TWI295789B - - Google Patents

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Publication number
TWI295789B
TWI295789B TW094103689A TW94103689A TWI295789B TW I295789 B TWI295789 B TW I295789B TW 094103689 A TW094103689 A TW 094103689A TW 94103689 A TW94103689 A TW 94103689A TW I295789 B TWI295789 B TW I295789B
Authority
TW
Taiwan
Prior art keywords
electronic device
circuit
base substrate
layer
circuit layer
Prior art date
Application number
TW094103689A
Other languages
English (en)
Chinese (zh)
Other versions
TW200527312A (en
Inventor
Kouji Tasaki
Hironori Ishizaka
Masahito Shibutani
Kousuke Tanaka
Masahisa Shinzawa
Hidehiko Tonotsuka
Katsuya Iwata
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200527312A publication Critical patent/TW200527312A/zh
Application granted granted Critical
Publication of TWI295789B publication Critical patent/TWI295789B/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
TW094103689A 2004-02-06 2005-02-04 Electronic device TW200527312A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004030535 2004-02-06

Publications (2)

Publication Number Publication Date
TW200527312A TW200527312A (en) 2005-08-16
TWI295789B true TWI295789B (cg-RX-API-DMAC7.html) 2008-04-11

Family

ID=34836004

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094103689A TW200527312A (en) 2004-02-06 2005-02-04 Electronic device

Country Status (7)

Country Link
US (1) US20090065586A1 (cg-RX-API-DMAC7.html)
EP (1) EP1715445A4 (cg-RX-API-DMAC7.html)
JP (1) JP4518024B2 (cg-RX-API-DMAC7.html)
KR (1) KR100879416B1 (cg-RX-API-DMAC7.html)
CN (1) CN1918583B (cg-RX-API-DMAC7.html)
TW (1) TW200527312A (cg-RX-API-DMAC7.html)
WO (1) WO2005076202A1 (cg-RX-API-DMAC7.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI7351U1 (fi) * 2006-09-19 2007-01-12 Upm Kymmene Wood Oy Puulevy
WO2009011375A1 (ja) 2007-07-18 2009-01-22 Murata Manufacturing Co., Ltd. 無線ｉｃデバイスおよびその製造方法
WO2013154603A1 (en) 2012-04-11 2013-10-17 Impinj, Inc. Rfid integrated circuits and tags with antenna contacts on multiple surfaces
US10600753B2 (en) * 2015-08-28 2020-03-24 Texas Instruments Incorporated Flip chip backside mechanical die grounding techniques
DE102016103790B8 (de) * 2016-03-03 2021-06-02 Infineon Technologies Ag Herstellung einer Packung unter Verwendung eines platebaren Verkapselungsmaterials
EP3456161A1 (en) * 2016-05-11 2019-03-20 Flex Automotive GmbH Electrical circuitry assembly and method for manufacturing the same
JP2019004266A (ja) * 2017-06-13 2019-01-10 富士通株式会社 アンテナ装置および電子機器
SE545307C2 (en) * 2019-05-29 2023-06-27 Digital Tags Finland Oy Method and apparatus for producing a radio-frequency identification (rfid) transponder

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH061096A (ja) * 1992-06-17 1994-01-11 Omron Corp カード形基板及びその製造方法
JP4187278B2 (ja) * 1998-07-08 2008-11-26 大日本印刷株式会社 非接触ｉｃカードおよびその製造方法
JP4409137B2 (ja) * 1999-06-03 2010-02-03 東洋鋼鈑株式会社 プリント配線板の製造方法
JP2001217380A (ja) * 2000-02-04 2001-08-10 Hitachi Ltd 半導体装置およびその製造方法
JP3398705B2 (ja) * 2000-02-24 2003-04-21 九州日本電気株式会社 半導体装置
JP2002017614A (ja) * 2000-07-07 2002-01-22 Toto Ltd 便座装置
JP2002164392A (ja) * 2000-11-28 2002-06-07 Toppan Forms Co Ltd Ｉｃチップの実装方法
US6407669B1 (en) * 2001-02-02 2002-06-18 3M Innovative Properties Company RFID tag device and method of manufacturing
JP2002366917A (ja) * 2001-06-07 2002-12-20 Hitachi Ltd アンテナを内蔵するｉｃカード
JP2003076969A (ja) * 2001-08-31 2003-03-14 Oji Paper Co Ltd Ｉｃチップ実装体
JP2003196631A (ja) * 2001-12-27 2003-07-11 Toppan Forms Co Ltd 耐曲折性を有するｉｃメディア
JP2003228698A (ja) * 2002-02-04 2003-08-15 Oji Paper Co Ltd 非接触型ｉｃカード
US7015479B2 (en) * 2003-07-31 2006-03-21 Eastman Kodak Company Digital film grain

Also Published As

Publication number Publication date
JPWO2005076202A1 (ja) 2007-08-02
WO2005076202A1 (ja) 2005-08-18
TW200527312A (en) 2005-08-16
EP1715445A1 (en) 2006-10-25
KR20060126801A (ko) 2006-12-08
JP4518024B2 (ja) 2010-08-04
CN1918583A (zh) 2007-02-21
US20090065586A1 (en) 2009-03-12
CN1918583B (zh) 2011-06-15
KR100879416B1 (ko) 2009-01-19
EP1715445A4 (en) 2016-08-31

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