AU2003281461A1 - Method of scribing on brittle matetrial, scribe head, and scribing apparatus with the scribe head - Google Patents
Method of scribing on brittle matetrial, scribe head, and scribing apparatus with the scribe headInfo
- Publication number
- AU2003281461A1 AU2003281461A1 AU2003281461A AU2003281461A AU2003281461A1 AU 2003281461 A1 AU2003281461 A1 AU 2003281461A1 AU 2003281461 A AU2003281461 A AU 2003281461A AU 2003281461 A AU2003281461 A AU 2003281461A AU 2003281461 A1 AU2003281461 A1 AU 2003281461A1
- Authority
- AU
- Australia
- Prior art keywords
- scribe head
- scribing
- matetrial
- brittle
- scribing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
- C03B33/107—Wheel design, e.g. materials, construction, shape
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002209823 | 2002-07-18 | ||
JP2002-209823 | 2002-07-18 | ||
PCT/JP2003/009127 WO2004009311A1 (en) | 2002-07-18 | 2003-07-17 | Method of scribing on brittle matetrial, scribe head, and scribing apparatus with the scribe head |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003281461A1 true AU2003281461A1 (en) | 2004-02-09 |
Family
ID=30767701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003281461A Abandoned AU2003281461A1 (en) | 2002-07-18 | 2003-07-17 | Method of scribing on brittle matetrial, scribe head, and scribing apparatus with the scribe head |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP4205664B2 (en) |
KR (1) | KR100647456B1 (en) |
CN (1) | CN1668431B (en) |
AU (1) | AU2003281461A1 (en) |
TW (1) | TW200403192A (en) |
WO (1) | WO2004009311A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005024497B4 (en) * | 2005-05-27 | 2008-06-19 | Schott Ag | Method for mechanically breaking scored flat workpieces from brittle material |
KR101251107B1 (en) * | 2005-12-01 | 2013-04-05 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Scribe methode |
US8051681B2 (en) * | 2007-05-09 | 2011-11-08 | Corning Incorporated | Constant force scoring device and method for using same |
US20100186239A1 (en) * | 2007-06-06 | 2010-07-29 | Hirotake Haraguchi | Tip holder for manual cutter, and manual cutter having the tip holder |
JP5450964B2 (en) * | 2008-02-29 | 2014-03-26 | 三星ダイヤモンド工業株式会社 | Scribing apparatus and scribing method |
KR100941080B1 (en) * | 2008-04-30 | 2010-02-10 | 세메스 주식회사 | Scribing apparatus and method, and apparatus for cutting substrate using the same |
TWI498293B (en) * | 2011-05-31 | 2015-09-01 | Mitsuboshi Diamond Ind Co Ltd | Scribe method, diamond point and scribe apparatus |
TWI562264B (en) * | 2012-12-19 | 2016-12-11 | Genesis Photonics Inc | Splitting apparatus and splitting method |
JP6519381B2 (en) * | 2015-07-27 | 2019-05-29 | 三星ダイヤモンド工業株式会社 | Method of forming vertical cracks in brittle material substrate and method of dividing brittle material substrate |
CN107775825A (en) * | 2016-08-30 | 2018-03-09 | 三星钻石工业股份有限公司 | Diamond cutter and its scribble method |
JP2018051945A (en) * | 2016-09-29 | 2018-04-05 | 三星ダイヤモンド工業株式会社 | Diamond tool and its scribing method |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0857846A (en) * | 1994-08-19 | 1996-03-05 | Hitachi Ltd | Diamond-point scribing device |
JP4191304B2 (en) * | 1999-03-03 | 2008-12-03 | 三星ダイヤモンド工業株式会社 | Chip holder |
JP4249373B2 (en) * | 2000-05-16 | 2009-04-02 | 三星ダイヤモンド工業株式会社 | Method for cross-scribing brittle materials |
CN1863740B (en) * | 2001-07-18 | 2012-04-25 | 三星钻石工业股份有限公司 | Scribe head, scribe apparatus and scribe method using the scribe head |
-
2003
- 2003-07-17 TW TW092119507A patent/TW200403192A/en not_active IP Right Cessation
- 2003-07-17 WO PCT/JP2003/009127 patent/WO2004009311A1/en active Application Filing
- 2003-07-17 AU AU2003281461A patent/AU2003281461A1/en not_active Abandoned
- 2003-07-17 KR KR1020047020721A patent/KR100647456B1/en not_active IP Right Cessation
- 2003-07-17 CN CN038169444A patent/CN1668431B/en not_active Expired - Fee Related
- 2003-07-17 JP JP2004522756A patent/JP4205664B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPWO2004009311A1 (en) | 2005-11-17 |
JP4205664B2 (en) | 2009-01-07 |
CN1668431B (en) | 2010-06-09 |
WO2004009311A1 (en) | 2004-01-29 |
KR100647456B1 (en) | 2006-11-23 |
CN1668431A (en) | 2005-09-14 |
TW200403192A (en) | 2004-03-01 |
KR20050013220A (en) | 2005-02-03 |
TWI296612B (en) | 2008-05-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |