TWI299293B - - Google Patents
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- Publication number
- TWI299293B TWI299293B TW092113548A TW92113548A TWI299293B TW I299293 B TWI299293 B TW I299293B TW 092113548 A TW092113548 A TW 092113548A TW 92113548 A TW92113548 A TW 92113548A TW I299293 B TWI299293 B TW I299293B
- Authority
- TW
- Taiwan
- Prior art keywords
- glass substrate
- cooling
- substrate
- scribing
- glass
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002170520A JP4408607B2 (ja) | 2002-06-11 | 2002-06-11 | スクライブ方法及びスクライブ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200307586A TW200307586A (en) | 2003-12-16 |
TWI299293B true TWI299293B (ja) | 2008-08-01 |
Family
ID=29996454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092113548A TW200307586A (en) | 2002-06-11 | 2003-05-20 | Scribing method and scribing device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4408607B2 (ja) |
KR (1) | KR100925287B1 (ja) |
CN (1) | CN100431108C (ja) |
TW (1) | TW200307586A (ja) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4615231B2 (ja) * | 2004-02-02 | 2011-01-19 | 三星ダイヤモンド工業株式会社 | スクライブ装置およびこの装置を用いたスクライブ方法 |
KR101043674B1 (ko) * | 2004-05-11 | 2011-06-23 | 엘지디스플레이 주식회사 | 스크라이빙 장치 및 방법 |
KR100602623B1 (ko) * | 2004-05-31 | 2006-07-19 | 윤종진 | 덩어리 고무의 절단장치 |
KR101096733B1 (ko) | 2004-12-27 | 2011-12-21 | 엘지디스플레이 주식회사 | 기판의 절단장치 및 이를 이용한 기판의 절단방법 |
US7423818B2 (en) * | 2005-07-15 | 2008-09-09 | Electro Scientific Industries, Inc. | Method of suppressing distortion of a working laser beam of a laser link processing system |
JP4851795B2 (ja) * | 2006-01-13 | 2012-01-11 | 株式会社ディスコ | ウエーハの分割装置 |
JP4251203B2 (ja) * | 2006-08-29 | 2009-04-08 | セイコーエプソン株式会社 | 貼合せマザー基板のスクライブ方法および貼合せマザー基板の分割方法 |
KR101453587B1 (ko) * | 2007-04-30 | 2014-11-03 | 코닝 인코포레이티드 | 이동 유리 리본을 스코어링하기 위한 장치, 시스템, 및 방법 |
US7982162B2 (en) * | 2007-05-15 | 2011-07-19 | Corning Incorporated | Method and apparatus for scoring and separating a brittle material with a single beam of radiation |
US8051679B2 (en) | 2008-09-29 | 2011-11-08 | Corning Incorporated | Laser separation of glass sheets |
US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
US8426767B2 (en) * | 2009-08-31 | 2013-04-23 | Corning Incorporated | Methods for laser scribing and breaking thin glass |
US8946590B2 (en) | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
US8720228B2 (en) | 2010-08-31 | 2014-05-13 | Corning Incorporated | Methods of separating strengthened glass substrates |
JP5202595B2 (ja) | 2010-09-10 | 2013-06-05 | 三星ダイヤモンド工業株式会社 | レーザ割断装置 |
TW201231421A (en) * | 2010-11-30 | 2012-08-01 | Corning Inc | Methods for separating a sheet of brittle material |
US8978528B2 (en) | 2011-08-05 | 2015-03-17 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Method for cutting panel substrate and substrate cutting apparatus |
CN102390923A (zh) * | 2011-08-05 | 2012-03-28 | 深圳市华星光电技术有限公司 | 面板基板切割方法及基板切割装置 |
DE102011084128A1 (de) * | 2011-10-07 | 2013-04-11 | Schott Ag | Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante |
JP5879106B2 (ja) * | 2011-11-25 | 2016-03-08 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のスクライブ方法 |
US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
JP6268805B2 (ja) * | 2013-08-13 | 2018-01-31 | 日本電気硝子株式会社 | ガラス板の製造方法 |
TW201628751A (zh) * | 2014-11-20 | 2016-08-16 | 康寧公司 | 彈性玻璃基板之回饋控制的雷射切割 |
WO2017206054A1 (en) * | 2016-05-31 | 2017-12-07 | Faurecia (China) Holding Co., Ltd. | Release agent supply device for cold knife weakening and a cold knife system comprising such a device |
CN107336369B (zh) * | 2017-06-20 | 2019-01-04 | 杭州师范大学钱江学院 | 玻璃瓶分割回收环保装置 |
CN108032354B (zh) * | 2017-10-25 | 2020-03-17 | 苏州三鑫时代新材料股份有限公司 | 一种光扩散板的切边自动分离方法及自动分离装置 |
CN113751789B (zh) * | 2021-09-29 | 2022-11-11 | 南通东海机床制造集团有限公司 | 一种剪板机剪切快速定位装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY120533A (en) * | 1997-04-14 | 2005-11-30 | Schott Ag | Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass. |
JP2001130921A (ja) * | 1999-10-29 | 2001-05-15 | Mitsuboshi Diamond Industrial Co Ltd | 脆性基板の加工方法及び装置 |
TR200201402T2 (tr) * | 1999-11-24 | 2003-03-21 | Applied Photonics, Inc. | Metalik olmayan materyallerin ayrılması için yöntem ve cihaz. |
KR100673073B1 (ko) * | 2000-10-21 | 2007-01-22 | 삼성전자주식회사 | 레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치 |
-
2002
- 2002-06-11 JP JP2002170520A patent/JP4408607B2/ja not_active Expired - Fee Related
-
2003
- 2003-05-20 TW TW092113548A patent/TW200307586A/zh not_active IP Right Cessation
- 2003-05-30 KR KR1020030034598A patent/KR100925287B1/ko not_active IP Right Cessation
- 2003-06-11 CN CNB031412890A patent/CN100431108C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1468695A (zh) | 2004-01-21 |
JP2004010466A (ja) | 2004-01-15 |
JP4408607B2 (ja) | 2010-02-03 |
KR100925287B1 (ko) | 2009-11-05 |
CN100431108C (zh) | 2008-11-05 |
TW200307586A (en) | 2003-12-16 |
KR20030095233A (ko) | 2003-12-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |