TWI296612B - - Google Patents

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Publication number
TWI296612B
TWI296612B TW092119507A TW92119507A TWI296612B TW I296612 B TWI296612 B TW I296612B TW 092119507 A TW092119507 A TW 092119507A TW 92119507 A TW92119507 A TW 92119507A TW I296612 B TWI296612 B TW I296612B
Authority
TW
Taiwan
Prior art keywords
scribing
brittle material
blade
head
line
Prior art date
Application number
TW092119507A
Other languages
English (en)
Chinese (zh)
Other versions
TW200403192A (en
Inventor
Wakayama Haruo
Original Assignee
Mitsuboshi Diamond Ind Co Ltdl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltdl filed Critical Mitsuboshi Diamond Ind Co Ltdl
Publication of TW200403192A publication Critical patent/TW200403192A/zh
Application granted granted Critical
Publication of TWI296612B publication Critical patent/TWI296612B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
TW092119507A 2002-07-18 2003-07-17 Method of scribing on brittle material, scribe head, and scribing apparatus with the scribe head TW200403192A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002209823 2002-07-18

Publications (2)

Publication Number Publication Date
TW200403192A TW200403192A (en) 2004-03-01
TWI296612B true TWI296612B (ja) 2008-05-11

Family

ID=30767701

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092119507A TW200403192A (en) 2002-07-18 2003-07-17 Method of scribing on brittle material, scribe head, and scribing apparatus with the scribe head

Country Status (6)

Country Link
JP (1) JP4205664B2 (ja)
KR (1) KR100647456B1 (ja)
CN (1) CN1668431B (ja)
AU (1) AU2003281461A1 (ja)
TW (1) TW200403192A (ja)
WO (1) WO2004009311A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005024497B4 (de) * 2005-05-27 2008-06-19 Schott Ag Verfahren zum mechanischen Brechen von geritzten flachen Werkstücken aus sprödbrüchigem Material
KR101182539B1 (ko) * 2005-12-01 2012-09-12 미쓰보시 다이야몬도 고교 가부시키가이샤 스크라이브 장치의 팁홀더 교환 방법
US8051681B2 (en) * 2007-05-09 2011-11-08 Corning Incorporated Constant force scoring device and method for using same
KR101200390B1 (ko) * 2007-06-06 2012-11-12 미쓰보시 다이야몬도 고교 가부시키가이샤 핸드 커터용 팁 홀더 및 그것을 구비한 핸드 커터
JP5450964B2 (ja) * 2008-02-29 2014-03-26 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
KR100941080B1 (ko) * 2008-04-30 2010-02-10 세메스 주식회사 스크라이빙 장치 및 방법과, 이를 이용한 기판 절단 장치
TWI498293B (zh) * 2011-05-31 2015-09-01 Mitsuboshi Diamond Ind Co Ltd 劃線方法、鑽石尖、劃線裝置
TWI562264B (en) * 2012-12-19 2016-12-11 Genesis Photonics Inc Splitting apparatus and splitting method
JP6519381B2 (ja) * 2015-07-27 2019-05-29 三星ダイヤモンド工業株式会社 脆性材料基板における垂直クラックの形成方法および脆性材料基板の分断方法
CN107775825A (zh) * 2016-08-30 2018-03-09 三星钻石工业股份有限公司 金刚石刀具及其划线方法
JP2018051945A (ja) * 2016-09-29 2018-04-05 三星ダイヤモンド工業株式会社 ダイヤモンドツール及びそのスクライブ方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0857846A (ja) * 1994-08-19 1996-03-05 Hitachi Ltd ダイヤモンド・ポイントスクライブ装置
JP4191304B2 (ja) * 1999-03-03 2008-12-03 三星ダイヤモンド工業株式会社 チップホルダー
JP4249373B2 (ja) * 2000-05-16 2009-04-02 三星ダイヤモンド工業株式会社 脆性材料のクロススクライブ方法
WO2003011777A1 (fr) * 2001-07-18 2003-02-13 Mitsuboshi Diamond Industrial Co., Ltd. Tete de decoupe, dispositif de decoupe et procede de decoupe utilisant cette tete de decoupe

Also Published As

Publication number Publication date
JP4205664B2 (ja) 2009-01-07
WO2004009311A1 (ja) 2004-01-29
CN1668431B (zh) 2010-06-09
CN1668431A (zh) 2005-09-14
AU2003281461A1 (en) 2004-02-09
TW200403192A (en) 2004-03-01
KR20050013220A (ko) 2005-02-03
KR100647456B1 (ko) 2006-11-23
JPWO2004009311A1 (ja) 2005-11-17

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees