TWI295305B

TWI295305B -

Info

Publication number: TWI295305B
Application number: TW090101538A
Authority: TW
Inventors: Koji Itano; Kenji Okamoto
Original assignee: Jsr Corp
Priority date: 2000-01-25
Filing date: 2001-01-29
Publication date: 2008-04-01
Also published as: KR20010074530A; JP2001206979A; KR100680087B1

Description

1295305 A7 B7 五、發明説明（彳）技術領域本發明係關於含有無機粒子之樹脂組成物，轉印薄膜及使用該薄膜之電漿顯示器面板之製造方法，更詳言之，係關於可良好適用於構成電漿顯示面板之各顯示胞之電極、間壁、電阻體、介電體、螢光體、濾色體以及黑條紋（格陣）之形成中，用以形成高度精細圖型之含有無機粒子之樹脂組成物，具用該組成物而得之含有無機粒子之樹脂層的轉印薄膜，以及使用該轉印薄膜而進行之電漿顯示面板之製造方法。先行技術電漿顯示面板（以下亦稱「P D P」），由於係大型面板，製程簡單，視角大，自行發光型顯示器質高等理由，在平板顯示技術中受矚目，尤其是彩色P D P，其將因作爲2 0吋以上壁上電視用顯示裝置被期待成爲未來主流〇彩色P D P，係藉氣體放電產生紫外線，使之照射螢光體即可作彩色顯示。而一般，彩色P D P中，係以將紅色發光用之螢光體部位，綠色發光用螢光體部位，及藍色發光用螢光體部位形成於基板上，各色之發光顯示胞構成爲全體均勻參混之狀態。具體言之，於玻璃等之基板表面，設有稱作圍壁之絕緣性材料所成之間壁，以該間壁區劃出多數顯示胞，該顯示胞內部即爲電漿之作用空間。而因於該電漿作用空間設置螢光體部位，並於該螢光體部位設本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） (請先閲讀背面之注意事項再填寫本頁) ‘衣· 訂經濟部智慧財產局員工消費合作社印製 1295305 A7 B7 五、發明説明（2 ) 置使電漿起作用之電極，以各顯币胞爲顯不單位之電獎顯示面板於是構成。 (請先閱讀背面之注意事項再填寫本頁) 第1圖係呈示交流型電漿顯示面板之剖面形狀的示意圖。該圖中，1及2係相向配置之玻璃基板，3係間壁，以玻璃基板1，玻璃基板2及間壁3區分成顯示胞。4係固定於玻璃基板1之透明電極，5係目的在降低透明電極 4之電阻而形成於透明電極4上之母線電極，6係固定於玻璃基板2之位址電極，7係保持在胞內之螢光體，8係被覆透明電極4及母線電極5之形成於玻璃基扳1之表面的介電體，9係被覆位址電極6之形成於玻璃基板2之表面的介電體，1 0係由例如鎂所成之保護膜。又，爲提升P D P之對比，有時亦設置紅色、綠色、藍色之濾色體，及通常具條紋狀或格子狀之形狀的黑格陣於上述玻璃基板1與介電體8之間，或上述介電體8與保護膜1 0之間。經濟部智慧財產局員工消費合作社印製而且，直流型P D P中，隨同上述交流型P D P之構成要素，通常於電極端子（陽極端子）與電極引線（陽極引線）之間設有電阻體。構成如此之電漿顯示面板之電極、間壁、電阻體、介電體、螢光體、濾色體以及黑格陣等之製造方法者，已知有，（1 )將非感光性之含有無機粒子之樹脂組成物網版印刷於基板上得圖型再加以煅燒之網版印刷法，（2 )於基板上形成感光性之含有無機粒子之樹脂組成物膜，經光罩以紫外線照射該膜再顯影，以於基板上形成圖型，加以本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -5- 1295305 A7 B7 五、發明説明（3 ) 煅燒之光微影法等。 (請先閱讀背面之注意事項再填寫本頁) 發明所欲解決之課題然而，上述網版印刷法中，隨面板之大型化以及高度精細化，圖型的位置精確度之要求變得非常嚴苛，有通常之印刷無法對應之問題。又，上述光微影法中，在一回的曝光顯影步驟中形成膜厚1 0至1 0 0微米之圖型時，含有無機粒子之樹脂層對深度方向之靈敏度低，難以製得邊緣尖銳之高度精細圖型。再者，顯影步驟中易有殘留，而且有經煅燒步驟形成之燒結體其圖型變形，或該圖型易起剝落等之問題。經濟部智慧財產局員工消費合作社印製作爲可得尺寸精確度高之電極、間壁、電阻體、介電體、螢光體、濾色體及黑格陣，而工作性較之如上述（1 )、（2)製造方法提升之形成方法，本發明人等已有包含，於支承膜上形成得自含有無機粒子之樹脂組成物的含有無機粒子之樹脂層，將該含有無機粒子之樹脂層轉印於基板上，於轉印至基板上之含有無機粒子之樹脂層上形成光阻膜，將該光阻膜作曝光處理形成光阻圖型之潛像，將該光阻膜作顯影處理呈顯光阻圖型，作該含有無機粒子之樹脂層的鈾刻處理形成對應於光阻圖型之含有無機粒子之樹脂層的圖型，將該圖型作煅燒處理等步驟的方法之利用，以形成電極、電阻體、介電體、螢光體、濾色體及黑格陣之至少一種的方法之提議（日本專利特開平 11 — 162339 號公報）。本紙張尺度適用中國國家標準（CNS ) A4規格（21〇><297公釐） -6- 1295305 A7 B7 五、發明説明（） 4 (請先閱讀背面之注意事項再填寫本頁) 根據如此之製造方法，可形成高度精細且表面均勻性優良之圖型。又，由含有無機粒子之樹脂組成物所成之含有無機粒子之樹脂層形成於支承膜上所成之複合膜（以下亦稱「轉印薄膜」），因可將之捲成輥狀保存，亦屬有利〇然而，以往之轉印薄膜，其形成於支承膜上之含有無機粒子之樹脂層無法形成具充分可撓性之膜，有轉印薄膜折彎及於該含有無機粒子之樹脂層表面產生微小龜裂（裂痕）之問題。又，含有無機粒子之樹脂層對於玻璃基板無法發揮充分之粘著性（加熱粘著性），有難以從支承膜轉印於玻璃基板表面之問題。再者，煅燒含有無機粒子之樹脂層的圖型所形成之燒結體圖像中，有易於變形或剝落之問題。在此，「圖型之變形」，係指圖型邊緣部從基板捲起之現象，亦即所謂邊緣捲曲。經濟部智慧財產局員工消費合作社印製又，「圖型之剝落」，係指極端的圖型之變形之結果，圖型從基板脫落之現象。本發明係基於以上實情而作成。本發明之第一目的，在提供可形成可撓性、轉印性（含有無機粒子之樹脂層對玻璃基板之加熱粘著性）優良，經飩刻步驟及煅燒步驟形成之燒結體圖型無變形或脫落發生之含有無機粒子之樹脂層的含有無機粒子之樹脂組成物本紙張尺度適用中國國家標準（CNS ) A4規格（21〇X297公釐） 1295305 A7 B7 五、發明説明（c ) 5 (請先閱讀背面之注意事項再填寫本頁) 本發明之第二目的，在提供具有可撓性、轉印性（含有無機粒子之樹脂層對玻璃基板之加熱粘著性）優良，經飩刻步驟及煅燒步驟形成之燒結體圖型無變形或剝落發生之含有無機粒子的樹脂層之轉印薄膜。本發明之第三目的，在提供可形成尺寸精確度高之圖型，工作性優良之電漿顯示面板的製造方法。用以解決課題之手段本發明之含有無機粒子之樹脂組成物，其特徵爲含有，（A )無機粒子，（B )粘結樹脂，（C )含羥甲基及 /或院氧基甲基之化合物（以下亦簡稱「特定化合物」以及（D )溶劑。本發明之轉印薄膜，其特徵爲，係得自上述含有無機„ 粒子之樹脂組成物的形成於支承膜上之含有無機粒子之樹脂層。經濟部智慧財產局員工消費合作社印製本發明之電漿顯示面板之製造方法，其特徵爲包含，藉由將構成上述轉印薄膜之含有無機粒子之樹脂層轉印於基板上，於轉印之含有無機粒子之樹脂層上形成光阻膜，作該光阻膜之曝光處理形成光阻圖型之潛像，作該光阻膜之顯影處理呈顯光阻圖型，作該含有無機粒子之樹脂層的蝕刻處理形成對應於光阻圖型的含有無機粒子之樹脂層圖型，作該圖型之煅燒處理形成間壁、電極、電阻體、介電體、螢光體、濾色體及黑格陣之至少一種的步驟。再者，本發明之電漿顯示面板之製造方法，其特徵爲本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）~' ' -8 - 1295305 Α7 A 7 B7 五、發明説明（。） 6 (請先閱讀背面之注意事項再填寫本頁) 包含，藉由在支承膜上形成光阻層與，上述之得自含有無機粒子之樹脂組成物的含有無機粒子之樹脂層的層合膜，將該層合膜轉印於基板上，作構成該層合膜之光阻膜的曝光處理形成光阻圖型之潛像，作該光阻膜之顯影處理呈顯光阻圖型，作該含有無機粒子之樹脂層的鈾刻處理形成對應於光阻圖型之含有無機粒子之樹脂層圖型，作該圖型之煅燒處理，形成間壁、電極、電阻體、介電體、螢光體、濾色體、及黑格陣之至少一種的步驟。發明之實施形態、以下，詳細說明本發明之含有無機粒子之樹脂組成物〇本發明之含有無機粒子之樹脂組成物，係含無機粒子，粘結樹脂，特定化合物及溶劑作爲必要成分。〈無機粒子〉經濟部智慧財產局員工消費合作社印製使用於本發明之含有無機粒子之樹脂組成物的無機粒子之種類，隨由該組成物形成之燒結體的用途（例如間壁、電極、電阻體、介電體、螢光體、濾色體、黑格陣等之 PDP構成要素）等而異。在此，含於用以形成構成P D P之間壁及介電體之組成物的無機粒子，可舉低熔點之玻璃料等。該低熔點之玻璃料，係以其軟化點在4 0 0至6 0 0 °C之範圍內者爲佳。本紙張尺度適用中國國家標準（CNS ) A4規格（210Χ297公釐） -9- 1295305 A7 B7 五、發明説明（7 ) (請先閲讀背面之注意事項再填寫本頁) 玻璃料之軟化點不足4 0 0 °C時，得自該組成物之含有無機粒子之樹脂層在煅燒步驟中，因爲在粘結樹脂等有機物質未完全去除分解之階段玻璃料已熔融，於形成之燒結體中有機物質部份殘留，其結果使燒結體著色，有透光率降低之傾向。另一方面，玻璃料之軟化點超過6 0 0 °C 時，因須於6 0 0 °C以上溫度煅燒，易導致玻璃基板之變形等。具體言之，可舉氧化鉛、氧化硼、氧化矽系（P b 0 一 B 2〇3 — S i〇2系），氧化鉛、氧化硼、氧化矽、氧化鋁系（P b〇一B 2 0 3 — S i〇2 — A 1 2〇3系），氧化鋅、氧化硼、氧化矽系（Ζ η〇一B 2〇3 — S i〇2系 )，氧化鋅、氧化硼、氧化矽、氧化鋁系（Ζ η 0 — Β 2 0 3 — S i〇2 — Α 12〇3系），氧化鈴、羁化ί羊、興化硼、氧化矽系（Pb〇一 Zn〇一B2〇3— S i〇2系 )，氧化鉛、氧化鋅、氧化硼、氧化矽、氧化鋁系（ Pb〇一 Zn〇一 B2〇3— Si〇2 — Al2〇3系），氧化鉍、氧化硼、氧化矽系（B i 2〇3 — Β 2〇3 — S i〇2 經濟部智慧財產局員工消費合作社印製系），氧化纟必、氧化硼、氧化砂、氧化錦系（B i 2 0 3 _ Β 2 Ο 3 — S i Ο 2 一八12〇3系），氧化祕、氧化鉢、興化硼、氧化矽系（B i2〇3— Zn〇一 B2〇3— S i〇2 系），氧化鉍、氧化鋅、氧化硼、氧化矽、氧化鋁系（ B i2〇3— Zn〇一 B2〇3— S i〇2 — Al2〇3系）等之玻璃料。這些低熔點玻璃料，亦可含於用以形成介電體及間壁本紙張尺度適用中國國家標準（CNS ) A4規格（21〇Χ297公釐） - 10- 1295305 A7 B7 經濟部智慧財產局員工消費合作社印製五、發明説明（8 ) 1 1 I 以外之構成要素（例如，電極、電阻體、螢光用曲體、濾色體 1 1 I Λ 黑格陣 )之組成物中。 1 1 含於用以形成構成P D P 之電極的組成物之 Μ j\\\ 機粒子請先 1 1 > 可舉 A g , A u , A 1 ， N i，A g 一 P d 合金 C U 閱讀 1 I 背 y C r 等所成之粒子。面之 1 注 1 含於用以形成構成P D P 之透明電極之組成物之 Μ j\\\ 機意事 1 1 1 粒子可舉氧化銦，氧化錫 y 含錫氧化銦（ I T 〇 ) > 含 4 銻氧化錫 (A T〇），力口氟氧化銦（F I〇 ) 加氟氧化舄本頁 1 錫 ( F T 〇），加氟氧化鋅 ( F Z〇）等所成之企丄松子以 1 | 及含有心BB 自 A 1，Co, F e ，In, S η 及 T i 之 —^ 種 1 I 或二種以上之金屬的氧化: 錄之微粒等。 1 1 訂 1 含於用以形成構成P D P 之電阻體之組成物的無機粒子 5 可舉 R u〇2等所成之粒子〇 1 I 含於用以形成構成P D P 之螢光體之組成物之 Μ ^\\\ 機粒 1 I 子可舉 Y 2 0 3 ： Ευ3 f ， Y 2 S i 〇 5 :Ε U 3 + > I 1 Y 3 1 1 5 0 1 2 ： E u 3 + : ，Y V •〇 4 : E u 3 + 5 ( Y G d ‘ ) B 0 3 ： E u 3 +， Z η 3 ( P 0 4 )2 ： Μ η 等之紅 1 1 色用螢光物質；Ζ η 2 S i ( D 4 •· Μ η， B a h ,1 1 2 〇 19 1 I : Μ η B a M g A 1 1 4 〇 2 3 • Μη, La P 〇 4 ( 1 1 C e T b ) , Y 3 ( A ： l , G a ) 6〇 12 : T b 等之綠色 1 1 用螢光物質；Y 2 S i〇 5 ： C e , B a M g A 1 1 0 〇 1 7 1 1 ： E U 2 + ，B a M g A 1 1 4 〇 2 3: E U 2 + (C a , 1 I S r > B a ) i〇 ( P 〇 4 )6 C 1 2 : E 1 α 2 + ( Ζ η ， 1 1 I C d ) S :A g等之藍色用螢光物質所成之粒子。 1 1 1 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -11 - 1295305 Α7 Β7 五、發明説明（。） 9 (請先閱讀背面之注意事項再填寫本頁) 含於用以形成構成P D P之黑條紋（格陣）之組成物之無機粒子，可舉Co, Cr， Cu， Fe， Mn， Ni ，T i，Z n等之金屬及其氧化物，複合氧化物，碳化物，氮化物，硫化物，矽化物，硼化物，及碳黑，石墨等之粒子。 <粘結樹脂> 用於本發明之粘結樹脂，係以在粘結樹脂中含有占 3 0至1 0 0重量％之比率的鹼可溶性樹脂之樹脂爲佳。在此，「鹼可溶性」係指可溶於下述鹼性蝕刻液，具可遂行目的之蝕刻處理之程度的溶解性之性質。相關之鹼可溶性樹脂之具體例，可舉例如，（甲基）丙烯酸系樹脂，羥基苯乙烯樹脂，酚醛清漆樹脂，聚酯樹脂等。如此之鹼可溶性樹脂之中，特佳者可舉下述之單體（甲）與單體（乙）之共聚物，或單體（甲）與單體（乙）及單體（丙）之共聚物等之（甲基）丙烯酸系樹脂。經濟部智慧財產局員工消費合作社印製單體（甲）：丙烯酸，甲基丙烯酸，馬來酸，富馬酸，巴豆酸，衣康酸，檸康酸，中康酸，肉桂酸，琥珀酸單（2 _(甲基 )丙燒醢氧基乙酯），0 —殘基一聚己內酯單（甲基）丙烯酸酯等之含羧基之單體類； (甲基）丙烯酸2—羥基乙酯，（甲基）丙烯酸2- 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐）一 -- -12- 1295305 Α7 Β7 五、發明説明（1Q) 羥基丙酯，（甲基）丙烯酸3 —羥基丙酯等之含羥基之單體類；鄰羥基苯乙烯，間羥基苯乙烯，對羥基苯乙烯等之含酚式羥基之單體類等爲代表之含鹼可溶性官能基之單體類。單體（乙）： (甲基）丙稀酸甲酯，（甲基）丙烯酸乙酯，（甲基 )丙烯酸正丁酯，（甲基）丙烯酸月桂酯，（甲基）两稀酸本甲酯，（甲基）丙燒酸環氧丙酯，（甲基）丙燃酸二環戊酯等之單體（甲）以外之（甲基)丙烯酸酯類；苯乙烯，α 一甲基苯乙烯等之芳族乙烯系單體類；丁二烯，異戊二烯等之共軛二烯類等所代表之可舉單體（甲基）共聚之單體類。單體（丙）：於聚苯乙烯，聚（甲基）丙烯酸甲酯，聚（甲基）丙烯酸乙酯，聚（甲基）丙烯酸苯甲酯等聚合物鏈之一末端，有（甲基）丙燦醯基等之聚合性不飽和基的巨單體爲代表之巨單體類。上述鹼可溶性樹脂之分子量，以GPC聚苯乙烯換算之重量平均分子量（以下亦稱「M w」）計，係以 5， 0〇〇至500， 000爲佳，更佳者爲 10， 0〇0 至 300, 000。粘結樹脂占含有無機粒子之樹脂組成物的含有比例，本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -----------暾|丨 (請先閱讀背面之注意事項再填寫本頁} -訂' 經濟部智慧財產局員工消費合作社印製 -13 - 1295305 A7 B7 五、發明説明（」 11 (請先閲讀背面之注意事項再填寫本頁) 相對於無機粒子1 0 0重量份，通常爲1至1，〇 0 0重量份，以5至2 0 0重量份爲佳。粘結樹脂之比例過低時，無法確實保持無機粒子之粘結。另一方面，該比例過高時，煅燒所需時間長，所形成之圖型形狀不均勻。〈特定化合物〉藉由使用含特定化合物之組成物，可使所形成之含有無機粒子之樹脂層顯現良好之可撓性及轉印性。又，於該含有無機粒子之樹脂層的圖型的煅燒形成之燒結體圖型，無該圖型之變形或該圖型之剝落的發生。因此，利用具備含有特定化合物之含有無機粒子之樹脂層的轉印薄膜的話，即可以藉由該含有無機粒子之樹脂層的圖型之煅燒，確實形成目的之燒結體圖型。相關之化合物，可舉三聚氰胺類，苯并胍胺類，二醇聯脲類等。經濟部智慧財產局員工消費合作社印製這些之中，較佳者係使用重複單元中含平均二個以上之碳原子數6以下之烷氧基甲基之化合物，更佳者爲使用重複單元中含平均二個以上之甲氧基甲基之化合物。特佳者爲使用重複單元中含平均二個以上之甲氧基甲基之三聚氰胺。如此之化合物之重量平均聚合度通常係在10以下，以5以下爲佳，以2 · 5以下爲特佳。特定化合物之市售品，可舉「Cymel 300」（重複單元中平均有5個以上甲氧基甲基之三聚氰胺，重量平均聚合本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -14- 1295305 Α7 Α7 Β7 五、發明説明（12) 度1 . 3 5 )，「Cymel 1170」（重複單元中平均有3個以上之甲氧基丁基之二醇聯脲，重量平均聚合度1 · 5) 等之Cymel系列（三井氰胺公司製），「Mw — 30」（重複單元中平均有5個以上甲氧基甲基之三聚氰胺，重量平均聚合度1 · 5)，「MX - 45」（重複單元中平均有5個以上甲氧基甲基及甲氧基丁基合倂之三聚氰胺，重量平均聚合度1 . 5)等之Nicaluk系列（三和化學公司製 )° 含有無機粒子之樹脂組成物中所含特定化合物之比例，相對於無機粒子1 0 0重量份，通常爲Ο · 1至5 0 0 重量份，較佳者爲0 · 5至1 0 0重量份，特佳者爲1至 5 0重量份。特定化合物之比例過低時，所得之轉印薄膜之可撓性及轉印性差，又，含有無機粒子之樹脂層圖型的煅燒形成之燒結體圖型，易起邊緣捲曲及圖型之剝落。g 一方面，該比例過高時，煅燒步驟所需時間長，無法獲致所形成之電極、間壁、電阻體、介電體、螢光體、濾色n 、及黑條紋（格陣）之形狀的均勻。 <含（甲基）丙烯醯基之化合物> 本發明之組成物中，亦可含分子中至少有一（甲基）丙烯醯基之化合物。上述化合物之具體例，可舉具有一（甲基）丙烯醯基之化合物，例如，（甲基）丙烯酸甲酯，（甲基）丙烯酸乙酯，（甲基）丙烯酸丙酯，（甲基）丙烯酸異丙酯，（本紙張尺度適用中國國家標準（CNS ) A4規格（210Χ297公釐） -----------I — (請先閱讀背面之注意事項再填寫本頁) 、1Τ 經濟部智慧財產局員工消費合作社印製 -15- 1295305 Α7 Β7 五、發明説明（） v 13 1 (請先閲讀背面之注意事項再填寫本頁) 甲基）丙烯酸丁酯，（甲基）丙烯酸異丁酯，（甲基）丙燒酸三級丁酯，（甲基）丙烯酸戊酯，（甲基）丙烯酸戊酯，（甲基）丙烯酸異戊酯，（甲基）丙烯酸己酯，（甲基）丙烯酸庚酯，（甲基）丙烯酸辛酯，（甲基）丙燃酸異辛酯，（甲基）丙烯酸2—乙基己酯，（甲基）丙嫌酸壬酯，（甲基）丙烯酸癸酯，（甲基）丙烯酸異癸酯，（甲基）丙烯酸~f 酯，（甲基）丙烯酸十二酯，（甲基）丙燦酸十三酯，（甲基）丙烯酸月桂酯，（甲基）丙嫌酸硬脂酯，（甲基）丙烯酸異硬脂酯等之（甲基）丙烯酸院基酯類； (甲基）丙烯酸羥甲酯，（甲基）丙烯酸2 —羥基乙酯， (甲基）丙烯酸2 —羥基丙酯，（甲基）丙烯酸3 —羥基丙酯，（甲基）丙烯酸2 —羥基丁酯，（甲基）丙烯酸3 一羥基丁酯，（甲基）丙烯酸一 4 一羥基丁酯等之（甲基 )丙烯酸羥基烷基酯類；經濟部智慧財產局員工消費合作社印製 (甲基）丙嫌酸2—甲氧基乙酯，（甲基）丙烯酸2—乙氧基乙酯，（甲基）丙烯酸2—丙氧基乙酯，（甲基）丙烯酸2—丁氧基乙酯，（甲基）丙烯酸2—甲氧基丁酯等之（甲基）丙烯酸烷氧基烷基酯類；丙烯酸，甲基丙烯酸，2 -（甲基）丙烯醯氧基琥珀酸， ω -羧基-聚己內酯單（甲基）丙烯酸酯等之含有含羧基之（甲基）丙烯醯基之化合物等。有二個以上之（甲基）丙烯醯基之化合物，可舉例如，乙二醇、丙二醇等之亞烴二醇之二（甲基）丙烯酸酯類本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐）經濟部智慧財產局員工消費合作社印製 1295305 A7 B7 五、發明説明（14) ，三元以上之多元醇之聚烷烴二醇加成物之多元（甲基）丙烯酸酯類；聚乙烯醇，聚丙烯醇等之聚亞烴二醇之二（甲基）丙烯酸酯；甘油，1，2，4 一丁三醇，三羥甲基鏈烷，四羥甲基鏈烷，季戊四醇，二季戊四醇等之三元以上多元醇之多元（甲基）丙烯酸酯類及其二羧酸改質物； 1，4 一環己二醇，1，4 一苯二醇類等之環狀多元醇之多元（甲基）丙烯酸酯類；聚酯.（甲基）丙烯酸酯，環氧.（甲基）丙烯酸酯，氨醋（甲基）丙烯酸酯，醇酸（甲基）丙烯酸酯，矽酮樹脂（甲基）丙烯酸酯，鏈烷（甲基）丙嫌酸酯等之低聚（甲基）丙烯酸酯類；聚丁二烯，聚異戊二烯，聚己內酯等之聚合物之二末端羥基化而得之二（甲基）丙烯酸酯類；參（甲基）丙烯醯氧基乙基磷酸酯等，而較佳者可舉乙二醇，丙二醇等之亞烴二醇之二（甲基）丙烯酸酯類；聚乙烯醇，聚丙烯醇等之聚亞烴二醇之二（甲基）丙烯酸酯類。這些可以單獨或二種以上混合使用。本發明之組成物中，爲使所得轉印薄膜之可撓性及轉印性佳，並使光阻圖型，及含有無機粒子之樹脂層的圖型之密合性優，特別以使用具二以上之（甲基）丙烯醯基之化合物，亦即多元丙烯酸酯爲佳。本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁)1295305 A7 B7 V. INSTRUCTION DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a resin composition containing inorganic particles, a transfer film, and a method of manufacturing a plasma display panel using the same, and more particularly, In forming the electrodes, partitions, resistors, dielectrics, phosphors, color filters, and black stripes (lattice arrays) of the display cells constituting the plasma display panel, the high-definition pattern is formed. A resin composition of inorganic particles, a transfer film having a resin layer containing inorganic particles obtained by using the composition, and a method for producing a plasma display panel using the transfer film. The advanced technology plasma display panel (hereinafter also referred to as "PDP") is attracting attention in flat panel display technology due to its large size, simple process, large viewing angle, and high quality of self-illuminating display, especially for color PDP. As a television display device for 20 吋 or more, it is expected to become a mainstream 〇 color PDP in the future, and ultraviolet rays are generated by gas discharge to illuminate the phosphor to perform color display. In general, in a color PDP, a phosphor portion for red light emission, a phosphor portion for green light emission, and a phosphor portion for blue light emission are formed on a substrate, and the light-emitting display cells of each color are uniformly formed. The status of the mixed. Specifically, on the surface of the substrate such as glass, a wall between the insulating materials called the surrounding walls is provided, and a plurality of display cells are drawn by the partition walls, and the inside of the display cells is the working space of the plasma. Because the plasma is located in the space of the phosphor, and the size of the paper is set to the Chinese National Standard (CNS) A4 specification (210X 297 mm) (please read the notes on the back and fill in the blanks). This page] 'Apparel · Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 1295305 A7 B7 V. Invention Description (2) Electrodes for making plasma work, electric display panel with each display cell as a unit So constituted. (Please read the precautions on the back and fill out this page.) Figure 1 shows a schematic view of the cross-sectional shape of the AC plasma display panel. In the figure, 1 and 2 are glass substrates which are arranged to face each other, and the 3 series partition walls are divided into display cells by the glass substrate 1, the glass substrate 2, and the partition wall 3. 4 is fixed to the transparent electrode of the glass substrate 1, 5 is intended to reduce the resistance of the transparent electrode 4 and is formed on the bus electrode of the transparent electrode 4, 6 is fixed to the address electrode of the glass substrate 2, and 7 is kept in the cell In the phosphor, the dielectric layer of the transparent electrode 4 and the bus bar electrode 5 formed on the surface of the glass substrate 1 is covered, and the dielectric layer of the address electrode 6 formed on the surface of the glass substrate 2 is covered by the 9-layer. 0 is a protective film made of, for example, magnesium. Further, in order to improve the contrast of the PDP, a red, green, and blue color filter and a black grid having a stripe or grid shape are sometimes disposed between the glass substrate 1 and the dielectric body 8. Or between the dielectric body 8 and the protective film 10 described above. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the Consumers' Cooperatives. In the DC type P D P, a resistor is usually provided between the electrode terminal (anode terminal) and the electrode lead (anode lead) along with the constituent elements of the above-described AC type P D P . It is known that the electrode, the partition, the resistor, the dielectric, the phosphor, the color filter, and the black matrix which constitute such a plasma display panel are (1) non-photosensitive. The resin composition of the inorganic particles is screen printed on the substrate to obtain a pattern and then calcined by the screen printing method, and (2) a photosensitive resin film containing the inorganic particles is formed on the substrate, and the mask is irradiated with ultraviolet rays through the mask. The film is re-developed to form a pattern on the substrate, and the paper size is applied to the Chinese National Standard (CNS) A4 specification (210X297 mm) -5 - 1295305 A7 B7 5. Invention Description (3) Calcination light lithography . (Please read the precautions on the back and fill out this page.) The problem to be solved by the invention However, in the above-mentioned screen printing method, as the panel is enlarged and highly refined, the positional accuracy of the pattern becomes very strict. It is harsh and there is a problem that the usual printing cannot correspond. Further, in the above-described photolithography method, when a pattern having a film thickness of 10 to 100 μm is formed in one exposure and development step, the resin layer containing the inorganic particles has low sensitivity to the depth direction, and it is difficult to obtain sharp edges. Highly detailed graphics. Further, it is liable to remain in the developing step, and the sintered body formed by the calcination step is deformed in a pattern, or the pattern is liable to be peeled off or the like. The Ministry of Economic Affairs, the Intellectual Property Office, and the Consumer Cooperatives are printed as electrodes, partitions, resistors, dielectrics, phosphors, filters, and black grids with high dimensional accuracy, and workability is as above ( (1) The method for forming a method for improving the production method, the present inventors have already included, a resin layer containing inorganic particles derived from a resin composition containing inorganic particles is formed on a support film, and the resin containing the inorganic particles is used. The layer is transferred onto the substrate, and a photoresist film is formed on the resin layer containing the inorganic particles transferred onto the substrate, and the photoresist film is exposed to form a latent image of the photoresist pattern, and the photoresist film is developed. Processing a pattern of a photoresist pattern, and performing uranium engraving of the resin layer containing the inorganic particles to form a pattern of a resin layer containing an inorganic particle corresponding to a resist pattern, and the pattern is subjected to a method such as a calcination treatment A method of forming at least one of an electrode, a resistor, a dielectric, a phosphor, a color filter, and a black matrix is employed (Japanese Patent Laid-Open Publication No. Hei 11-162339). This paper scale applies to China National Standard (CNS) A4 specification (21〇><297 mm) -6- 1295305 A7 B7 V. Invention description () 4 (Please read the note on the back and fill in this page) Such a manufacturing method can form a pattern having a high degree of fineness and excellent surface uniformity. Further, the resin layer containing the inorganic particles formed of the resin composition containing the inorganic particles is formed on the support film (hereinafter referred to as "transfer film"), and can be wound into a roll shape. It is also advantageous in the conventional transfer film that the resin layer containing the inorganic particles formed on the support film cannot form a film having sufficient flexibility, and the transfer film is bent and the resin layer containing the inorganic particles is formed. The problem of tiny cracks (cracks) on the surface. Further, the resin layer containing the inorganic particles does not exhibit sufficient adhesiveness (heat adhesiveness) to the glass substrate, and there is a problem that it is difficult to transfer from the support film to the surface of the glass substrate. Further, in the image of the sintered body formed by patterning the resin layer containing the inorganic particles, there is a problem that it is easily deformed or peeled off. Here, the "deformation of the pattern" refers to a phenomenon in which the edge portion of the pattern is rolled up from the substrate, that is, the edge curl. Printed by the Ministry of Economic Affairs, the Intellectual Property Bureau, and the Consumer Cooperatives. The "exfoliation of the pattern" refers to the result of the deformation of the extreme pattern and the phenomenon that the pattern falls off the substrate. The present invention has been made based on the above facts. A first object of the present invention is to provide flexibility, transferability (heat-adhesiveness of a resin layer containing an inorganic particle to a glass substrate), and a sintered body pattern formed by a squeezing step and a calcination step. The inorganic particle-containing resin composition of the inorganic particle-containing resin layer which is deformed or peeled off is applicable to the Chinese National Standard (CNS) A4 specification (21〇X297 mm) 1295305 A7 B7 5. Inventive Note (c) 5 ( Please read the precautions on the back side and fill out this page.) The second object of the present invention is to provide flexibility and transferability (heat-adhesiveness of a resin layer containing inorganic particles to a glass substrate). The transfer film formed by the step and the calcination step is a transfer film of a resin layer containing inorganic particles which is not deformed or peeled off. A third object of the present invention is to provide a method of manufacturing a plasma display panel which is capable of forming a pattern having high dimensional accuracy and excellent workability. Means for Solving the Problem A resin composition containing an inorganic particle of the present invention is characterized by containing (A) inorganic particles, (B) a binder resin, and (C) a methylol group and/or an oxymethyl group. The compound (hereinafter also referred to as "specific compound" and (D) solvent. The transfer film of the present invention is characterized in that it is obtained from the above-mentioned inorganic granule-containing resin composition and formed on the support film containing inorganic particles. The resin layer of the present invention is characterized in that the resin layer containing the inorganic particles constituting the transfer film is transferred onto the substrate by the method of manufacturing the plasma display panel of the present invention. Forming a photoresist film on the transferred resin layer containing the inorganic particles, and exposing the photoresist film to form a latent image of the photoresist pattern, and developing the photoresist film as a photoresist pattern The etching treatment of the resin layer containing the inorganic particles forms a pattern of the resin layer containing the inorganic particles corresponding to the resist pattern, and the calcination treatment of the pattern forms the partition, the electrode, the resistor, and the dielectric The step of manufacturing at least one of a phosphor, a color filter and a black matrix. Further, the method for manufacturing a plasma display panel of the present invention is characterized in that the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210×297 mm). )~' ' -8 - 1295305 Α7 A 7 B7 V. INSTRUCTIONS (.) 6 (Please read the note on the back and fill out this page) Included, by forming a photoresist layer on the support film, A laminated film of a resin layer containing inorganic particles from a resin composition containing inorganic particles, which is transferred onto a substrate, and subjected to exposure treatment of a photoresist film constituting the laminated film to form a resist pattern The latent image is developed into a photoresist pattern for the development of the photoresist film, and the uranium engraving treatment of the resin layer containing the inorganic particles forms a resin layer pattern containing the inorganic particles corresponding to the photoresist pattern. The calcination treatment of the type forms a step of forming at least one of a partition, an electrode, a resistor, a dielectric, a phosphor, a color filter, and a black matrix. In the embodiment of the invention, the inorganic content of the invention will be described in detail below. Resin composition of particles〇 The inorganic particle-containing resin composition of the present invention contains inorganic particles, a binder resin, and a specific compound and a solvent as essential components. <Inorganic Particles> Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative Printed Containing Inorganic Particles Used in the Invention The type of the inorganic particles of the resin composition is composed of the use of the sintered body formed of the composition (for example, a partition, an electrode, a resistor, a dielectric, a phosphor, a color filter, a black matrix, etc.) Here, the inorganic particles contained in the composition for forming the wall between the PDP and the dielectric may be a glass frit having a low melting point, etc. The glass frit having a low melting point is softened by the element. The point is in the range of 400 to 600 ° C. This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210Χ297 mm) -9- 1295305 A7 B7 V. Invention description (7 ) (Please Read the back of the precautions and fill out this page.) When the softening point of the glass frit is less than 40 °C, the resin layer containing the inorganic particles from the composition is in the calcination step because the organic substance such as the binder resin is not Phase decomposition of the glass frit is removed wholly molten, formed in the sintered body portion of the residual organic substances, with the result that the sintered body is colored, the light transmittance tends to decrease. On the other hand, when the softening point of the glass frit exceeds 60 ° C, it is liable to be calcined at a temperature of 60 ° C or higher, which tends to cause deformation of the glass substrate. Specifically, lead oxide, boron oxide, lanthanum oxide (P b 0 - B 2 〇 3 - S i 〇 2 series), lead oxide, boron oxide, cerium oxide, alumina (P b 〇 B) 2 0 3 — S i〇2 — A 1 2〇3 series), zinc oxide, boron oxide, lanthanum oxide system (Ζη〇B 2〇3 — S i〇2 system), zinc oxide, boron oxide, oxidation矽, alumina system (Ζ η 0 — Β 2 0 3 — S i〇2 — Α 12〇3 series), oxidation bell, 羁化羊 sheep, Xinghua boron, lanthanum oxide system (Pb〇-Zn〇-B2 〇3—S i〇2 series), lead oxide, zinc oxide, boron oxide, cerium oxide, aluminum oxide (Pb〇-Zn〇-B2〇3—Si〇2—Al2〇3 series), yttrium oxide, oxidation Boron, lanthanum oxide system (B i 2〇3 — Β 2〇3 — S i〇2 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing system), bismuth oxide, boron oxide, oxidized sand, oxidized brocade (B i 2 0 3 _ Β 2 Ο 3 — S i Ο 2 八12〇3 series), oxidized secret, cerium oxide, Xinghua boron, lanthanum oxide system (B i2〇3—Zn〇B2〇3—S i〇 2 series), cerium oxide, zinc oxide, boron oxide, cerium oxide, oxidation A glass frit such as aluminum (B i2〇3—Zn〇-B2〇3—S i〇2 — Al2〇3 series). These low-melting glass frits can also be used to form dielectrics and partitions. The paper is applicable to China National Standard (CNS) A4 specifications (21〇Χ297 mm) - 10 1295305 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau employees Consumer Cooperatives Print 5, Invention Description (8) Components of components other than I 1 (for example, electrodes, resistors, fluorescent files, and color filters 1 1 I Λ black matrix). 