JPH0857846A - Diamond-point scribing device - Google Patents

Abstract

PURPOSE: To remove instantly a foreign matter to be generated by diamond-point scribing, by possessing a foreign matter removing mechanism removing the foreign matter to be generated by hurting by a diamond cutter. CONSTITUTION: In a diamond-point scribing device, after fancy paper tablet bodies 1 are stuck to a tape 4 of a frame 3 by arranging, a frame 3 is fixed to a stage 2 by a vacuum suction. After an end fringe of the single fancy paper tablet body 1 is recognized and positioned by a microscope after that, hurts 21 having fixed lengths are put in order on the top of the fancy paper tablet body 1. The hurts 21 are placed so as to run along a boundary of a sphere of an adjoining semiconductor laser chip and put into the central part. On the occasion of hurting 21, a vacuum suction and discharge mechanism is operated, therefore, since scratch scraps to be generated at the time of hurting is vacuum-sucked and discharged outside by passing through within a cutter guide 18 simultaneously with generation, it becomes that the scratch scraps do not stick to the surface of the fancy paper tablet body 1, that is, the sides which become the top and a laser beam emitting surface.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to at least a part of a scratch which serves as a guide for the cutting prior to the cutting of a plate-like object such as a single crystal plate on the main surface side of the plate-like object by a diamond cutter having a diamond attached to the tip thereof. Regarding diamond point scribe device to put.

[0002]

2. Description of the Related Art A semiconductor substrate (wafer) made of silicon
A dicing technique is known as a technique for manufacturing a semiconductor chip having a rectangular body by dividing the substrate into pieces. Regarding dicing, for example, “VLSI packaging technology (below)” issued by Nikkei BP, May 15, 1993, P14 to P16
"Electronic Materials" published by the Industrial Research Institute, March 1989, March 1, 1989, P31 and P32.

In the former document, dicing is to cut out each LSI chip from a wafer, and dicing method includes diamond blade dicing method,
It is described that there are a laser scribe method and a diamond point scribe method. In this document,
"Diamond blade dicing uses pure water as a grinding fluid. If the grinding fluid has a high specific resistance, the ground silicon chips tend to be charged with static electricity and adhere to the wafer. If it flows to the process, it may cause unexpected trouble. ”

In the diamond point scribing method according to the document of the VLSI packaging technology (below), a diamond point cutter (diamond cutter) is used to scratch the boundaries of individual chips with sharp corners of diamond. After that, the wafer is subjected to mechanical bending stress by, for example, a roller, and the cleavage of silicon is used to separate (break) into individual chips.

Further, in the diamond point scribing device according to the latter document, an elastic force (spring pressure) is applied by a spring to a diamond cutter having a diamond attached to its tip, and this spring pressure causes the main surface of the wafer ( It is described that scratches for cleavage (hereinafter simply referred to as scratches) are formed on the surface).

On the other hand, in the semiconductor laser, crystal planes (cleavage planes) at both ends of a substrate (semiconductor substrate) made of a compound semiconductor are used as emission surfaces (mirror surfaces) for emitting laser light. The cleaved surface has a semiconductor laser element formed on a semiconductor substrate (wafer) obtained by slicing a compound semiconductor ingot, scratches one edge of the wafer, and then external force is applied to the scratched portion by a diamond cutter or the like. Is added to cause cleavage at the scratched portion. By cleaving the wafer, an elongated strip body (semiconductor substrate) having a width of, for example, about 0.25 to 0.4 mm is obtained. The strip body is divided at intervals of, for example, about 0.3 mm by the same cleavage technique as described above (that is, scratching and breaking by diamond point scribing). As a result, a semiconductor laser chip having a rectangular body is manufactured. As a technique for cleaving a wafer for manufacturing a semiconductor laser, a technique described in JP-A-62-133800 is known.

On the other hand, a scribing device for scribing compound semiconductor wafers is commercially available (a point scribing device with a recognition device described on page 4 of "INFORMATION" issued by Daitron Technology Co., Ltd.).

[0008]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Applicant
In the manufacture of semiconductor laser chips, the cutting of the strip after the wafer is cleaved to form the strip is not damaged by the diamond point scribing device in order to prevent the emission surfaces of both sides from being contaminated. It's done with breaking.

