1 and the guide plate 13 being placed. The wafer component 2 in the box waiting area 43 is transported forward into the groove 451 occupied by the pallet, and then collected by the outlet 452 to be collected in the storage box 49 below the implant box*; The wafer component 2 is smoothly transported into the implanted region 44 by the wafer component 2, and an air outlet may be provided in the rear end side wall 42 of the implant box 4 (not shown). The air outlet is also connected to a supply air source, and air can be blown from the air outlet to assist the advancement of the wafer element 2.
1309145 比本發明僅是就特定實施例做描 述。依據本發明的特徵當 例如，本發明之電磁驅動…，匕實施或修改。 驅動限制為前電磁驅動器、 後電磁驅動器及中間電 旦 弛軔态等二個，也可增加數 5 可以…又置前、後各-個電磁驅動器61a、 a’亦即’當將該電磁驅動器的線圈脱與電磁鋼 “设成傾斜相對配置（如第十—圖、第十二圖所 不）’是為面對植入箱4垂直方向〇〜90度間的傾斜 仰角設置’而能同時產生前後與上下方向的分力時， ^中間電磁驅動器可省略不用；而在一較佳的設置狀 態下：前、後電磁驅動器61a、62a最佳的傾斜仰設 角度是在15〜60度間。是以，對於熟悉此項技藝人士 可作之明顯替換與修改，仍將併入於本發明所主張的 專利範圍之内。 15 13091451309145 is merely illustrative of specific embodiments than the present invention. Features in accordance with the invention are, for example, implemented or modified by the electromagnetic drive of the present invention. The driving limit is two for the front electromagnetic drive, the rear electromagnetic drive and the intermediate electric drive state, and the number 5 can also be increased. The front and rear electromagnetic drives 61a, a' are also used. The coil is disengaged from the electromagnetic steel and is disposed in a tilted relative arrangement (as shown in the tenth-figure and the twelfth figure) to set the tilt elevation angle between 〇 and 90 degrees in the vertical direction of the implant box 4. When the component forces of the front and rear and the up and down direction are generated, the intermediate electromagnetic actuator can be omitted; and in a preferred setting state, the optimal tilting angles of the front and rear electromagnetic actuators 61a, 62a are between 15 and 60 degrees. Therefore, obvious substitutions and modifications to those skilled in the art will still be incorporated in the scope of the claimed invention. 15 1309145
12.膠帶 13.導板 131.篩孔 14.定位孔 2.晶片元件 21.端頭 3.基座 30.頂面 31.邊板 32.墊圈 4.植入箱 41.底板 42.邊壁 43.等待區 431.底面 4 4.植入區 441. 467.定位銷 45.托板 451.溝槽 452.出口 46.框架 4 61.軸桿 462.前端部 463.出風口 464.氣道 465.定位柱 466.導引孔 47.氣壓缸 48.壓桿 49.儲放盒 5.支撐件 51.第一端 52.第二端 53.中間部 531.斜面 532.頂面 61. 62. 63. 61a. 62a.電磁驅動器 64. 64a.電磁鋼片 65.65a.線圈 66.支持座 7.機體 17 130914512. Tape 13. Guide plate 131. Screen hole 14. Positioning hole 2. Wafer element 21. End 3. Base 30. Top surface 31. Side plate 32. Washer 4. Implant box 41. Base plate 42. Side wall 43. Waiting area 431. Bottom surface 4. 4. Implanting area 441. 467. Locating pin 45. Pallet 451. Groove 452. Outlet 46. Frame 4 61. Shaft 462. Front end 463. Air outlet 464. Air passage 465 Positioning post 466. Guide hole 47. Pneumatic cylinder 48. Pressure bar 49. Storage box 5. Support member 51. First end 52. Second end 53. Intermediate portion 531. Oblique surface 532. Top surface 61. 62. 63. 61a. 62a. Electromagnetic drive 64. 64a. Electromagnetic steel sheet 65.65a. Coil 66. Support base 7. Body 17 1309145
71.工作台 81.載板搬送機構 811. 812.氣壓缸 813.吸附板 814.吸嘴 82.晶片供應機構 821.料斗 822.輸送道 83.滾壓機構 831.滾筒 84.傳送機構 841.轉輪 842.凹槽 85.料倉 86.輸送軌道 87.收集箱 1871. Workbench 81. Carrier transport mechanism 811. 812. Pneumatic cylinder 813. Adsorption plate 814. Suction nozzle 82. Wafer supply mechanism 821. Hopper 822. Transport path 83. Rolling mechanism 831. Roller 84. Transport mechanism 841. Runner 842. Groove 85. Silo 86. Transport track 87. Collection box 18