TW201932382A - Leveling mechanism of electronic component carrier and operation classification device thereof capable of effectively reducing the operation time of leveling electronic components and improving production efficiency - Google Patents
Leveling mechanism of electronic component carrier and operation classification device thereof capable of effectively reducing the operation time of leveling electronic components and improving production efficiency Download PDFInfo
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Abstract
Description
本發明係提供一種可快速整平承載器上之電子元件,而有效縮短整平作業時間及提高生產效能之整平機構。 The invention provides a leveling mechanism capable of quickly leveling electronic components on a carrier, effectively shortening the working time of the leveling and improving the production efficiency.
在現今,電子元件作業設備係設有至少一承載器,該承載器可為收料器、載台或預溫器等,而可直接承載電子元件,或間接承載一具電子元件之料盤;以收料器為例,請參閱第1、2圖,該收料器係於機架11之側面設有輸送皮帶輪組12,該輸送皮帶輪組12之皮帶121的第一端區域係為收料區,而第二端區域則為收盤區,該輸送皮帶輪組12係以收料區之皮帶121承載一具有複數個凹槽131之收料盤13,該收料盤13之凹槽131可供一移料器(圖未示出)移入已作業之電子元件14,於收料盤13盛滿已作業之電子元件14後,輸送皮帶輪組12之皮帶121即將一具有已作業電子元件14之收料盤13載送至收盤區,一位於收盤區之托盤架15,係作Z方向位移將皮帶121上之該具已作業電子元件14的收料盤13托移至承盤器16上堆疊收置;惟,該移料器將已作業電子元件14移入收料盤13之凹槽131時,易因移載誤差,而將已作業電子元件14偏斜擺置於收料盤13之凹槽131,令已作業電子元件14之一端跨置於凹槽131之槽口,一旦下一收料盤堆疊置放於該收料盤13上時,即發生下一收料盤壓損該收料盤13上偏斜擺置之已作業電子元件14,不僅影響電子元件品質,亦將影響後續製程;因此,如何使電子元件平整擺置於承載器,著實相當重要。 At present, the electronic component working device is provided with at least one carrier, which can be a receiver, a stage or a preheater, etc., and can directly carry electronic components or indirectly carry a tray of electronic components; Taking the receiver as an example, referring to Figures 1 and 2, the receiver is provided with a conveyor pulley set 12 on the side of the frame 11, and the first end region of the belt 121 of the conveyor pulley group 12 is received. The second end region is a closing area, and the conveying pulley set 12 carries a receiving tray 13 having a plurality of grooves 131, and a groove 131 of the receiving tray 13 is provided by the belt 121 of the receiving area. A shifter (not shown) is moved into the electronic component 14 that has been operated. After the receiving tray 13 is filled with the electronic components 14 that have been operated, the belt 121 of the transport pulley set 12 is about to have a working electronic component 14 The tray 13 is carried to the closing area, and the tray frame 15 located in the closing area is displaced in the Z direction to transfer the receiving tray 13 of the working electronic component 14 on the belt 121 to the tray 16 for stacking. However, when the feeder moves the operated electronic component 14 into the recess 131 of the receiving tray 13, it is easy The transfer error is applied, and the operated electronic component 14 is obliquely placed in the recess 131 of the receiving tray 13, so that one end of the operated electronic component 14 is placed across the slot of the recess 131, once the next receiving tray is stacked When placed on the receiving tray 13, the next receiving tray pressure is damaged, and the working electronic component 14 is deflected on the receiving tray 13, which not only affects the quality of the electronic component, but also affects the subsequent process; How to make the electronic components flat on the carrier is really important.
本發明之目的一,係提供一種電子元件承載器之整平機構,其承載器係承置至少一電子元件,該整平機構係設有主振式驅動源,並以至少一具彈性之架置件架置主振式驅動源,以使主振式驅動源可偏擺作動,傳振結構係設有至少一裝配於承載器之第一傳振具,該第一傳振具係承置該架置件,於主振式驅動源振動時,利用架置件使主振式驅動源作彈性偏擺晃動而產生更大之振動力,並以第一傳振具將振動力傳導至承載器,使承載器快速振動而整平電子元件,達到有效縮短整平電子元件作業時間及提高生產效能之實用效益。 A first object of the present invention is to provide a leveling mechanism for an electronic component carrier, the carrier of which is to receive at least one electronic component, the leveling mechanism is provided with a main vibration type driving source, and at least one elastic frame The main vibration type driving source is arranged to enable the main vibration type driving source to be yawed, and the vibration transmission structure is provided with at least one first transmission device mounted on the carrier, and the first vibration transmission system is mounted When the main vibration type driving source vibrates, the mounting member causes the main vibrating driving source to elastically yaw to generate a larger vibration force, and transmits the vibration force to the bearing by the first transmitting device. The utility model enables the carrier to vibrate rapidly and level the electronic components, thereby achieving the practical benefit of effectively shortening the working time of the leveling electronic components and improving the production efficiency.
本發明之目的二,係提供一種電子元件承載器之整平機構,其中,該整平機構之傳振結構係於承載器設有至少一第二傳振具,並於主振式驅動源與第二傳振具之間設有至少一第三傳振具,於主振式驅動源振動時,利用第三傳振具振動第二傳振具,使第二傳振具將振動力傳導至承載器,進而增加振動承載器之效能,達到更加迅速整平電子元件之實用效益。 A second object of the present invention is to provide a leveling mechanism for an electronic component carrier, wherein the vibration absorbing structure of the leveling mechanism is provided with at least one second vibration absorbing device on the carrier, and is driven by the main vibration type At least one third vibration absorbing device is disposed between the second vibration absorbing members, and when the main vibration type driving source vibrates, the second vibration absorbing member is vibrated by the third vibration absorbing device, so that the second vibration absorbing device transmits the vibration force to The carrier, in turn, increases the efficiency of the vibration carrier, achieving the practical benefits of more rapid leveling of the electronic components.
本發明之目的三,係提供一種應用電子元件承載器之整平機構的作業分類設備,其包含機台、供料裝置、收料裝置、作業裝置、輸送裝置、至少一本發明之整平機構及中央控制裝置,該供料裝置係配置於機台上,並設有至少一承載待作業電子元件之供料承載器,該收料裝置係配置於機台上,並設有至少一承載已作業電子元件之收料承載器,該作業裝置係配置於機台上,並設有至少一對電子元件執行預設作業之作業器,該輸送裝置係配置於機台上,並設有至少一移載電子元件之移料器,至少一本發明之整平機構係裝配於至少一承載器上,用以整平電子元件,該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。 A third object of the present invention is to provide an operation classification device for applying a leveling mechanism of an electronic component carrier, comprising a machine table, a feeding device, a receiving device, a working device, a conveying device, and at least one leveling mechanism of the present invention. And a central control device, the feeding device is disposed on the machine table, and is provided with at least one feeding carrier for carrying the electronic components to be operated, the receiving device is disposed on the machine table, and is provided with at least one bearing a receiving carrier for the working electronic component, the working device is disposed on the machine table, and is provided with at least one pair of electronic components to perform a preset operation, the conveying device is disposed on the machine table, and is provided with at least one A shifter for transferring electronic components, at least one leveling mechanism of the present invention is mounted on at least one carrier for leveling electronic components, and the central control device is for controlling and integrating the operations of the devices to perform automation Work, to achieve practical benefits of improving operational efficiency.
〔習知〕 [study]
11‧‧‧機架 11‧‧‧Rack
12‧‧‧輸送皮帶輪組 12‧‧‧Conveyor pulley set
121‧‧‧皮帶 121‧‧‧Belt
13‧‧‧收料盤 13‧‧‧ receiving tray
131‧‧‧凹槽 131‧‧‧ Groove
14‧‧‧電子元件 14‧‧‧Electronic components
15‧‧‧托盤架 15‧‧‧Tray rack
16‧‧‧承盤器 16‧‧‧Driver
〔本發明〕 〔this invention〕
20‧‧‧承載器 20‧‧‧Carrier
21‧‧‧架體 21‧‧‧ ‧ body
22‧‧‧治具 22‧‧‧ fixture
221‧‧‧容置槽 221‧‧‧ accommodating slots
30‧‧‧整平機構 30‧‧‧ leveling agency
31‧‧‧馬達 31‧‧‧Motor
311‧‧‧本體 311‧‧‧ Ontology
312‧‧‧轉軸 312‧‧‧ shaft
313‧‧‧配重塊 313‧‧‧weights
32‧‧‧架置件 32‧‧‧Equipment
33‧‧‧座體 33‧‧‧ body
34‧‧‧連結部件 34‧‧‧Connected parts
35‧‧‧第一傳振具 35‧‧‧First transmission
351‧‧‧第一板體 351‧‧‧ first board
352‧‧‧第二板體 352‧‧‧Second plate
353‧‧‧限位件 353‧‧‧Limited parts
36‧‧‧第二傳動具 36‧‧‧Second gear
361‧‧‧穿孔 361‧‧‧Perforation
37‧‧‧第三傳振具 37‧‧‧The third transmission
371‧‧‧凸塊 371‧‧‧Bumps
372‧‧‧通孔 372‧‧‧through hole
373‧‧‧定位件 373‧‧‧ Positioning parts
38‧‧‧中介件 38‧‧‧Intermediary
41‧‧‧機台 41‧‧‧ machine
42‧‧‧移料器 42‧‧‧Transfer
43‧‧‧電子元件 43‧‧‧Electronic components
50‧‧‧供料裝置 50‧‧‧Feeding device
51‧‧‧供料承載器 51‧‧‧Feeding carrier
60‧‧‧收料裝置 60‧‧‧ receiving device
61‧‧‧收料承載器 61‧‧‧ Receiving carrier
70‧‧‧作業裝置 70‧‧‧Working device
71‧‧‧電路板 71‧‧‧Circuit board
72‧‧‧測試座 72‧‧‧ test seat
80‧‧‧輸送裝置 80‧‧‧Conveyor
81‧‧‧第一移料器 81‧‧‧First mover
82‧‧‧第一入料載台 82‧‧‧First feeding platform
83‧‧‧第二入料載台 83‧‧‧Second feed stage
84‧‧‧第二移料器 84‧‧‧Second shifter
85‧‧‧第三移料器 85‧‧‧ third shifter
86‧‧‧第一出料載台 86‧‧‧First discharge stage
87‧‧‧第二出料載台 87‧‧‧Second discharge platform
88‧‧‧第四移料器 88‧‧‧fourth shifter
第1圖:習知電子元件收料器之示意圖。 Figure 1: Schematic diagram of a conventional electronic component receiver.
