TWI299293B - - Google Patents

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Publication number
TWI299293B
TWI299293B TW092113548A TW92113548A TWI299293B TW I299293 B TWI299293 B TW I299293B TW 092113548 A TW092113548 A TW 092113548A TW 92113548 A TW92113548 A TW 92113548A TW I299293 B TWI299293 B TW I299293B
Authority
TW
Taiwan
Prior art keywords
glass substrate
cooling
substrate
scribing
glass
Prior art date
Application number
TW092113548A
Other languages
English (en)
Chinese (zh)
Other versions
TW200307586A (en
Inventor
Shuichi Inoue
Original Assignee
Mitsuboshi Diamond Ind Co Ltdl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltdl filed Critical Mitsuboshi Diamond Ind Co Ltdl
Publication of TW200307586A publication Critical patent/TW200307586A/zh
Application granted granted Critical
Publication of TWI299293B publication Critical patent/TWI299293B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW092113548A 2002-06-11 2003-05-20 Scribing method and scribing device TW200307586A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002170520A JP4408607B2 (ja) 2002-06-11 2002-06-11 スクライブ方法及びスクライブ装置

Publications (2)

Publication Number Publication Date
TW200307586A TW200307586A (en) 2003-12-16
TWI299293B true TWI299293B (ja) 2008-08-01

Family

ID=29996454

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092113548A TW200307586A (en) 2002-06-11 2003-05-20 Scribing method and scribing device

Country Status (4)

Country Link
JP (1) JP4408607B2 (ja)
KR (1) KR100925287B1 (ja)
CN (1) CN100431108C (ja)
TW (1) TW200307586A (ja)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4615231B2 (ja) * 2004-02-02 2011-01-19 三星ダイヤモンド工業株式会社 スクライブ装置およびこの装置を用いたスクライブ方法
KR101043674B1 (ko) * 2004-05-11 2011-06-23 엘지디스플레이 주식회사 스크라이빙 장치 및 방법
KR100602623B1 (ko) * 2004-05-31 2006-07-19 윤종진 덩어리 고무의 절단장치
KR101096733B1 (ko) 2004-12-27 2011-12-21 엘지디스플레이 주식회사 기판의 절단장치 및 이를 이용한 기판의 절단방법
US7423818B2 (en) * 2005-07-15 2008-09-09 Electro Scientific Industries, Inc. Method of suppressing distortion of a working laser beam of a laser link processing system
JP4851795B2 (ja) * 2006-01-13 2012-01-11 株式会社ディスコ ウエーハの分割装置
JP4251203B2 (ja) * 2006-08-29 2009-04-08 セイコーエプソン株式会社 貼合せマザー基板のスクライブ方法および貼合せマザー基板の分割方法
WO2008133800A1 (en) * 2007-04-30 2008-11-06 Corning Incorporated Apparatus, system, and method for scoring a moving glass ribbon
US7982162B2 (en) * 2007-05-15 2011-07-19 Corning Incorporated Method and apparatus for scoring and separating a brittle material with a single beam of radiation
US8051679B2 (en) * 2008-09-29 2011-11-08 Corning Incorporated Laser separation of glass sheets
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8426767B2 (en) * 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
TWI513670B (zh) 2010-08-31 2015-12-21 Corning Inc 分離強化玻璃基板之方法
JP5202595B2 (ja) 2010-09-10 2013-06-05 三星ダイヤモンド工業株式会社 レーザ割断装置
TW201231421A (en) * 2010-11-30 2012-08-01 Corning Inc Methods for separating a sheet of brittle material
CN102390923A (zh) * 2011-08-05 2012-03-28 深圳市华星光电技术有限公司 面板基板切割方法及基板切割装置
US8978528B2 (en) 2011-08-05 2015-03-17 Shenzhen China Star Optoelectronics Technology Co., Ltd. Method for cutting panel substrate and substrate cutting apparatus
DE102011084128A1 (de) * 2011-10-07 2013-04-11 Schott Ag Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante
JP5879106B2 (ja) * 2011-11-25 2016-03-08 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
JP6268805B2 (ja) * 2013-08-13 2018-01-31 日本電気硝子株式会社 ガラス板の製造方法
TW201628751A (zh) * 2014-11-20 2016-08-16 康寧公司 彈性玻璃基板之回饋控制的雷射切割
EP3463770B1 (en) * 2016-05-31 2021-04-14 Faurecia (China) Holding Co., Ltd. A cold knife system and a method for forming a cold knife weakening line
CN107336369B (zh) * 2017-06-20 2019-01-04 杭州师范大学钱江学院 玻璃瓶分割回收环保装置
CN108032354B (zh) * 2017-10-25 2020-03-17 苏州三鑫时代新材料股份有限公司 一种光扩散板的切边自动分离方法及自动分离装置
CN113751789B (zh) * 2021-09-29 2022-11-11 南通东海机床制造集团有限公司 一种剪板机剪切快速定位装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY120533A (en) * 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
JP2001130921A (ja) * 1999-10-29 2001-05-15 Mitsuboshi Diamond Industrial Co Ltd 脆性基板の加工方法及び装置
EP1232038B1 (en) * 1999-11-24 2008-04-23 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials
KR100673073B1 (ko) * 2000-10-21 2007-01-22 삼성전자주식회사 레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치

Also Published As

Publication number Publication date
JP2004010466A (ja) 2004-01-15
TW200307586A (en) 2003-12-16
KR20030095233A (ko) 2003-12-18
CN1468695A (zh) 2004-01-21
KR100925287B1 (ko) 2009-11-05
JP4408607B2 (ja) 2010-02-03
CN100431108C (zh) 2008-11-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees