TWI657985B - Leveling mechanism of electronic component carrier and operation classification equipment for application thereof - Google Patents

Leveling mechanism of electronic component carrier and operation classification equipment for application thereof Download PDF

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Publication number
TWI657985B
TWI657985B TW107102980A TW107102980A TWI657985B TW I657985 B TWI657985 B TW I657985B TW 107102980 A TW107102980 A TW 107102980A TW 107102980 A TW107102980 A TW 107102980A TW I657985 B TWI657985 B TW I657985B
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Taiwan
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vibration
leveling mechanism
carrier
electronic component
mounting member
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TW107102980A
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Chinese (zh)
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TW201932382A (en
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陳振元
黃冠瑋
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鴻勁精密股份有限公司
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Publication of TW201932382A publication Critical patent/TW201932382A/en

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Abstract

一種電子元件承載器之整平機構,其承載器係承置至少一電子元件,該整平機構係設有主振式驅動源,並以至少一具彈性之架置件架置主振式驅動源,以使主振式驅動源可偏擺作動,傳振結構係設有至少一裝配於承載器之第一傳振具,該第一傳振具係承置該架置件,於主振式驅動源振動時,利用架置件使主振式驅動源作彈性偏擺晃動而產生更大之振動力,並以第一傳振具將振動力傳導至承載器,使承載器快速振動而整平電子元件,達到有效縮短整平電子元件作業時間及提高生產效能之實用效益。 A leveling mechanism for an electronic component carrier. The carrier is configured to receive at least one electronic component. The leveling mechanism is provided with a main vibration driving source and the main vibration driving is mounted by at least one elastic mounting member. Source, so that the main vibration type driving source can oscillate. The vibration transmission structure is provided with at least a first vibration transmission device mounted on the carrier. The first vibration transmission device supports the mounting member, and the main vibration When the type driving source is vibrated, the mounting member is used to make the main vibration type driving source oscillate elastically to generate greater vibration force, and the vibration force is transmitted to the carrier by the first vibration transmitting device, so that the carrier quickly vibrates and Leveling electronic components to achieve practical benefits of effectively shortening the operation time of leveling electronic components and increasing production efficiency.

Description

電子元件承載器之整平機構及其應用之作業分類設備 Leveling mechanism of electronic component carrier and operation classification equipment for application thereof

本發明係提供一種可快速整平承載器上之電子元件,而有效縮短整平作業時間及提高生產效能之整平機構。 The invention provides a leveling mechanism that can quickly level electronic components on a carrier, and effectively shorten the leveling operation time and improve production efficiency.

在現今,電子元件作業設備係設有至少一承載器,該承載器可為收料器、載台或預溫器等,而可直接承載電子元件,或間接承載一具電子元件之料盤;以收料器為例,請參閱第1、2圖,該收料器係於機架11之側面設有輸送皮帶輪組12,該輸送皮帶輪組12之皮帶121的第一端區域係為收料區,而第二端區域則為收盤區,該輸送皮帶輪組12係以收料區之皮帶121承載一具有複數個凹槽131之收料盤13,該收料盤13之凹槽131可供一移料器(圖未示出)移入已作業之電子元件14,於收料盤13盛滿已作業之電子元件14後,輸送皮帶輪組12之皮帶121即將一具有已作業電子元件14之收料盤13載送至收盤區,一位於收盤區之托盤架15,係作Z方向位移將皮帶121上之該具已作業電子元件14的收料盤13托移至承盤器16上堆疊收置;惟,該移料器將已作業電子元件14移入收料盤13之凹槽131時,易因移載誤差,而將已作業電子元件14偏斜擺置於收料盤13之凹槽131,令已作業電子元件14之一端跨置於凹槽131之槽口,一旦下一收料盤堆疊置放於該收料盤13上時,即發生下一收料盤壓損該收料盤13上偏斜擺置之已作業電子元件14,不僅影響電子元件品質,亦將影響後續製程;因此,如何使電子元件平整擺置於承載器,著實相當重要。 At present, electronic component operating equipment is provided with at least one carrier, which can be a receiver, a stage or a pre-heater, etc., and can directly carry electronic components, or indirectly carry a tray with electronic components; Taking the take-up device as an example, please refer to FIGS. 1 and 2. The take-up device is provided with a conveying pulley group 12 on the side of the frame 11, and the first end region of the belt 121 of the conveying pulley group 12 is a receiving device. Area, and the second end area is the closing area. The conveying belt wheel set 12 uses a belt 121 in the receiving area to carry a receiving tray 13 with a plurality of grooves 131. The grooves 131 of the receiving tray 13 are provided. A shifter (not shown) moves in the operated electronic components 14. After the receiving tray 13 is filled with the operated electronic components 14, the belt 121 of the conveying pulley group 12 is about to receive the received electronic components 14. The tray 13 is carried to the closing area. A tray rack 15 located in the closing area is moved in the Z direction to move the receiving tray 13 with the operated electronic components 14 on the belt 121 to the tray 16 for stacking and receiving. However, when the feeder moves the operated electronic component 14 into the groove 131 of the receiving tray 13, it is easy Transfer error, and placed the operated electronic component 14 in the groove 131 of the receiving tray 13 obliquely, so that one end of the operated electronic component 14 is placed in the slot of the groove 131, once the next receiving tray is stacked When placed on the receiving tray 13, the next receiving tray pressure will damage the operated electronic components 14 placed on the receiving tray 13, which will not only affect the quality of the electronic components, but also affect the subsequent processes; How to make the electronic components be placed on the carrier flat is really important.

本發明之目的一,係提供一種電子元件承載器之整平機構,其承載器係承置至少一電子元件,該整平機構係設有主振式驅動源,並以至少一具彈性之架置件架置主振式驅動源,以使主振式驅動源可偏擺作動,傳振結構係設有至少一裝配於承載器之第一傳振具,該第一傳振具係承置該架置件,於主振式驅動源振動時,利用架置件使主振式驅動源作彈性偏擺晃動而產生更大之振動力,並以第一傳振具將振動力傳導至承載器,使承載器快速振動而整平電子元件,達到有效縮短整平電子元件作業時間及提高生產效能之實用效益。 One object of the present invention is to provide a leveling mechanism for an electronic component carrier. The carrier supports at least one electronic component. The leveling mechanism is provided with a main vibration driving source and at least one elastic frame. The main vibration type driving source is set up by a piece so that the main vibration type driving source can oscillate. The vibration transmission structure is provided with at least a first vibration transmission device mounted on the carrier, and the first vibration transmission device is supported. When the main vibration driving source is vibrated, the mounting member uses the mounting member to cause the main vibration driving source to oscillate elastically to generate greater vibration force, and transmits the vibration force to the bearing by the first vibration transmitting device. The device enables the carrier to quickly vibrate and level electronic components, thereby achieving practical benefits of effectively shortening the operation time of leveling electronic components and increasing production efficiency.

本發明之目的二,係提供一種電子元件承載器之整平機構,其中,該整平機構之傳振結構係於承載器設有至少一第二傳振具,並於主振式驅動源與第二傳振具之間設有至少一第三傳振具,於主振式驅動源振動時,利用第三傳振具振動第二傳振具,使第二傳振具將振動力傳導至承載器,進而增加振動承載器之效能,達到更加迅速整平電子元件之實用效益。 The second object of the present invention is to provide a leveling mechanism for an electronic component carrier, wherein the vibration transmitting structure of the leveling mechanism is provided with at least a second vibration transmitting device on the carrier, and the main vibration type driving source and At least one third vibration transmitting device is provided between the second vibration transmitting devices. When the main vibration type driving source vibrates, the third vibration transmitting device is used to vibrate the second vibration transmitting device, so that the second vibration transmitting device transmits the vibration force to the second vibration transmitting device. The carrier, thereby increasing the effectiveness of the vibration carrier, achieves the practical benefit of more rapid leveling of electronic components.

本發明之目的三,係提供一種應用電子元件承載器之整平機構的作業分類設備,其包含機台、供料裝置、收料裝置、作業裝置、輸送裝置、至少一本發明之整平機構及中央控制裝置,該供料裝置係配置於機台上,並設有至少一承載待作業電子元件之供料承載器,該收料裝置係配置於機台上,並設有至少一承載已作業電子元件之收料承載器,該作業裝置係配置於機台上,並設有至少一對電子元件執行預設作業之作業器,該輸送裝置係配置於機台上,並設有至少一移載電子元件之移料器,至少一本發明之整平機構係裝配於至少一承載器上,用以整平電子元件,該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。 A third object of the present invention is to provide a work classification device using a leveling mechanism of an electronic component carrier, which includes a machine, a feeding device, a receiving device, a working device, a conveying device, and at least one leveling mechanism of the present invention. And a central control device, the feeding device is arranged on the machine platform and is provided with at least one feeding carrier for carrying the electronic components to be operated, and the receiving device is arranged on the machine platform and is provided with at least one loading device. A receiving carrier for operating electronic components. The operating device is arranged on the machine and is provided with at least one pair of electronic components to perform a preset operation. The conveying device is arranged on the machine and is provided with at least one A transfer device for transferring electronic components, at least one leveling mechanism of the present invention is mounted on at least one carrier for leveling electronic components, and the central control device is used to control and integrate the actions of various devices to perform automation. Operation to achieve practical benefits to improve operation efficiency.

〔習知〕 [Learning]

11‧‧‧機架 11‧‧‧ Rack

12‧‧‧輸送皮帶輪組 12‧‧‧ Conveyor pulley set

121‧‧‧皮帶 121‧‧‧Belt

13‧‧‧收料盤 13‧‧‧ Receiving tray

131‧‧‧凹槽 131‧‧‧ groove

14‧‧‧電子元件 14‧‧‧Electronic components

15‧‧‧托盤架 15‧‧‧pallet rack

16‧‧‧承盤器 16‧‧‧ plate holder

〔本發明〕 〔this invention〕

20‧‧‧承載器 20‧‧‧ Carrier

21‧‧‧架體 21‧‧‧frame

22‧‧‧治具 22‧‧‧Jig

221‧‧‧容置槽 221‧‧‧Receiving slot

30‧‧‧整平機構 30‧‧‧leveling agency

31‧‧‧馬達 31‧‧‧Motor

311‧‧‧本體 311‧‧‧ Ontology

312‧‧‧轉軸 312‧‧‧Shaft

313‧‧‧配重塊 313‧‧‧ Counterweight

32‧‧‧架置件 32‧‧‧mounting parts

33‧‧‧座體 33‧‧‧ seat

34‧‧‧連結部件 34‧‧‧Connecting parts

35‧‧‧第一傳振具 35‧‧‧First pass

351‧‧‧第一板體 351‧‧‧First plate

352‧‧‧第二板體 352‧‧‧Second plate

353‧‧‧限位件 353‧‧‧Limit pieces

36‧‧‧第二傳動具 36‧‧‧Second Transmission

361‧‧‧穿孔 361‧‧‧perforation

37‧‧‧第三傳振具 37‧‧‧ Third pass

371‧‧‧凸塊 371‧‧‧ bump

372‧‧‧通孔 372‧‧‧through hole

373‧‧‧定位件 373‧‧‧Positioning

38‧‧‧中介件 38‧‧‧Intermediary

41‧‧‧機台 41‧‧‧machine

42‧‧‧移料器 42‧‧‧Feeder

43‧‧‧電子元件 43‧‧‧Electronic components

50‧‧‧供料裝置 50‧‧‧feeding device

51‧‧‧供料承載器 51‧‧‧Feed carrier

60‧‧‧收料裝置 60‧‧‧Receiving device

61‧‧‧收料承載器 61‧‧‧Receiving carrier

70‧‧‧作業裝置 70‧‧‧Working device

71‧‧‧電路板 71‧‧‧Circuit Board

72‧‧‧測試座 72‧‧‧Test Block

80‧‧‧輸送裝置 80‧‧‧ Conveying device

81‧‧‧第一移料器 81‧‧‧first feeder

82‧‧‧第一入料載台 82‧‧‧First loading stage

83‧‧‧第二入料載台 83‧‧‧Second loading stage

84‧‧‧第二移料器 84‧‧‧second feeder

85‧‧‧第三移料器 85‧‧‧third feeder

86‧‧‧第一出料載台 86‧‧‧First discharge stage

87‧‧‧第二出料載台 87‧‧‧Second discharge stage

88‧‧‧第四移料器 88‧‧‧Fourth transfer device

第1圖:習知電子元件收料器之示意圖。 Figure 1: Schematic diagram of a conventional electronic component receiver.

第2圖:習知電子元件收料器之使用示意圖。 Figure 2: Schematic diagram of the conventional electronic component receiver.

第3圖:本發明承載器及整平機構第一實施例之配置圖。 Fig. 3: Configuration diagram of the first embodiment of the carrier and the leveling mechanism of the present invention.

第4圖:本發明整平機構第一實施例之示意圖。 FIG. 4 is a schematic diagram of a first embodiment of a leveling mechanism according to the present invention.

第5圖:本發明整平機構第一實施例之使用示意圖(一)。 FIG. 5 is a schematic diagram of a first embodiment of a leveling mechanism according to the present invention (I).

第6圖:本發明整平機構第一實施例之使用示意圖(二)。 Fig. 6: A schematic diagram of the first embodiment of the leveling mechanism of the present invention (2).

第7圖:本發明承載器及整平機構第二實施例之配置圖。 Figure 7: Configuration diagram of the second embodiment of the carrier and the leveling mechanism of the present invention.

第8圖:本發明整平機構第二實施例之示意圖。 FIG. 8 is a schematic diagram of a second embodiment of a leveling mechanism according to the present invention.

第9圖:本發明整平機構第二實施例之使用示意圖(一)。 Fig. 9 is a schematic diagram of the second embodiment of the leveling mechanism according to the present invention (I).

第10圖:本發明整平機構第二實施例之使用示意圖(二)。 Fig. 10: A schematic diagram of the second embodiment of the leveling mechanism according to the present invention (2).

第11圖:本發明整平機構應用於作業分類設備之示意圖。 FIG. 11 is a schematic diagram of the application of the leveling mechanism of the present invention to a job classification device.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:請參閱第3、4圖,係為電子元件承載器20及整平機構30之第一實施例,該承載器20係承置至少一電子元件,該承載器可為置料承載器、載台或預溫器等,而固定於機台或於機台上作至少一方向位移,例如置料承載器及預溫器係固設於機台,而承置電子元件,例如載台則承置電子元件於機台上作至少一方向位移,更進一步,該承載器20可於本身設有至少一盛裝電子元件之承置部件,或承置至少一具承置部件之承具,例如一為置料承載器或預溫器之承載器20,可承置一具有複數個承置部件(例如容置槽)之承具(例如料盤或治具),於本實施例中,該承載器20係為預溫器,並於機台41上設置有架體21,該架體21上裝配一具有複數個容置槽221之治具22,並以容置槽221承置待預溫之電子元件;該整平機構30係裝配於該承載器20,並設有至少一主振式驅動源,更進一步,該主振式驅動源可為旋轉驅動源、線性驅動源或壓電元件,例如該旋轉驅動源可為具轉軸及配重塊之馬達,馬達可利用具配重塊之轉軸 作連續旋轉而產生振動,又例如主振式驅動源可為壓電元件,利用壓電元件於通電時而使自身作長度伸縮變化而產生振動,於本實施例中,該主振式驅動源係為馬達31,該馬達31之本體311第一端係凸伸出有轉軸312,並於轉軸312上偏心裝配有至少一配重塊313,以使配重塊313可作偏心旋轉;又該整平機構30係設有至少一具彈性之架置件32,以架置主振式驅動源,並使主振式驅動源可偏擺作動,該架置件32可為彈片或彈簧等,於本實施例中,係設有複數個為彈片之架置件32,各架置件32之第一端係設置於一座體33,而第二端則架置馬達31,更進一步,該架置件32與座體33可為一體成型,例如於座體33之周側一體成型有呈Z方向配置之架置件32,又或該架置件32與座體33可為各別獨立元件,例如於座體33之周側鎖固有呈Z方向配置之架置件32,以利更換修護架置件32,又該架置件32之第二端可直接連結架置馬達31,或於架置件32之第二端與馬達31間設有至少一連結部件,以令架置件32經由該連結部件而架置馬達31,於本實施例中,二架置件32之第一端係分別鎖固於座體33之兩側,而第二端則以二連結部件34裝配架置馬達31之本體311,使馬達31之本體311可偏擺作動,另該整平機構30係設有具至少一第一傳振具35之傳振結構,其第一傳振具35係裝配於承載器20,並承置該架置件32,以於主振式驅動源振動時,利用架置件32及第一傳振具35將振動力傳導至承載器20,使承載器20快速振動而整平電子元件,更進一步,該第一傳振具35可一體成型向上衝製彎折出具彈性之架置件32,亦或該第一傳振具35可一體成型出座體33,以供裝配具彈性之架置件32,於本實施例中,該傳振結構係設有一概呈L型之第一傳振具35,並以第一傳振具35之第一板體351承置鎖固該座體33,以使架置件32裝配於第一傳振具35,第一傳振具35之第二板體352則裝配於承載器20之架體21,而將振動力傳 導至承載器20,另該傳振結構係於第一傳振具35上且相對應架置件32之位置設有至少一限位件353,以限位架置件32之擺幅,更進一步,該限位件353係具有可壓縮性,以對架置件32形成一緩衝作用,例如該限位件353可為橡膠墊或氣墊等,於本實施例中,係於第一傳振具35之第二板體352上且相對應二架置件32之第二端位置設有二為橡膠墊製成之限位件353,用以限位及緩衝該架置件32。 In order for your reviewing committee to further understand the present invention, a preferred embodiment will be given in conjunction with the drawings, detailed as follows: Please refer to Figures 3 and 4, which are the electronic component carrier 20 and the leveling mechanism 30 In a first embodiment, the carrier 20 is used to house at least one electronic component. The carrier may be a material carrier, a carrier or a pre-heater, etc., and is fixed on the machine or in at least one direction on the machine. Displacement, such as the loading carrier and the pre-heater are fixed on the machine, and the electronic components are placed, for example, the electronic platform is placed on the machine for at least one direction displacement. Furthermore, the carrier 20 can be At least one supporting component for containing electronic components or a supporting component for at least one receiving component, such as a carrier 20 which is a material carrier or a pre-heater, may be provided with a plurality of A support (such as a tray or a jig) for receiving a component (such as a receiving tank). In this embodiment, the carrier 20 is a pre-heater, and a frame 21 is provided on the machine 41. A jig 22 having a plurality of receiving grooves 221 is assembled on the frame body 21, and the to-be-preheated Sub-elements; the leveling mechanism 30 is assembled on the carrier 20 and is provided with at least one main vibration-type driving source. Furthermore, the main vibration-type driving source may be a rotary driving source, a linear driving source, or a piezoelectric element. For example, the rotary driving source may be a motor with a rotating shaft and a weight, and the motor may use a rotating shaft with a weight Vibration is generated by continuous rotation. For example, the main vibration-type driving source may be a piezoelectric element. When the piezoelectric element is energized, the length of the piezoelectric element is changed to cause vibration. In this embodiment, the main vibration-type driving source is a piezoelectric element. It is a motor 31. The first end of the main body 311 of the motor 31 is convexly protruding with a rotating shaft 312, and at least one weight block 313 is eccentrically mounted on the rotating shaft 312, so that the weight block 313 can rotate eccentrically; The leveling mechanism 30 is provided with at least one elastic mounting member 32 for mounting the main vibration driving source and allowing the main vibration driving source to oscillate. The mounting member 32 may be an elastic piece or a spring. In this embodiment, a plurality of mounting members 32 which are elastic pieces are provided. The first end of each mounting member 32 is set on a body 33, and the second end is mounted on the motor 31. Further, the frame The mounting member 32 and the seat body 33 may be integrally formed. For example, the mounting member 32 arranged in the Z direction is integrally formed on the peripheral side of the seat body 33, or the mounting member 32 and the seat body 33 may be separate components. For example, the mounting piece 32 arranged in the Z direction is inherently locked on the peripheral side of the seat body 33 to facilitate replacement of the maintenance mounting piece 32, and The second end of the mounting member 32 can be directly connected to the mounting motor 31, or at least one connecting member is provided between the second end of the mounting member 32 and the motor 31, so that the mounting member 32 can be mounted through the connecting member. The motor 31, in this embodiment, the first ends of the two mounting members 32 are respectively locked on both sides of the base body 33, and the second end is assembled with the main body 311 of the motor 31 by two connecting members 34 so that The body 311 of the motor 31 can be oscillated, and the leveling mechanism 30 is provided with a vibration transmission structure having at least a first vibration transmission device 35. The first vibration transmission device 35 is assembled to the carrier 20 and is placed. The mounting member 32 is used to transmit the vibration force to the carrier 20 when the main vibration type driving source vibrates, so that the carrier 20 quickly vibrates to level the electronic components. Further, the first vibration transmitting device 35 may be integrally formed and punched upwards to bend out to form an elastic mounting member 32, or the first vibration transmitting device 35 may be integrally formed to form a seat body 33 for assembling the elastic mounting device. 32, in this embodiment, the vibration transmitting structure is provided with a first L-shaped vibration transmitting device 35, and the first plate 35 of the first vibration transmitting device 35 1 Hold and lock the base 33 so that the mounting member 32 is assembled to the first vibration transmitting device 35, and the second plate 352 of the first vibration transmitting device 35 is assembled to the frame 21 of the carrier 20. Vibration force transmission Lead to the carrier 20, and the vibration transmitting structure is on the first vibration transmitting device 35 and is provided with at least one limiting member 353 at a position corresponding to the mounting member 32. Further, the limiting member 353 is compressible to form a buffering effect on the mounting member 32. For example, the limiting member 353 may be a rubber cushion or an air cushion. In this embodiment, it is connected to the first vibration transmitting device. Two limiting members 353 made of rubber pads are provided on the second plate body 352 of the tool 35 and corresponding to the second ends of the two mounting members 32 to limit and buffer the mounting members 32.

請參閱第5圖,於使用時,一輸送裝置之移料器42係將待預溫之電子元件43移入承載器20之治具22的容置槽221,若移料器42因位移誤差而將一待預溫之電子元件43偏斜移入於治具22的容置槽221時,為避免影響下一作業,於承載器20之治具22盛裝一批次複數個待預溫之電子元件43後,即以整平機構30執行電子元件43之整平作業。 Please refer to FIG. 5. In use, a transfer device 42 of a conveying device moves the electronic component 43 to be preheated into the receiving groove 221 of the fixture 22 of the carrier 20. When obliquely moving an electronic component 43 to be preheated into the receiving groove 221 of the fixture 22, in order to avoid affecting the next operation, a batch of multiple electronic components to be warmed is contained in the fixture 22 of the carrier 20. After 43, the leveling operation of the electronic component 43 is performed by the leveling mechanism 30.

請參閱第6圖,於執行電子元件43之整平作業時,該整平機構30係啟動馬達31,馬達31之轉軸312即帶動配重塊313作連續性快速旋轉,由於配重塊313之重心非在轉軸312之軸心,而可利用配重塊313之偏心轉動,使得馬達31處於不斷的失去平衡狀態而產生連續性快速振動,並以本體311將振動傳導至連結部件34,由於連結部件34係裝配於架置件32之第二端,該第二端為一自由端,使得馬達31可利用架置件32而作彈性偏擺晃動,以產生更大之振動力,該架置件32之第一端則將振動力經由座體33傳導至第一傳振具35之第一板體351,由於第一傳振具35之第二板體352係鎖固於承載器20之架體21,使得第一傳振具35可將振動力經由第二板體352而傳導至承載器20之架體21,令承載器20之架體21產生振動,並將振動傳導至治具22,治具22即可同步振動,使得治具22上偏斜擺置之電子元件43滑入於容置槽221而平整擺置,進而迅速完成電子元件整平作業。 Please refer to FIG. 6. When the leveling operation of the electronic component 43 is performed, the leveling mechanism 30 is a start motor 31, and the rotating shaft 312 of the motor 31 drives the weight block 313 to rotate continuously and rapidly. The center of gravity is not on the axis of the rotating shaft 312, but the eccentric rotation of the weight block 313 can be used to keep the motor 31 in an unbalanced state and generate continuous and rapid vibration. The body 311 transmits the vibration to the connecting member 34. The component 34 is assembled on the second end of the mounting member 32, and the second end is a free end, so that the motor 31 can use the mounting member 32 to perform elastic deflection shaking to generate a greater vibration force. The first end of the member 32 transmits the vibration force to the first plate 351 of the first vibration transmitting device 35 through the base 33. Since the second plate 352 of the first vibration transmitting device 35 is locked to the carrier 20 The frame 21 allows the first vibration transmitting device 35 to transmit the vibration force to the frame 21 of the carrier 20 through the second plate 352, so that the frame 21 of the carrier 20 vibrates and transmits the vibration to the fixture 22, the fixture 22 can vibrate synchronously, so that the electronic components 43 on the fixture 22 are slanted In the receiving slot 221 arrangements and smooth, rapid completion of the electronic component and thus leveling job.

請參閱第7、8圖,係為承載器20及整平機構3 0之第二實施例,該承載器20係承置至少一電子元件,於本實施例中,該承載器20係為預溫器,並於機台41上設置有架體21,架體21上裝配一具有複數個容置槽221之治具22,並以容置槽221承置待預溫之電子元件;該整平機構30係裝配於該承載器20,並設有至少一主振式驅動源,於本實施例中,主振式驅動源係為馬達31,該馬達31之本體311第一端係凸伸出有轉軸312,並於轉軸312上偏心裝配有至少一配重塊313,該整平機構30係設有至少一具彈性之架置件32,以架置主振式驅動源,並使主振式驅動源可偏擺作動,於本實施例中,係設有二為彈片之架置件32,二架置件32之第一端係分別鎖固於座體33之兩側,而第二端則以複數個連結部件34裝配架置馬達31之本體311,使馬達31之本體311可偏擺作動,該整平機構30之傳振結構係於承載器20裝配有第一傳振具35,第一傳振具35之第一板體351承置鎖固該座體33,以使架置件32裝配於第一傳振具35,第一傳振具35之第二板體352則裝配於承載器20之架體21,而可將振動力傳導至承載器20,另該傳振結構係於第一傳振具35上且相對應架置件32之位置設有至少一限位件353,以限位架置件32之擺幅,其中,該整平機構30之第二實施例與第一實施例之差異在於該傳振結構係於承載器20設有至少一第二傳振具,更進一步,該第二傳振具可裝配於承載器20之架體21或承具上,於本實施例中,係以治具22側面之手把作為第二傳動具36,該傳振結構並於主振式驅動源與第二傳振具36間設有至少一可作偏擺晃動之第三傳振具37,並以第三傳振具37振動第二傳振具36,更進一步,該第三傳振具37可為主振式驅動源之本體311或架置件32之第二端,亦可為一裝配於主振式驅動源或架置件32上之獨立元件,於本實施例中,第三傳振具37係為一獨立元件,並連結馬達31之本體311,然於製作時,該第三傳振具37與連結部件34可製成一體,又該第三傳振具 37係以敲擊或連動之方式而使第二傳振具36振動,例如該第三傳振具37隨同馬達31之本體311作偏擺晃動時,利用一側面敲擊第二傳振具36,使第二傳振具36振動,又例如於第三傳振具37與第二傳振具36之間設有至少一中介件38,該中介件38可為插銷,而裝配於第三傳振具37或第二傳振具36,以使第三傳振具37利用中介件38振動第二傳振具36,於本實施例中,係於第三傳振具37之一側面設有具通孔372之凸塊371,該通孔372可供穿置一呈Z方向配置且為插銷之中介件38,另於第二傳振具36相對應中介件38之位置開設有穿孔361,以供穿置中介件38,於中介件38穿置第三傳振具37之通孔372及第二傳振具36之穿孔361後,即於第三傳振具37之凸塊371側面鎖設一可定位中介件38之定位件373,使第三傳振具37利用中介件38振動第二傳振具36。 Please refer to Figures 7 and 8 for the carrier 20 and the leveling mechanism 3 In the second embodiment of 0, the carrier 20 is used to house at least one electronic component. In this embodiment, the carrier 20 is a pre-heater, and a frame 21 is provided on the machine 41. A fixture 22 having a plurality of accommodating grooves 221 is assembled thereon, and the electronic components to be pre-heated are received by the accommodating grooves 221. The leveling mechanism 30 is assembled to the carrier 20 and is provided with at least one main vibration In this embodiment, the main vibration-type driving source is a motor 31. A first end of the main body 311 of the motor 31 protrudes from a rotating shaft 312, and at least one weight block is eccentrically mounted on the rotating shaft 312. 313. The leveling mechanism 30 is provided with at least one elastic mounting member 32 for mounting the main vibration driving source and enabling the main vibration driving source to oscillate. In this embodiment, the leveling mechanism 30 is provided with The second is the mounting piece 32 of the shrapnel. The first ends of the two mounting pieces 32 are respectively locked to the two sides of the base 33, and the second end is assembled with the main body 311 of the mounting motor 31 by a plurality of connecting members 34. The main body 311 of the motor 31 can be oscillated, and the vibration transmitting structure of the leveling mechanism 30 is mounted on the carrier 20. The first vibration transmitting device 35 is equipped with the first vibration transmitting device 35. A plate body 351 receives and locks the base body 33 so that the mounting member 32 is assembled to the first vibration transmitting device 35, and the second plate 352 of the first vibration transmitting device 35 is installed to the frame body 21 of the carrier 20. The vibration force can be transmitted to the carrier 20, and the vibration transmission structure is attached to the first vibration transmission device 35 and is provided with at least one limiting member 353 at a position corresponding to the mounting member 32 to limit the mounting member. The swing of 32, wherein the second embodiment of the leveling mechanism 30 differs from the first embodiment in that the vibration transmitting structure is provided with at least one second vibration transmitting device on the carrier 20, and further, the second The vibration transmission device can be assembled on the frame 21 or the support of the carrier 20. In this embodiment, the handle on the side of the jig 22 is used as the second transmission device 36. The vibration transmission structure is driven by the main vibration type. The source and the second vibration transmitting device 36 are provided with at least one third vibration transmitting device 37 capable of oscillating, and the third vibration transmitting device 37 is used to vibrate the second vibration transmitting device 36. Furthermore, the third vibration transmitting device 36 The tool 37 may be the main body 311 of the main vibration type driving source or the second end of the mounting member 32, or may be an independent component assembled on the main vibration type driving source or the mounting member 32. In this embodiment, 37 having three vibration transmission system is a separate element, and connected to the motor 31 of the main body 311, and then in the production of the third tool 37 and the vibration transmission member 34 may be formed integrally coupling, should the third vibration transmission having 37 is the second vibration transmitting device 36 that is vibrated by knocking or interlocking. For example, when the third vibration transmitting device 37 oscillates along with the body 311 of the motor 31, the second vibration transmitting device 36 is hit with a side. To cause the second vibration transmitting device 36 to vibrate, and for example, at least one intermediary member 38 is provided between the third vibration transmitting device 37 and the second vibration transmitting device 36, and the interposing member 38 may be a pin and is assembled on the third transmission device. The vibrating device 37 or the second vibrating device 36 is used to make the third vibrating device 37 vibrate the second vibrating device 36 by using the intermediary member 38. In this embodiment, it is provided on one side of the third vibrating device 37 A bump 371 with a through hole 372. The through hole 372 can be used to pass a Z-shaped interposer 38 and a perforation 361 is provided at a position corresponding to the interposer 38 in the second vibration transmitting tool 36. For inserting the intermediary member 38, after the intermediary member 38 penetrates the through hole 372 of the third vibration transmitting device 37 and the perforation 361 of the second vibration transmitting device 36, it is locked at the side of the projection 371 of the third vibration transmitting device 37 A positioning member 373 capable of positioning the intermediate member 38 is provided, so that the third vibration transmitting device 37 uses the intermediate member 38 to vibrate the second vibration transmitting device 36.

請參閱第9、10圖,當承載器20之治具22的容置槽221承置偏斜擺置之待預溫電子元件43後,可執行電子元件43之整平作業,該整平機構30係啟動馬達31,馬達31之轉軸312即帶動配重塊313作連續性旋轉,以利用配重塊313之偏心轉動,使得馬達31處於不斷的失去平衡狀態而產生連續性快速振動,並經本體311及連結部件34將振動傳導至架置件32,使馬達31可利用架置件32而作彈性偏擺晃動,以產生更大之振動力,該架置件32之第一端係將振動力經由座體33傳導至第一傳振具35之第一板體351,再由第一傳振具35之第二板體352將振動力傳導至承載器20之架體21,而使承載器20之架體21振動,架體21並將振動傳導至治具22,治具22同步振動,然於第一傳振具35傳導振動時,由於第三傳振具37係連結馬達31之本體311,使得馬達31之本體311可同步帶動第三傳振具37作偏擺晃動,第三傳振具37可利用中介件38帶動第二傳振具36振動,該 第二傳振具36則帶動承載器20之治具22振動,進而該傳振結構可利用第一傳振具35及第二、三傳振具36、37而帶動承載器20之架體21及治具22振動,使得治具22上偏斜擺置之電子元件43確實滑入於容置槽221而平整擺置,進而迅速完成整平作業。 Please refer to FIG. 9 and FIG. 10, when the receiving groove 221 of the fixture 22 of the carrier 20 receives the electronic component 43 to be preliminarily disposed at an inclined position, the leveling operation of the electronic component 43 can be performed. The 30 series starts the motor 31, and the rotating shaft 312 of the motor 31 drives the weight block 313 to continuously rotate, so that the eccentric rotation of the weight block 313 is used to make the motor 31 in an unbalanced state and generate continuous and rapid vibration. The body 311 and the connecting member 34 transmit vibration to the mounting member 32, so that the motor 31 can use the mounting member 32 to perform elastic deflection shaking to generate greater vibration force. The first end of the mounting member 32 is The vibration force is transmitted to the first plate body 351 of the first vibration transmitting device 35 through the base body 33, and then the second plate body 352 of the first vibration transmitting device 35 transmits the vibration force to the frame body 21 of the carrier 20, so that The frame body 21 of the carrier 20 vibrates, the frame body 21 transmits the vibration to the jig 22, and the jig 22 vibrates synchronously. However, when the first vibration transmitting device 35 transmits the vibration, the third vibration transmitting device 37 is connected to the motor 31. The body 311, so that the body 311 of the motor 31 can synchronously drive the third vibration transmitting device 37 to oscillate, and the third vibration transmitting Interposer 37 may be utilized to drive the second vibration transmission member 38 having a vibration 36, the The second vibration transmitting device 36 drives the fixture 22 of the carrier 20 to vibrate, and the vibration transmitting structure can use the first vibration transmitting device 35 and the second and third vibration transmitting devices 36 and 37 to drive the frame 21 of the carrier 20 And the jig 22 vibrates, so that the electronic component 43 placed obliquely on the jig 22 does slide into the accommodating groove 221 to be placed flat, and then the leveling operation is quickly completed.

請參閱第3、4、11圖,係本發明電子元件整平機構30應用於作業分類設備,該作業分類設備包含機台41、承載器20、本發明整平機構30、供料裝置50、收料裝置60、作業裝置70、輸送裝置80及中央控制裝置(圖未示出),該供料裝置50係配置於機台41上,並設有至少一承載待作業電子元件之供料承載器51;該收料裝置60係配置於機台41上,並設有至少一承載已作業電子元件之收料承載器61,至少一承載器20係承置電子元件,該承載器20可為供料承載器51、收料承載器61、載台或預溫器等,於本實施例中,該承載器20係為預溫器,並裝配於機台41上,用以承置及預溫電子元件;本發明之整平機構30係裝配於至少一承載器上,以使承載器上之電子元件平整擺置,例如整平機構30可裝配於供料承載器51、收料承載器61、載台或預溫器,於本實施例中,該整平機構30係裝配於一為預溫器之承載器20,以振動承載器20上預溫之電子元件平整擺置;該作業裝置70係配置於機台41上,並設有至少一對電子元件執行預設作業之作業器,於本實施例中,該作業器係設有電性連接之電路板71及測試座72,用以測試電子元件;該輸送裝置80係配置於機台41上,並設有至少一移載電子元件之移料器,於本實施例中,係設有第一移料器81,以於供料裝置50之供料承載器51處取出待作業之電子元件,並移載至承載器20,於承載器20完成電子元件之整平作業及預溫作業後,第一移料器81即將承載器20上之電子元件移載至第一入料載台82及第二入料載台83,第一入料載台82及第二入料載台83將待作業電子元件載送至作業 裝置70處,該輸送裝置80再以第二移料器84及第三移料器85將第一入料載台82及第二入料載台83上之待作業電子元件移入測試座72而執行測試作業,以及將測試座72之已作業電子元件移載至第一出料載台86及第二出料載台87,第一出料載台86及第二出料載台87載出已作業之電子元件,供第四移料器88取出已作業電子元件,並依測試結果,而移載至收料裝置60之收料承載器61上而分類收置,該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。 Please refer to FIGS. 3, 4, and 11 for the electronic component leveling mechanism 30 of the present invention applied to job classification equipment, which includes a machine 41, a carrier 20, the leveling mechanism 30 of the present invention, a feeding device 50, Receiving device 60, operating device 70, conveying device 80 and central control device (not shown). The feeding device 50 is arranged on the machine 41 and is provided with at least one feeding bearing for electronic components to be operated. 51; The receiving device 60 is arranged on the machine 41, and is provided with at least one receiving carrier 61 for carrying the operated electronic components, and at least one carrier 20 is for receiving the electronic components. The carrier 20 may be The feeding carrier 51, the receiving carrier 61, the carrier or the pre-heater, etc. In this embodiment, the carrier 20 is a pre-heater and is assembled on the machine 41 for receiving and pre-heating. Warm electronic components; the leveling mechanism 30 of the present invention is assembled on at least one carrier, so that the electronic components on the carrier are placed horizontally, for example, the leveling mechanism 30 can be assembled on the feeding carrier 51 and the receiving carrier 61. A stage or pre-heater. In this embodiment, the leveling mechanism 30 is assembled in a The carrier 20 of the pre-heater is arranged with the pre-heated electronic components on the vibration carrier 20 flatly; the working device 70 is arranged on the machine 41 and is provided with at least one pair of electronic components to perform preset operations In this embodiment, the working device is provided with an electrically connected circuit board 71 and a test base 72 for testing electronic components; the conveying device 80 is arranged on the machine 41 and is provided with at least one transfer In this embodiment, the electronic component transfer device is provided with a first material transfer device 81 for taking out electronic components to be operated at the supply support 51 of the supply device 50 and transferring the electronic components to the support 20 After the carrier 20 completes the leveling operation and the pre-warming operation of the electronic components, the first transferer 81 transfers the electronic components on the carrier 20 to the first loading stage 82 and the second loading stage 83. , The first feeding stage 82 and the second feeding stage 83 carry the electronic components to be operated to the operation At the device 70, the conveying device 80 uses the second feeder 84 and the third feeder 85 to move the electronic components to be operated on the first feeding stage 82 and the second feeding stage 83 into the test base 72, and Perform test operations, and transfer the operated electronic components of the test base 72 to the first discharge stage 86 and the second discharge stage 87, and the first discharge stage 86 and the second discharge stage 87 are carried out. The operated electronic components are used for the fourth transfer device 88 to take out the operated electronic components and transfer them to the receiving carrier 61 of the receiving device 60 according to the test results. The central control device is used. To control and integrate the operation of various devices to perform automated operations to achieve practical benefits of improving operation efficiency.

Claims (9)

一種電子元件承載器之整平機構,包含:承載器;係承置至少一電子元件;整平機構:係設有主振式驅動源,並以至少一可偏擺作動之架置件架置該主振式驅動源,傳振結構係設有至少一裝配於該承載器之第一傳振具,該第一傳振具係承置該架置件,又該傳振結構係於該承載器設有至少一第二傳振具,並於該主振式驅動源與該第二傳振具之間設有至少一第三傳振具,該第三傳振具係振動該第二傳振具。A leveling mechanism of an electronic component carrier includes: a carrier; at least one electronic component is mounted; a leveling mechanism: a main vibration drive source is set and is mounted by at least one swayable mounting member In the main vibration type driving source, the vibration transmission structure is provided with at least a first vibration transmission device mounted on the carrier. The first vibration transmission device supports the mounting member, and the vibration transmission structure is connected to the bearing. The device is provided with at least a second vibration transmitting device, and at least a third vibration transmitting device is provided between the main vibration driving source and the second vibration transmitting device, and the third vibration transmitting device vibrates the second transmission device. Vibration. 依申請專利範圍第1項所述之電子元件承載器之整平機構,其中,該傳振結構之第三傳振具係為主振式驅動源之本體或該架置件之端部,亦或為一獨立元件而裝配於該主振式驅動源或該架置件。The leveling mechanism of the electronic component carrier according to item 1 of the scope of the patent application, wherein the third vibration transmitting device of the vibration transmitting structure is the body of the main vibration driving source or the end of the mounting member, Or it is assembled to the main vibration drive source or the mounting member as an independent component. 依申請專利範圍第2項所述之電子元件承載器之整平機構,其中,該第三傳振具與該第二傳振具之間係設有至少一中介件。According to the leveling mechanism of the electronic component carrier according to item 2 of the scope of the patent application, at least one intermediary member is arranged between the third vibration transmitting device and the second vibration transmitting device. 依申請專利範圍第1至3項所述之電子元件承載器之整平機構,其中,該承載器係設有至少一盛裝電子元件之承置部件,或承載至少一具該承置部件之承具。The leveling mechanism of an electronic component carrier according to items 1 to 3 of the scope of the patent application, wherein the carrier is provided with at least one mounting component for holding electronic components, or at least one mounting component for the mounting component With. 依申請專利範圍第1至3項所述之電子元件承載器之整平機構,其中,該主振式驅動源可為旋轉驅動源、線性驅動源或壓電元件。According to the leveling mechanism of the electronic component carrier according to items 1 to 3 of the scope of the patent application, the main vibration driving source may be a rotary driving source, a linear driving source, or a piezoelectric element. 依申請專利範圍第1至3項所述之電子元件承載器之整平機構,其中,該整平機構之架置件的第一端係設置於一座體,而第二端則架置該主振式驅動源。The leveling mechanism of the electronic component carrier according to items 1 to 3 of the scope of the patent application, wherein the first end of the mounting member of the leveling mechanism is set on a body, and the second end of the mounting member is set on the main body. Vibration drive source. 依申請專利範圍第6項所述之電子元件承載器之整平機構,其中,該架置件第二端與該主振式驅動源之間係設有至少一連結部件。According to the leveling mechanism of the electronic component carrier according to item 6 of the scope of the patent application, wherein at least one connecting member is provided between the second end of the mounting member and the main vibration driving source. 依申請專利範圍第1至3項所述之電子元件承載器之整平機構,其中,該整平機構之傳振結構係於該第一傳振具上且相對應該架置件之位置設有至少一限位件。The leveling mechanism of the electronic component carrier according to items 1 to 3 of the scope of the patent application, wherein the vibration transmitting structure of the leveling mechanism is provided on the first vibration transmitting device and is provided at a position corresponding to the mounting member. At least one stop. 一種應用電子元件承載器之整平機構的作業分類設備,包含:機台;供料裝置:係配置於該機台上,並設有至少一承載待作業電子元件之供料承載器;收料裝置:係配置於該機台上,並設有至少一承載已作業電子元件之收料承載器;作業裝置:係配置於該機台上,並設有至少一對電子元件執行預設作業之作業器;輸送裝置:係配置於該機台上,並設有至少一移載電子元件之移料器;至少一依申請專利範圍第1項所述之電子元件承載器之整平機構;中央控制裝置:係用以控制及整合各裝置作動,以執行自動化作業。An operation classification device using a leveling mechanism of an electronic component carrier, comprising: a machine; a feeding device: arranged on the machine and provided with at least one feeding carrier for carrying electronic components to be operated; and receiving material Device: It is arranged on the machine and is provided with at least one receiving carrier for operating electronic components. Operating device: It is arranged on the machine and is provided with at least one pair of electronic components to perform preset operations. Operating device; Conveying device: It is arranged on the machine and is provided with at least one transfer device for transferring electronic components; at least one leveling mechanism of electronic component carrier according to item 1 of the scope of patent application; central Control device: It is used to control and integrate the actions of various devices to perform automatic operations.
TW107102980A 2018-01-26 2018-01-26 Leveling mechanism of electronic component carrier and operation classification equipment for application thereof TWI657985B (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW503927U (en) * 2000-01-07 2002-09-21 Shan Chang Double-layer type oscillation conveyor
TWI309145B (en) * 2006-07-06 2009-04-21 Eastern Standard Technology Corp

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW503927U (en) * 2000-01-07 2002-09-21 Shan Chang Double-layer type oscillation conveyor
TWI309145B (en) * 2006-07-06 2009-04-21 Eastern Standard Technology Corp

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