The diamond point scribing device is similar to the above-mentioned commercially available device, but after the wafer is fixed on the stage by vacuum suction, the movement pitch of the diamond diamond cutter is adjusted according to the chip size while observing the wafer with a microscope. It has a structure to set. This allows automatic one-way scribing.
In addition, the applicant of the present invention removes minute scratches (also referred to as foreign matter in this specification) generated at the time of scribing by blowing air (air blow) to the scribing site in the diamond point scribing device. I am trying.

However, the minute foreign matter generated when the wafer is scratched cannot be removed by air blow once it adheres to the surface of the wafer, which may lead to deterioration of product quality. In particular, in the case of strip-shaped scribing, foreign matter contamination on the side surface (the surface that becomes the emission surface) causes a fatal defect as described above.

Therefore, the present inventors have examined a method of removing foreign matter adhering to the strip by cleaning the strip after scratching a part of the strip with a diamond point scribing device. It has been found that the following problems occur in the case of cleaning.

(1) There is a high risk that the cleaning liquid permeates the cleaning liquid after the cleaning and then stains, that is, a so-called stain is generated.
Since this stain contains the above-mentioned scratching dust (foreign matter) which is also conductive, it easily causes an electrical short circuit.

(2) Further, since the thin strip is attached to the tape, it may be easily peeled off from the tape by the cleaning liquid, which causes a trouble in the later process and causes a decrease in yield.

(3) Further, it is very difficult to completely remove the foreign matter once attached to the semiconductor substrate.

The present inventors have attempted to develop a technique capable of instantaneously removing foreign matter when scratches (foreign matter) occur, before the foreign matter adheres to the surface of a semiconductor substrate.

An object of the present invention is to provide a diamond point scribing apparatus capable of instantaneously removing foreign matter generated by diamond point scribing.

The above and other objects and novel features of the present invention will be apparent from the description of the present specification and the accompanying drawings.

[0018]

The outline of the representative ones of the inventions disclosed in the present application will be briefly described as follows. That is, the diamond of the present invention
The point scribing device is a diamond point scribing device that scratches a part of the main surface of a strip made of a compound semiconductor substrate that is an elongated plate-like object with a diamond cutter, and scratches caused by the scratching of the diamond cutter. It has a structure having a foreign matter removing mechanism for removing dust (foreign matter). The foreign matter removing mechanism is configured by a vacuum suction / exhaust mechanism including a tubular body (cutter guide) that surrounds a part or the whole of the periphery of the diamond cutter and an exhaust mechanism that evacuates the tubular body. .

In a diamond point scribing apparatus having a vacuum suction / exhaust mechanism according to another embodiment of the present invention, a diamond is directly or indirectly formed on the lower surface of the tubular body (cutter guide) facing the semiconductor substrate. A flexible brush is provided so as to surround the entire circumference of the cutter.

A diamond according to another embodiment of the present invention
The point scribing device is a diamond point scribing device that scratches a part of the main surface of the strip made of the semiconductor substrate with a diamond cutter, and the foreign matter removing mechanism is arranged around the diamond cutter. It has a structure including an electrostatic attraction / removal mechanism including an anode electrode and a cathode electrode that electrically attract the foreign matter.

[0021]

According to the above means, since the diamond point scribing apparatus of the present invention has the foreign matter removing mechanism by the vacuum suction / exhaust mechanism, the main surface of the semiconductor substrate (rectangular body) is scratched by the diamond cutter. Since the foreign matter generated at the time of attachment is vacuumed and exhausted, it becomes difficult for the foreign matter to adhere to the surface of the semiconductor substrate, particularly to the side surface which becomes the emitting surface.

In a diamond point scribing device with a vacuum suction / exhaust mechanism according to another embodiment of the present invention, a flexible brush is provided over the entire circumference on the lower surface side of the tube body facing the strip body. Since the structure is provided, it becomes difficult for foreign matter generated when scratched by the diamond cutter to escape to the outside of the brush, and removal of foreign matter by vacuum suction and exhaust becomes reliable.

A diamond according to another embodiment of the present invention
In the point scribing device, the foreign matter generated when scratching the diamond cutter is charged and is attracted to the anode electrode or the cathode electrode arranged near the diamond cutter, so that the foreign matter generated when scratching the diamond cutter is a strip surface, In particular, it becomes difficult to adhere to the side surface that becomes the emission surface.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1 is a perspective view showing an essential part of a diamond point scribing device according to a first embodiment of the present invention, FIG. 2 is a schematic front view showing an essential part of the diamond point scribing device, and FIG. 3 is also attached to a tape. FIG. 4 is a perspective view showing the formed strip, FIG. 4 is a schematic sectional view showing a damaged state by the diamond cutter of the first embodiment, and FIG. 5 is a schematic partially enlarged sectional view showing the damaged state.
Is a perspective view showing a strip body similarly damaged, and FIG. 7 is a schematic perspective view showing a semiconductor laser chip formed by breaking after scratching.

The diamond point scribing apparatus of the present invention, as shown in FIGS. 2 and 1, has a test table (stage) 2 on which a strip 1 made of an elongated semiconductor substrate which is an object to be processed is placed. There is. The strip 1 is a GaAs-based or IuP-based compound semiconductor for manufacturing a semiconductor laser, and has a width of about 0.3 mm and a thickness of 0.
It is about 1 mm.

In the figure, the strip 1 is illustrated as being simply placed on the stage 2. However, as shown in FIG. 3, the strip 1 is actually one side of the donut-shaped frame 3. A plurality of tapes 4 are attached side by side by the adhesive force of the tape. Then, as shown in FIG. 1, the tape 4 portion is fixed to the stage 2 by vacuum suction. The stage 2 can be moved and controlled in the plane XY directions and can also be rotated.

A frame 10 is arranged on the side of the stage 2. A support plate 11 is fixed to the upper surface side of the frame 10, and a holder 12 extending in the horizontal direction is attached to the support plate 11 via a support shaft 13 so as to be vertically swingable. Also, the holder 12
An arm 14 is attached to the tip (left end in the figure) of the.

The tip of the arm 14 is provided at the cutter head 1.
5, the adjustment head 16 extending in the Y direction is rotatably attached to the cutter head 15. As shown in FIG. 4, a cylindrical cutter guide 18 for guiding a diamond cutter 17 is fixed to the adjustment shaft 16 in a penetrating state. Therefore, the adjustment shaft 16
If the left and right are rotated and adjusted, the lower end of the cutter guide 18 moves back and forth in the X direction. Thereby, the angle of the diamond cutter 17 can be freely set. Although not shown, a diamond blade is attached to the tip (lower end) of the diamond cutter 17.

The diamond cutter 17 is arranged concentrically with the cutter guide 18, and the cutter guide 18 is provided.
It is fixed by a support piece 19 attached to the inside of the.
That is, the entire circumference (entire circumference) of the diamond cutter 17 is surrounded by the cutter guide 18.
A pipe 20 (see FIG. 4) connected to a vacuum pump system (not shown) is connected to the upper end of the cutter guide 18.

Then, air is sucked from the tip (lower end) of the cutter guide 18 by operating a switch on an operation panel of a control device (not shown). That is,
The pipe 20 is connected to a vacuum pipe laid in the factory, or directly connected to a vacuum pump,
By operating the switch, the inside of the cutter guide 18 is evacuated and the associated exhaust is performed.
The vacuum suction / exhaust mechanism includes the cutter guide 18 and the pipe 2.
0, a vacuum source, etc.

As a result, as shown in FIGS. 4 and 5, a part of the strip 1 is scratched by the diamond cutter 17.
When 1 is put in, scratches (foreign matter) generated when scratching 2
No. 2 is exhausted at the same time (instantaneously) as it is generated by the vacuum suction / exhaust mechanism, so that it does not adhere to the surface of the strip 1. The foreign material 22 is indicated by a dot in FIG. 4 and a small circle in FIG. During the scratching, the diamond cutter 17 is moved relative to the stage 2 to scratch it.

On the other hand, an abutment 25 is fixed to the portion of the frame 10 corresponding to the intermediate portion of the holder 12. At the lower part of this abutment 25, a receiving portion 2 that supports the holder 12
6 is provided to support the holder 12 which swings its tip up and down. Further, a spring accommodating portion 28 in which a cutter loading spring 27 is built-in is provided above the abutment 25. The lower end of the cutter loading spring 27 is structured so as to ride on the holder 12. Further, a load adjusting screw 29 is provided on the ceiling portion of the spring accommodating portion 28 so that the damage force (pressing force) of the diamond cutter 17 against the strip 1 can be adjusted by adjusting the load adjusting screw 29. Has become.

The rear end (right end in the figure) of the frame 10 is swingably attached to a part of the machine base 35 via a support pin 36. The vertical swing of the frame 10 is controlled by the rotation of a cam 39 mounted on the machine base 35 and fixed to a rotation shaft 38 of a motor 37.

Therefore, when the tip (left end) of the frame 10 is lowered by the rotation of the cam 39, the tip (lower end) of the diamond cutter 17 comes into contact with the strip 1. A diamond blade is attached to the tip of the diamond cutter 17, and the surface of the strip 1 is scratched by the applied load. That is, after the tip of the diamond cutter 17 comes into contact with the surface of the strip 1 and the frame 10 is further lowered, the cutter load spring 27 is bent by the amount of the lowering, and the load corresponding to the restoring force of the cutter load spring 27 is applied. Is strip 1 on stage 2
Will be added to the surface (top surface) of. The shape of the blade of the diamond cutter is not particularly limited,
The tip is conical, but the tip has a three-sided cone shape.

In the diamond point scribing apparatus of the first embodiment as described above, after the strips 1 are attached side by side to the tape 4 of the frame 3 as shown in FIG.
The frame 3 is fixed to the stage 2 by vacuum suction.
After that, after recognizing and positioning the edge of the single strip 1 by a microscope (not shown), while automatically feeding the pitch, as shown in FIG. 1 and FIG. Insert scratch 21 in sequence.

As shown in FIG. 6, the scratch 21 is formed along the boundary 40 between the adjacent semiconductor laser chip regions and in the central portion. The length of this scratch 21 is
For example, it is about 0.1 mm. Further, in the diamond point scribe of the strip 1, since both side surfaces of the strip 1 are important surfaces (emission surface) for emitting laser light, the scratch 21 due to the diamond point scribe is located at the center of the strip 1. Partially provided.

At the time of scratching, the vacuum suction / exhaust mechanism is operated. Therefore, the scraps (foreign matter) 22 generated at the time of scratching (scratching) are generated simultaneously with the cutter guide 18.
Since it is vacuum-sucked and evacuated to the outside through the inside, the foreign matter 22 does not adhere to the surface of the strip 1, that is, the upper surface and the side surface serving as the laser light emitting surface.

The strip 1 which has been scratched is divided by regular breaking, and a semiconductor laser chip 42 as shown in FIG. 7 is manufactured. FIG. 7 is a schematic view of the semiconductor laser chip 12, but when a predetermined voltage is applied to the upper and lower electrodes (not shown), the laser light 45 is emitted from both ends of the waveguide 43, that is, the emission surface 44. The emission surface 44 is a cleavage plane obtained by cleaving the crystal. Since the waveguide 43 is formed by the pn junction portion of the semiconductor, the exit surface 4 which is the end of the waveguide 43 is formed.
Adhesion of the conductive foreign matter 22 to 4 causes an electrical short circuit. Therefore, the emission surface 4 of the foreign matter 22 generated in the diamond point scribe
Adhesion to 4 must be avoided especially.

According to the diamond point scribing apparatus of the first embodiment, the foreign matter 22 generated during diamond point scribing is exhausted by the vacuum suction / exhaust mechanism before adhering to the surface of the strip 1 at the same time as it is generated. The foreign matter 22 can be prevented from adhering to the emission surface 44.

Here, an example of the dimensions of the semiconductor laser chip 42 will be described. The length along the waveguide 43 is 0.
25-0.4mm, width 0.3mm, height 0.1mm
Becomes Therefore, such a semiconductor laser chip 4
Since the strip 1 for forming 2 is minute and the strip 1 is adhered to the tape 4 by the adhesive force of the tape 4, cutting with a diamond blade becomes impossible, and A semiconductor laser chip is achieved by diamond point scribing and breaking.

FIG. 8 shows a state in which a cleavage scratch 21 is formed on one edge of a compound semiconductor substrate (wafer 50) made of a GaAs-based or InP-based plate-like material. Also in this example, the foreign matter 22 (not shown) generated during diamond point scribing is vacuum suctioned and exhausted by the vacuum suction / exhaust mechanism before being attached to the surface of the wafer 50. After the scratch 21 is placed on one edge of the wafer 50, the wafer 50 is divided by a diamond cutter protruding from below to form the strip 1 as shown in FIG.

According to the diamond point scribing apparatus of the first embodiment, the foreign substances generated during the diamond point scribing are removed to the outside by the vacuum suction / exhaust mechanism at the same time as they are generated. No foreign matter will adhere to the surface of the object.

Further, in the diamond point scribing apparatus of the first embodiment, the diamond cutter 17
Has an integrated structure with the cutter guide 18. Therefore, the cutter guide 18 for the diamond cutter 17
It is convenient because there is no need to adjust the positional relationship of.
Further, when the diamond cutter 17 becomes unusable, it is only necessary to replace each of the cutter guides 18, and the replacement work is easy.

