200301755 玖、發明說明 【發明所屬之技術領域】 本發明，係關於適合例如玻璃、矽、陶瓷等非金屬性 脆性材料或塑膠片等非金屬材料之切斷的刀輪、及使用該 刀輪之劃線裝置、使用該刀輪之劃線方法。 【先前技術】 習知，對上述脆性材料之劃線，廣泛使用具備如圖18 所示具鈍角之刀鋒的刀輪Η。使用此刀輪Η之劃線，通常 ，係邊將適合脆性材料G之材質或厚度等各條件的荷重施 加於刀鋒，邊在脆性材料之表面上轉動刀輪Η來進行，藉 此在脆性材料表面形成連續之垂直裂痕Κ之線（刻痕）。 又’例如在玻璃基板之劃線製程中，如圖19所示，經 常進行玻璃基板G之交叉劃線。此時，發生所謂跳過交點 之現象，該現象係對第1方向作劃線時受劃線L1〜L3各兩 側所積蓄之內部變形之影響，當要在與第1方向交叉之第2 方向作劃線時，在與前述劃線L1〜L3之交點附近發生，以 致時常在該交點附近不能形成第2劃線L4〜L6。內部變形 ，係有關其以水平裂痕之形態出現於加工物表面而引起玻 璃屑（cullet)之產生等切斷後截面品質降低等問題的重要現 象，故有必要盡量減少內部變形之發生。因此，須使劃線 時之劃線動作穩定，具體而言，在劃線動作中使劃線壓力 保持在既定範圍內是重要的。於是，爲防止上述現象之發 生，習知在形成第2劃線L4〜L6時，將其刀鋒荷重增加至 形成第1劃線L1〜L3時之刀鋒荷重的約1.2至3倍。 200301755 又，塑膠片之劃線時，將塑膠片吸引固定於硬工作台 等上來作劃線。又，在塑膠片之情形，圖18所示之刀輪之 刀鋒角度則與脆性材料之情形不相同，形成銳角。 在脆性材料或塑膠片等加工對象物作劃線加工之情形 ，若使用在加工對象物之表面上轉動來加工對象物表面部 的刀輪時，所關心者乃是如何邊將刀輪之刀鋒部對加工對 象物之表面穩定地緊壓於緊壓方向而邊轉動移動。 因加工表面所發生之現象，係依加工對象物之材料是 脆性材料或是塑膠材料而不相同，故依材料別詳述如下。 首先，在脆性材料之情形，若觀察以刀輪Η在脆性材 料G產生垂直裂痕Κ之機構，則得知：首先藉由在刀鋒增 加荷重，在與脆性材料G表面之刀鋒抵接之部位產生彈性 變形，其次，伴隨刀鋒荷重之增大，在上述部位產生塑性 變形。進一步增大刀鋒荷重，就超過塑性變形之界限點， 其結果產生脆性破壞，在脆性材料之厚度方向開始成長垂 直裂痕Κ。該垂直裂痕Κ之成長，係當垂直裂痕Κ之前端 Μ，達到因應刀鋒荷重之大小及脆性材料之材質或厚度等 之到達深度Ρ(從脆性材料表面之距離）的時候終止。若就一 定之材質、一定之厚度來觀察它，則得知：能控制上述垂 直裂痕Κ之前端Μ達到之到達深度Ρ者僅爲刀鋒荷重。即 ，若增大刀鋒荷重，因刀輪Η之刀鋒侵入脆性材料G表面 之深度則變長，用以產生垂直裂痕Κ之能量則變大，故垂 直裂痕Κ之到達深度就變深。然而，若刀鋒荷重超過某一 定大小，雖然能獲得所謂深垂直裂痕Κ，但是與它同時積 200301755 蓄於脆性材料G表面附近之內部變形變成飽和狀態，產生 朝向與垂直裂痕K之成長方向完全不相同方向的裂痕，所 謂水平裂痕。此種水平裂痕，造成產生多量不希望存在之 切粉的原因。 本發明人等，將上述機構更詳細探究之結果，發現： 刀鋒荷重與垂直裂痕K之到達深度P間有如圖14所示之關 係。即，亦從此圖14所示之曲線圖明瞭，垂直裂痕K之到 達深度P，係先存在伴隨刀鋒荷重增大緩慢加深之領域（A 領域），接著，存在伴隨刀鋒荷重增大急劇增加之領域（B領 域），再者，存在刀鋒荷重雖增大但幾乎不增加之領域（C領 域）。並且，在此C領域，在A領域或B領域尙未見過之 水平裂痕就比垂直裂痕大幅增加。 從以上之事實，發現：藉由以相當於B領域，即伴隨 刀鋒荷重增大到達深度P就急劇增加之領域內，的刀鋒荷 重進行劃線，能不伴隨水平裂痕之產生而獲得深垂直裂痕 〇 【發明內容】 (一）發明所欲解決之技術問題 然而，得知：B領域之能設定刀鋒荷重的最適合範圍 係極爲狹窄，僅使用通常劃線時之刀鋒荷重之調整就在B 領域內不能作長時間穩定之劃線。 又，在交叉劃線，由於爲防止如前述跳過交點之產生 ，當形成第2劃線時需要大幅增加刀鋒荷重比第1劃線之 形成時大，刀鋒荷重則往往會進入上述C領域，因此有不 200301755 能避免多量切粉之產生的問題。 再者，與如上述之問題另外，使用上述習知之刀輪Η ，例如對玻璃基板作劃線，由於玻璃之起伏或彎曲，玻璃 表面之凹凸，或，保持刀輪之支持具或保持該支持具之劃 線頭之搖晃等的外來要因，時常會產生不能獲得穩定之劃 線。 又，上述所提之另一材料的塑膠，若是塑膠片之情形 ，由於塑膠片厚度之偏差或保持該板之工作台之平坦度， 或保持相對移動之刀鋒的部分之對該板高度方向之平行度 的偏差等，需要具有相當寬裕之刀鋒深度設定。因此，對 塑膠片之刀鋒侵入深度則變成不一定，在侵入深度淺之部 分就不容易使塑膠片分開，又在侵入深度深之部分就刀鋒 達至硬工作台，有損傷刀鋒前端之問題。 再者，例如液晶顯示用板之貼合透光性塑膠基板，將2 片重疊之基板切斷之情形等，受基板2片分之厚度偏差的 影響，當刀鋒前端深深侵入時，連使非切斷對象之下側基 板亦一起損傷，造成不良品之產生，相反地若是淺時，變 成不能分開，有製品之取出困難之問題。 (二）解決問題之技術手段 本發明人等，依據前述之見解，發現：對脆性材料， 若藉由穩定且不斷地施加相當於上述Β領域之刀鋒荷重的 劃線壓力，則能保持刀鋒對脆性材料之咬入量爲一定，不 僅能穩定且確實獲得不引起水平裂痕之產生而到達極深之 深度的垂直裂痕，同時能解決上述外來要因所造成之劃線 200301755 之不穩定化等問題，又，發現：若對塑膠片亦能保持刀鋒 之侵入深度爲一定，就不受塑膠片厚度之偏差等影響而能 形成一定深度之割痕。 在此種刀輪之使用法，重要之處在於：將刀鋒部轉動 而移動時，須儘可能減少：因加工物表面部之凹凸之影響 等由於轉動刀輪之刀鋒時的物理運動之不穩定性等所造成 的外亂之影響，致使刀鋒之加工性能不穩定。 鑒於此觀點，爲能獲得穩定之轉動動作，而於刀鋒兩 側面部設置當作限制機構之限制部，藉以用簡單之機構來 限制刀輪（緊壓加工物表面）刀鋒部之緊壓方向之動作。 即，本發明之非金屬材料用刀輪，其特徵在於：係邊 在非金屬材料表面上轉動邊對非金屬材料進行劃線者；於 其刀鋒之至少一側具有，限制刀鋒自該非金屬材料表面起 算之侵入深度的限制面。 依本發明，由於對刀輪在限制刀鋒之侵入深度的面與 刀鋒稜線之間的徑向距離，以次微米級之精度作精密加工 ’故對脆性材料，能獲得以刀鋒荷重之調整所不能得到之 B領域的垂直裂痕，對塑膠片，能穩定地獲得一定深度之 割痕。 並且，對於脆性材料，即使對刀鋒施加超過前述B領 域範圍之大荷重，因以刀鋒之至少一側之限制面抵接於脆 性材料表面來承受該荷重，故經常保持刀鋒對脆性材料之 侵入量爲一定，因此，能確實獲得不引起水平裂痕之產生 而到達極深之深度的垂直裂痕。 200301755 又，藉由如上述在刀鋒之至少一側具有限制面，因即 使施加大荷重於刀鋒亦不會產生水平裂痕，故能以增大刀 鋒荷重之方式去除如前述之外來要因，其結果能獲得穩定 之刻痕。 又，上述非金屬材料用刀輪，亦可將該限制面與刀輪 側面相接之周緣角部在全周均作成缺口。 此種形狀之刀輪適合於：將有多數個元件矩陣狀形成 於表面之玻璃基板或矽晶圓等脆性材料基板切成各元件單 位時的場合。即，在對露出上述元件間之基板面以刀輪劃 線之情形，若使用如圖18所示形狀的刀輪，刀鋒之傾斜面 就妨礙元件，而藉由將各限制面與各側面分別相接之周緣 角部在全周均作成缺口之形狀，能將刀鋒以不妨礙元件之 方式插入元件間，能對露出元件間之基板面作劃線。 又，上述非金屬材料用刀輪，亦可使刀鋒之刀鋒棱線 之位置比刀輪兩側面間之中心更靠近任一側面。 在此情形’亦適合將玻璃基板或矽晶圓等（於其表面有 矩陣狀形成之多數個元件）之脆性材料基板切成各元件單位 ° ，藉由使在有刀鋒棱線靠近之一側之刀輪側面面向元 件側面，能使刀鋒稜線比習知刀輪更接近元件，切斷基板 時’能不損傷元件而在各元件之最靠元件附近作劃線。 本發明之劃線裝置，其特徵在於：具備：載置非金屬 材料之工作台；配置於該工作台上方之劃線頭；及交叉劃 線機構’藉由該劃線頭在工作台上之被加工對象物形成互 相父叉之刻痕；並且在該劃線頭設有上述非金屬材料用刀 10 200301755 輪之任一種。 又，在此劃線裝置，亦可設置刀輪反轉機構，每次i 條刻痕形成完，即將刀輪方向反轉180° 。 藉此，不必翻轉基板即可對基板之既定部位，即接近 各元件之凸部或薄膜之部位，作劃線。 又，在上述劃線裝置，亦可使用具備2個刀輪者。此 情形，將該等刀輪配置成並排，並且使彼此之刀鋒稜線位 於最遠之位置。然後，上述2個刀輪就能以動作程式選擇 性地作同時或個別劃線。藉此，不需要如上述每次形成完1 條劃線就將刀輪反轉180° 。 又，在具備劃線頭相對載置非金屬材料之工作台往X 方向及/或Y方向移動之機構的劃線裝置，亦可在劃線頭設 置上述非金屬材料用刀輪之任一種。 再者，作爲手動刀具之劃線工具，亦可具備由筒狀柄 所構成的握取部、及設置於該握取部前端的刀片支持具， 並在該刀片支持具設置上述非金屬材料用刀輪之任一種。 又，本發明之劃線方法，係使用上述各種非金屬材料 用刀輪之非金屬材料劃線方法；其特徵在於：對該刀輪一 直加壓至其限制面接觸非金屬材料表面爲止，並且邊維持 刀鋒侵入非金屬材料內之狀態，邊使該刀輪朝既定方向轉 動，來對非金屬材料進行劃線。 【實施方式】 (發明之較佳實施例） 以下，參閱圖式說明本發明之實施例。 11 200301755 圖1，係本發明之實施例之刀輪1的立體圖，圖2係該 側視圖，圖3係該前視圖。 此刀輪1，係在其軸孔6插穿支軸（未圖示）後，在圖外 脆性材料表面上轉動；該刀輪係於其刀鋒2兩側具有限制 面3，用以限制刀鋒2自脆性材料表面算起之侵入深度。 上述刀鋒2之刀鋒角度Θ，若以玻璃等之脆性材料作爲 切斷對象時，宜設取100°〜165° 。刀鋒角度Θ若比100°小 就不能獲得刀鋒2所需要之強度，又若比165°大就刀鋒2 不容易侵入脆性材料內。又，刀鋒2之刀鋒稜線21與限制 面3間之徑向距離D，宜設定爲2μηι〜ΙΟΟμπι。若該距離比 2μηι小則在脆性材料不產生塑性變形，其結果不產生垂直 裂痕。又，若比ΙΟΟμπι大，則刀鋒2對脆性材料之咬入量 就太大，會使脆性材料破裂。又，雖距離D依脆性材料之 材質而異，但在脆性材料之厚度越厚的場合，若在上述範 圍內選定距離D，則較能有效地獲得深的垂直裂痕Κ。 又，至於上述刀鋒角度Θ與距離D之相配，則因應切斷 對象之脆性材料G之材質或厚度、及刀輪1本身之厚度等 ’在上述限制面3能確保達成既定功能之面積的範圍內適 宜選擇即可。 對於上述限制面3最好施以鏡面加工，藉此在劃線時 ’能使該限制面在被加壓於脆性材料G表面之狀態圓滑地 在該表面上轉動。 圖4，係表示本發明之其他實施例，在此例，刀輪1， 係將各限制面3與刀輪各側面4分別相接之周緣角部在全 12 200301755 周均作成缺口者。 在具此種形狀之刀輪1之情形，如圖6所示，適合將 玻璃基板或矽晶圓等（其表面有排成矩陣狀之多數個元件T) 脆性材料基板G切成元件T單位。即，在對露出元件T間 之基板面以此刀輪1作劃線之情形，能使刀輪1不干擾元 件T而插入元件T間，來對露出元件T間之基板面作劃線 〇 圖5，係表示本發明之其他實施例，在此例，刀輪1， 係使刀鋒2之刀鋒稜線21之位置比刀輪1兩側面4、4間 之中心更靠近任一側面4(在圖7K例係左側之側面4)者。 在此實施例，一方面能確保兩側面4間之厚度爲有足 夠機械強度之厚度，另方面則藉由將另一側面4與刀鋒之 刀鋒稜線的距離縮小，而能進行有與圖6所示實施例同樣 特徵之劃線。 在此情形，亦與圖4所示之實施例同樣，適合將玻璃 基板或矽晶圓等（在表面有排成矩陣狀之多數個元件T)脆性 材料基板G切成元件T單位。即，如圖7所示，藉由將靠 近刀鋒稜線21側之刀輪側面4面向元件T側面，能使刀鋒 稜線21比習知刀輪Η更接近元件T，基板G之切斷時，對 各元件Τ能在最靠近元件Τ之部位作劃線而不損傷元件Τ 〇 其次，本發明之劃線方法，係使用上述各實施例所示 之刀輪，如圖3所示，將刀輪1加壓至其限制面3抵接於 脆性材料G表面，並邊維持刀鋒2侵入於脆性材料G內之 13 20030175fj 狀態，邊使刀輪1朝既定方向（在圖3係垂直於紙面之方向） 轉動，來對脆性材料G作劃線。 在此，施加在刀鋒2之荷重大小，較佳者爲調整至使 它存在於圖14所示之B領域的値。即，即使到達雖增大刀 鋒荷重但垂直裂痕K之深度幾乎不增加的C領域，藉由刀 鋒2兩側之限制面3與脆性材料G之表面抵接，來承受其 荷重’因藉此抑制刀鋒2緊壓脆性材料G的劃線壓力之變 動’能保持對脆性材料G之侵入量爲經常一定，故能確實 獲得到達極深之深度之垂直裂痕K而不致產生水平裂痕， 同時因幾乎沒有水平裂痕之產生，能有效防止交叉劃線時 之跳過交點，而幾乎不產生切粉。 又，若要以圖5所示之上述實施例的刀輪1進行脆性 材料G之劃線，就如圖7所示，使刀輪1以靠近刀鋒稜線 21側之側面來面向元件T側面之方式緊貼於脆性材料G。 在此，因元件T於脆性材料G排列成矩陣狀，故順沿一列 的元件對最靠近此等元件側面之部位作劃線，若形成完1 條劃線，接著將刀輪1反轉180° ，順沿鄰接前列之列的元 件T對最靠近此等元件側面之部位作劃線，來形成第2條 劃線。 又，作劃線時，如上述，除每次形成完1條劃線就將 刀輪1反轉180。外，亦可使用如下之刀輪支持具（省略圖 示）：配置2個有如圖8所示關係之刀輪1、1，亦即，將2 個刀輪1、1並排，並且使彼此之刀鋒稜線21位於最遠之 位置。如上述使用2個刀輪1、1之情形，只要行走1次於 14 200301755 各元件T間，就能對脆性基板中，分別接近所鄰接之各元 件Τ之相對之各側面的部位能同時劃線，不需要如上述每 次形成完1條劃線就將刀輪1反轉180° ，故能提高作業性 〇 又，本發明之實施例之其他脆性材料的刀輪之一例， 係包含如圖9刀鋒部32兩側之限制面33與圓錐形狀之軸 部35形成一體的刀輪。該刀輪因軸部係圓錐形狀，故若以 最佳狀態保持刀輪於支持具之軸承而能旋轉，就不僅能減 低刀輪與軸承間所產生之摩擦阻力，而且刀輪本身之壽命 比刀輪長100倍以上。並且，亦可在刀鋒部32、限制面33 與軸部35以軟焊之方式接合與其等不同之其他構件之其他 材質，再作最後之加工即可。 本發明之刀輪，不限於上述脆性材料，亦能有效地使 用於切斷塑膠片。 例如，在液晶顯示板基板用透光性塑膠，使用厚度 0.2mm之丙烯酸樹脂，將此基板吸引固定於鐵料或鋁料之 硬工作台上並加以分開時，須使刀鋒之咬入量爲一定，例 如設定爲〇.15mm來形成割痕。 習知，若要以未具限制刀鋒咬入量的面之刀輪在透光 性塑膠基板形成割痕，就由於基板本身之厚度偏差或吸引 保持基板之工作台的平坦度之偏差，以及由於相對基板表 面平行移動的刀輪之高度偏差，刀輪所形成之割痕深度不 能保持一定。 因此，在形成於基板的割痕之深度淺的部位，基板不 15 200301755 容易分開，在割痕已到達基板背面之部位，刀鋒會接觸工 作台，使刀鋒損傷。 又，要分開液晶顯示板基板用之貼合透光性塑膠基板 時，若受2片基板之厚度偏差之影響，刀鋒會深深地侵入 ，此時，連非加工對象之下側基板也會損傷，若割痕深度 淺時，不能分開基板而產生不良品。 圖10，係使用本發明刀輪的單板之透光性塑膠基板70 的加工狀態圖，圖11，係使用本發明刀輪的貼合透光性塑 膠基板60的加工狀態圖。 爲解除上述問題點，如圖10、圖11，在形成割痕於透 光性塑膠基板之刀輪41設置限制刀鋒侵入之深度的限制面 43，對刀輪41之刀鋒施加既定之割痕荷重，使刀輪之限制 面43在加工中經常抵接於基板表面71、61，藉此來保持形 成於透光性塑膠基板70、60之割痕深度爲一定。 適合在透光性塑膠基板形成割痕的刀鋒之前端角度α 係以10°〜40°爲最佳，加工對象之基板厚度越大，就越要 使前端角度α爲銳角。此一點與在脆性材料之情形相反， 脆性材料之情形係厚度越增加越要成爲鈍角。 透光性塑膠基板用之刀輪，以如圖12所示，在軸孔46 插上支軸（未圖示）後在基板表面轉動的碟形狀者爲最佳，這 是因藉由限制面43不會損傷基板表面。 又，如圖13所示，亦可僅在碟形刀輪之刀鋒稜線之一 側設置限制面。 刀輪之材質，係使用鐵、陶瓷、超硬合金、鑽石等。 16 200301755 透光性塑膠基板，除上述之丙烯酸系樹脂外，例如還 有：聚碳酸酯、聚醚硼、聚烯丙酯、聚對苯二甲酸乙二醇 酯、聚萘-2,6-二甲酸乙二醇酯、聚醚等。 —劃線裝置一 圖15,係表示裝設上述刀輪之劃線裝置之一實施例的 槪略前視圖。 圖16，係圖15之劃線裝置的側視圖。 此劃線裝置，例如，係具備：工作台51，將所載置之 脆性材料基板G以真空吸收機構固定而能水平旋轉；平行 之一對導軌52、52，支撐此工作台51，能使它朝Y方向（ 垂直於圖15之紙面之方向）移動，·滾珠螺桿53，使工作台 51順沿此導軌52、52移動；導桿54，順沿X方向（在此圖 係左右方向）架設於工作台51上方；劃線頭55，設置於此 導桿54，能朝X方向滑動；馬達56，使此劃線頭55滑動 ;刀片支持具57，設置於劃線頭55下部，能升降且擺頭自 如；上述之刀輪1，裝設於此刀片支持具57下端而能旋轉 ;及一對CCD攝影機58，設置於導桿54上方，來辨識顯 示於工作台51上之脆性材料基板G的對準標記。又，在劃 線頭55內，內建使刀片支持具57反轉180°之刀輪反轉機 構，每次1條劃線形成完，如前述就將刀輪1反轉180° 。 又，劃線裝置，亦可不設置如上述之刀輪反轉機構， 而在2個刀片支持具57裝設2個刀輪，使該2個刀輪並排 ，且使彼此之刀鋒稜線21、21位於最遠之位置。如上述， 若使用2個刀輪1、1之情形，例如圖8所示，僅將劃線頭 17 200301755 在各元件間行走1次，就能對分別接近於所鄰接之各元件 τ、T之凸部或薄膜的部位E、F同時作劃線，不需要如上 述每於形成1條劃線之後就將刀輪1反轉180° ，故作業性 能提高。 再者，2個刀輪1、1，係以動作程式能選擇要同時或 要個別作劃線，在劃線頭55內建能將2個刀片支持具57、 57個別升降之升降機構。 又，對塑膠片作劃線之情形，不使用上述劃線裝置之 刀輪1而使用刀輪41亦可。 再者，圖17，係顯示裝有上述刀輪1的劃線工具之實 施例的局部截面圖。 此圖17所示之構造，係不使用在本申請人之「玻璃切 割器」（日本之實公昭62-23780)所揭示之玻璃切割用刀刃 ，而是裝設本發明之刀輪1者。又，此玻璃切割器，係具 備：握取部81，以筒狀柄（手柄）所構成；及刀片支持具82 ，裝設於此握取部81端部；在此刀片支持具82前端，以 透過軸11a可旋轉自如之方式設置刀輪1。此玻璃切割器， 係爲了供應油至刀輪1，進一步於握取部81中空部設置油 室83、及此油室83之蓋子84，並具備附在其等上之機構 91〜99。在此，因機構91〜99係非直接與本發明有關，故省 略其等說明。 產業上之利用可能忤 如以上所說明，據本發明之非金屬材料用刀輪、劃線 裝置及劃線方法，對脆性材料不僅能獲得不引起水平裂痕 18 200301755 而到達極深之深度的垂直裂痕，同時亦能解決如前述之外 來要因所造成的劃線不穩定化等問題。 又，能有效防止交叉劃線時之跳過交點，而幾乎不產 生切粉。 另方面，對塑膠片，即使塑膠片之厚度或工作台之平 坦度有偏差，能使所形成之割痕深度爲一定。 如上述，使用本發明之裝置及方法，能供應品質佳， 可靠性高之製品，而爲實用之發明。 【圖式簡單說明】 (一）圖式部分 圖1 ’係表示本發明之刀輪之實施例的立體圖。 圖2 ’係圖1所示刀輪之側視圖， 圖3 ’係圖1所示刀輪之前視圖。 圖4 ’係表示本發明之另一實施例之刀輪的前視圖。 匱1 5 ’係表示本發明之另一實施例之刀輪的前視圖。 ® 6 ’係表示以圖4所示之刀輪對有元件排成矩陣狀之 脆性材料作劃線之狀況的前視圖。 ® 7 ’係表示以圖5所示之刀輪對有元件排成矩陣狀之 脆性材料作劃線之狀況的前視圖。 ® 8 ’係表示以圖5所示之2個刀輪對有元件排成矩陣 狀之脆性材料作劃線之狀況的前視圖。 ® 9 ’係表示本發明之刀輪之另一實施例的立體圖。 ® 1G’係使用本發明刀輪的單板之透光性塑膠基板的 加工狀態_。 19 200301755 圖11，係使用本發明刀輪的貼合透光性塑膠基板的加 工狀態圖。 圖12，係表示本發明之其他實施例之刀輪的前視圖。 圖13，係表示本發明之其他實施例之刀輪的前視圖。 圖14,係將脆性材料之切斷時之刀鋒荷重與垂直裂痕 之到達深度的關係以曲線圖表示的圖。 圖15,係表示本發明之劃線裝置之實施例的槪略前視 圖。200301755 发明 Description of the invention [Technical field to which the invention belongs] The present invention relates to a cutter wheel suitable for cutting non-metallic brittle materials such as glass, silicon, ceramics or non-metal materials such as plastic sheets, and the use of the cutter wheel Scribing device and scribing method using the cutter wheel. [Prior art] It is known that for the marking of the above brittle materials, a cutter wheel with an obtuse blade edge as shown in FIG. 18 is widely used. Using this cutter wheel 划线 to scribe, usually, the system applies a load suitable for the material or thickness of the brittle material G to the blade edge, and rotates the cutter wheel Η on the surface of the brittle material. The surface forms a continuous vertical crack K line (notch). Also, for example, in a scribing process of a glass substrate, as shown in FIG. 19, a cross scribing of a glass substrate G is often performed. At this time, the phenomenon of the so-called skipping intersection occurs. This phenomenon is affected by the internal deformation accumulated on each side of the scribe lines L1 to L3 when making a line in the first direction. When the second direction intersects the first direction, When a scribe line is drawn in the direction, it occurs near the intersection with the aforementioned scribe lines L1 to L3, so that the second scribe lines L4 to L6 cannot always be formed near the intersection point. Internal deformation is an important phenomenon related to the appearance of horizontal cracks on the surface of the processed object, which causes problems such as the generation of glass chips and the reduction of cross-sectional quality after cutting. Therefore, it is necessary to minimize the occurrence of internal deformation. Therefore, it is necessary to stabilize the scribe operation during the scribe operation. Specifically, it is important to keep the scribe pressure within a predetermined range during the scribe operation. Therefore, in order to prevent the above-mentioned phenomenon, it is known that when the second scribe lines L4 to L6 are formed, the blade load is increased to about 1.2 to 3 times the blade load when the first scribe lines L1 to L3 are formed. 200301755 Also, when scoring a plastic sheet, the plastic sheet is attracted and fixed on a hard table or the like to make a scribe. In the case of a plastic sheet, the blade angle of the cutter wheel shown in FIG. 18 is different from that of a brittle material, forming an acute angle. In the case of scoring processing objects such as brittle materials or plastic pieces, if the cutter wheel on the surface of the object is processed by rotating on the surface of the object, the concern is how to cut the blade of the cutter wheel. The surface of the part is pressed firmly against the surface of the object to be pressed while rotating and moving. The phenomenon that occurs on the processed surface is different depending on whether the material of the processing object is a brittle material or a plastic material. First of all, in the case of brittle materials, if we observe the mechanism that the knife wheel 垂直 produces a vertical crack K in the brittle material G, we know that firstly, by increasing the load on the blade edge, it is generated at the part that abuts the blade edge of the brittle material G Elastic deformation. Second, with the increase in blade load, plastic deformation occurs in the above-mentioned locations. Increasing the blade load further exceeds the limit of plastic deformation. As a result, brittle failure occurs, and vertical cracks K begin to grow in the thickness direction of the brittle material. The growth of the vertical crack K is terminated when the front end M of the vertical crack K reaches the reaching depth P (distance from the surface of the brittle material) according to the size of the blade load and the material or thickness of the brittle material. If we observe it with a certain material and a certain thickness, we know that the person who can control the depth P reached by the front end M of the vertical crack K is only the blade load. That is, if the blade load is increased, the depth at which the blade edge of the cutter wheel penetrates into the surface of the brittle material G becomes longer, and the energy used to generate the vertical crack K becomes larger, so the depth of the vertical crack K becomes deeper. However, if the blade load exceeds a certain size, although the so-called deep vertical crack K can be obtained, the internal deformation stored at the same time as 200301755 near the surface of the brittle material G becomes saturated, and the growth direction of the vertical crack K is completely different. Cracks in the same direction, so-called horizontal cracks. Such horizontal cracks cause a large amount of undesired cutting powder. As a result of more detailed investigations by the present inventors, it was found that there is a relationship as shown in Fig. 14 between the blade load and the depth P of the vertical crack K. That is, it is also clear from the graph shown in FIG. 14 that the reach depth P of the vertical crack K first exists in a field (field A) that gradually deepens with the increase of the blade load, and then there is a field that increases sharply with the increase in the blade load. (B area). Furthermore, there is an area where the blade load increases but hardly increases (C area). Moreover, in this area C, horizontal cracks that have not been seen in area A or B are much larger than vertical cracks. From the above facts, it was found that by scoring the blade load in the area equivalent to area B, that is, the area where the depth P increases sharply as the blade load increases, it is possible to obtain deep vertical cracks without the occurrence of horizontal cracks. 〇 [Summary of the Invention] (I) Technical Problems to Be Solved by the Invention However, it is learned that the most suitable range for setting the blade load in the B area is extremely narrow. Only the adjustment of the blade load when using a normal scribe line is in the B area. Do not make long-term stable markings. In addition, in order to prevent the occurrence of skipping intersections as described above, when the second scribe line is formed, it is necessary to increase the blade load significantly more than when the first scribe line is formed, and the blade load often enters the above-mentioned C area. Therefore, there is a problem that can not be caused by a large amount of cutting powder. Furthermore, in addition to the problems described above, using the conventional knife wheel Η, such as scribe a glass substrate, due to the undulation or bending of the glass, the unevenness of the glass surface, or to maintain the holder of the knife wheel or to maintain the support External factors, such as shaking of the scribe line head, often produce scribe lines that cannot be stabilized. In addition, if the plastic of another material mentioned above is a plastic sheet, due to the deviation of the thickness of the plastic sheet or the flatness of the worktable of the board, or the part of the blade that keeps relatively moving, Deviations in parallelism, etc., need to have a fairly wide blade depth setting. Therefore, the penetration depth of the blade of the plastic sheet becomes indefinite. It is not easy to separate the plastic sheet in the shallow depth of penetration, and the blade reaches the hard workbench in the deep depth of penetration, which damages the front end of the blade. In addition, for example, when a transparent plastic substrate is bonded to a liquid crystal display panel and two overlapping substrates are cut, the thickness of the two substrates is affected by the thickness deviation of the substrate. The substrates below the non-cutting object are also damaged, causing defective products. On the other hand, if it is shallow, it cannot be separated, and it is difficult to remove the product. (II) Technical means for solving the problem According to the foregoing findings, the present inventors have found that for brittle materials, if a scribe pressure equivalent to the blade load in the above-mentioned field B is stably and continuously applied, the blade edge can be maintained. The bite amount of the brittle material is constant, which can not only stably and surely obtain vertical cracks that do not cause horizontal cracks to reach extremely deep depths, but also solve the above-mentioned problems such as the instability of the streak 20031755, In addition, it was found that if the penetration depth of the blade edge can also be kept constant for the plastic sheet, a cut of a certain depth can be formed without being affected by the deviation of the thickness of the plastic sheet. In this method of using the cutter wheel, the important point is that when the blade edge part is rotated and moved, it must be reduced as much as possible: due to the influence of the unevenness on the surface of the workpiece and the instability of the physical movement when the blade edge of the cutter wheel is rotated The effect of external disturbance caused by nature, etc., makes the processing performance of the blade unstable. In view of this point of view, in order to obtain a stable turning action, the restricting parts of the restricting mechanism are provided on the sides of the blade edge, so that a simple mechanism can be used to restrict the pressing direction of the blade edge of the cutter wheel (pressing the surface of the workpiece). action. That is, the cutter wheel for non-metallic materials of the present invention is characterized in that: a person who scribes a non-metallic material while rotating on the surface of the non-metallic material is provided on at least one side of the blade edge, and the blade edge is restricted from the non-metallic material Limiting surface from the depth of penetration. According to the present invention, since the radial distance between the cutter wheel on the surface that restricts the penetration depth of the blade edge and the edge of the blade edge is precisely processed with sub-micron precision, so for brittle materials, it is impossible to obtain the adjustment of the blade edge load. The obtained vertical cracks in the B area can stably obtain cuts of a certain depth for the plastic sheet. In addition, for brittle materials, even if a large load is applied to the blade beyond the range of the aforementioned area B, because the limiting surface of at least one side of the blade abuts against the surface of the brittle material to bear the load, the amount of invasion of the blade to the brittle material is often maintained. Because it is constant, it is possible to surely obtain a vertical crack that reaches a very deep depth without causing horizontal cracks. 200301755 Furthermore, by having a limiting surface on at least one side of the blade as described above, even if a large load is applied to the blade, a horizontal crack will not be generated. Therefore, factors other than those mentioned above can be removed by increasing the blade load, and the result can be Obtain a stable score. In addition, in the above-mentioned cutter wheel for non-metallic materials, the peripheral edge corner portion where the restricting surface is in contact with the cutter wheel side surface may be notched throughout the entire circumference. The cutter wheel of this shape is suitable for cutting a brittle material substrate such as a glass substrate or a silicon wafer having a plurality of elements formed on the surface in a matrix form into each element unit. That is, in the case where a cutter wheel is used to mark the substrate surface exposed between the elements, if a cutter wheel having a shape as shown in FIG. 18 is used, the inclined surface of the blade prevents the element, and the restriction surfaces and the side surfaces are separated from each other. The corners of the contacting peripheral edges are formed in a notch shape throughout the circumference, and the blade can be inserted between the components in a manner that does not hinder the components, and the substrate surface exposed between the components can be scribed. In addition, in the above-mentioned non-metallic cutter wheel, the position of the edge of the blade edge may be closer to either side than the center between the two side surfaces of the cutter wheel. In this case, it is also suitable to cut a brittle material substrate such as a glass substrate or a silicon wafer (there are a large number of components formed in a matrix shape on the surface) into each component unit °, so that a blade edge edge line is close to one side The side of the cutter wheel faces the side of the element, which can make the edge of the blade closer to the element than the conventional cutter wheel. When cutting the substrate, it is possible to draw a line near the closest element of each element without damaging the element. The scribing device of the present invention is characterized by comprising: a worktable on which non-metal materials are placed; a scribing head arranged above the worktable; and a cross scribing mechanism 'on the worktable by the scribing head. The object to be processed forms a notch with each other; and the scribing head is provided with any of the above-mentioned non-metal material knife 10 200301755 wheels. In addition, in this scribing device, a cutter wheel reversing mechanism can also be provided. Each time i marks are formed, the cutter wheel direction is reversed by 180 °. Thereby, a predetermined portion of the substrate, that is, a portion near a convex portion or a thin film of each element can be scribed without inverting the substrate. Further, in the scribing device, a person having two cutter wheels may be used. In this case, the cutter wheels are arranged side by side, and the edge edges of each other are positioned at the farthest positions. Then, the two cutter wheels mentioned above can be used to select lines at the same time or individually according to the motion program. This eliminates the need to reverse the cutter wheel by 180 ° each time a scribe line is formed as described above. In addition, a scribing device having a mechanism for moving the scribing head in the X direction and / or the Y direction with respect to the table on which the nonmetal material is placed, may be provided with any of the above-mentioned cutter wheels for nonmetal materials. In addition, as a scribing tool for a manual cutter, a gripping portion composed of a cylindrical handle and a blade holder provided at a front end of the gripping portion may be provided, and the non-metal material may be provided on the blade holder. Either of the cutter wheels. In addition, the scribing method of the present invention is a scribing method of a non-metal material using the above-mentioned various non-metal material cutter wheels; it is characterized in that the cutter wheel is pressurized until its limiting surface contacts the surface of the non-metal material, and While maintaining the state where the blade penetrates into the non-metallic material, the cutter wheel is rotated in a predetermined direction to scribe the non-metallic material. [Embodiment] (Preferred Embodiment of the Invention) Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 11 200301755 FIG. 1 is a perspective view of a cutter wheel 1 according to an embodiment of the present invention, FIG. 2 is a side view, and FIG. 3 is a front view. The cutter wheel 1 is rotated on the surface of the brittle material outside the figure after its shaft hole 6 is inserted through a supporting shaft (not shown); the cutter wheel is provided with a limiting surface 3 on both sides of the blade 2 to limit the blade 2Intrusion depth from the surface of the brittle material. If the cutting edge angle Θ of the above-mentioned blade 2 is made of a brittle material such as glass, it should be set to 100 ° ~ 165 °. If the blade angle Θ is smaller than 100 °, the strength required by the blade 2 cannot be obtained, and if it is larger than 165 °, the blade 2 cannot easily penetrate into the brittle material. In addition, the radial distance D between the blade edge ridge 21 of the blade 2 and the restricting surface 3 is preferably set to 2 μm to 100 μm. If the distance is smaller than 2 μm, plastic deformation does not occur in the brittle material, and as a result, no vertical cracks occur. If it is larger than 100 μm, the bite amount of the blade edge 2 into the brittle material is too large, and the brittle material may be broken. Further, although the distance D varies depending on the material of the brittle material, when the thickness of the brittle material is thicker, if the distance D is selected within the above range, a deep vertical crack K can be obtained more effectively. As for the matching of the blade angle Θ and the distance D, the range of the area in which the predetermined function can be ensured in the limiting surface 3 according to the material or thickness of the brittle material G to be cut, and the thickness of the cutter wheel 1 itself, etc. You can choose as appropriate. It is preferable that the above-mentioned restricting surface 3 be mirror-finished so that the restricting surface can be smoothly rotated on the surface of the brittle material G while being pressurized. FIG. 4 shows another embodiment of the present invention. In this example, the cutter wheel 1 is formed by cutting the peripheral corners of each of the limiting surfaces 3 and the side surfaces 4 of the cutter wheel through a gap of 12 200301755. In the case of the cutter wheel 1 having such a shape, as shown in FIG. 6, it is suitable for cutting a glass substrate or a silicon wafer (the surface of which has a plurality of elements T arranged in a matrix) of a brittle material substrate G into elements T units. . That is, when the substrate surface between the exposed elements T is scribed by this cutter wheel 1, the cutter wheel 1 can be inserted between the components T without interfering with the component T to scribe the substrate surface between the exposed elements T. FIG. 5 shows another embodiment of the present invention. In this example, the cutter wheel 1 is such that the position of the blade edge 21 of the blade 2 is closer to any one side 4 (the center between the two sides 4 and 4 of the blade 1). FIG. 7K illustrates the left side 4). In this embodiment, on the one hand, it is possible to ensure that the thickness between the two side surfaces 4 is a thickness with sufficient mechanical strength, and on the other hand, by reducing the distance between the other side surface 4 and the blade edge line of the blade, it is possible to perform the same as in FIG. 6. Shows the same features of the embodiment. In this case, as in the embodiment shown in FIG. 4, it is suitable to cut a brittle material substrate G such as a glass substrate or a silicon wafer (there are a plurality of elements T arranged in a matrix on the surface) into element T units. That is, as shown in FIG. 7, by facing the blade wheel side 4 near the blade edge 21 to the side of the element T, the blade edge 21 can be closer to the element T than the conventional blade wheel ，. Each component T can be scribed at the position closest to the component T without damaging the component T. Second, the scribing method of the present invention uses the cutter wheel shown in each of the above embodiments. As shown in FIG. 3, the cutter wheel 1 Press to its limiting surface 3 Abut the surface of the brittle material G and maintain the blade edge 2 infiltrating into the 13 20030175fj state of the brittle material G while keeping the cutter wheel 1 in the predetermined direction (the direction perpendicular to the paper surface in Fig. 3) ) Turn to score the brittle material G. Here, the magnitude of the load applied to the blade edge 2 is preferably adjusted so that it exists in the region B in FIG. 14. That is, even if the area C where the depth of the vertical crack K hardly increases even though the blade load is increased, the restriction surface 3 on both sides of the blade 2 abuts against the surface of the brittle material G to bear its load is suppressed. The change in the scribe pressure of the blade 2 pressing the brittle material G can keep the amount of intrusion into the brittle material G constantly constant, so it is possible to obtain a vertical crack K reaching a very deep depth without causing horizontal cracks. The occurrence of horizontal cracks can effectively prevent skipping intersections when crossing lines, and hardly produce cutting powder. In addition, if the brittle material G is to be scribed by the cutter wheel 1 of the above-mentioned embodiment shown in FIG. 5, as shown in FIG. 7, the cutter wheel 1 faces the side of the component T with the side close to the blade edge 21 side. The way clings to brittle material G. Here, because the elements T are arranged in a matrix form with the brittle material G, the elements closest to the side of the element are lined along the line. If a line is formed, the cutter wheel 1 is reversed 180 °, along the element T adjacent to the front row, scribe the portion closest to the side of these elements to form a second scribe. In the case of scribing, as described above, the cutter wheel 1 is reversed by 180 each time a scribing is completed. In addition, the following cutter wheel supporters (not shown) can be used: two cutter wheels 1, 1 having a relationship as shown in FIG. 8 are configured, that is, two cutter wheels 1, 1 are arranged side by side, and each other The blade edge 21 is located at the farthest position. As in the case of using the two cutter wheels 1 and 1 as described above, as long as one walks between 14 200301755 and each component T, the parts of the fragile substrate that are close to the opposite sides of the adjacent components T can be simultaneously drawn. It is not necessary to reverse the cutter wheel 1 by 180 ° each time a scribe line is formed as described above, so the workability can be improved. Moreover, one example of cutter wheels of other brittle materials according to the embodiment of the present invention includes, for example, In FIG. 9, the restriction surfaces 33 on both sides of the blade edge portion 32 and the conical shaft portion 35 form an integrated cutter wheel. The cutter wheel has a conical shape. Therefore, if the cutter wheel can be rotated on the bearing of the support in an optimal state, not only the friction resistance between the cutter wheel and the bearing can be reduced, but also the life ratio of the cutter wheel itself. The cutter wheel is more than 100 times longer. In addition, other materials other than the other members may be joined to the blade edge portion 32, the restricting surface 33, and the shaft portion 35 by soldering, and then the final processing may be performed. The cutter wheel of the present invention is not limited to the aforementioned brittle materials, but can also be effectively used for cutting plastic sheets. For example, when the substrate of the liquid crystal display panel is made of light-transmissive plastic, using a thickness of 0.2mm acrylic resin, the substrate is attracted and fixed on a hard workbench made of iron or aluminum and separated, the bite of the blade must be Certainly, for example, it is set to 0.15 mm to form a cut. It is known that if a cutting wheel is used to form a cut on a transparent plastic substrate with a cutter wheel that does not have a limit on the amount of bite of the blade, it is due to the deviation of the thickness of the substrate itself or the deviation of the flatness of the table that attracts the substrate, and The height of the cutter wheel moving parallel to the surface of the substrate is deviated, and the depth of the cut formed by the cutter wheel cannot be kept constant. Therefore, the substrate is not easy to separate at the shallow depth of the cut formed on the substrate. When the cut has reached the back of the substrate, the blade will contact the workbench and damage the blade. In addition, when the transparent plastic substrate for the liquid crystal display substrate is to be separated, if the thickness deviation of the two substrates is affected, the blade will penetrate deeply. At this time, even the substrate below the non-processed object will also be infiltrated. Damage, if the depth of the cut is shallow, the substrate cannot be separated to produce defective products. Fig. 10 is a processing state diagram of a transparent plastic substrate 70 of a veneer using the cutter wheel of the present invention, and Fig. 11 is a processing state diagram of a transparent plastic substrate 60 bonded using the cutter wheel of the present invention. In order to solve the above problems, as shown in FIG. 10 and FIG. 11, a cutting surface 41 is formed on the cutting wheel 41 formed with cutting marks on the transparent plastic substrate to limit the depth of the blade intrusion, and a predetermined cutting mark load is applied to the cutting edge of the cutting wheel 41. In order to keep the cutting surface 43 of the cutter wheel abutting on the substrate surfaces 71 and 61 during processing, the depth of cuts formed on the transparent plastic substrates 70 and 60 is kept constant. The angle α of the front end of the blade suitable for forming a cut on a transparent plastic substrate is preferably 10 ° ~ 40 °. The larger the thickness of the substrate to be processed, the more acute the angle α of the front end must be. This is in contrast to the case of a brittle material, which becomes an obtuse angle as the thickness increases. As shown in FIG. 12, a knife wheel for a transparent plastic substrate is preferably a dish shape that rotates on the surface of the substrate after a shaft (not shown) is inserted into the shaft hole 46. This is because of the restriction surface 43 will not damage the substrate surface. Further, as shown in FIG. 13, a restricting surface may be provided only on one side of a blade edge line of the dish-shaped cutter wheel. The material of the cutter wheel is iron, ceramic, cemented carbide, diamond, etc. 16 200301755 In addition to the acrylic resins mentioned above, translucent plastic substrates include, for example: polycarbonate, polyether boron, polyallyl ester, polyethylene terephthalate, and polynaphthalene-2,6- Diethylene glycol dicarboxylate, polyether, etc. —Scribing Device 1 FIG. 15 is a schematic front view showing an embodiment of the scribing device provided with the above cutter wheel. FIG. 16 is a side view of the scribing device of FIG. 15. This scribing device is, for example, equipped with: a table 51 that fixes the placed brittle material substrate G with a vacuum absorption mechanism so that it can rotate horizontally; and a pair of parallel guide rails 52 and 52 that support the table 51 can make It moves in the Y direction (the direction perpendicular to the paper surface in FIG. 15). The ball screw 53 moves the table 51 along the guide rails 52, 52; the guide rod 54 moves in the X direction (in this figure, left and right directions) Erected above the work table 51; scribe head 55 is provided on the guide rod 54 and can slide in the X direction; motor 56 slides the scribe head 55; blade holder 57 is provided on the lower part of the scribe head 55 and can Lift and swing freely; the above-mentioned cutter wheel 1 is installed on the lower end of the blade holder 57 and can rotate; and a pair of CCD cameras 58 are arranged above the guide bar 54 to identify the brittle material displayed on the work table 51 Alignment mark of the substrate G. In addition, a cutter wheel reversing mechanism for reversing the blade holder 57 by 180 ° is built in the scribe head 55, and each time a scribe is formed, the cutter wheel 1 is rotated 180 ° as described above. In addition, the scribing device may not be provided with the cutter wheel reversing mechanism as described above, but two cutter wheels may be installed on the two blade holders 57 so that the two cutter wheels are side by side and the edge edges 21 and 21 of each other are formed. Located farthest away. As described above, if two cutter wheels 1 and 1 are used, for example, as shown in FIG. 8, only the scribing head 17 200301755 is walked once between the components, and the adjacent components τ and T can be approached. The convex portions or the portions E and F of the film are scribed at the same time. It is not necessary to reverse the cutter wheel 1 by 180 ° after forming a scribe line as described above, so the workability is improved. Furthermore, the two cutter wheels 1 and 1 can be selected to perform scribing at the same time or individually according to the motion program. The scribing head 55 has a lifting mechanism capable of lifting and lowering the two blade supports 57 and 57 individually. In the case of scoring a plastic sheet, the cutter wheel 1 may be used instead of the cutter wheel 1 of the scribing device. Fig. 17 is a partial cross-sectional view showing an embodiment of a scribing tool equipped with the cutter wheel 1 described above. The structure shown in FIG. 17 does not use the glass cutting blade disclosed in the applicant's "Glass Cutter" (Sho Sho 62-23780, Japan), but is provided with the cutter wheel 1 of the present invention. In addition, the glass cutter includes: a gripping portion 81 constituted by a cylindrical handle (handle); and a blade holder 82 installed at an end portion of the gripping portion 81; and at the front end of the blade holder 82, The cutter wheel 1 is rotatably provided through the shaft 11a. In order to supply oil to the cutter wheel 1, this glass cutter is further provided with an oil chamber 83 and a cover 84 of the oil chamber 83 in a hollow portion of the gripping portion 81, and includes mechanisms 91 to 99 attached thereto. Here, since the mechanisms 91 to 99 are not directly related to the present invention, their descriptions are omitted. Industrial use may be as described above. According to the cutter wheel, scribing device and scribing method for non-metallic materials according to the present invention, not only brittle materials can be obtained without causing horizontal cracks 18 200301755 and reaching extremely deep vertical The crack can also solve problems such as instability of the scribing caused by factors other than the foregoing. In addition, it is possible to effectively prevent the skipping of the intersection point when crossing the lines, and hardly produces cutting powder. On the other hand, for plastic sheets, even if the thickness of the plastic sheet or the flatness of the table is different, the depth of the cut formed can be made constant. As described above, using the device and method of the present invention can provide products of high quality and high reliability, and is a practical invention. [Brief description of the drawings] (I) Schematic part Fig. 1 'is a perspective view showing an embodiment of the cutter wheel of the present invention. FIG. 2 ′ is a side view of the cutter wheel shown in FIG. 1, and FIG. 3 ′ is a front view of the cutter wheel shown in FIG. 1. Fig. 4 'is a front view showing a cutter wheel according to another embodiment of the present invention. 15 ′ is a front view showing a cutter wheel according to another embodiment of the present invention. ® 6 ′ is a front view showing the condition where the brittle material with components arranged in a matrix is drawn by the cutter wheel shown in FIG. 4. ® 7 ′ is a front view showing a state in which a brittle material with elements arranged in a matrix is drawn by a cutter wheel shown in FIG. 5. ® 8 ′ is a front view showing the condition where the two cutter wheels shown in FIG. 5 are used to mark a brittle material with elements arranged in a matrix. ® 9 'is a perspective view showing another embodiment of the cutter wheel of the present invention. ® 1G ’is the processing state of the transparent plastic substrate of the veneer using the cutter wheel of the present invention. 19 200301755 FIG. 11 is a processing state diagram of a transparent plastic substrate bonded with a cutter wheel of the present invention. Fig. 12 is a front view showing a cutter wheel according to another embodiment of the present invention. FIG. 13 is a front view showing a cutter wheel according to another embodiment of the present invention. Figure 14 is a graph showing the relationship between the blade load when cutting brittle materials and the depth of vertical cracks. Fig. 15 is a schematic front view showing an embodiment of a scribing device according to the present invention.
圖16，係圖15之劃線裝置的側視圖。 _ 17,係表示裝設本發明之刀輪的劃線工具之實施例 的局部截面圖。 ® U，係表示習知刀輪的前視圖。 係表示使用習知刀輪作劃線之狀況的槪略立體 圖。 (一）元件代表符號FIG. 16 is a side view of the scribing device of FIG. 15. _17 is a partial cross-sectional view showing an embodiment of a scribing tool provided with the cutter wheel of the present invention. ® U is a front view of a conventional cutter wheel. This is a schematic perspective view showing a state in which a conventional knife wheel is used for scribing. (A) the symbol of the component
1 ' 41、Η 刀輪 2 Ν 32 刀鋒 3 Ν 33 ' 43 限制面 4 側面 6 ^ 46 軸孔 21 刀鋒稜線 35 軸部 51 工作台 52 導軌 20 200301755 53 滾球螺桿 54 導桿 55 劃線頭 56 馬達 57 刀片支持具 58 C C D攝影機 60 、70 透光性塑膠基板 61 、71 基板表面 81 握取部 82 刀片支持具 83 油室 84 蓋子 9L· -99 附帶機構 G 脆性材料 K 垂直裂痕 Μ 垂直裂痕前端 Τ 元件1 '41, Η cutter wheel 2 Ν 32 blade 3 Ν 33' 43 restricting surface 4 side 6 ^ 46 shaft hole 21 blade edge 35 shaft 51 table 52 guide 20 200301755 53 ball screw 54 guide rod 55 scribing head 56 Motor 57 Blade support 58 CCD camera 60, 70 Transparent plastic substrate 61, 71 Substrate surface 81 Grip 82 Blade support 83 Oil chamber 84 Cover 9L · -99 Attached mechanism G Brittle material K Vertical crack M Vertical crack front Τ element
21twenty one