KR100755874B1 - 진공처리장치의 정전척, 그를 가지는 진공처리장치 및정전척의 제조방법 - Google Patents

진공처리장치의 정전척, 그를 가지는 진공처리장치 및정전척의 제조방법 Download PDF

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Publication number
KR100755874B1
KR100755874B1 KR1020050115601A KR20050115601A KR100755874B1 KR 100755874 B1 KR100755874 B1 KR 100755874B1 KR 1020050115601 A KR1020050115601 A KR 1020050115601A KR 20050115601 A KR20050115601 A KR 20050115601A KR 100755874 B1 KR100755874 B1 KR 100755874B1
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KR
South Korea
Prior art keywords
electrostatic
layer
forming
base material
insulating layer
Prior art date
Application number
KR1020050115601A
Other languages
English (en)
Korean (ko)
Inventor
차훈
엄용택
Original Assignee
주식회사 아이피에스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 아이피에스 filed Critical 주식회사 아이피에스
Priority to KR1020050115601A priority Critical patent/KR100755874B1/ko
Priority to TW094147572A priority patent/TWI308849B/zh
Priority to JP2006008691A priority patent/JP2007158286A/ja
Priority to CNB2006100020778A priority patent/CN100505206C/zh
Application granted granted Critical
Publication of KR100755874B1 publication Critical patent/KR100755874B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020050115601A 2005-11-30 2005-11-30 진공처리장치의 정전척, 그를 가지는 진공처리장치 및정전척의 제조방법 KR100755874B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020050115601A KR100755874B1 (ko) 2005-11-30 2005-11-30 진공처리장치의 정전척, 그를 가지는 진공처리장치 및정전척의 제조방법
TW094147572A TWI308849B (en) 2005-11-30 2005-12-30 Electrostatic chuck for vacuum processing apparatus, vacuum processing apparatsu havign the same, and method for manufacturing the same
JP2006008691A JP2007158286A (ja) 2005-11-30 2006-01-17 真空処理装置の静電チャック、それを有する真空処理装置、及び静電チャックの製造方法
CNB2006100020778A CN100505206C (zh) 2005-11-30 2006-01-24 用于真空处理装置的静电吸盘、具有该静电吸盘的真空处理装置、及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050115601A KR100755874B1 (ko) 2005-11-30 2005-11-30 진공처리장치의 정전척, 그를 가지는 진공처리장치 및정전척의 제조방법

Publications (1)

Publication Number Publication Date
KR100755874B1 true KR100755874B1 (ko) 2007-09-05

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050115601A KR100755874B1 (ko) 2005-11-30 2005-11-30 진공처리장치의 정전척, 그를 가지는 진공처리장치 및정전척의 제조방법

Country Status (4)

Country Link
JP (1) JP2007158286A (ja)
KR (1) KR100755874B1 (ja)
CN (1) CN100505206C (ja)
TW (1) TWI308849B (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010132640A3 (en) * 2009-05-15 2011-03-31 Entegris, Inc. Electrostatic chuck with polymer protrusions
CN103811332A (zh) * 2014-02-14 2014-05-21 北京京东方显示技术有限公司 一种干法刻蚀设备的下部电极基台和干法刻蚀设备
KR101448817B1 (ko) 2008-05-02 2014-10-13 주식회사 원익아이피에스 진공처리장치
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
US9025305B2 (en) 2010-05-28 2015-05-05 Entegris, Inc. High surface resistivity electrostatic chuck
US9543187B2 (en) 2008-05-19 2017-01-10 Entegris, Inc. Electrostatic chuck
KR20220015009A (ko) * 2020-07-30 2022-02-08 주식회사 이에스티 정전척 및 그 제조방법

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5745394B2 (ja) * 2008-03-20 2015-07-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板支持体、プラズマ反応装置、および、サセプターを形成する方法
KR101058748B1 (ko) * 2008-09-19 2011-08-24 주식회사 아토 정전척 및 그 제조방법
KR101134736B1 (ko) * 2010-04-26 2012-04-13 가부시키가이샤 크리에이티브 테크놀러지 스페이서를 구비하는 정전 척 및 그 제조방법
US9329497B2 (en) 2011-02-01 2016-05-03 Asml Netherlands B.V. Substrate table, lithographic apparatus and device manufacturing method
US8349116B1 (en) 2011-11-18 2013-01-08 LuxVue Technology Corporation Micro device transfer head heater assembly and method of transferring a micro device
US8426227B1 (en) 2011-11-18 2013-04-23 LuxVue Technology Corporation Method of forming a micro light emitting diode array
US8646505B2 (en) * 2011-11-18 2014-02-11 LuxVue Technology Corporation Micro device transfer head
CN102610476B (zh) * 2012-03-12 2015-05-27 中微半导体设备(上海)有限公司 一种静电吸盘
JP5996276B2 (ja) * 2012-05-31 2016-09-21 京セラ株式会社 静電チャック、吸着方法及び吸着装置
KR20150053775A (ko) * 2012-09-07 2015-05-18 어플라이드 머티어리얼스, 인코포레이티드 얇은 기판들을 위한 포터블 정전 척 캐리어
CN106663653B (zh) * 2014-09-30 2019-03-15 住友大阪水泥股份有限公司 静电卡盘装置
WO2017209325A1 (ko) * 2016-06-01 2017-12-07 (주)브이앤아이솔루션 정전척 및 그 제조방법
CN114523433B (zh) * 2021-09-27 2023-10-24 杭州大和江东新材料科技有限公司 一种凸点式吸盘的加工方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020064507A (ko) * 2001-02-02 2002-08-09 삼성전자 주식회사 정전 척과 그의 제조방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020064507A (ko) * 2001-02-02 2002-08-09 삼성전자 주식회사 정전 척과 그의 제조방법

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101448817B1 (ko) 2008-05-02 2014-10-13 주식회사 원익아이피에스 진공처리장치
US9543187B2 (en) 2008-05-19 2017-01-10 Entegris, Inc. Electrostatic chuck
US10395963B2 (en) 2008-05-19 2019-08-27 Entegris, Inc. Electrostatic chuck
WO2010132640A3 (en) * 2009-05-15 2011-03-31 Entegris, Inc. Electrostatic chuck with polymer protrusions
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
US8879233B2 (en) 2009-05-15 2014-11-04 Entegris, Inc. Electrostatic chuck with polymer protrusions
US9721821B2 (en) 2009-05-15 2017-08-01 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
US9025305B2 (en) 2010-05-28 2015-05-05 Entegris, Inc. High surface resistivity electrostatic chuck
CN103811332A (zh) * 2014-02-14 2014-05-21 北京京东方显示技术有限公司 一种干法刻蚀设备的下部电极基台和干法刻蚀设备
KR20220015009A (ko) * 2020-07-30 2022-02-08 주식회사 이에스티 정전척 및 그 제조방법
KR102457215B1 (ko) * 2020-07-30 2022-10-20 주식회사 이에스티 정전척 및 그 제조방법

Also Published As

Publication number Publication date
CN100505206C (zh) 2009-06-24
TW200721915A (en) 2007-06-01
CN1975998A (zh) 2007-06-06
TWI308849B (en) 2009-04-11
JP2007158286A (ja) 2007-06-21

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