TWI300024B - - Google Patents

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Publication number
TWI300024B
TWI300024B TW094129005A TW94129005A TWI300024B TW I300024 B TWI300024 B TW I300024B TW 094129005 A TW094129005 A TW 094129005A TW 94129005 A TW94129005 A TW 94129005A TW I300024 B TWI300024 B TW I300024B
Authority
TW
Taiwan
Prior art keywords
ceramic
powder layer
layer
polishing pad
substrate
Prior art date
Application number
TW094129005A
Other languages
English (en)
Chinese (zh)
Other versions
TW200708375A (en
Inventor
Hsiu Yi Lin
Chou Chih Tseng
Yu Tai Chen
Wey Hwang
Original Assignee
Kinik Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kinik Co filed Critical Kinik Co
Priority to TW094129005A priority Critical patent/TW200708375A/zh
Priority to US11/466,716 priority patent/US7467989B2/en
Publication of TW200708375A publication Critical patent/TW200708375A/zh
Application granted granted Critical
Publication of TWI300024B publication Critical patent/TWI300024B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW094129005A 2005-08-24 2005-08-24 Ceramic polishing pad conditioner/dresser having plastic base and manufacturing method thereof TW200708375A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094129005A TW200708375A (en) 2005-08-24 2005-08-24 Ceramic polishing pad conditioner/dresser having plastic base and manufacturing method thereof
US11/466,716 US7467989B2 (en) 2005-08-24 2006-08-23 Ceramic polishing pad dresser and method for fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094129005A TW200708375A (en) 2005-08-24 2005-08-24 Ceramic polishing pad conditioner/dresser having plastic base and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW200708375A TW200708375A (en) 2007-03-01
TWI300024B true TWI300024B (enExample) 2008-08-21

Family

ID=37804925

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129005A TW200708375A (en) 2005-08-24 2005-08-24 Ceramic polishing pad conditioner/dresser having plastic base and manufacturing method thereof

Country Status (2)

Country Link
US (1) US7467989B2 (enExample)
TW (1) TW200708375A (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI537097B (zh) * 2012-04-10 2016-06-11 宋健民 組合式修整器及其製法與化學機械平坦化應用
US20080014845A1 (en) * 2006-07-11 2008-01-17 Alpay Yilmaz Conditioning disk having uniform structures
TWI289093B (en) * 2006-07-26 2007-11-01 Kinik Co Method of manufacturing diamond disk
CN102341215B (zh) 2009-03-24 2014-06-18 圣戈班磨料磨具有限公司 用作化学机械平坦化垫修整器的研磨工具
TWI380878B (zh) * 2009-04-21 2013-01-01 Sung Chien Min Combined Dressing Machine and Its Making Method
US20110159784A1 (en) * 2009-04-30 2011-06-30 First Principles LLC Abrasive article with array of gimballed abrasive members and method of use
CA2764358A1 (en) * 2009-06-02 2010-12-09 Saint-Gobain Abrasives, Inc. Corrosion-resistant cmp conditioning tools and methods for making and using same
TWI383860B (zh) * 2009-06-19 2013-02-01 宋健民 Modular dresser
US20110097977A1 (en) * 2009-08-07 2011-04-28 Abrasive Technology, Inc. Multiple-sided cmp pad conditioning disk
CH701596B1 (de) * 2009-08-11 2013-08-15 Meister Abrasives Ag Abrichtwerkzeug.
EP2474025A2 (en) 2009-09-01 2012-07-11 Saint-Gobain Abrasives, Inc. Chemical mechanical polishing conditioner
US9242342B2 (en) * 2012-03-14 2016-01-26 Taiwan Semiconductor Manufacturing Company, Ltd. Manufacture and method of making the same
CN107234550A (zh) 2012-08-02 2017-10-10 罗伯特·博世有限公司 包含不具有角的第一面以及具有角的第二面的磨粒
CN203390712U (zh) * 2013-04-08 2014-01-15 宋健民 化学机械研磨修整器
TWI546158B (zh) * 2013-12-20 2016-08-21 中國砂輪企業股份有限公司 低磁性化學機械研磨修整器
TWI551399B (zh) * 2014-01-20 2016-10-01 中國砂輪企業股份有限公司 高度磨料品質之化學機械研磨修整器
JP2017035751A (ja) * 2015-08-10 2017-02-16 株式会社ディスコ パッドドレッサー
TWI623382B (zh) * 2015-10-27 2018-05-11 中國砂輪企業股份有限公司 Hybrid chemical mechanical polishing dresser
DE112017001938T5 (de) 2016-04-06 2019-01-17 M Cubed Technologies, Inc. Diamantverbundwerkstoff-Konditionierer für ein CMP-Tuch
CN105729308A (zh) * 2016-05-09 2016-07-06 廊坊西波尔钻石技术有限公司 一种钎焊式金刚石笔条修整笔及加工方法
TWI636854B (zh) * 2017-06-12 2018-10-01 Kinik Company 研磨工具及其製造方法
CN116619246B (zh) * 2023-07-24 2023-11-10 北京寰宇晶科科技有限公司 一种具有金刚石柱状晶簇的cmp抛光垫修整器及其制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2118409A (en) * 1937-03-20 1938-05-24 Julius E Loewy Abrasive assembly
US4907376A (en) * 1988-05-10 1990-03-13 Norton Company Plate mounted grinding wheel
JP3527448B2 (ja) * 1999-12-20 2004-05-17 株式会社リード Ｃｍｐ研磨布用ドレッサー及びその製造方法

Also Published As

Publication number Publication date
TW200708375A (en) 2007-03-01
US20070049185A1 (en) 2007-03-01
US7467989B2 (en) 2008-12-23

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees