WO2002100620A1 - Dispositif et procede pour le dessin de lignes de rayure sur substance fragile - Google Patents

Dispositif et procede pour le dessin de lignes de rayure sur substance fragile Download PDF

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Publication number
WO2002100620A1
WO2002100620A1 PCT/JP2002/005815 JP0205815W WO02100620A1 WO 2002100620 A1 WO2002100620 A1 WO 2002100620A1 JP 0205815 W JP0205815 W JP 0205815W WO 02100620 A1 WO02100620 A1 WO 02100620A1
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WO
WIPO (PCT)
Prior art keywords
glass substrate
scribing
brittle substrate
blind crack
cooling
Prior art date
Application number
PCT/JP2002/005815
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English (en)
Japanese (ja)
Other versions
WO2002100620B1 (fr
Inventor
Haruo Wakayama
Original Assignee
Mitsuboshi Diamond Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co., Ltd. filed Critical Mitsuboshi Diamond Industrial Co., Ltd.
Publication of WO2002100620A1 publication Critical patent/WO2002100620A1/fr
Publication of WO2002100620B1 publication Critical patent/WO2002100620B1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers

Definitions

  • the present invention relates to a scribing apparatus and a scribing method used for cutting a brittle substrate such as a glass substrate and a semiconductor wafer used for a flat panel display (hereinafter referred to as FPD).
  • FPD flat panel display
  • An FPD in which a pair of glass substrates are bonded together is manufactured by bonding a pair of large-sized mother glasses to each other, and then dividing the pair of mother glasses into a predetermined size. You. When the mother glass is cut, a scribe line is formed on the mother glass by a cutter in advance.
  • a method using a laser beam to form a scribe line has been put to practical use.
  • a glass substrate 50 is irradiated with a laser beam from a laser-oscillation device 61.
  • the laser beam emitted from the laser oscillator 61 is an elliptical laser spot along the line to be scribed.
  • the LS is formed on a glass substrate 50.
  • the glass substrate 50 and the laser beam emitted from the laser oscillator 61 are relatively moved along the longitudinal direction of the laser spot.
  • a cooling medium such as cooling water is blown from the cooling nozzle 62 near the laser beam irradiation area on the surface of the glass substrate 50 so that a scribe line is formed.
  • the surface of the glass substrate irradiated with the laser beam generates a compressive stress due to heating by the laser beam, and then a tensile stress is generated by blowing a cooling medium.
  • compressive stress is generated Since a tensile stress is generated in an area close to the area of the glass substrate, a stress gradient is generated between the two areas based on the respective stresses, and a notch formed at an end of the glass substrate 50 is formed in the glass substrate 50. Cracks along the scheduled scribe line.
  • the cracks formed on the surface of the glass substrate 50 in this manner are minute, they cannot usually be seen with the naked eye, and are called blind cracks BC.
  • the blind crack BC as a scribe line is formed on the glass substrate 50
  • the glass substrate 50 is supplied to the next cutting step, and is applied to the glass substrate so that a bending moment acts in the width direction of the blind crack BC. Power is applied. Thereby, the glass substrate 50 is divided along the blind crack BC which is a scribe line.
  • Blind crack BC may not be formed properly.
  • the glass substrate 50 is supplied to the next cutting step without the blind crack BC being formed normally on the glass substrate 50, the glass substrate 50 is not separated along the blind crack BC, and the glass substrate 50 is not cut. 0 will be damaged.
  • the glass substrate 50 is broken in the dividing step, it cannot be used as a component of the FPD, and the economic efficiency is impaired, and the production efficiency of the FPD is reduced.
  • the device for dividing the glass substrate 50 itself may be damaged due to the damage of the glass substrate 50.
  • the blind cracks BC are reliably formed on the glass substrate 50 in the scribe device.
  • the blind cracks BC formed in the glass substrate 50 have a small change in shape due to the change and are not normally visible, the blind cracks BC are formed in the scribe device.
  • the blind cracks BC are formed in the scribe device.
  • there is a problem that it is not easy to confirm In addition, there is a risk on the eyes due to the infrared light emitted from the laser, so there is a safety problem in visually confirming the formation of blind cracks during laser irradiation during scribing.
  • the present invention is to solve such a problem, and an object of the present invention is to be able to reliably confirm the formation state of blind cracks formed on the surface of a brittle substrate such as a glass substrate on one monitor screen. At the same time, the degree of formation is quantified by an image processing method or is compared with the image formed when the image is formed normally to automatically determine whether or not the image is formed normally.
  • An object of the present invention is to provide a scribing apparatus and a scribing method for a brittle substrate that can surely cut the brittle substrate. Disclosure of the invention
  • the scribing apparatus for a brittle substrate continuously heats the brittle substrate at a temperature lower than the softening point of the brittle substrate along a scribe line on the surface of the brittle substrate.
  • the imaging device captures an image of a formation region of a blind crack adjacent to a cooling region on a surface of the brittle substrate.
  • an image processing device for confirming the formation of a blind crack based on the image data captured by the image capturing means.
  • the imaging area of the imaging means is determined in consideration of the resolution of the CCD element to be used, the size of the detection target, and the detection conditions of illumination irradiation. Therefore, when it is necessary to increase the resolution and perform imaging in a wide range in order to increase the detection sensitivity, an image processing device having an imaging device with a high resolution and a storage area with a large amount of captured data is required. A person can visually check the screen on the monitor and determine the threshold for the matching of the required capture range and the pattern matching with the normal image according to the operating state. If it becomes necessary to change the settings depending on the operating conditions, an image processing operation software is built in so that it is possible to change the setting data (capture range, threshold value, etc.).
  • the image processing apparatus previously stores an image data in a state in which a blind crack is normally formed.
  • the image processing apparatus stores the image data stored therein and an image captured by the imaging unit.
  • the data is compared with, for example, the pattern matching method. It is automatically recognized that a blind crack is formed normally depending on the degree of coincidence when comparing the mutual data and whether the degree of coincidence exceeds a certain set value (threshold value).
  • the hardware and software configuration in the image processing device is designed so that the threshold can be changed depending on the condition of the inspection target (for example, disturbance light or illumination intensity for irradiating the inspection area).
  • a region near the heated region is continuously heated.
  • a region near the heated region is continuously heated.
  • a region where the blind crack is formed is immediately below a cooling point.
  • the imaging unit is set at a mounting angle of 30 ° to 90 ° with respect to a horizontal direction with respect to the blind crack.
  • the automatic brittle substrate cutting line according to the present invention is characterized by comprising at least one brittle substrate scribing device and at least one break device.
  • FIG. 1 is a front view showing an example of an embodiment of a scriber for brittle substrates according to the present invention.
  • FIG. 2 is a perspective view schematically showing a beam irradiation state on a glass substrate during a scribe line forming operation by the scribe device of FIG.
  • FIG. 3 is a plan view schematically showing a physical change state on the glass substrate of FIG.
  • FIG. 4 is a schematic configuration diagram of an imaging mechanism provided in the scribe device of FIG.
  • Fig. 5 (a) is an example of an image when the image data captured by the image processing device of the imaging mechanism is displayed on a monitor
  • Fig. 5 (b) shows the image data at the time of abnormality captured by the imaging mechanism. It is an image example at the time of monitor display.
  • FIG. 6 is a schematic diagram for explaining a method of forming a scribe line using one laser beam.
  • FIG. 7 is a perspective view schematically showing a beam irradiation state on the glass substrate when the cooling point CP is formed inside the laser spot LS.
  • FIG. 8 is a plan view schematically showing a physical change state on the glass substrate when the cooling point CP is formed inside the laser spot LS.
  • FIGS. 9 (a) and 9 (b) are schematic diagrams illustrating preferred angular ranges of a light source installed to illuminate the blind crack BC and a CCD camera for imaging the blind crack BC, respectively.
  • FIG. 10 is a schematic view of an automatic glass substrate cutting line showing an example of an automatic glass substrate cutting line in which a breaking device is incorporated, following the scribing device.
  • FIG. 1 is a schematic configuration diagram showing an embodiment of a brittle substrate scribing apparatus according to the present invention.
  • This scribing device is used, for example, to cut a glass substrate used in an FPD, and reciprocates along a predetermined horizontal direction (Y direction) on a horizontal base 11 as shown in FIG. It has a slide table 12 that moves.
  • the slide table 12 can slide along a pair of guide rails 14 and 15 in a horizontal state on a pair of guide rails 14 and 15 arranged in parallel in the Y direction on the upper surface of the gantry 11 It is supported by.
  • a ball screw 13 is provided at an intermediate portion between the two guide rails 14 and 15 in parallel with the respective guide rails 14 and 15 so as to be rotated by a motor (not shown).
  • the pole screw 13 is rotatable forward and backward, and the ball nut 16 is attached to the ball screw 13 so as to be screwed.
  • the pole nut 16 is integrally attached to the slide table 12 without rotating, and slides in both directions along the ball screw 13 by the forward and reverse rotation of the ball screw 13.
  • the slide table 12 integrally mounted with the ball nut 16 slides in the Y direction along each of the guide rails 14 and 15.
  • a pedestal 19 is arranged on the slide table 12 in a horizontal state.
  • the pedestal 19 is slidably supported by a pair of guide rails 21 arranged in parallel on the slide table 12.
  • Each guide rail 21 is arranged along an X direction orthogonal to the Y direction, which is the slide direction of the slide table 12.
  • a pole screw 22 is disposed in the center between the guide rails 21 in parallel with each guide rail 21 so that the pole screw 22 can be rotated forward and backward by the motor 23. .
  • a ball nut 24 is attached to the ball screw 22 in a state where it is screwed.
  • the pole nut 24 is integrally attached to the pedestal 19 in a non-rotating state, and is moved in both directions along the ball screw 22 by the forward and reverse rotation of the pole screw 22. Move. As a result, the pedestal 19 slides in the X direction along each guide rail 21.
  • a rotating mechanism 25 is provided on the pedestal 19, and a rotating table 26 on which a glass substrate 50 to be cut is mounted is provided on the rotating mechanism 25 in a horizontal state. ing.
  • the rotation mechanism 25 rotates the rotary table 26 around a central axis along the vertical direction, and rotates the rotary table 26 so as to have an arbitrary rotation angle with respect to the reference position. Can be done.
  • a glass substrate 50 is fixed by, for example, a suction chuck.
  • a support 31 is disposed at an appropriate distance from the rotary table 26.
  • the support table 31 is horizontally supported by the lower end of the optical holder 33 arranged vertically.
  • the upper end of the optical holder 33 is attached to the lower surface of a mount 32 provided on the gantry 11.
  • a laser oscillator 34 that oscillates a laser beam is provided on the mounting table 32, and the laser beam oscillated from the laser oscillator 34 irradiates the optical system held in the optical holder 33. Is done.
  • the laser beam applied to the inside of the optical holder 33 is applied to the glass substrate 50 placed on the turntable 26 from the lower end surface of the optical holder 33.
  • the glass substrate 50 is irradiated as an oblong laser spot extending long in a predetermined direction by an optical system held in an optical holder 33.
  • the support table 31 attached to the lower end of the optical holder 33 is provided with a cutter wheel chip 35 that forms a cut on the surface of the glass substrate 50.
  • the cutter wheel chip 35 is used for forming a crack at the end of the glass substrate 50 as a trigger of a blind crack along the longitudinal direction of the laser beam to be irradiated. It is held by the chip holder 36 so as to be able to move up and down.
  • the support table 31 is placed near the optical holder 33, and the cooling position is A chimney 37 is provided. From the cooling nozzle 37, a cooling medium such as cooling water, He gas, N 2 gas, and C 2 gas is injected onto the glass substrate 50. The cooling medium sprayed from the cooling nozzle 37 is blown to a position close to the longitudinal end of the laser spot irradiated on the glass substrate 50 from the optical holder 33.
  • a cooling medium such as cooling water, He gas, N 2 gas, and C 2 gas is injected onto the glass substrate 50.
  • the cooling medium sprayed from the cooling nozzle 37 is blown to a position close to the longitudinal end of the laser spot irradiated on the glass substrate 50 from the optical holder 33.
  • the support base 31 is provided with an imaging mechanism 40 for imaging the surface of the glass substrate 50 near the cooling nozzle 37.
  • the imaging mechanism 40 has a CCD (solid-state imaging device) arranged in a predetermined area close to a cooling medium blown from the cooling nozzle 37 onto the glass substrate 50 via an optical system 42.
  • a camera 41 is provided.
  • the imaging area of the CCD camera 41 is an area along the longitudinal direction of one laser beam irradiated on the glass substrate 50, and is an area close to a position where the coolant is blown from the cooling nozzle 37.
  • the scribing apparatus is provided with a pair of CCD cameras 38 and 39 for imaging alignment marks pre-patterned on the glass substrate 50, and the CCD cameras 38 and 39 capture images.
  • Monitors 28 and 29 for displaying images are provided on the mount 32, respectively.
  • the glass substrate 50 cut into a predetermined size is placed on a rotary table 26 of the scribe device and fixed by suction means. Is done. Then, the alignment marks provided on the glass substrate 50 are imaged by the CCD cameras 38 and 39. The captured alignment marks are displayed on monitors 28 and 29, and the position information of the alignment marks is processed by an image processing device (not shown) for positioning the table. Thereafter, the rotary table 26 on which the glass substrate 50 is placed is positioned at a predetermined position with respect to the support table 31, and the glass substrate 50 is scribed by a laser beam.
  • an elliptical laser spot irradiated from the optical holder 33 onto the surface of the glass substrate 50 is used.
  • the longitudinal direction of the cut is in the X direction along the scribe line formed on the glass substrate 50.
  • Positioning of the rotary table 26 is performed by sliding the slide table 12, sliding the pedestal 19, and rotating the rotary table 26 by the rotating mechanism 25.
  • the rotary table 26 When the rotary table 26 is positioned with respect to the support 31, the rotary table 26 is slid along the X direction, and the end of the glass substrate 50 faces the cutter wheel chip 35. Then, the cutter wheel chip 35 descends, and a cut (TR in FIG. 2) is formed at the end of the glass substrate 50.
  • FIG. 2 is a schematic perspective view showing a beam irradiation state on a glass substrate 50 scribed by a scribe device
  • FIG. 3 is a plan view schematically showing a physical change state on the glass substrate 50. .
  • the method according to the patented invention disclosed in Japanese Patent No. 3027768 is suitable.
  • the laser beam oscillated from the laser-oscillator 34 forms an oblong laser spot L S on the surface of the glass substrate 50.
  • the laser spot LS has, for example, an elliptical shape in which the major axis b is 30.0 mm and the minor axis a is 1.0 mm, and is irradiated so that the major axis coincides with the direction of the scribe line to be formed. Is done.
  • the heating temperature by the laser spot L S is lower than the temperature at which the glass substrate 50 is melted, that is, lower than the softening point of the glass substrate.
  • the surface of the glass substrate 50 irradiated with the laser spot LS is heated without being melted.
  • Cooling water is sprayed on the cooling point CP on the scheduled line. Thereby, the cooling point CP on the surface of the glass substrate 50 is cooled. As a result, a temperature gradient occurs in a region between the laser spot LS and the cooling point CP.
  • Compressive stress is generated in the surface region of the glass substrate 50 heated by the laser spot LS, and tensile stress is generated in the cooling point CP where the cooling water is blown.
  • a compressive stress is generated in the heating area by the laser spot LS and a tensile stress is generated at the cooling point CP by the cooling water
  • a thermal stress is generated in the heat diffusion area HD between the laser-spot LS and the cooling point CP.
  • Due to the compressive stress a large tensile stress is generated in a region opposite to the laser spot LS with respect to the cooling point CP. Utilizing this tensile stress, a blind crack BC is generated along a line to be scribed from a cut formed by the cutter wheel chip 35 at the end of the glass substrate 50.
  • the depth (depth) ⁇ of the blind crack BC depends on the size of the laser spot LS, the size of the heat diffusion area HD, the laser spot LS and the moving speed V between the cooling point CP and the glass substrate 50. It is expressed by the following equation (1). However, as described above, a is the short diameter of the laser spot LS, b is the long diameter of the laser spot LS, and L is the length along the scribe line of the heat diffusion area HD (the laser spot LS and the cooling point CP). And k is a coefficient that depends on the thermophysical properties of the material (glass substrate) to be scribed, the heating beam irradiation density, and the like.
  • V k-a (b + L) / ⁇ ... (1)
  • the minor axis a of the laser spot LS is 1.0 mm
  • the major axis b of the laser spot LS is 30.0 mm
  • the length L along the scribe line of the thermal diffusion region HD is 2.
  • the moving speed of the glass substrate 50 is 300 mmZec
  • the power of the laser beam is 80 W
  • the depth of the blind crack BC is 120 im.
  • the glass substrate on which the scribe line is formed is thin and the scribe speed is low, for example, a glass substrate having a thickness of 0.5 to 0.7 mm suitable for 0 and a scribe speed of 3 O
  • the cooling point CP is formed outside the laser spot LS at low speeds such as mmZs
  • the blind cracks that make up the scribe lines become full body cuts that penetrate to the lower surface of the glass substrate, and the break process
  • the glass substrate is already cut before performing the process.
  • the cut target is full-podic cut. In other words, after scribing, it may be required that the object to be cut is transported to the break process and cut in the process.
  • the glass substrate may drop or fall off during the transportation to the breaking process, which may hinder the automatic cutting line of the glass substrate.
  • the scribing line formed in the scribing process so that it does not become a full body cut is formed at an appropriate depth to break correctly along the scribing line when breaking the glass substrate in the breaking process
  • the cooling spot CP formed by spraying the cooling medium may be formed inside the laser spot LS.
  • FIG. 7 is a schematic perspective view showing a beam irradiation state on the glass substrate in this case
  • FIG. 8 is a plan view schematically showing a physical change state on the glass substrate 50.
  • a cooling spot for forced cooling is formed near the highest point of the temperature or on the way down. For this reason, the cooling of the glass plate is started before the heating region by the laser beam reaches the lower surface of the glass plate, so that it is possible to prevent the blind crack from becoming a full body cut. Furthermore, even if the output of the laser beam fluctuates slightly, for example, around 10 W, or if the moving speed of the laser spot LS and the cooling point CP with respect to the glass substrate fluctuates slightly, the blind crack will be at an appropriate depth. Can be formed.
  • the laser light output used for scribe The permissible fluctuation range and the permissible fluctuation range of the moving speed of the laser spot LS and the cooling spot CP with respect to the glass substrate can be widened, so that a stable scribe can be performed.
  • the blind cracks B C formed in this manner are minute, and when the tensile stress caused by the cooling medium does not act, the blind cracks B C are almost invisible to the naked eye.
  • the blind crack BC formed on the surface of the glass substrate 50 has an opening with a large width when viewed from a microscopic view. It is in a state where it has been done.
  • the imaging mechanism 40 captures an image of a region close to the cooling point CP on which the cooling water is blown and where a large tensile force is acting.
  • the length of the imaging area CF of the imaging mechanism 40 is determined in consideration of the resolution of the CCD element to be used, an object to be detected, and various detection conditions due to illumination irradiation. Therefore, when it is necessary to increase the resolution to increase the detection sensitivity at high speed and to capture images in a wide range, an image processor with a high-resolution image sensor and a storage area with a large amount of captured data is required. .
  • the hardware and software configuration is designed so that these setting data can be changed in the event that the data comes in.
  • FIG. 4 is a schematic configuration diagram of the imaging mechanism 40.
  • the imaging mechanism 40 is configured so that the CCD camera 41 captures an image of the imaging area CF on the surface of the glass substrate 50, which is enlarged by the optical system 42 disposed opposite to the imaging area CF on the surface of the glass substrate 50. Has become.
  • the imaging area CF on the surface of the glass substrate 50, which is imaged by the CCD camera 41, is a portion close to the area where the cooling water is blown.
  • the open state of the crack changes to the closed state within a short time, so the area where the blind crack BC is most easily optically confirmed is the cooling point Directly below the CP.
  • the CCD camera 41 is arranged so as to be able to image a portion immediately below the cooling point CP.
  • L in equation (1) is a negative value, that is, even when the cooling point CP is located inside the laser spot LS, the blind crack is optically generated just below the cooling point CP. You can check.
  • the optical system 42 is provided with illumination light emitted from the light source 43, and the light illuminates the imaging region on the surface of the glass substrate 50.
  • FIGS. 9 (a) and (b) are schematic diagrams illustrating the preferred angle range of a light source 43 installed to illuminate the blind crack BC and a CCD camera 41 for imaging the blind crack BC, respectively.
  • FIG. 9 (a) and (b) are schematic diagrams illustrating the preferred angle range of a light source 43 installed to illuminate the blind crack BC and a CCD camera 41 for imaging the blind crack BC, respectively.
  • Image data captured by the CCD camera 41 is transmitted to an image processing device 45 via a camera 'control' unit (CCU) 44.
  • the output of the image processing device 45 is given to a control circuit 46 for controlling the entire scribe device.
  • the image processing device 45 reads the image data captured by the CCD camera 41 at a predetermined time interval and compares it with the image data of a normal blind crack BC stored in advance.
  • FIG. 5A shows an example of an image when image data of a normal blind crack BC stored in advance is displayed on a monitor.
  • a plurality of image data are read during scribing (during formation of blind cracks), and
  • the confirmation processing may be performed in real time in accordance with a series of movements related to the automatic scribe operation.
  • the blind crack BC is formed stably from near the start end of the glass substrate 50, the blind crack BC is continuously formed to the end, so that the blind crack BC near the end of the scribe line is scheduled. If BC can be confirmed, it is almost the same as confirming that blind crack BC is formed in a line on the scheduled scribe line almost certainly.
  • the image processing device 45 indicates that the image data captured by the CCD camera 41 substantially matches the stored image data of the blind crack BC (the result of pattern matching between the two image data). If the degree of coincidence is within a predetermined allowable range), a ⁇ K signal indicating that the blind crack BC is well formed is output to the control circuit 46. On the other hand, if the image data captured by the CCD camera 41 does not substantially match the stored image data of the blind crack BC (the above matching degree is out of the allowable range), An NG signal is output to the control circuit 46 indicating that the blind crack BC is not properly formed.
  • FIG. 5 (b) shows an example of an image when the image data in an abnormal state where the blind crack BC is not properly formed is displayed on a monitor.
  • the line as shown in Fig. 5 (a) will not be displayed on the monitor.
  • the OK signal is output from the image processing device 45
  • the control circuit 46 is controlled to continue the scribe forming operation on the glass substrate 50.
  • the NG signal is output from the image processing device 45
  • the NG signal is output to the glass substrate 50.
  • a warning is issued to notify the operator of the occurrence of an abnormality so that the glass substrate 50 is not sent to the subsequent process.
  • the scribe forming operation is interrupted and an alarm is issued. It can be recognized that the blind cracks BC are not formed on the glass substrate 50 being formed. As a result, the operator removes the glass substrate 50 on the rotary table 26 of the scribe device as a defective product, and supplies the defective glass substrate 50 on which the blind crack BC is not formed to the next breaking step. There is no danger.
  • a control system based on this image processing is incorporated in an automatic line device, it is possible to automatically discharge NG products with poor crack formation.
  • FIG. 10 is a schematic diagram of an automatic glass substrate dividing line 100 showing an example of an automatic line for dividing a glass substrate 50 into which a breaking device is incorporated, following a scribing device.
  • the automatic glass substrate cutting line 100 has an apparatus configuration for cutting a single glass substrate, and includes a cassette loader 110 1 equipped with a cassette containing the glass substrate 50 and a cassette loader 100. After placing the glass substrate 50 pulled out from 1, a conveyor 102 for positioning the placed glass substrate 50, a scribing device 103 of the present invention for scribing the glass substrate 50, After placing the glass substrate 50 on which the scribe line is formed, it is composed of a conveyor 104 for positioning and two separate tables, and at least one of the tables is rotated downward to rotate the glass substrate. Breaking device 105 for bending glass substrate 50 along the scribe line by bending 50, and unloading glass substrate 50B outside glass substrate automatic cutting line 100 And an unloading conveyor 106. Each part of the glass substrate automatic cutting line 100 has a glass substrate in each state. Robots R1 to R5 for carrying the plate 50 are provided.
  • the glass substrate 50 stored in the cassette of the cassette loader 101 is taken out by the robot (feeding robot) R1, and the taken out glass substrate 50 is placed on the conveyor 102. Is done. Next, on the front side of the conveyor 102, the glass substrate 50 is positioned. Thereafter, the glass substrate 50 is held by a robot (transport robot) R2 and transported into the scribe device 103.
  • the transported glass substrate 50 is placed on a table in the scribe device 50.
  • a blind crack BC is formed on the glass substrate 50 along a previously designed line.
  • an NG signal is output from the image processing device 45 and the scribing device 103 The operation of is stopped, and an alarm to notify the occurrence of an abnormality is issued.
  • the glass substrate 50 is held by the robot (transport opening pot) R3 and conveyed. It is placed on 104.
  • the glass substrate 50 placed on the conveyor 104 is positioned at the front side of the conveyor 104, and the robot (transport opening pot) R4 has the blind crack BC of the glass substrate 50. It is transported in the breaker 105 so as to be located at the center between the divided tables.
  • the glass substrate divided into a plurality of sheets by the breaker 105 (hereinafter each glass substrate divided into a plurality of sheets is referred to as a glass substrate 50B) is taken out by a mouth pot (transport robot) R5 and conveyed. Place on 106.
  • the scribing apparatus and the scribing method for a brittle substrate according to the present invention can reliably detect that no blind crack is formed on the glass substrate, so that the glass substrate without the blind crack is formed. However, it is possible to prevent in advance from being supplied to a dividing step which is a subsequent step. Therefore, it is possible to prevent a decrease in yield and a decrease in cutting efficiency when the brittle substrate is cut.

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Abstract

L'invention concerne un procédé permettant de tracer des lignes de rayure sur un substrat fragile, selon les étapes suivantes: échauffement d'un substrat en verre (50) par application continue de tâche laser à la surface du substrat (50) le long d'une zone dans laquelle on souhaite tracer une ligne de rayure à une température inférieure à celle du point de ramollissement du substrat, et en parallèle, refroidissement continu de ladite zone par injection d'eau de refroidissement via une buse de refroidissement (37), ce qui permet de former une fissure aveugle le long de la ligne de rayure prévue. Un mécanisme d'imagerie (40) réalise par imagerie une zone de formation de fissure aveugle à proximité de la zone de la surface du substrat dans laquelle est injectée l'eau de refroidissement, et vérifie que la fissure est formée sur la base des données d'image traitée en imagerie.
PCT/JP2002/005815 2001-06-11 2002-06-11 Dispositif et procede pour le dessin de lignes de rayure sur substance fragile WO2002100620A1 (fr)

Applications Claiming Priority (2)

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JP2001176372 2001-06-11
JP2001-176372 2001-06-11

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WO2002100620A1 true WO2002100620A1 (fr) 2002-12-19
WO2002100620B1 WO2002100620B1 (fr) 2003-03-06

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KR101140164B1 (ko) * 2005-10-28 2012-04-24 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료 기판의 스크라이브 라인 형성방법 및 스크라이브라인 형성장치
US8720228B2 (en) 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
CN104493365A (zh) * 2014-12-15 2015-04-08 江南大学 一种水射流-激光刻蚀陶瓷的装置及方法
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101140164B1 (ko) * 2005-10-28 2012-04-24 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료 기판의 스크라이브 라인 형성방법 및 스크라이브라인 형성장치
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US9533910B2 (en) 2009-08-28 2017-01-03 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
US10358374B2 (en) 2009-11-30 2019-07-23 Corning Incorporated Methods for laser scribing and separating glass substrates
US8720228B2 (en) 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
CN104493365A (zh) * 2014-12-15 2015-04-08 江南大学 一种水射流-激光刻蚀陶瓷的装置及方法

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