TWI304927B - - Google Patents
Download PDFInfo
- Publication number
- TWI304927B TWI304927B TW93101900A TW93101900A TWI304927B TW I304927 B TWI304927 B TW I304927B TW 93101900 A TW93101900 A TW 93101900A TW 93101900 A TW93101900 A TW 93101900A TW I304927 B TWI304927 B TW I304927B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- elastic buckle
- heat sink
- electronic component
- vertical electronic
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000012545 processing Methods 0.000 description 20
- 235000012431 wafers Nutrition 0.000 description 12
- 238000013461 design Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 210000004556 brain Anatomy 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 241000283690 Bos taurus Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 230000005612 types of electricity Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93101900A TW200525337A (en) | 2004-01-28 | 2004-01-28 | Cooling device structure applied to erected electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93101900A TW200525337A (en) | 2004-01-28 | 2004-01-28 | Cooling device structure applied to erected electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200525337A TW200525337A (en) | 2005-08-01 |
| TWI304927B true TWI304927B (cs) | 2009-01-01 |
Family
ID=45071038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW93101900A TW200525337A (en) | 2004-01-28 | 2004-01-28 | Cooling device structure applied to erected electronic component |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200525337A (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI881701B (zh) * | 2024-02-05 | 2025-04-21 | 啓碁科技股份有限公司 | 電子裝置散熱結構 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205025805U (zh) * | 2015-09-25 | 2016-02-10 | 善元科技股份有限公司 | 散热风扇及备援式电源供应器 |
| CN111988953B (zh) * | 2019-05-22 | 2025-07-01 | 泰连公司 | 电连接器的热沉组件 |
| US12322898B2 (en) | 2019-05-22 | 2025-06-03 | Te Connectivity Solutions Gmbh | Heat sink assembly for an electrical connector assembly |
| CN115119461A (zh) * | 2021-03-19 | 2022-09-27 | Tvs电机股份有限公司 | 用于固定电子设备的电子部件的安装组件及其方法 |
-
2004
- 2004-01-28 TW TW93101900A patent/TW200525337A/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI881701B (zh) * | 2024-02-05 | 2025-04-21 | 啓碁科技股份有限公司 | 電子裝置散熱結構 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200525337A (en) | 2005-08-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW444369B (en) | Heat sink, method of manufacturing the same and cooling apparatus using the same | |
| TW201024982A (en) | Heat dissipation device | |
| TWM336471U (en) | Heat dissipating device used in memory module | |
| TW201116983A (en) | Heat dissipation structure of electronic apparatus | |
| TWI304927B (cs) | ||
| JP2866632B2 (ja) | 放熱材 | |
| TWI325754B (en) | Heat dissipation module | |
| TWM383765U (en) | Fast disassemble heat sink clip | |
| JP2003198171A (ja) | ヒートシンクおよび放熱器 | |
| TW200910070A (en) | Heat dissipation module | |
| JPH10145064A (ja) | 高放熱性伝熱部品 | |
| CN201557358U (zh) | 散热装置及其电子运算系统 | |
| TWM250535U (en) | Overlap-type heat dissipating device | |
| TWM263733U (en) | Heatsink for electronic component | |
| TWI335204B (en) | Fastening structure and thermal module using the same | |
| TWI270765B (en) | Heat sink device and assembly method thereof | |
| TWI329257B (en) | Heat dissipation device | |
| TWI330315B (en) | Heat dissipation device | |
| TWI295943B (en) | Heat-dissipating device and method for producing the same | |
| TW201020739A (en) | Heat dissipation structure for portable computer | |
| TWM265692U (en) | Heat sink module for electronic device | |
| JP2001035979A (ja) | 電子機器におけるヒートパイプ式放熱構造 | |
| TWI265266B (en) | Heat dissipation device with heat pipe | |
| TWM267819U (en) | Improved structure of heat sink device | |
| JP2000349212A (ja) | 高集積素子用放熱器 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |