TW200525337A - Cooling device structure applied to erected electronic component - Google Patents
Cooling device structure applied to erected electronic component Download PDFInfo
- Publication number
- TW200525337A TW200525337A TW93101900A TW93101900A TW200525337A TW 200525337 A TW200525337 A TW 200525337A TW 93101900 A TW93101900 A TW 93101900A TW 93101900 A TW93101900 A TW 93101900A TW 200525337 A TW200525337 A TW 200525337A
- Authority
- TW
- Taiwan
- Prior art keywords
- elastic
- heat
- electronic component
- buckle
- seat
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title abstract description 6
- 238000012546 transfer Methods 0.000 claims abstract description 8
- 230000017525 heat dissipation Effects 0.000 claims description 27
- 238000003825 pressing Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 claims 2
- 230000033228 biological regulation Effects 0.000 claims 1
- 238000005485 electric heating Methods 0.000 claims 1
- 210000002784 stomach Anatomy 0.000 claims 1
- 230000005855 radiation Effects 0.000 abstract 2
- 238000012545 processing Methods 0.000 description 17
- 238000013461 design Methods 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 210000004556 brain Anatomy 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 241000972773 Aulopiformes Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 235000019515 salmon Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93101900A TW200525337A (en) | 2004-01-28 | 2004-01-28 | Cooling device structure applied to erected electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93101900A TW200525337A (en) | 2004-01-28 | 2004-01-28 | Cooling device structure applied to erected electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200525337A true TW200525337A (en) | 2005-08-01 |
| TWI304927B TWI304927B (cs) | 2009-01-01 |
Family
ID=45071038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW93101900A TW200525337A (en) | 2004-01-28 | 2004-01-28 | Cooling device structure applied to erected electronic component |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200525337A (cs) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI642851B (zh) * | 2015-09-25 | 2018-12-01 | 善元科技股份有限公司 | Cooling fan and its backup power supply |
| CN111988953A (zh) * | 2019-05-22 | 2020-11-24 | 泰连公司 | 电连接器的热沉组件 |
| CN115119461A (zh) * | 2021-03-19 | 2022-09-27 | Tvs电机股份有限公司 | 用于固定电子设备的电子部件的安装组件及其方法 |
| TWI881701B (zh) * | 2024-02-05 | 2025-04-21 | 啓碁科技股份有限公司 | 電子裝置散熱結構 |
| US12322898B2 (en) | 2019-05-22 | 2025-06-03 | Te Connectivity Solutions Gmbh | Heat sink assembly for an electrical connector assembly |
-
2004
- 2004-01-28 TW TW93101900A patent/TW200525337A/zh not_active IP Right Cessation
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI642851B (zh) * | 2015-09-25 | 2018-12-01 | 善元科技股份有限公司 | Cooling fan and its backup power supply |
| CN111988953A (zh) * | 2019-05-22 | 2020-11-24 | 泰连公司 | 电连接器的热沉组件 |
| US12322898B2 (en) | 2019-05-22 | 2025-06-03 | Te Connectivity Solutions Gmbh | Heat sink assembly for an electrical connector assembly |
| CN115119461A (zh) * | 2021-03-19 | 2022-09-27 | Tvs电机股份有限公司 | 用于固定电子设备的电子部件的安装组件及其方法 |
| TWI881701B (zh) * | 2024-02-05 | 2025-04-21 | 啓碁科技股份有限公司 | 電子裝置散熱結構 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI304927B (cs) | 2009-01-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |