TWI308849B - Electrostatic chuck for vacuum processing apparatus, vacuum processing apparatsu havign the same, and method for manufacturing the same - Google Patents

Electrostatic chuck for vacuum processing apparatus, vacuum processing apparatsu havign the same, and method for manufacturing the same Download PDF

Info

Publication number
TWI308849B
TWI308849B TW094147572A TW94147572A TWI308849B TW I308849 B TWI308849 B TW I308849B TW 094147572 A TW094147572 A TW 094147572A TW 94147572 A TW94147572 A TW 94147572A TW I308849 B TWI308849 B TW I308849B
Authority
TW
Taiwan
Prior art keywords
electrostatic chuck
substrate
electrostatic
vacuum processing
protrusion
Prior art date
Application number
TW094147572A
Other languages
English (en)
Chinese (zh)
Other versions
TW200721915A (en
Inventor
Hun Cha
Yong Taek Eom
Original Assignee
Ips Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ips Ltd filed Critical Ips Ltd
Publication of TW200721915A publication Critical patent/TW200721915A/zh
Application granted granted Critical
Publication of TWI308849B publication Critical patent/TWI308849B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW094147572A 2005-11-30 2005-12-30 Electrostatic chuck for vacuum processing apparatus, vacuum processing apparatsu havign the same, and method for manufacturing the same TWI308849B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050115601A KR100755874B1 (ko) 2005-11-30 2005-11-30 진공처리장치의 정전척, 그를 가지는 진공처리장치 및정전척의 제조방법

Publications (2)

Publication Number Publication Date
TW200721915A TW200721915A (en) 2007-06-01
TWI308849B true TWI308849B (en) 2009-04-11

Family

ID=38125941

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094147572A TWI308849B (en) 2005-11-30 2005-12-30 Electrostatic chuck for vacuum processing apparatus, vacuum processing apparatsu havign the same, and method for manufacturing the same

Country Status (4)

Country Link
JP (1) JP2007158286A (ja)
KR (1) KR100755874B1 (ja)
CN (1) CN100505206C (ja)
TW (1) TWI308849B (ja)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5745394B2 (ja) * 2008-03-20 2015-07-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板支持体、プラズマ反応装置、および、サセプターを形成する方法
KR101448817B1 (ko) 2008-05-02 2014-10-13 주식회사 원익아이피에스 진공처리장치
TWI475594B (zh) 2008-05-19 2015-03-01 Entegris Inc 靜電夾頭
KR101058748B1 (ko) * 2008-09-19 2011-08-24 주식회사 아토 정전척 및 그 제조방법
CN102449754B (zh) 2009-05-15 2015-10-21 恩特格林斯公司 具有聚合物突出物的静电吸盘
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
KR101134736B1 (ko) * 2010-04-26 2012-04-13 가부시키가이샤 크리에이티브 테크놀러지 스페이서를 구비하는 정전 척 및 그 제조방법
KR101731136B1 (ko) 2010-05-28 2017-04-27 엔테그리스, 아이엔씨. 표면저항이 높은 정전 척
US9329497B2 (en) 2011-02-01 2016-05-03 Asml Netherlands B.V. Substrate table, lithographic apparatus and device manufacturing method
US8349116B1 (en) 2011-11-18 2013-01-08 LuxVue Technology Corporation Micro device transfer head heater assembly and method of transferring a micro device
US8426227B1 (en) 2011-11-18 2013-04-23 LuxVue Technology Corporation Method of forming a micro light emitting diode array
US8646505B2 (en) * 2011-11-18 2014-02-11 LuxVue Technology Corporation Micro device transfer head
CN102610476B (zh) * 2012-03-12 2015-05-27 中微半导体设备(上海)有限公司 一种静电吸盘
JP5996276B2 (ja) * 2012-05-31 2016-09-21 京セラ株式会社 静電チャック、吸着方法及び吸着装置
KR20150053775A (ko) * 2012-09-07 2015-05-18 어플라이드 머티어리얼스, 인코포레이티드 얇은 기판들을 위한 포터블 정전 척 캐리어
CN103811332B (zh) * 2014-02-14 2016-05-25 北京京东方显示技术有限公司 一种干法刻蚀设备的下部电极基台和干法刻蚀设备
CN106663653B (zh) * 2014-09-30 2019-03-15 住友大阪水泥股份有限公司 静电卡盘装置
WO2017209325A1 (ko) * 2016-06-01 2017-12-07 (주)브이앤아이솔루션 정전척 및 그 제조방법
KR102457215B1 (ko) * 2020-07-30 2022-10-20 주식회사 이에스티 정전척 및 그 제조방법
CN114523433B (zh) * 2021-09-27 2023-10-24 杭州大和江东新材料科技有限公司 一种凸点式吸盘的加工方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020064507A (ko) * 2001-02-02 2002-08-09 삼성전자 주식회사 정전 척과 그의 제조방법

Also Published As

Publication number Publication date
CN100505206C (zh) 2009-06-24
KR100755874B1 (ko) 2007-09-05
TW200721915A (en) 2007-06-01
CN1975998A (zh) 2007-06-06
JP2007158286A (ja) 2007-06-21

Similar Documents

Publication Publication Date Title
TWI308849B (en) Electrostatic chuck for vacuum processing apparatus, vacuum processing apparatsu havign the same, and method for manufacturing the same
KR100994299B1 (ko) 정전척용 전극 시트 및 정전척
KR102369706B1 (ko) 정전 척 및 이의 제조 방법
JP5094863B2 (ja) 基板吸着装置及びその製造方法
TW548691B (en) Substrate supporting table, method for manufacturing the same and processing apparatus
JP6968120B2 (ja) 薄い基板をハンドリングするための静電キャリア
KR101058748B1 (ko) 정전척 및 그 제조방법
TW200949980A (en) Electrostatic chuck and manufacturing method thereof
TW200901363A (en) Substrate carrying bench and substrate treatment device
KR100976320B1 (ko) 정전척 및 정전척용 전극 시트
WO2000072376A1 (fr) Mandrin electrostatique et dispositif de traitement
JP5578762B2 (ja) 表面テクスチャリングを組み込んだプラズマリアクタ基板
JP2007051367A (ja) サセプタの粗面化による静電荷の削減
CN109891570A (zh) 静电卡盘及其制造方法
KR101066798B1 (ko) 정전척, 기판 지지대, 챔버 및 그 제조 방법
CN103149751B (zh) 一种下部电极及其制作方法
JP2019523989A (ja) 静電チャック及び静電チャックのための製造方法
KR100757694B1 (ko) 반도체 및 ｌｃｄ 제조장비의 세라믹 용사코팅을 이용한다중코팅 발열 장치
KR101588566B1 (ko) 롤-성형 표면을 갖는 서셉터 및 이를 제조하기 위한 방법
TW201943013A (zh) 在其部分上具有電極之雙極靜電夾具
TWI443770B (zh) 靜電夾盤
JP2002009138A (ja) 静電チャックの製造方法および静電チャック
KR101605704B1 (ko) 대면적 바이폴라 정전척의 제조방법 및 이에 의해 제조된 대면적 바이폴라 정전척
KR100677169B1 (ko) 평판 패널용 대면적 정전척
KR101463395B1 (ko) 정전척 및 그 제조방법