WO2002100620A1 - Dispositif et procede pour le dessin de lignes de rayure sur substance fragile - Google Patents

Dispositif et procede pour le dessin de lignes de rayure sur substance fragile Download PDF

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Publication number
WO2002100620A1
WO2002100620A1 PCT/JP2002/005815 JP0205815W WO02100620A1 WO 2002100620 A1 WO2002100620 A1 WO 2002100620A1 JP 0205815 W JP0205815 W JP 0205815W WO 02100620 A1 WO02100620 A1 WO 02100620A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass substrate
scribing
brittle substrate
blind crack
cooling
Prior art date
Application number
PCT/JP2002/005815
Other languages
English (en)
Japanese (ja)
Other versions
WO2002100620B1 (fr
Inventor
Haruo Wakayama
Original Assignee
Mitsuboshi Diamond Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co., Ltd. filed Critical Mitsuboshi Diamond Industrial Co., Ltd.
Publication of WO2002100620A1 publication Critical patent/WO2002100620A1/fr
Publication of WO2002100620B1 publication Critical patent/WO2002100620B1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

L'invention concerne un procédé permettant de tracer des lignes de rayure sur un substrat fragile, selon les étapes suivantes: échauffement d'un substrat en verre (50) par application continue de tâche laser à la surface du substrat (50) le long d'une zone dans laquelle on souhaite tracer une ligne de rayure à une température inférieure à celle du point de ramollissement du substrat, et en parallèle, refroidissement continu de ladite zone par injection d'eau de refroidissement via une buse de refroidissement (37), ce qui permet de former une fissure aveugle le long de la ligne de rayure prévue. Un mécanisme d'imagerie (40) réalise par imagerie une zone de formation de fissure aveugle à proximité de la zone de la surface du substrat dans laquelle est injectée l'eau de refroidissement, et vérifie que la fissure est formée sur la base des données d'image traitée en imagerie.
PCT/JP2002/005815 2001-06-11 2002-06-11 Dispositif et procede pour le dessin de lignes de rayure sur substance fragile WO2002100620A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-176372 2001-06-11
JP2001176372 2001-06-11

Publications (2)

Publication Number Publication Date
WO2002100620A1 true WO2002100620A1 (fr) 2002-12-19
WO2002100620B1 WO2002100620B1 (fr) 2003-03-06

Family

ID=19017370

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/005815 WO2002100620A1 (fr) 2001-06-11 2002-06-11 Dispositif et procede pour le dessin de lignes de rayure sur substance fragile

Country Status (2)

Country Link
TW (1) TW592867B (fr)
WO (1) WO2002100620A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101140164B1 (ko) * 2005-10-28 2012-04-24 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료 기판의 스크라이브 라인 형성방법 및 스크라이브라인 형성장치
US8720228B2 (en) 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
CN104493365A (zh) * 2014-12-15 2015-04-08 江南大学 一种水射流-激光刻蚀陶瓷的装置及方法
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6469304A (en) * 1987-09-09 1989-03-15 Sharp Kk Cleaving device
JPH0417987A (ja) * 1990-05-11 1992-01-22 Amada Co Ltd レーザ加工機の画像処理システム
US5543365A (en) * 1994-12-02 1996-08-06 Texas Instruments Incorporated Wafer scribe technique using laser by forming polysilicon
US5609284A (en) * 1992-04-02 1997-03-11 Fonon Technology Limited Method of splitting non-metallic materials
JPH1110374A (ja) * 1997-06-25 1999-01-19 Souei Tsusho Kk 割断加工方法
JP2000281371A (ja) * 1999-03-09 2000-10-10 Corning Inc レーザスコアリングにおける亀裂深さの制御

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6469304A (en) * 1987-09-09 1989-03-15 Sharp Kk Cleaving device
JPH0417987A (ja) * 1990-05-11 1992-01-22 Amada Co Ltd レーザ加工機の画像処理システム
US5609284A (en) * 1992-04-02 1997-03-11 Fonon Technology Limited Method of splitting non-metallic materials
US5543365A (en) * 1994-12-02 1996-08-06 Texas Instruments Incorporated Wafer scribe technique using laser by forming polysilicon
JPH1110374A (ja) * 1997-06-25 1999-01-19 Souei Tsusho Kk 割断加工方法
JP2000281371A (ja) * 1999-03-09 2000-10-10 Corning Inc レーザスコアリングにおける亀裂深さの制御

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101140164B1 (ko) * 2005-10-28 2012-04-24 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료 기판의 스크라이브 라인 형성방법 및 스크라이브라인 형성장치
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US9533910B2 (en) 2009-08-28 2017-01-03 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
US10358374B2 (en) 2009-11-30 2019-07-23 Corning Incorporated Methods for laser scribing and separating glass substrates
US8720228B2 (en) 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
CN104493365A (zh) * 2014-12-15 2015-04-08 江南大学 一种水射流-激光刻蚀陶瓷的装置及方法

Also Published As

Publication number Publication date
TW592867B (en) 2004-06-21
WO2002100620B1 (fr) 2003-03-06

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