第2圖:習知電子元件收料器之使用示意圖。 Figure 2: Schematic diagram of the use of the conventional electronic component receiver.
第3圖:本發明承載器及整平機構第一實施例之配置圖。 Figure 3 is a layout view of a first embodiment of the carrier and leveling mechanism of the present invention.
第4圖:本發明整平機構第一實施例之示意圖。 Figure 4 is a schematic view showing a first embodiment of the leveling mechanism of the present invention.
第5圖:本發明整平機構第一實施例之使用示意圖(一)。 Fig. 5 is a schematic view showing the use of the first embodiment of the leveling mechanism of the present invention (I).
第6圖:本發明整平機構第一實施例之使用示意圖(二)。 Figure 6 is a schematic view showing the use of the first embodiment of the leveling mechanism of the present invention (2).
第7圖:本發明承載器及整平機構第二實施例之配置圖。 Figure 7 is a layout view of a second embodiment of the carrier and leveling mechanism of the present invention.
第8圖:本發明整平機構第二實施例之示意圖。 Figure 8 is a schematic view showing a second embodiment of the leveling mechanism of the present invention.
第9圖:本發明整平機構第二實施例之使用示意圖(一)。 Figure 9 is a schematic view showing the use of the second embodiment of the leveling mechanism of the present invention (I).
第10圖:本發明整平機構第二實施例之使用示意圖(二)。 Fig. 10 is a schematic view showing the use of the second embodiment of the leveling mechanism of the present invention (2).
第11圖:本發明整平機構應用於作業分類設備之示意圖。 Figure 11: Schematic diagram of the leveling mechanism of the present invention applied to the operation classification equipment.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:請參閱第3、4圖,係為電子元件承載器20及整平機構30之第一實施例,該承載器20係承置至少一電子元件,該承載器可為置料承載器、載台或預溫器等,而固定於機台或於機台上作至少一方向位移,例如置料承載器及預溫器係固設於機台,而承置電子元件,例如載台則承置電子元件於機台上作至少一方向位移,更進一步,該承載器20可於本身設有至少一盛裝電子元件之承置部件,或承置至少一具承置部件之承具,例如一為置料承載器或預溫器之承載器20,可承置一具有複數個承置部件(例如容置槽)之承具(例如料盤或治具),於本實施例中,該承載器20係為預溫器,並於機台41上設置有架體21,該架體21上裝配一具有複數個容置槽221之治具22,並以容置槽221承置待預溫之電子元件;該整平機構30係裝配於該承載器20,並設有至少一主振式驅動源,更進一步,該主振式驅動源可為旋轉驅動源、線性驅動源或壓電元件,例如該旋轉驅動源可為具轉軸及配重塊之馬達,馬達可利用具配重塊之轉軸 作連續旋轉而產生振動,又例如主振式驅動源可為壓電元件,利用壓電元件於通電時而使自身作長度伸縮變化而產生振動,於本實施例中,該主振式驅動源係為馬達31,該馬達31之本體311第一端係凸伸出有轉軸312,並於轉軸312上偏心裝配有至少一配重塊313,以使配重塊313可作偏心旋轉;又該整平機構30係設有至少一具彈性之架置件32,以架置主振式驅動源,並使主振式驅動源可偏擺作動,該架置件32可為彈片或彈簧等,於本實施例中,係設有複數個為彈片之架置件32,各架置件32之第一端係設置於一座體33,而第二端則架置馬達31,更進一步,該架置件32與座體33可為一體成型,例如於座體33之周側一體成型有呈Z方向配置之架置件32,又或該架置件32與座體33可為各別獨立元件,例如於座體33之周側鎖固有呈Z方向配置之架置件32,以利更換修護架置件32,又該架置件32之第二端可直接連結架置馬達31,或於架置件32之第二端與馬達31間設有至少一連結部件,以令架置件32經由該連結部件而架置馬達31,於本實施例中,二架置件32之第一端係分別鎖固於座體33之兩側,而第二端則以二連結部件34裝配架置馬達31之本體311,使馬達31之本體311可偏擺作動,另該整平機構30係設有具至少一第一傳振具35之傳振結構,其第一傳振具35係裝配於承載器20,並承置該架置件32,以於主振式驅動源振動時,利用架置件32及第一傳振具35將振動力傳導至承載器20,使承載器20快速振動而整平電子元件,更進一步,該第一傳振具35可一體成型向上衝製彎折出具彈性之架置件32,亦或該第一傳振具35可一體成型出座體33,以供裝配具彈性之架置件32,於本實施例中,該傳振結構係設有一概呈L型之第一傳振具35,並以第一傳振具35之第一板體351承置鎖固該座體33,以使架置件32裝配於第一傳振具35,第一傳振具35之第二板體352則裝配於承載器20之架體21,而將振動力傳 導至承載器20,另該傳振結構係於第一傳振具35上且相對應架置件32之位置設有至少一限位件353,以限位架置件32之擺幅,更進一步,該限位件353係具有可壓縮性,以對架置件32形成一緩衝作用,例如該限位件353可為橡膠墊或氣墊等,於本實施例中,係於第一傳振具35之第二板體352上且相對應二架置件32之第二端位置設有二為橡膠墊製成之限位件353,用以限位及緩衝該架置件32。 In order to make the present invention further understand the present invention, a preferred embodiment and a drawing will be described in detail as follows: Please refer to Figures 3 and 4 for the electronic component carrier 20 and the leveling mechanism 30. In the first embodiment, the carrier 20 is configured to receive at least one electronic component, and the carrier may be a loading carrier, a carrier or a preheater, etc., and is fixed to the machine or at least one direction on the machine. The displacement, for example, the loading carrier and the preheater are fixed on the machine table, and the mounting electronic components, such as the loading platform, the electronic components are mounted on the machine table for at least one direction displacement. Further, the carrier 20 can be Having at least one receiving member for holding electronic components or a bearing for at least one bearing member, such as a carrier 20 for a stock carrier or a preheater, can have a plurality of In the present embodiment, the carrier 20 is a preheater, and the frame 41 is disposed on the machine 41, which is provided with a frame 21, which is provided with a frame 21, for example, a tray or a jig. A fixture 22 having a plurality of accommodating slots 221 is mounted on the frame 21, and is received by the accommodating slot 221 for preheating. The leveling mechanism 30 is mounted on the carrier 20 and is provided with at least one main vibrating driving source. Further, the main vibrating driving source may be a rotating driving source, a linear driving source or a piezoelectric element. For example, the rotary driving source can be a motor with a rotating shaft and a weight, and the motor can use a rotating shaft with a weight. For example, the main vibration type driving source may be a piezoelectric element, and the piezoelectric element may be subjected to length expansion and contraction to generate vibration when the piezoelectric element is energized. In this embodiment, the main vibration type driving source is used. The main body 311 of the motor 31 has a rotating shaft 312 protruding from the first end thereof, and at least one weight 313 is eccentrically mounted on the rotating shaft 312 so that the weight 313 can be eccentrically rotated; The leveling mechanism 30 is provided with at least one elastic mounting member 32 for arranging the main vibrating driving source, and the main vibrating driving source can be yawed, and the mounting member 32 can be a spring piece or a spring. In this embodiment, a plurality of mounting members 32 are provided, and the first ends of the mounting members 32 are disposed on the body 33, and the second end is mounted on the motor 31. Further, the frame is mounted. The mounting member 32 and the base body 33 may be integrally formed. For example, the mounting member 32 disposed in the Z direction may be integrally formed on the circumferential side of the seat body 33, or the mounting member 32 and the seat body 33 may be separate components. For example, the bracket 32 disposed in the Z direction is locked on the peripheral side of the seat body 33 to facilitate replacement of the repair bracket 32, and The second end of the mounting member 32 can directly connect the mounting motor 31, or at least one connecting member is disposed between the second end of the mounting member 32 and the motor 31, so that the mounting member 32 is mounted via the connecting member. In the present embodiment, the first ends of the two mounting members 32 are respectively fixed to the two sides of the seat body 33, and the second end is assembled with the body 311 of the mounting motor 31 by the two connecting members 34. The body 311 of the motor 31 can be biased, and the leveling mechanism 30 is provided with a vibration transmitting structure having at least one first vibration absorbing member 35. The first vibration absorbing member 35 is mounted on the carrier 20 and is mounted. The mounting member 32 transmits the vibration force to the carrier 20 by the mounting member 32 and the first transmitting member 35 when the main vibrating driving source vibrates, so that the carrier 20 vibrates rapidly to level the electronic components. Further, the first vibrating tool 35 can be integrally formed to be bent upward to bend the elastic mounting member 32, or the first transmitting member 35 can be integrally formed with the seat body 33 for elastic mounting. In the embodiment, the vibration-transmitting structure is provided with a first L-shaped first transmission 35, and the first plate 35 of the first transmission 35 1 mounting the locking body 33 so that the mounting member 32 is assembled to the first transmitting member 35, and the second plate 352 of the first transmitting member 35 is mounted on the frame 21 of the carrier 20, and Vibration force transmission Leading to the carrier 20, the vibration transmitting structure is disposed on the first transmitting member 35 and corresponding to the position of the mounting member 32 is provided with at least one limiting member 353 to limit the swing of the mounting member 32, and Further, the limiting member 353 is compressible to form a buffering effect on the mounting member 32. For example, the limiting member 353 can be a rubber pad or an air cushion. In this embodiment, the first vibration is transmitted. A second end portion of the second plate body 352 having the second mounting member 32 is provided with a limiting member 353 made of a rubber pad for limiting and buffering the mounting member 32.