FIG. 9 shows a modification of the first embodiment of the present invention. In this structure, the cutter guide 18 surrounds the entire circumference (entire) of the diamond cutter 17, but is not provided integrally with the diamond cutter 17 but provided independently. Therefore, the diamond cutter 17
Can be moved and adjusted, though there is a limit due to the hole 51 in the ceiling portion of the cutter guide 18.

FIG. 10 shows another modification of the first embodiment of the present invention. In this structure, the cutter guide 18 takes in air from a partial area around the diamond cutter 17, and the foreign matter 2 generated when the diamond cutter 17 scratches
2 has a structure for vacuum suction and exhaust. In this structure, since the cutter guide 18 is provided only in a part, the front, rear, left, and right of the diamond cutter 17 can be freely adjusted.

FIG. 11 is a sectional view showing the main part of the second embodiment of the present invention. In this embodiment, a circular plate 55 is provided on the cutter guide 18 of the first embodiment, and a doughnut-shaped soft brush 56 is provided on the lower surface of the circular plate 55.
Has a structure. The tip of the brush 56 comes into contact with the surface of the strip body 1 while being elastically bent while being damaged.

According to the second embodiment, since the diamond cutter 17 is surrounded by the brush 56, the foreign matter 22 generated at the time of scratching does not come out of the brush 56. Further, the foreign matter 22 temporarily attached to the surface of the strip 1 may also be rubbed by the brush 56, scraped off and vacuum-exhausted.

In the second embodiment, the cutter guide 18
Although the circular plate 55 is attached to the lower portion of the diamond brush 17, and the brush 56 is attached to the lower portion, the brush 56 is provided on the entire lower end surface of the cutter guide 18 that surrounds the entire circumference of the diamond cutter 17. Brush the foreign material 22 with the brush 56
You can vacuum suction and exhaust without missing,
It is possible to reliably remove foreign matter.

FIG. 12 is a sectional view showing the main part of the third embodiment of the present invention. The foreign matter removing mechanism of the first and second embodiments is a vacuum suction / exhaust mechanism that suctions and removes the foreign matter 22 generated when the rectangular cutter 1 is scratched by the diamond cutter 17 by vacuuming. However, the foreign matter removing mechanism of the third embodiment is an electrostatic attraction / removal mechanism that removes foreign matter by adsorption due to static electricity.

That is, in the third embodiment, the cutter guide 18 surrounding the diamond cutter 17 is made of an insulating material and has a thick structure. And
A plurality of conical depressions 60 are provided on the lower surface of the cutter guide 18, and an electrode rod 61 having a tip protruding from the bottom of the conical depressions 60 is disposed through the conical depressions 60. One of the electrode rods 61 is an anode electrode 61a and the other is a cathode electrode 61b. A wiring 62 extending from a controller (not shown) is connected to the upper ends of the anode electrode 61a and the cathode electrode 61b. A plurality of pairs of negative and positive cathode electrodes 61b may be arranged. The cutter guide 18 is fixed to the holder 12 via a support arm 63.

In the diamond point scribing apparatus of the third embodiment, the electrode rod 61 is used as the anode electrode 61a or the cathode electrode 61b when the scratch is made. Semiconductors
At the diamond point scribe, it becomes charged,
It is attracted by being attracted to the anode electrode 61a or the cathode electrode 61b. As a result, the foreign matter 22 does not adhere to the surface of the entire circumference strip 1.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments described above, and various modifications can be made without departing from the scope of the invention. Needless to say. For example, even if the foreign matter removing mechanism has a structure having both the electrostatic attraction / removal mechanism and the vacuum suction / exhaust mechanism, the same effect as in the above-described embodiment can be obtained.

In the above description, the diamond point scribing technique in the manufacturing of semiconductor laser chips, which is the field of application of the invention made mainly by the present inventor, has been described, but the manufacturing of semiconductor devices such as semiconductor integrated circuit devices has been described. It can be applied to diamond point scribe technology in. That is, in the case of manufacturing a semiconductor chip for an integrated circuit or the like using a general silicon substrate, scribe lines (scratches) are formed from end to end of the wafer, and the scribe lines are formed in a lattice shape on the main surface of the wafer. Also in this case, the foreign matter generated at the time of scratching is removed at the same time as the foreign matter is removed by the vacuum suction / exhaust mechanism and the foreign matter removing mechanism including the anode electrode and the cathode electrode,
It will not adhere to the surface of the silicon wafer.

The present invention can be applied at least to the diamond point scribe technique prior to the breaking of the plate-like material.

[0055]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows. Since the diamond point scribing apparatus of the present invention has a vacuum suction / exhaust mechanism, when scratched by a diamond cutter, foreign matter generated at the same time as scratching forms a strip for forming a semiconductor laser chip. Since it is exhausted to the outside before adhering to the surface or side surface of the sheet which becomes the emission surface, it is possible to prevent foreign matter from adhering to the strip. As a result, the yield of semiconductor laser products and the reliability of the products can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view showing a main part of a diamond point scribing apparatus according to a first embodiment of the present invention.

FIG. 2 is a schematic front view showing a main part of the diamond point scribing apparatus according to the first embodiment.

FIG. 3 is a perspective view showing a pasted state of the strip body in the first embodiment.

FIG. 4 is a schematic cross-sectional view showing a scratched state by the diamond cutter of the first embodiment.

FIG. 5 is a schematic partially enlarged cross-sectional view showing a scratched state by the diamond cutter of the first embodiment.

FIG. 6 is a perspective view showing a strip body scratched by the diamond point scribing apparatus of the first embodiment.

FIG. 7 is a schematic perspective view showing a semiconductor laser chip formed by scratching by the diamond point scribing apparatus of the first embodiment and then breaking.

FIG. 8 is a schematic perspective view showing a main part of a diamond point scribing apparatus showing a state in which a peripheral edge portion of a wafer is scratched by scribing with the diamond cutter according to the first embodiment.

FIG. 9 is a sectional view showing an essential part of a diamond point scribing apparatus according to a modification of the first embodiment of the present invention.

FIG. 10 is a cross-sectional view showing the main parts of a diamond point scribing device according to another modification of the first embodiment of the present invention.

FIG. 11 is a sectional view showing an essential part of a diamond point scribing device according to a second embodiment of the scribing device of the present invention.

FIG. 12 is a sectional view showing a main part of a diamond point scribing device according to a third embodiment of the scribing device of the present invention.

[Explanation of symbols]

1 ... Strip body, 2 ... Stage, 3 ... Frame, 4 ... Tape, 10 ... Frame, 11 ... Support plate, 12 ... Holder, 1
3 ... Spindle, 14 ... Arm, 15 ... Cutter head, 16 ...
Adjustment shaft, 17 ... Diamond cutter, 18 ... Cutter guide, 19 ... Support piece, 20 ... Pipe, 21 ... Scratch, 22 ... Foreign material, 25 ... Abutment, 26 ... Receiving part, 27 ... Cutter load spring, 28 ... Spring Storage part, 29 ... Load adjusting screw, 35 ... Machine stand, 36 ... Support pin, 37 ... Motor, 38 ... Rotating shaft, 3
9 ... Cam, 40 ... Border, 42 ... Semiconductor laser chip, 4
3 ... Waveguide, 44 ... Emitting surface, 45 ... Laser light, 50 ... Wafer, 51 ... Hole, 55 ... Circular plate, 56 ... Brush, 60 ... Conical depression, 61 ... Electrode rod, 61a ... Anode electrode, 61b ... Cathode Electrodes, 62 ... Wiring, 63 ... Support arm.

Claims (5)

[Claims] 1. A diamond point scribing apparatus for scratching at least a part of a main surface of a plate-like object with a diamond cutter, comprising a foreign matter removing mechanism for removing foreign matter generated by scratching the diamond cutter. Characteristic diamond point scribe device. 2. The diamond point scribing apparatus according to claim 1, further comprising a vacuum suction / exhaust mechanism that vacuum-exhausts foreign matter generated by scratching the diamond cutter. Scribe device. 3. The diamond point scribing device according to claim 2, wherein the vacuum suction / exhaust mechanism encloses a part or all of the periphery of at least the tip of the diamond cutter, and a vacuum inside the body. A diamond point scribing device characterized by being constituted by an exhaust mechanism for generating exhaust. 4. The diamond point scribing device according to claim 2, wherein the lower surface side of the tubular body facing the plate-shaped object is flexible and surrounds the entire circumference of the diamond cutter. A diamond point scribe device that is equipped with a brush. 5. A diamond point scribing apparatus for scratching at least a part of a main surface of a plate-like object with a diamond cutter, wherein the foreign matter removing mechanism electrically removes the foreign matter arranged around the diamond cutter. A diamond point scribing device comprising an anode electrode and a cathode electrode that are electrically attracted.