請參閱第5圖,於使用時,一輸送裝置之移料器42係將待預溫之電子元件43移入承載器20之治具22的容置槽221,若移料器42因位移誤差而將一待預溫之電子元件43偏斜移入於治具22的容置槽221時,為避免影響下一作業,於承載器20之治具22盛裝一批次複數個待預溫之電子元件43後,即以整平機構30執行電子元件43之整平作業。 Referring to FIG. 5, in use, the feeder 42 of the transport device moves the electronic component 43 to be pre-warmed into the receiving slot 221 of the fixture 22 of the carrier 20, if the shifter 42 is displaced due to a displacement error. When the electronic component 43 to be pre-warmed is obliquely moved into the accommodating groove 221 of the jig 22, in order to avoid affecting the next operation, the jig 22 of the carrier 20 holds a plurality of electronic components to be pre-warmed. After 43, the leveling operation of the electronic component 43 is performed by the leveling mechanism 30.
請參閱第6圖,於執行電子元件43之整平作業時,該整平機構30係啟動馬達31,馬達31之轉軸312即帶動配重塊313作連續性快速旋轉,由於配重塊313之重心非在轉軸312之軸心,而可利用配重塊313之偏心轉動,使得馬達31處於不斷的失去平衡狀態而產生連續性快速振動,並以本體311將振動傳導至連結部件34,由於連結部件34係裝配於架置件32之第二端,該第二端為一自由端,使得馬達31可利用架置件32而作彈性偏擺晃動,以產生更大之振動力,該架置件32之第一端則將振動力經由座體33傳導至第一傳振具35之第一板體351,由於第一傳振具35之第二板體352係鎖固於承載器20之架體21,使得第一傳振具35可將振動力經由第二板體352而傳導至承載器20之架體21,令承載器20之架體21產生振動,並將振動傳導至治具22,治具22即可同步振動,使得治具22上偏斜擺置之電子元件43滑入於容置槽221而平整擺置,進而迅速完成電子元件整平作業。 Referring to FIG. 6, when the leveling operation of the electronic component 43 is performed, the leveling mechanism 30 activates the motor 31, and the rotating shaft 312 of the motor 31 drives the weight 313 for rapid and continuous rotation, due to the weight 313. The center of gravity is not at the axis of the rotating shaft 312, but the eccentric rotation of the weight 313 can be utilized, so that the motor 31 is continuously lost in equilibrium to generate continuous rapid vibration, and the vibration is transmitted to the connecting member 34 by the body 311 due to the connection. The component 34 is mounted on the second end of the mounting member 32. The second end is a free end, so that the motor 31 can be elastically yawed by the mounting member 32 to generate a greater vibration force. The first end of the member 32 transmits the vibration force to the first plate body 351 of the first transmission device 35 via the base body 33, and the second plate body 352 of the first transmission device 35 is locked to the carrier 20 The frame body 21 is such that the first vibration absorbing member 35 can transmit the vibration force to the frame body 21 of the carrier 20 via the second plate body 352, so that the frame body 21 of the carrier 20 vibrates and transmits the vibration to the fixture. 22, the fixture 22 can synchronously vibrate, so that the electronic component 43 on the fixture 22 is tilted In the receiving slot 221 arrangements and smooth, rapid completion of the electronic component and thus leveling job.
請參閱第7、8圖,係為承載器20及整平機構3 0之第二實施例,該承載器20係承置至少一電子元件,於本實施例中,該承載器20係為預溫器,並於機台41上設置有架體21,架體21上裝配一具有複數個容置槽221之治具22,並以容置槽221承置待預溫之電子元件;該整平機構30係裝配於該承載器20,並設有至少一主振式驅動源,於本實施例中,主振式驅動源係為馬達31,該馬達31之本體311第一端係凸伸出有轉軸312,並於轉軸312上偏心裝配有至少一配重塊313,該整平機構30係設有至少一具彈性之架置件32,以架置主振式驅動源,並使主振式驅動源可偏擺作動,於本實施例中,係設有二為彈片之架置件32,二架置件32之第一端係分別鎖固於座體33之兩側,而第二端則以複數個連結部件34裝配架置馬達31之本體311,使馬達31之本體311可偏擺作動,該整平機構30之傳振結構係於承載器20裝配有第一傳振具35,第一傳振具35之第一板體351承置鎖固該座體33,以使架置件32裝配於第一傳振具35,第一傳振具35之第二板體352則裝配於承載器20之架體21,而可將振動力傳導至承載器20,另該傳振結構係於第一傳振具35上且相對應架置件32之位置設有至少一限位件353,以限位架置件32之擺幅,其中,該整平機構30之第二實施例與第一實施例之差異在於該傳振結構係於承載器20設有至少一第二傳振具,更進一步,該第二傳振具可裝配於承載器20之架體21或承具上,於本實施例中,係以治具22側面之手把作為第二傳動具36,該傳振結構並於主振式驅動源與第二傳振具36間設有至少一可作偏擺晃動之第三傳振具37,並以第三傳振具37振動第二傳振具36,更進一步,該第三傳振具37可為主振式驅動源之本體311或架置件32之第二端,亦可為一裝配於主振式驅動源或架置件32上之獨立元件,於本實施例中,第三傳振具37係為一獨立元件,並連結馬達31之本體311,然於製作時,該第三傳振具37與連結部件34可製成一體,又該第三傳振具 37係以敲擊或連動之方式而使第二傳振具36振動,例如該第三傳振具37隨同馬達31之本體311作偏擺晃動時,利用一側面敲擊第二傳振具36,使第二傳振具36振動,又例如於第三傳振具37與第二傳振具36之間設有至少一中介件38,該中介件38可為插銷,而裝配於第三傳振具37或第二傳振具36,以使第三傳振具37利用中介件38振動第二傳振具36,於本實施例中,係於第三傳振具37之一側面設有具通孔372之凸塊371,該通孔372可供穿置一呈Z方向配置且為插銷之中介件38,另於第二傳振具36相對應中介件38之位置開設有穿孔361,以供穿置中介件38,於中介件38穿置第三傳振具37之通孔372及第二傳振具36之穿孔361後,即於第三傳振具37之凸塊371側面鎖設一可定位中介件38之定位件373,使第三傳振具37利用中介件38振動第二傳振具36。 Please refer to Figures 7 and 8, for the carrier 20 and the leveling mechanism 3 In the second embodiment of the present invention, the carrier 20 is provided with at least one electronic component. In the embodiment, the carrier 20 is a preheater, and the frame 41 is disposed on the machine 41, and the frame 21 is provided. A fixture 22 having a plurality of accommodating slots 221 is mounted thereon, and the electronic components to be pre-warmed are received by the accommodating slots 221; the leveling mechanism 30 is mounted on the carrier 20 and is provided with at least one main vibration In the present embodiment, the main oscillating drive source is a motor 31. The first end of the body 311 of the motor 31 protrudes from the rotating shaft 312, and the rotating shaft 312 is eccentrically assembled with at least one weight. 313, the leveling mechanism 30 is provided with at least one elastic mounting member 32 for arranging the main vibrating driving source, and the main vibrating driving source can be yawed. In this embodiment, The second member is the mounting member 32 of the spring piece. The first ends of the two mounting members 32 are respectively fixed to the two sides of the seat body 33, and the second end is assembled with the body 311 of the mounting motor 31 by a plurality of connecting members 34. The body 311 of the motor 31 can be yawed, and the vibration-transmitting structure of the leveling mechanism 30 is mounted on the carrier 20 with the first vibration absorbing member 35, and the first vibration absorbing member 35 A plate body 351 is mounted to lock the base body 33 such that the mounting member 32 is mounted on the first transmission member 35, and the second plate body 352 of the first transmission member 35 is mounted on the frame body 21 of the carrier 20. The vibrating force is transmitted to the carrier 20, and the vibration transmitting structure is disposed on the first vibrating member 35 and at least one limiting member 353 is disposed at a position corresponding to the mounting member 32 to limit the mounting member. The swing of 32, wherein the second embodiment of the leveling mechanism 30 differs from the first embodiment in that the vibration transmitting structure is provided with at least one second vibration absorbing member on the carrier 20, and further, the second The vibration absorbing member can be mounted on the frame body 21 or the carrier of the carrier 20. In the embodiment, the handle of the side of the fixture 22 is used as the second transmission 36, and the vibration transmission structure is driven by the main vibration type. Between the source and the second transducer 36, at least one third oscillating tool 37 capable of yaw is provided, and the second oscillating tool 37 is vibrated by the third oscillating tool 37. Further, the third vibration is transmitted. The second end of the main body 311 or the mounting member 32 having the main vibration type driving source 37 can also be a separate component mounted on the main vibrating driving source or the mounting member 32. In this embodiment, 37 having three vibration transmission system is a separate element, and connected to the motor 31 of the main body 311, and then in the production of the third tool 37 and the vibration transmission member 34 may be formed integrally coupling, should the third vibration transmission having The 37 transmits the second vibrating device 36 by tapping or interlocking. For example, when the third vibrating device 37 is swayed with the body 311 of the motor 31, the second vibrating member 36 is struck by one side. The second vibration absorbing member 36 is vibrated. For example, at least one intermediate member 38 is disposed between the third vibration absorbing member 37 and the second vibration absorbing member 36. The intermediate member 38 can be a latch and assembled in the third transmission. The vibrator 37 or the second vibrating tool 36 is configured to cause the third vibrating tool 37 to vibrate the second vibrating tool 36 by using the interposer 38. In this embodiment, the third vibrating tool 37 is disposed on one side of the third vibrating tool 37. The through hole 372 has a through hole 372, and the through hole 372 can be disposed through the intermediate member 38 disposed in the Z direction and is a pin, and the through hole 361 is defined in the position of the second transmitting member 36 corresponding to the intermediate member 38. After the intermediate member 38 is inserted through the through hole 372 of the third transmission member 37 and the through hole 361 of the second transmission member 36, the side of the projection 371 of the third transmission member 37 is locked. A positioning member 373 for positioning the intermediate member 38 is provided to cause the third vibration absorbing member 37 to vibrate the second vibration absorbing member 36 by using the intermediate member 38.
請參閱第9、10圖,當承載器20之治具22的容置槽221承置偏斜擺置之待預溫電子元件43後,可執行電子元件43之整平作業,該整平機構30係啟動馬達31,馬達31之轉軸312即帶動配重塊313作連續性旋轉,以利用配重塊313之偏心轉動,使得馬達31處於不斷的失去平衡狀態而產生連續性快速振動,並經本體311及連結部件34將振動傳導至架置件32,使馬達31可利用架置件32而作彈性偏擺晃動,以產生更大之振動力,該架置件32之第一端係將振動力經由座體33傳導至第一傳振具35之第一板體351,再由第一傳振具35之第二板體352將振動力傳導至承載器20之架體21,而使承載器20之架體21振動,架體21並將振動傳導至治具22,治具22同步振動,然於第一傳振具35傳導振動時,由於第三傳振具37係連結馬達31之本體311,使得馬達31之本體311可同步帶動第三傳振具37作偏擺晃動,第三傳振具37可利用中介件38帶動第二傳振具36振動,該 第二傳振具36則帶動承載器20之治具22振動,進而該傳振結構可利用第一傳振具35及第二、三傳振具36、37而帶動承載器20之架體21及治具22振動,使得治具22上偏斜擺置之電子元件43確實滑入於容置槽221而平整擺置,進而迅速完成整平作業。 Referring to FIGS. 9 and 10, when the accommodating groove 221 of the fixture 22 of the carrier 20 is placed on the electronic component 43 to be pre-warmed, the leveling operation of the electronic component 43 can be performed. The 30-series starter motor 31, and the rotating shaft 312 of the motor 31 drives the counterweight 313 to rotate continuously to utilize the eccentric rotation of the weight 313, so that the motor 31 is continuously lost in equilibrium and generates continuous rapid vibration. The body 311 and the connecting member 34 transmit the vibration to the mounting member 32, so that the motor 31 can be elastically yawed by the mounting member 32 to generate a greater vibration force. The first end of the mounting member 32 will be The vibration force is transmitted to the first plate body 351 of the first transmission device 35 via the base body 33, and the vibration force is transmitted to the frame body 21 of the carrier 20 by the second plate body 352 of the first transmission device 35, thereby The frame body 21 of the carrier 20 vibrates, the frame body 21 transmits the vibration to the jig 22, and the jig 22 vibrates synchronously. However, when the first vibrating tool 35 conducts vibration, the third transmission device 37 is coupled to the motor 31. The body 311 is configured such that the body 311 of the motor 31 can synchronously drive the third vibration absorbing device 37 to yaw and oscillate, and the third vibration is transmitted. Interposer 37 may be utilized to drive the second vibration transmission member 38 having a vibration 36, the The second vibrating member 36 drives the fixture 22 of the carrier 20 to vibrate, and the vibration transmitting structure can drive the frame 21 of the carrier 20 by using the first vibrating device 35 and the second and third vibrating members 36 and 37. The fixture 22 is vibrated, so that the electronic component 43 that is tilted on the fixture 22 is slid into the accommodating groove 221 and is placed flat, thereby quickly completing the leveling operation.
請參閱第3、4、11圖,係本發明電子元件整平機構30應用於作業分類設備,該作業分類設備包含機台41、承載器20、本發明整平機構30、供料裝置50、收料裝置60、作業裝置70、輸送裝置80及中央控制裝置(圖未示出),該供料裝置50係配置於機台41上,並設有至少一承載待作業電子元件之供料承載器51;該收料裝置60係配置於機台41上,並設有至少一承載已作業電子元件之收料承載器61,至少一承載器20係承置電子元件,該承載器20可為供料承載器51、收料承載器61、載台或預溫器等,於本實施例中,該承載器20係為預溫器,並裝配於機台41上,用以承置及預溫電子元件;本發明之整平機構30係裝配於至少一承載器上,以使承載器上之電子元件平整擺置,例如整平機構30可裝配於供料承載器51、收料承載器61、載台或預溫器,於本實施例中,該整平機構30係裝配於一為預溫器之承載器20,以振動承載器20上預溫之電子元件平整擺置;該作業裝置70係配置於機台41上,並設有至少一對電子元件執行預設作業之作業器,於本實施例中,該作業器係設有電性連接之電路板71及測試座72,用以測試電子元件;該輸送裝置80係配置於機台41上,並設有至少一移載電子元件之移料器,於本實施例中,係設有第一移料器81,以於供料裝置50之供料承載器51處取出待作業之電子元件,並移載至承載器20,於承載器20完成電子元件之整平作業及預溫作業後,第一移料器81即將承載器20上之電子元件移載至第一入料載台82及第二入料載台83,第一入料載台82及第二入料載台83將待作業電子元件載送至作業 裝置70處,該輸送裝置80再以第二移料器84及第三移料器85將第一入料載台82及第二入料載台83上之待作業電子元件移入測試座72而執行測試作業,以及將測試座72之已作業電子元件移載至第一出料載台86及第二出料載台87,第一出料載台86及第二出料載台87載出已作業之電子元件,供第四移料器88取出已作業電子元件,並依測試結果,而移載至收料裝置60之收料承載器61上而分類收置,該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。 Referring to Figures 3, 4 and 11, the electronic component leveling mechanism 30 of the present invention is applied to a job sorting device, which includes a machine table 41, a carrier 20, a leveling mechanism 30 of the present invention, a feeding device 50, The receiving device 60, the working device 70, the conveying device 80 and the central control device (not shown) are disposed on the machine table 41 and provided with at least one feeding carrier for carrying the electronic components to be operated. The receiving device 60 is disposed on the machine table 41 and is provided with at least one receiving carrier 61 carrying the working electronic components, and at least one carrier 20 is for holding the electronic components, and the carrier 20 can be In the present embodiment, the carrier 20 is a preheater and is mounted on the machine table 41 for receiving and pre-preserving the feed carrier 51, the receiving carrier 61, the stage or the preheater. The temperature electronic component; the leveling mechanism 30 of the present invention is mounted on at least one carrier to flatten the electronic components on the carrier, for example, the leveling mechanism 30 can be assembled to the feeding carrier 51 and the receiving carrier 61, a stage or a preheater, in this embodiment, the leveling mechanism 30 is assembled in a The preheater carrier 20 is arranged with the electronic components pre-warmed on the vibrating carrier 20; the working device 70 is disposed on the machine 41 and is provided with at least one pair of electronic components for performing preset operations. In this embodiment, the operator device is provided with an electrically connected circuit board 71 and a test stand 72 for testing electronic components. The transport device 80 is disposed on the machine table 41 and is provided with at least one transfer load. In the present embodiment, the first component shifter 81 is provided to take out the electronic component to be operated at the feeding carrier 51 of the feeding device 50, and transfer to the carrier 20 After the carrier 20 completes the leveling operation and the pre-warming operation of the electronic component, the first shifter 81 transfers the electronic components on the carrier 20 to the first loading stage 82 and the second loading stage 83. The first loading stage 82 and the second loading stage 83 carry the electronic components to be operated to the operation. At the device 70, the transport device 80 moves the electronic components to be operated on the first loading stage 82 and the second loading stage 83 into the test socket 72 by using the second feeder 84 and the third feeder 85. Performing the test operation, and transferring the electronic components of the test stand 72 to the first discharge stage 86 and the second discharge stage 87, the first discharge stage 86 and the second discharge stage 87 are carried out. The electronic component that has been operated, for the fourth feeder 88 to take out the already-operated electronic components, and according to the test result, transfer to the receiving carrier 61 of the receiving device 60 for sorting and collecting, the central control device is used for To control and integrate the various devices to perform automated operations, to achieve practical benefits of improved operational efficiency.
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