1 1 Μ j\\\ machine particles used to form the electrode constituting the PDP, please first 1 1 > A g , A u , A 1 , N i, A g - P d alloy CU Read 1 I Back y C r and other particles. Note 1 is included in the composition of the transparent electrode used to form the PDP. j\\\ Machine Ideas 1 1 1 Particles can be indium oxide, tin oxide y tin-containing indium oxide (IT 〇) > 4 antimony tin oxide (AT〇), indium oxyfluoride (FI〇) plus fluorinated yttria page 1 tin (FT 〇), fluorinated zinc oxide (FZ〇) and other enterprises into the pine nuts to 1 | and Oxidation of a metal containing two or more metals of the core BB from A 1, Co, F e , In, S η and T i : recorded particles and the like. 1 1 The inorganic particles 5 contained in the composition for forming the resistor body constituting the PDP are exemplified by particles 〇1 I formed of R u 〇 2 or the like, which are contained in a composition for forming a phosphor constituting the PDP. Μ ^\\\ Machine particles 1 I can be Y 2 0 3 : Ευ 3 f , Y 2 S i 〇 5 : Ε U 3 + > I 1 Y 3 1 1 5 0 1 2 : E u 3 + : , YV •〇4 : E u 3 + 5 ( YG d ' ) B 0 3 : E u 3 +, Z η 3 ( P 0 4 )2 : Red 1 η etc. 1 1 color using fluorescent substance; Ζ η 2 S i ( D 4 •· Μ η, B ah , 1 1 2 〇19 1 I : Μ η B a M g A 1 1 4 〇 2 3 • Μη, La P 〇4 ( 1 1 C e T b ) , Y 3 ( A : l , G a ) 6〇12 : Green color 1 1 of T b etc. Fluorescent substance; Y 2 S i〇5 : C e , B a M g A 1 1 0 〇1 7 1 1 : EU 2 + , B a M g A 1 1 4 〇 2 3: EU 2 + (C a , 1 IS r > B a ) i〇( P 〇4 )6 C 1 2 : E 1 α 2 + ( Ζ η , 1 1 IC d ) S : A g or the like is a blue particle made of a fluorescent substance. 1 1 1 This paper scale applies to Chinese national standards. CNS ) A4 size (210X297 mm) -11 - 1295305 Α7 Β7 V. Invention description (.) 9 (Please read the note on the back and fill out this page) Contains the black stripes (lattice array) used to form the PDP. Examples of the inorganic particles of the composition include metals such as Co, Cr, Cu, Fe, Mn, Ni, Ti, and Z n and oxides thereof, composite oxides, carbides, nitrides, sulfides, and tellurides. Boron, and particles of carbon black, graphite, etc. <Binder Resin> The binder resin used in the present invention contains alkali solubility in a ratio of 30 to 100% by weight in the binder resin. The resin of the resin is preferred. Here, the "alkali-soluble" means a solubility which is soluble in the following alkaline etching liquid and has a solubility to the extent that it can be etched. Specific examples of the alkali-soluble resin to be used include, for example, a (meth)acrylic resin, a hydroxystyrene resin, a novolak resin, and a polyester resin. Among such alkali-soluble resins, a copolymer of the following monomer (A) and monomer (B), or a monomer (A) and a monomer (B) and a monomer (C) may be mentioned. A (meth)acrylic resin such as a copolymer. Ministry of Economic Affairs, Intellectual Property Bureau, Staff Consumer Cooperative, Printing Monomer (A): Acrylic acid, methacrylic acid, maleic acid, fumaric acid, crotonic acid, itaconic acid, citraconic acid, mesaconic acid, cinnamic acid, succinic acid a monomer having a carboxyl group such as mono(2-(methyl)propenyloxyethyl ester), 0-residue-polycaprolactone mono(meth)acrylate; 2-hydroxyl (meth)acrylate Ethyl ester, (meth)acrylic acid 2- This paper size is applicable to Chinese National Standard (CNS) Α4 specification (210Χ297 mm) I---12- 1295305 Α7 Β7 V. Description of invention (1Q) Hydroxypropyl ester, (methyl a hydroxyl group-containing monomer such as 3-hydroxypropyl acrylate; an alkali-soluble functional group represented by a phenolic hydroxyl group-containing monomer such as o-hydroxystyrene, m-hydroxystyrene or p-hydroxystyrene; Monomers. Monomer (B): methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, lauryl (meth) acrylate, (methyl) diacid (meth)acrylates other than the monomers (methyl), such as esters, (meth)propionate, propylene acrylate, (meth)propionic acid, dicyclopentyl ester, etc.; styrene, α-methylbenzene An aromatic vinyl monomer such as ethylene; a conjugated diene such as butadiene or isoprene; and a monomer (meth) copolymerizable monomer. Monomer (C): at the end of one of the polymer chains of polystyrene, poly(methyl) acrylate, poly(ethyl) acrylate, poly(methyl) methacrylate, etc. A macromonomer represented by a macromonomer of a polymerizable unsaturated group such as a propylene group. The molecular weight of the above alkali-soluble resin is preferably from 5,000 to 50,000, more preferably from 10,0 Å, based on the weight average molecular weight (hereinafter also referred to as "Mw") in terms of GPC polystyrene. 0 to 300,000. The binder resin accounts for the content ratio of the resin composition containing inorganic particles. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -----------暾|丨(Please read first Precautions on the back page Fill in this page} -Booked 'Ministry of Economics Intellectual Property Bureau Staff Consumer Cooperative Printed -13 - 1295305 A7 B7 V. Invention Description (" 11 (Please read the note on the back and fill out this page) The inorganic particles are 100 parts by weight, usually 1 to 1, and 0 parts by weight, preferably 5 to 200 parts by weight. When the ratio of the binder resin is too low, the bonding of the inorganic particles cannot be surely maintained. On the one hand, when the ratio is too high, the time required for calcination is long, and the shape of the formed pattern is not uniform. <Specific compound> By using a composition containing a specific compound, the formed resin layer containing the inorganic particles can be visualized. Good flexibility and transferability. Moreover, the sintered body pattern formed by the calcination of the pattern of the resin layer containing the inorganic particles does not have the deformation of the pattern or the occurrence of peeling of the pattern. Contains a specific compound In the transfer film of the resin layer of the inorganic particles, the desired sintered body pattern can be surely formed by calcination of the pattern of the resin layer containing the inorganic particles. Related compounds include melamine and benzoguanamine. Classes, glycols, ureas, etc. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the employee consumption cooperatives, preferably using a compound having an average of two or more alkoxymethyl groups having 6 or less carbon atoms in the repeating unit. More preferably, a compound having an average of two or more methoxymethyl groups in the repeating unit is used. Particularly preferred is the use of melamine containing an average of two or more methoxymethyl groups in the repeating unit. The average degree of polymerization is usually 10 or less, preferably 5 or less, and particularly preferably 2 or less. The commercial product of a specific compound is "Cymel 300" (the average of 5 or more methoxy groups in the repeating unit) Based on melamine, the weight average polymerization of this paper scale is applicable to China National Standard (CNS) A4 specification (210X297 mm) -14- 1295305 Α7 Α7 Β7 V. Invention description (12) degree 1. 3 5 ), "Cymel 1170" (Cymel series with an average of 3 or more methoxy butyl groups in a repeating unit, weight average degree of polymerization of 1-5), etc., Cymel series (manufactured by Mitsui Cyanamide Co., Ltd.), "Mw-30" (On average, there are more than 5 methoxymethyl melamines in the repeating unit, the weight average degree of polymerization is 1 · 5), "MX - 45" (the average of 5 or more methoxymethyl and methoxy butyl groups in the repeating unit) The ratio of the specific compound contained in the resin composition containing inorganic particles, and the weight average degree of polymerization of melamine, the weight average degree of polymerization of 1.5%, etc., 100 parts by weight relative to the inorganic particles. It is usually from 1 to 5,000 parts by weight, preferably from 0.5 to 10,000 parts by weight, and particularly preferably from 1 to 50 parts by weight. When the ratio of the specific compound is too low, the resulting transfer film has poor flexibility and transferability, and the sintered body pattern formed by calcination of the resin layer pattern containing inorganic particles is liable to cause edge curl and pattern peeling. . g On the one hand, when the ratio is too high, the calcination step takes a long time to obtain the formed electrode, the partition, the resistor, the dielectric, the phosphor, the filter n, and the black stripe (lattice). Uniform shape. <Compound containing (meth)acrylinyl group> The composition of the present invention may further contain a compound having at least one (meth)acryloyl group in the molecule. Specific examples of the above compound include a compound having a (meth) acrylonitrile group, for example, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, (methyl). Isopropyl acrylate, (This paper scale applies to Chinese National Standard (CNS) A4 specification (210Χ297 mm) -----------I — (Please read the notes on the back and fill out this page) 1Τ Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Print -15- 1295305 Α7 Β7 V. Invention Description () v 13 1 (Please read the note on the back and fill out this page) Methyl) butyl acrylate, (methyl) Isobutyl acrylate, tert-butyl (meth)propionate, pentyl (meth)acrylate, amyl (meth)acrylate, isoamyl (meth)acrylate, hexyl (meth)acrylate, Heptyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)propionate, 2-ethylhexyl (meth)acrylate, (meth)propanoic acid decyl ester, Ethyl methacrylate, isodecyl (meth) acrylate, (methyl) propylene ~f ester, dodecyl (meth)acrylate, tridecyl (meth)propanoate, lauryl (meth)acrylate, stearyl methacrylate, (meth)acrylic acid (meth)acrylic acid esters such as aliphatic esters; methyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, (meth)acrylic acid 3-hydroxypropyl ester, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, hydroxyalkyl (meth)acrylate such as 4-tetrahydroxybutyl (meth)acrylate Class; Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed (methyl) propylene acid 2-methoxyethyl ester, (meth)acrylic acid 2-ethoxyethyl ester, (meth)acrylic acid 2-propoxy Ethyl (meth)acrylic acid alkoxyalkyl esters such as ethyl ester, 2-butoxyethyl (meth)acrylate, 2-methoxybutyl (meth)acrylate; acrylic acid, methacrylic acid, 2 -(meth)acryloxy succinic acid, ω-carboxy-polycaprolactone mono(meth)acrylate, etc. A compound containing a carboxyl group (meth) acrylonitrile group or the like. A compound having two or more (meth) acrylonitrile groups, for example, a di(meth) acrylate of an alkylene glycol such as ethylene glycol or propylene glycol. The paper size is applicable to the Chinese National Standard (CNS) Α 4 Specifications (210Χ297 mm) Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperatives Printed 1295305 A7 B7 V. Description of Invention (14), Poly(alkyl) acrylates of polyalkane diol adducts of ternary or higher polyols ; a di(meth) acrylate of a polyalkylene glycol such as polyvinyl alcohol or polypropylene alcohol; glycerin, 1,2,4 tributol, a trimethylol alkane, a tetramethylol alkane, a polyvalent (meth) acrylate of a trihydric or higher polyhydric alcohol such as pentaerythritol or dipentaerythritol, and a dicarboxylic acid modified product thereof; a cyclic polyol such as 1,4 cyclohexanediol or 1,4 monophenylene glycol; Poly (meth) acrylates; polyesters (meth) acrylates, epoxy (meth) acrylates, ammonia vinegar (meth) acrylates, alkyd (meth) acrylates, fluorenone Resin (meth) acrylate, alkane (methyl) propylene An oligomeric (meth) acrylate such as an ester; a di(meth) acrylate obtained by hydroxylating two ends of a polymer such as polybutadiene, polyisoprene or polycaprolactone; (meth)acryloyloxyethyl phosphate, etc., preferably di(meth)acrylates of alkylene glycols such as ethylene glycol and propylene glycol; polyvinyl alcohol, polypropylene alcohol, etc. Di(meth)acrylates of polyalkylene glycols. These may be used alone or in combination of two or more. In the composition of the present invention, the flexibility and transferability of the obtained transfer film are excellent, and the pattern of the photoresist pattern and the resin layer containing the inorganic particles are excellent in adhesion, particularly in the use of the article. A compound of two or more (meth) acrylonitrile groups, that is, a polybasic acrylate is preferred. This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the notes on the back and fill out this page)

-17- 1295305 Δ7 A 7 B7 五、發明説明（） 15 (請先閱讀背面之注意事項再填寫本頁) 含有無機粒子之樹脂組成物中，含（甲基）丙烯醯基之化合物之含有比例，爲於所形成之含有無機粒子之樹脂層，更得良好之可撓性及鈾刻性，對於無機粒子1 〇〇重量份，通常係在Ο·1至500重量份，較佳者爲0.5 至1 0 0重量份。 <溶劑> 構成本發明之含有無機粒子之樹脂組成物的溶劑，係用以賦予該含有無機粒子之樹脂組成物適當之流動性或可塑性，良好之成膜性。上述溶劑係與無機粒子之親和性，粘：結樹脂，特定化合物等之有機成分的溶解性良好，可賦予含有無機粒子之樹脂組成物適當之粘性，以乾燥可易於蒸發去除者即無特殊限制，可舉例如，醚類，酯類，醚酯類，酮類，酮酯類，醯胺類，醯胺酯類，內醯胺類，內酯類，亞颯類，楓類，烴類，鹵化烴類等。經濟部智慧財產局員工消費合作社印製相關溶劑之具體例，可舉四氫呋喃，苯甲醚，二噁院，乙二醇單烷醚類，二乙二醇二烷醚類，丙二醇單烷醚類，丙二醇二烷醚類，醋酸酯類，羥基醋酸酯類，烷氧基醋酸酯類，丙酸酯類，羥基丙酸酯類，烷氧基丙酸酯類，乳酸酯類，乙二醇單烷醚醋酸酯類，丙二醇單烷醚醋酸酯類，烷氧基醋酸酯類，環狀酮類，非環狀酮類，乙醯基醋酸酯類，丙酮酸酯類，Ν，Ν —二烷基甲醯胺類，Ν，Ν -一院基乙醯胺類，Ν —院基吼略院酮類，7 -內酯類，二本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） -18- 1295305 Α7 Β7 五、發明説明（16) 烷基亞楓類，二烷基颯類，葉輪機油，N -甲基一 2 -吡咯烷酮等，這些可單獨使用或二種以上混合使用。 (請先閲讀背面之注意事項再填寫本頁) 含有無機粒子之樹脂組成物中溶劑之含有比例，可在能得良好成膜性（流動性或可塑性）之範圍內適當選擇，通常，對於無機粒子1 0 0重量份，係以在1至 10，000重量份爲佳，以在10至1，000重量份爲更佳。 <可塑劑> 本發明之組成物中，爲於所形成之含有無機粒子之樹脂層賦予更佳之可撓性，亦可含可塑劑。特佳之可塑劑，可舉以下結構式（1 )或結構式（2 )所示化合物所成之可塑劑（以下稱「特定可塑劑」）。從含特定可塑劑而成之本發明之組成物，可於所形成之含有無機粒子之樹脂層得更佳之可撓性及煅燒性，並且，因該特定可塑劑容易以熱分解去除，該含有無機粒子之樹脂層煅燒而得之例如介電體等可無透光率之下降。經濟部智慧財產局員工消費合作社印製結構式（1 ) R^O-^-^OOC-f CHg^COO -(-R3 〔式中，R1及R3各係相同或不同之碳原子數1至 3 0之烷基，R2及R4各係相同或不同之碳原子數 1至3 0之亞烴基，m係〇至5之數，η係1至 1 0之數。〕本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） -19- 1295305 Α7 Β7 五、發明説明（）式構結 5 R I CHO 1 ο - Η1c1Η _Η HICIO - C 3 Η (請先閱讀背面之注意事項再填寫本頁) 〔式中，R5係碳原子數1至30之烷基或烯基。〕呈示特定可塑劑之上述結構式（1 )中，R 1或R 4所示之烷基，及R 2或R 3所示之亞烴基，可係直鏈狀或分枝狀，且可係飽和基或不飽和基。 R 1或R 4所示之烷基之碳原子數在1至3 0，以2至 2 0.爲佳，4至1 0爲更佳。上述結構式（1 )中，η係在1至1 0，以2至6爲佳。上述結構式（1 )所示化合物之具體例者，可舉己二酸二丁酯，己二酸二異丁酯，己二酸二—2 —乙基己酯，壬二酸二一2—乙基己酯，癸二酸二丁酯，二丁二醇己二酸酯等。經濟部智慧財產局員工消費合作社印製呈示特定可塑劑之上述結構式（2 )中，R 5所示之烷基或烯基，可係直鏈狀或分枝狀，又，可係飽和基或不飽和基。 R5所示之烷基或烯基之碳原子數係在1至3 0，以2 至20爲較佳，以10至18爲更佳。上述結構式（2 )所示化合物之具體例，可舉丙二醇單月桂酸酯，丙二醇單油酸酯等。本銀*張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐) " -20- 1295305 Α7 Β7 五、發明説明（） Ίο 又，特定可塑劑以外之較佳可用化合物，可舉聚丙二醇等。 (請先閱讀背面之注意事項再填寫本頁) 本發明之組成物中特定可塑劑之含有比例，對於無機粒子1 0 0重量份，係以在1 0 0重量份以下爲佳，以在 0 · 5至5 0重量份爲更佳。本發明之組成物，除上述成分外，可含分散劑，顯影促進劑，粘著助劑，暈影防止劑，保存安定劑，消泡劑，抗氧化劑，紫外線吸收劑，增粘劑，表面張力調節劑，流平劑，交連劑，聚合啓始劑，酸產生劑等各種添加劑作爲任意成分。又，本發明之含無機粒子之樹脂組成物，亦可含構成下述之光阻組成物的光聚合啓始劑，而具放射線靈敏性。本發明之含有無機粒子之樹脂組成物，可由將無機粒子，粘結樹脂，特定化合物，溶劑以及任意成分，用輥筒混練機，混合機，均質機，球磨機，珠磨機等混練機混練調製。經濟部智慧財產局員工消費合作社印製如上述調製之含無機粒子的樹脂組成物，通常係具適於塗布之流動性之糊狀組成物，其粘度通常係在1 0 0至 300， 000厘泊，以在500至30， 000厘泊爲佳。本發明之組成物，可特適用以製造以下將予詳述之轉印薄膜（本發明之轉印薄膜）。在此，供給作支承膜之塗布的本發明之含有無機粒子之樹脂組成物，其粘度係以在1，〇〇〇至1 〇，〇〇〇 ^紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） ' -21 - 1295305 A7 B7 五、發明説明（19) 厘泊爲佳。 (請先閱讀背面之注意事項再填寫本頁) <轉印薄膜> 第2圖（甲）係呈示捲成輥狀之本發明的轉印薄膜之槪略剖視圖，同圖（乙）係呈示該轉印薄膜之層構造的剖視圖〔（甲）之部分放大圖〕。第2圖所示之轉印薄膜，係本發明的轉印薄膜之一例，係用以形成構成P D P之介電體的複合薄膜，通常由支承膜F 1，形成於該支承膜F 1之表面而可剝離之含有無機粒子之樹脂層F 2，及設於該含有無機粒子之樹脂層 F 2之表面且容易剝離之覆蓋膜F 3所構成。覆蓋膜F3 亦可依含有無機粒子之樹脂層F 2之性質，或爲減輕轉印薄膜所捲成之捲輥的重量不予使用。構成轉印薄膜之支承膜F 1，係以具耐熱性及耐溶劑性，並具可撓性之樹脂膜爲佳。支承膜因具有可撓性，可用輥塗機等塗布本發明之組成物，將所得之含有無機粒子之樹脂層於捲起成輥之狀態保存、供給。經濟部智慧財產局員工消費合作社印製形成支承膜F 1之樹脂，可舉例如，聚對苯二甲酸乙二醇酯，聚酯，聚乙烯，聚丙烯，聚苯乙烯，聚醯亞胺，聚乙烯醇，聚氯乙烯，聚氟乙烯等之含氟樹脂，尼龍，纖維素等。支承膜F 1之厚度，係例如2 0至1 0 〇微米。構成轉印薄膜之含有無機粒子之樹脂層F 2，係藉火段燒成之燒結體所成之層，可藉塗布本發明之含有無機粒子之樹脂組成物於上述支承膜上，將塗膜乾燥以去除部份或本紙張尺度適用中國國家標準（CNS ) A4規格（X 297公釐） -22- 1295305 A7 ________B7 五、發明説明（2()) 全部之溶劑而形成。 (請先閱讀背面之注意事項再填寫本頁) 含有無機粒子之樹脂層F2之膜厚，可依無機粒子之含有率，部品之種類及大小等，作適當選擇。構成轉印薄膜F 3之覆蓋膜F 3，係用以保護含有無機粒子之樹脂層F 2之正面（與玻璃基板之接觸面）的膜。該覆蓋膜F 3亦以係具可撓性之樹脂膜爲佳。形成覆蓋膜F 3之樹脂，可舉聚對苯二甲酸乙二醇酯膜，聚乙烯膜，聚乙烯醇系膜等。又，覆蓋膜F 3之厚度，係在例如 2 0至1 〇〇微米。本發明之轉印薄膜，可藉形成含有無機粒子之樹脂層 (F 2 )於支承膜（F 1 )上，設置（壓合）覆蓋膜（ F 3 )於該含有無機粒子之樹脂層上而製造。塗布本發明之組成物於支承膜上之方法，係以能高效率形成厚度均勻性優之膜厚（例如1微米以上）的塗膜者爲佳，具體而g，可舉凹輥塗布法，模口塗布法，輥塗法，幕塗法，線塗法等較佳方法。經濟部智慧財產局員工消費合作社印製塗膜之乾燥條件，係5 0至1 5 0 °C，0 · 5至3 0 分鐘左右，乾燥後溶劑殘留比率（含有無機粒子之樹脂層中之含有率）通常係在2重量％以下。又，本發明之轉印薄膜，亦可於支承膜上，形成光阻膜後，將由本發明之含有無機粒子之樹脂組成物所成的含有無機粒子之樹脂層層合而形成。此情況下，即可將形成於支承膜上之光阻膜，與含有無機粒子之樹脂層的層合膜一起轉印於基板上，進一步簡化步驟，可得圖型之高精細本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -23- 1295305 A7 B7 五、發明説明（21) 化。 ----------4! (請先閱讀背面之注意事項再填寫本頁) 又，用於本發明之轉印薄膜的支承膜之表面，必要時係以作脫模處理爲佳。藉此，在往基板轉印之步驟中，其支承膜之剝離操作可易於進行。設於如上述形成之含有無機粒子之樹脂層上的覆蓋膜之表面，亦以施加脫模處理爲佳。藉此，於含有無機粒子之樹脂層的轉印前，可易於將覆蓋膜自該含有無機粒子之樹脂層剝離。支承膜上之含有無機粒子之樹脂層，係一倂轉印於基板表面。利用本發明之轉印薄膜，由於以如此之簡單操作即可於玻璃基板上確實形成含有無機粒子之樹脂層，介電體等之P D P構成要素之形成步驟中可得工作改善（高效率化），並且可得所形成之構成要素的品質提升（例如，於電極的安定電特性之實現）。經濟部智慧財產局員工消費合作社印製本發明之組成物，如上述，可特別適用於在支承膜上形成含有無機粒子之樹脂層以製造轉印薄膜，但不限於此類用法，亦可適用於以往已知的含有無機粒子之樹脂層的形成方法，亦即，以網版印刷法等將該組成物直接塗布於玻璃基板表面，經塗膜之乾燥形成含有無機粒子之樹脂層的方法。在此，供作以網版印刷法塗布於玻璃基板的本發明之含有無機粒子之樹脂組成物之粘度，係以在 10， 000至200， 000厘泊爲佳。 <PDP之製造方法> 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -24- 1295305 A7 B7 五、發明説明（22) (請先閲讀背面之注意事項再填寫本頁) 本發明之製造方法係包含，將構成本發明之轉印薄膜的含有無機粒子之樹脂層轉印於基板上，於所轉印之含有無機粒子之樹脂層上形成光阻膜，係該光阻膜之曝光處理形成光阻圖型之潛像，作該光阻膜之顯影處理呈顯光阻圖型，作該含有無機粒子之樹脂層的蝕刻處理形成對應於光阻圖型之圖型層（含有無機粒子之樹脂層的圖型），經該圖型層之煅燒處理，形成燒結體所成之選自間壁、電極、電阻體、介電體、螢光體、濾色體及黑格陣之構成要素的步驟。經濟部智慧財產局員工消費合作社印製或者，包含，於支承膜上形成光阻膜與得自本發明之含有無機粒子之樹脂組成物的含有無機粒子之樹脂層的層合膜，將形成於支承膜上之層合膜轉印於基板上，作構成該層合膜之光阻膜的曝光處理形成光阻圖型之潛像，作該光阻膜之顯影處理呈顯光阻圖型，作該含有無機粒子之樹脂層的蝕刻處理形成對應於光阻圖型之圖型層，藉由該圖型層之煅燒處理，形成燒結體所成之選自間壁、電極、電阻體、介電體、螢光體、濾色體及黑格陣之構成要素的步驟。藉由經過上述步驟，P D P之構成要素的間壁、電極、電阻體、介電體、螢光體、濾色體及黑格陣之任何一種均可形成。以下說明有關在正面基板上之表面形成「電極」之方法。該方法中，係以〔1〕含有無機粒子之樹脂層的轉印步驟，〔2〕光阻膜之形成步驟，〔3〕光阻膜之曝光步驟，〔4〕光阻膜之顯影步驟，〔5〕含有無機粒本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -25- 1295305 A7 ___B7 五、發明説明（。） 23 子之樹脂層的鈾刻步驟，〔6〕含有無機粒子之樹脂層的圖型煅燒步驟，於基板之表面形成電極。第3及第4圖係呈示爲形成電極之一連串步驟之槪略剖視圖。第3及第4圖中，1 1係玻璃基板，於該玻璃基板1 1上，等間隔配列有用以產生電漿之透明電極1 2。又，本發明中，「將含有無機粒子之樹脂層轉印於基板上」之樣態，除轉印於上述玻璃基板1 1之表面的樣態之外，亦包含轉印於上述透明電極1 2之表面的樣態。 (1 )含有無機粒子之樹脂層的轉印步驟：以下呈示含有無機粒子之樹脂層的轉印步驟之一例。轉印薄膜之覆蓋膜（圖未示）剝離後，如第3圖（乙 )所示，於透明電極1 2表面，使含有無機粒子之樹脂層 2 1的表面抵接，將轉印薄膜2 0貼合，將該轉印薄膜 2 0以加熱輥筒等熱壓合後，從含有無機粒子之樹脂層 2 1將支承膜2 2剝離去除。藉此，如第3圖（丙）所示，於透明電極1 2之表面，含有無機粒子之樹脂層2 1即成轉印而密合之狀態。在此，轉印條件可係，例如，加熱輥筒表面溫度8 0至1 4 0 °C，加熱輥筒之輥壓1至5公斤/平方公分，加熱輥筒之移動速率〇 · 1至1 〇 · 0米 /分鐘。又，亦可將玻璃基板1 1預熱，預熱溫度可係，例如，4 0至1 0 0 °c。 (2 )光阻膜之形成步驟：本紙張尺度適用中國國家標準（CNS ) A4規格（2丨〇><297公菱） -----------MWII (請先閲讀背面之注意事項再填寫本頁) 訂經濟部智慧財產局員工消費合作社印製 -26 - 1295305 Α7 Β7 五、發明説明（24) (請先閎讀背面之注意事項再填寫本頁) 該步驟中，如第3圖（丁）所示，於所轉印之含有無機粒子之樹脂層2 1的表面，形成光阻膜3 1。構成該光阻膜3 1之光阻，可係正型或負型光阻之任一型。光阻膜（3 1 )可用網版印刷法，輥塗法，旋塗法，流延塗布法等種種方法塗布光阻後，將塗膜乾燥而形成。在此，塗膜之乾燥溫度，通常係在6 0至1 3 0 °C左右。又，亦可藉由將形成於支承膜上之光阻膜轉印於含有無機粒子之樹脂層（2 1 )之表面而形成。以如此之形成方法，可減少光阻膜之形成步驟數，並且所得之光阻膜均勻性變佳，故該光阻膜之顯影處理及含有無機粒子之樹脂層的蝕刻處理得以均勻進行，所形成之電極高度及形狀可得均一。光阻膜（31)之膜厚，通常係在〇 · 1至40微米，而以0·5至20微米爲佳。 (3 )光阻膜之曝光步驟：經濟部智慧財產局員工消費合作社印製該步驟中，如第3圖（戊）所示，在形成於含有無機粒子之樹脂層2 1上的光阻膜3 1之表面，經由光罩Μ，作紫外線等放射線之選擇性照射（曝光），形成光阻圖型之潛像。同圖中，ΜΑ及MB各係光罩Μ之透光部及遮光部。在此，放射線照射裝置，可以使用光微影法所使用之紫外線照射裝置，半導體或液晶顯示元件製造中所使用之曝光裝置等，並無特殊限制。本紙張尺度適用中國國家標準（CNS ) Α4規格（21〇Χ297公釐） -27- 1295305 A7 B7 五、發明説明（％) Ζο (4 )光阻膜之顯影步驟： (請先閱讀背面之注意事項再填寫本頁)，該步驟中，藉曝光後的光阻膜之顯影處理，使光阻圖型（潛像）顯現。在此，顯影處理條件者可依光阻膜（3 1 )之種類等，適當選擇顯影液之種類、組成、濃度、顯影時間、顯影溫度、顯影方法（例如浸泡法、搖動法、淋灑法、噴塗法、浸置法），顯影裝置等。經由該顯影步驟，如第4圖（己）所示，光阻殘留部 3 5 A，及光阻去除部3 5 Β所構成之光姐僵型3 5 (對應於光罩Μ之圖型）已經形成。. 該光阻圖型3 5，係用作其次步驟（蝕刻步驟）中之蝕刻遮罩，光阻殘留部3 5 Α之構成材料（經光硬化之光阻），必須比含有無機粒子之樹脂層2 1的構成材料對鈾刻液之溶解速率低。 (5 )含有無機粒子之樹脂層的蝕刻步驟：經濟部智慧財產局員工消費合作社印製該步驟中，係作含有無機粒子之樹脂層的蝕刻處理，以形成對應於光阻圖型之電極圖型層（含有無機粒子之樹脂層的圖型）。亦即，如第4圖（庚）所示，含有無機粒子之樹脂層 21之中，對應於光阻圖型35之光阻去除部（35B) 之部份，爲蝕刻液所溶解而選擇性去除。在此，第4圖（庚），係呈示蝕刻處理中之狀態。本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -28- 1295305 Δ7 A 7 B7 五、發明説明（26) (請先閲讀背面之注意事項再填寫本頁) 然後，再繼續蝕刻處理，則如第4圖（辛）所示，含有無機粒子之樹脂層（2 i )的選定部份完全去除而露出透明電極1 2或玻璃基板1 1。藉此，樹脂層殘留部 2 5 A，及樹脂層去除部2 5 B所構成之電極圖型層（含有無機粒子之樹脂層的圖型）2 5即可形成。於此，蝕刻條件者可依含有無機粒子之樹脂層（2 1 )的種類等，對蝕刻液之種類、組成、濃度、處理時間、處理溫度，處理方法（例如浸漬法、搖動法、淋灑法、噴塗法、浸置法），處理裝置等作適當選擇。在此，構成光阻圖型（3 5 )之光阻殘留部（35八 )，係以在蝕刻處理之際緩緩溶解，在電極圖型層（含有無機粒子之樹脂層的圖型）（2 5 )已形成之階段（飩刻處理完成時）完全去除爲佳。又，即使鈾刻處理後仍有光阻殘留部（3 5 A )之部份或全部殘留，該光阻殘留部（3 5 A )亦於其次之煅燒步驟去除。經濟部智慧財產局員工消費合作社印製 (6 )含有無機粒子之樹脂層的圖型煅燒步驟：該步驟中，係將含有無機粒子之樹脂層圖型（25) 作煨燒處理形成電極。藉此，樹脂層殘留部2 5 A中之有機物質燒除而形成電極，可得如第4圖（壬）所示之於透明電極1 2之表面形成電極4 0而成之面板材料5 〇。在此，煅燒處理溫度，必須係能完全燒除樹脂層殘留部（2 5 A )中之有機物質的溫度，通常係在4 〇〇至 :本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ~ ' -29- 1295305 A7 B7 五、發明説明（27) 6 0 0 °C。又，煅燒時間通常係在1 〇至9 0分鐘。 (請先閲讀背面之注意事項再填寫本頁) <利用光光阻法之較佳實施樣態> 本發明中之P D P的形成方法，並非僅限於如第3及第4懦所示之方法。於此，用以形成P D P之構成要素的其它較佳方法，可舉經下述（1 )至（3 )之步驟的形成方法。 ‘（1 )於支承膜上形成光阻膜之後，於該光阻膜上塗布本發明之含有無機粒子之樹脂組成物，經乾燥形成層合之含有無機粒子之樹脂層。在此，於形成光阻膜及含有無機粒子之樹脂層之際，可使用輥塗機等，藉此，可於支承膜上形成膜厚均勻性優良之層合膜。 (2 )將形成於支承膜上之光阻膜與含有無機粒子之樹脂層的層合膜轉印於基板上。在此，轉印條件同上述「含有無機粒子之樹脂層的轉印步驟中之條件即可。經濟部智慧財產局員工消費合作社印製 (3)進行與上述「光阻膜之曝光步驟」，「光阻膜之顯影步驟，「含有無機粒子之樹脂層的蝕刻步驟」及「含有無機粒子之樹脂層的圖型煅燒步驟」同樣之操作。此時，係以使光阻膜之顯影液及含有無機粒子之樹脂層的蝕刻液爲同一溶液，連續施行「光阻膜之顯影步驟」及「含有無機粒子之樹脂層的蝕刻步驟」爲佳。利用以上方法，由於含有無機粒子之樹脂層及光阻膜係一倂轉印於基板上，可因步驟簡化更加提升製造效率。本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -30- 1295305 A7 B7 五、發明説明（） 28 / <光阻組成物> (請先閱讀背面之注意事項再填寫本頁) 本發明之製造方法中，係藉由在含有無機粒子之樹脂層上形成光阻膜，作該光阻膜之曝光處理及顯影處理，於上述含有無機粒子之樹脂層上形成光阻圖型。用以形成光阻膜之光阻組成物者，可例示鹼顯影型放射線靈敏性光阻組成物，有機溶劑顯影型放射線靈敏性光阻組.成物，水性顯影型放射線靈敏性光阻組成物等，而較佳者係使用鹼顯影型放射線靈敏性光阻組成物。本發明中所謂「放射線」，係包含可見光，紫外線，深紫外線，電子束，X線等。鹼顯影型放射線靈敏性光阻組成物，係含鹼可溶性樹脂及放射線靈敏性成分作爲必要成分。構成鹼顯影型放射線靈敏性光阻組成物之鹼可溶性樹脂，可舉作爲構成含有無機粒子之樹脂組成物的粘結樹脂者所例示之鹼可溶性樹脂。經濟部智慧財產局員工消費合作社印製構成鹼顯影型放射線靈敏性光阻組成物之放射線靈敏性成分者，可例示如（甲）多元丙烯酸酯與光聚合啓始劑之組合，（乙）三聚氰胺樹脂與經放射線照射形成酸之光酸產生劑之組合，（丙）經放射線照射從鹼難溶性變成鹼可溶性之化合物等，上述（甲）之組合中，多元丙烯酸類與光聚合啓始劑之負型組合，及（丙）之正型係爲特佳。構成負型之放射線靈敏性成分之多元丙烯酸酯，可舉用於上述之本發明的含有無機粒子之樹脂組成物的含（甲基）丙烯醯基之化合物中，具有二以上之（甲基）丙烯醯本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -31 - 1295305 A7 B7 五、發明説明（） 29 基之化合物。這些可以單獨或二種以上組合使用。又，構成負型放射線靈敏性成分之光聚合啓始劑的具體例，可舉苯甲基，苯偶姻，二苯甲酮，米蚩酮，4， 4 — 一雙二乙基胺基苯甲酮，樟腦醌，2 —羥基—2 —甲基一 1 一苯基丙酮一〔1〕， 1 一羥基環己基苯基甲酮， 2， 2 —二甲氧基一 2 —苯基乙醯苯，2 —甲基一〔4 / 一（甲硫基）苯基〕一 2 —嗎啉一 1 一丙酮，2 —苯甲基 —2 -一甲基胺基一1 一（4 一嗎啉苯基）—丁酬一〔1 〕，2，4 一二乙基硫蒽酮，異丙基硫蒽酮等之羰基化合物；雙（2， 6 —二甲氧基苯甲醯）一2， 4， 4 一三甲基戊基膦化氧，雙（2，4，6 -三甲基苯甲醯）苯基膦化氧等之膦化氧化合物；偶氮異丁腈，4 -疊氮苯甲醛等之偶氮化合物或疊氮化合物；硫醇二硫化物等之有機硫化物；過氧化苯甲醯，二特丁基化過氧，特丁基化過氧，過氧化氫異丙苯，過氧化氫對甲烷等之有機過氧化物；2， 4 一雙（三氯甲基）—6 —（2 / -氯苯基）一1， 3, 5 —三哄，2 —〔2_ (2 —苯基）乙烯基〕一4，6 - 雙（二氣甲基）一 1， 3， 5 —二哄，等之三鹵甲院類； 2，2> —雙（2 —氯苯基）—4，5，4 ^ , 5一 —四苯基—1，2 / -二咪唑等之咪唑二聚體等，這些可以單獨或二種以上組合使用。又，亦可倂用增感劑，增感助劑，氫供給體，鏈轉移劑。另一方面，正型之放射線靈敏性化合物，可舉多元羥基化合物之1，2 -苯醌二疊氮一 4 —磺酸酯，1，2 - 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -----------— (請先閎讀背面之注意事項再填寫本頁) 訂經濟部智慧財產局員工消費合作社印製 -32- 1295305 Μ Β7 五、發明説明（3Q) 萘醌二疊氮一4一磺酸酯，1， 2-萘醌二疊氮一5-磺 (請先閲讀背面之注意事項再填寫本頁) 酸酯及1，2 -萘醌二疊氮一 6 -磺酸酯等，特佳者爲， 1， 2-萘醌二疊氮一4一磺酸酯，1， 2—萘醌二疊氮一 5 —磺酸酯。放射線靈敏性化合物，可由例如，多元羥基化合物與醌二疊氮硫醯氯在鹼性觸媒之存在下反應而得。通常，對多兀經基化合物之所有羥基，II二疊氮磺酸酯之比率（平均酯化率），係在2 0%以上10 0%以下，較佳者爲 4 0 %以上9 5 %以下。平均酯化率過低時，難以形成圖型，過高則會導致靈敏度下降。在此，所用之多元羥基化合物，無特殊限制，具體可舉以下一般式（1 )至一般式（6)所示之化合物。一般式1-17- 1295305 Δ7 A 7 B7 V. Inventive Note () 15 (Please read the note on the back side and fill in this page) The content of the compound containing (meth) acrylonitrile group in the resin composition containing inorganic particles In order to form the resin layer containing the inorganic particles, the flexibility and uranium engraving property are better, and the amount of the inorganic particles is usually from 1 to 500 parts by weight, preferably 0.5. Up to 100 parts by weight. <Solvent> The solvent constituting the resin composition containing the inorganic particles of the present invention is used to impart appropriate fluidity or plasticity to the resin composition containing the inorganic particles, and has good film formability. The solvent is compatible with the inorganic particles, and the solubility of the organic component such as a binder resin or a specific compound is good, and the resin composition containing the inorganic particles can be appropriately viscous, and the organic component can be easily evaporated and dried without any particular limitation. For example, ethers, esters, ether esters, ketones, ketoesters, guanamines, guanamine esters, indoleamines, lactones, fluorenes, maples, hydrocarbons, Halogenated hydrocarbons, etc. Specific examples of printing related solvents in the Intellectual Property Office of the Intellectual Property Office of the Ministry of Economic Affairs include tetrahydrofuran, anisole, dioxins, ethylene glycol monoalkyl ethers, diethylene glycol dialkyl ethers, and propylene glycol monoalkyl ethers. , propylene glycol dialkyl ethers, acetates, hydroxyacetates, alkoxy acetates, propionates, hydroxypropionates, alkoxypropionates, lactates, ethylene glycols Alkyl ether acetates, propylene glycol monoalkyl ether acetates, alkoxy acetates, cyclic ketones, acyclic ketones, ethyl acetoxyacetate, pyruvate, hydrazine, hydrazine-dioxane Base carbamide, hydrazine, hydrazine - a hospital acetamide, Ν - hospital based ketones, 7 - lactones, two paper scales applicable to China National Standard (CNS) Α 4 specifications (210 Χ 297 public PCT) -18- 1295305 Α7 Β7 V. Description of invention (16) Alkyl sulfoxides, dialkyl hydrazines, impeller oils, N-methyl-2-pyrrolidone, etc. These may be used alone or in combination of two or more. . (Please read the precautions on the back and fill out this page.) The content of the solvent in the resin composition containing inorganic particles can be appropriately selected within the range of good film formability (fluidity or plasticity). Usually, for inorganic The particles are preferably 1 to 10,000 parts by weight, more preferably 10 to 1,000 parts by weight, based on 100 parts by weight of the particles. <Plasticizer> The composition of the present invention may contain a plasticizer in order to impart better flexibility to the formed resin layer containing the inorganic particles. The plasticizer (hereinafter referred to as "specific plasticizer") which is a compound represented by the following structural formula (1) or structural formula (2) can be mentioned. The composition of the present invention comprising a specific plasticizer can provide better flexibility and calcinability in the formed resin layer containing the inorganic particles, and the specific plasticizer is easily removed by thermal decomposition. The resin layer of the inorganic particles is calcined to obtain, for example, a dielectric body or the like without a decrease in light transmittance. Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing structure (1) R^O-^-^OOC-f CHg^COO -(-R3 [wherein, R1 and R3 are the same or different carbon atoms 1 to 30 alkyl, R2 and R4 are the same or different alkylene groups having 1 to 30 carbon atoms, m is from 〇 to 5, and η is from 1 to 10. The paper scale is applicable to China. Standard (CNS) Α4 size (210Χ297 mm) -19- 1295305 Α7 Β7 V. Invention description () Type of construction 5 RI CHO 1 ο - Η1c1Η _Η HICIO - C 3 Η (Please read the notes on the back and fill in this [In the formula, R5 is an alkyl group or an alkenyl group having 1 to 30 carbon atoms.] Alkyl group represented by R 1 or R 4 in the above structural formula (1) which exhibits a specific plasticizer, and R 2 or The alkylene group represented by R 3 may be linear or branched, and may be a saturated group or an unsaturated group. The alkyl group represented by R 1 or R 4 has 1 to 30 carbon atoms to 2 Preferably, it is more preferably 4 to 10. In the above structural formula (1), η is in the range of 1 to 10, preferably 2 to 6. Specific examples of the compound represented by the above structural formula (1) , can be dibutyl adipate, two Diisobutyl ester, di-2-ethylhexyl adipate, di-2-ethylhexyl sebacate, dibutyl sebacate, dibutyl glycol adipate, etc. In the above structural formula (2), the alkyl or alkenyl group represented by R 5 in the above formula (2), which may be linear or branched, and may be saturated or unsaturated. The alkyl group or the alkenyl group represented by R5 has a carbon number of from 1 to 30, preferably from 2 to 20, more preferably from 10 to 18. Specific examples of the compound represented by the above structural formula (2), It can be propylene glycol monolaurate, propylene glycol monooleate, etc. The silver * sheet scale is applicable to China National Standard (CNS) Α 4 specification (210X297 mm) " -20- 1295305 Α7 Β7 V. Invention description () Ίο A preferred compound other than a specific plasticizer may, for example, be a polypropylene glycol or the like. (Please read the following notes on the back side and fill out this page.) The content of the specific plasticizer in the composition of the present invention, for the inorganic particles 100 weight The portion is preferably 100 parts by weight or less, more preferably 0 to 5 parts by weight. The composition of the composition, in addition to the above components, may contain a dispersant, a development accelerator, an adhesion promoter, a vignette preventer, a preservation stabilizer, an antifoaming agent, an antioxidant, a UV absorber, a tackifier, and a surface tension adjustment. The additive, the leveling agent, the crosslinking agent, the polymerization initiator, the acid generator, and the like are optional components. Further, the inorganic particle-containing resin composition of the present invention may further contain light constituting the photoresist composition described below. Polymerization initiator, with radiation sensitivity. The inorganic particle-containing resin composition of the present invention may be prepared by mixing inorganic particles, a binder resin, a specific compound, a solvent, and an optional component by a kneader, a mixer, a homogenizer, a ball mill, a bead mill, or the like. . The Ministry of Economic Affairs, the Intellectual Property Office, and the Employees' Cooperatives Co., Ltd. print the resin composition containing inorganic particles prepared as described above, usually with a paste composition suitable for coating fluidity, and its viscosity is usually between 10 and 300,000%. Poise to 500 to 30,000 centipoise is preferred. The composition of the present invention can be suitably used to produce a transfer film (transfer film of the present invention) which will be described later in detail. Here, the inorganic particle-containing resin composition of the present invention which is applied as a support film has a viscosity of from 1, 〇〇〇 to 1 〇, and the paper size is applicable to the Chinese National Standard (CNS) Α 4 specification. (210Χ297 mm) ' -21 - 1295305 A7 B7 V. Description of invention (19) It is preferred. (Please read the precautions on the back and fill out this page.) <Transfer film> Fig. 2 (A) is a schematic cross-sectional view showing the transfer film of the present invention wound into a roll shape, and the same figure (B) A cross-sectional view showing a layer structure of the transfer film [partially enlarged view of (a)]. The transfer film shown in Fig. 2 is an example of a transfer film of the present invention, which is used to form a composite film constituting a dielectric of a PDP, and is usually formed on the surface of the support film F1 by a support film F1. Further, the resin layer F 2 containing the inorganic particles which can be peeled off, and the cover film F 3 which is provided on the surface of the resin layer F 2 containing the inorganic particles and which are easily peeled off are formed. The cover film F3 may also be used depending on the nature of the resin layer F 2 containing the inorganic particles or the weight of the roll wound by the transfer film. The support film F1 constituting the transfer film is preferably a resin film having heat resistance and solvent resistance and having flexibility. The support film is coated with the composition of the present invention by a roll coater or the like, and the obtained resin layer containing the inorganic particles is stored and supplied in a state of being rolled up into a roll. The Ministry of Economic Affairs, the Intellectual Property Office, the employee consumption cooperative, prints the resin forming the support film F1, and examples thereof include polyethylene terephthalate, polyester, polyethylene, polypropylene, polystyrene, and polyimine. Fluorine resins such as polyvinyl alcohol, polyvinyl chloride, polyvinyl fluoride, etc., nylon, cellulose, and the like. The thickness of the support film F 1 is, for example, 20 to 10 μm. The resin layer F 2 containing the inorganic particles constituting the transfer film is a layer formed by the sintered body fired in the fire section, and the resin film containing the inorganic particles of the present invention can be applied onto the support film to coat the film. Drying to remove part or paper size is applicable to China National Standard (CNS) A4 specification (X 297 mm) -22- 1295305 A7 ________B7 V. Invention description (2()) All solvents are formed. (Please read the precautions on the back and fill out this page.) The film thickness of the resin layer F2 containing inorganic particles can be appropriately selected depending on the content of inorganic particles, the type and size of parts. The cover film F 3 constituting the transfer film F 3 is a film for protecting the front surface (contact surface with the glass substrate) of the resin layer F 2 containing inorganic particles. The cover film F 3 is also preferably a resin film which is flexible. The resin forming the coating film F 3 may, for example, be a polyethylene terephthalate film, a polyethylene film or a polyvinyl alcohol film. Further, the thickness of the cover film F 3 is, for example, 20 to 1 〇〇 micrometer. In the transfer film of the present invention, a resin layer (F 2 ) containing inorganic particles is formed on the support film (F 1 ), and a cover film (F 3 ) is provided (pressed) on the resin layer containing the inorganic particles. Manufacturing. The method of applying the composition of the present invention to the support film is preferably a film having a film thickness (for example, 1 μm or more) which is excellent in thickness uniformity, and specifically, a gravure coating method. A preferred method such as die coating, roll coating, curtain coating, and wire coating. The drying conditions of the coating film printed by the Intellectual Property Office of the Intellectual Property Office of the Ministry of Economic Affairs are 50 to 150 ° C, 0 · 5 to 30 minutes, and the solvent residual ratio after drying (the content of the resin layer containing inorganic particles) The rate is usually 2% by weight or less. Further, the transfer film of the present invention may be formed by laminating a resin film containing inorganic particles formed of the resin composition containing inorganic particles of the present invention after forming a photoresist film on a support film. In this case, the photoresist film formed on the support film can be transferred onto the substrate together with the laminated film of the resin layer containing the inorganic particles, thereby further simplifying the steps, and the high-definition paper size of the pattern can be obtained. China National Standard (CNS) A4 Specification (210X297 mm) -23- 1295305 A7 B7 V. Invention Description (21). ----------4! (Please read the precautions on the back and fill out this page.) Further, the surface of the support film used in the transfer film of the present invention is subjected to mold release treatment if necessary. good. Thereby, the peeling operation of the support film can be easily performed in the step of transferring the substrate. The surface of the cover film provided on the resin layer containing the inorganic particles formed as described above is preferably applied by a release treatment. Thereby, the cover film can be easily peeled off from the resin layer containing the inorganic particles before the transfer of the resin layer containing the inorganic particles. The resin layer containing the inorganic particles on the support film is transferred to the surface of the substrate. According to the transfer film of the present invention, the resin layer containing the inorganic particles can be surely formed on the glass substrate by such a simple operation, and the operation of forming the PDP component of the dielectric material or the like can be improved (high efficiency). And the quality of the formed constituent elements can be improved (for example, the realization of the stable electrical characteristics of the electrodes). The composition of the present invention printed by the Intellectual Property Office of the Intellectual Property Office of the Ministry of Economic Affairs, as described above, is particularly suitable for forming a resin layer containing inorganic particles on a support film to manufacture a transfer film, but is not limited to such usage, and is also applicable. A method of forming a resin layer containing inorganic particles known in the related art, that is, a method of directly applying the composition to a surface of a glass substrate by a screen printing method or the like, and drying the coating film to form a resin layer containing inorganic particles. Here, the viscosity of the resin composition containing the inorganic particles of the present invention applied to the glass substrate by the screen printing method is preferably from 10,000 to 200,000 cps. <Manufacturing method of PDP> This paper scale is applicable to China National Standard (CNS) A4 specification (210X297 mm) -24- 1295305 A7 B7 V. Invention description (22) (Please read the note on the back and fill out this page. The production method of the present invention comprises transferring a resin layer containing inorganic particles constituting the transfer film of the present invention onto a substrate, and forming a photoresist film on the transferred resin layer containing the inorganic particles. The exposure process of the resist film forms a latent image of the photoresist pattern, and the development process of the photoresist film is in the form of a photoresist pattern, and the etching process of the resin layer containing the inorganic particles forms a pattern corresponding to the photoresist pattern. a layer (a pattern of a resin layer containing inorganic particles) is subjected to calcination treatment of the pattern layer to form a sintered body selected from the group consisting of a partition, an electrode, a resistor, a dielectric, a phosphor, a color filter, and The steps of the elements of the black grid. A laminated film comprising a resist film formed on a support film and a resin layer containing inorganic particles derived from the resin composition of the present invention, which is formed by the Intellectual Property Office of the Intellectual Property Office of the Ministry of Economic Affairs, or The laminated film on the support film is transferred onto the substrate, and the latent image of the photoresist pattern is formed by exposure treatment of the photoresist film constituting the laminated film, and the development process of the photoresist film is a photoresist pattern. The etching treatment of the resin layer containing the inorganic particles forms a pattern layer corresponding to the photoresist pattern, and the calcination treatment of the pattern layer forms a sintered body selected from the group consisting of a partition, an electrode, a resistor, and a dielectric layer. The steps of the components of the electric body, the phosphor, the color filter, and the black matrix. By the above steps, any of the partition walls, electrodes, resistors, dielectrics, phosphors, color filters, and black matrix of the constituent elements of P D P can be formed. A method of forming an "electrode" on the surface of the front substrate will be described below. In this method, the transfer step of [1] a resin layer containing inorganic particles, [2] a step of forming a photoresist film, [3] an exposure step of a photoresist film, and [4] a development step of a photoresist film, [5] Containing inorganic particles This paper scale applies to Chinese National Standard (CNS) A4 specification (210X297 mm) -25- 1295305 A7 ___B7 V. Invention description (.) 23 urethane engraving step of resin layer, [6] contains The pattern calcination step of the resin layer of the inorganic particles forms an electrode on the surface of the substrate. The third and fourth figures are schematic cross-sectional views showing the steps of forming one of the electrodes. In Figs. 3 and 4, a 1 1 type glass substrate is provided, and a transparent electrode 12 for generating a plasma is arranged at equal intervals on the glass substrate 11. Further, in the present invention, the state in which the resin layer containing the inorganic particles is transferred onto the substrate is transferred to the transparent electrode 1 in addition to the state of being transferred onto the surface of the glass substrate 1 1 . The appearance of the surface of 2. (1) Transfer step of resin layer containing inorganic particles: An example of a transfer step of a resin layer containing inorganic particles is shown below. After the cover film (not shown) of the transfer film is peeled off, as shown in FIG. 3(B), the surface of the resin layer 21 containing inorganic particles is abutted on the surface of the transparent electrode 12, and the transfer film 2 is transferred. When the transfer film 20 is thermally bonded by a heating roll or the like, the support film 22 is peeled off from the resin layer 21 containing inorganic particles. As a result, as shown in Fig. 3 (c), on the surface of the transparent electrode 12, the resin layer 21 containing inorganic particles is transferred and adhered. Here, the transfer conditions may be, for example, a heating roller surface temperature of 80 to 140 ° C, a heating roller rolling pressure of 1 to 5 kg/cm 2 , and a heating roller moving speed 〇·1 to 1 〇· 0 m/min. Further, the glass substrate 11 may be preheated, and the preheating temperature may be, for example, 40 to 100 °C. (2) Step of forming the photoresist film: The paper size is applicable to the Chinese National Standard (CNS) A4 specification (2丨〇><297 Gongling) -----------MWII (please read first) Precautions on the back side Fill in this page) Printed by the Ministry of Economic Affairs, Intellectual Property Bureau, Staff Consumer Cooperatives -26 - 1295305 Α7 Β7 V. Invention Description (24) (Please read the back note and fill out this page) As shown in Fig. 3 (d), a photoresist film 31 is formed on the surface of the transferred inorganic particle-containing resin layer 21. The photoresist constituting the photoresist film 31 may be either a positive type or a negative type photoresist. The photoresist film (3 1 ) can be formed by applying a photoresist by various methods such as screen printing, roll coating, spin coating, and cast coating, and then drying the coating film. Here, the drying temperature of the coating film is usually about 60 to 130 °C. Further, it may be formed by transferring a photoresist film formed on a support film onto the surface of the resin layer (2 1 ) containing inorganic particles. With such a formation method, the number of steps of forming the photoresist film can be reduced, and the uniformity of the obtained photoresist film can be improved, so that the development treatment of the photoresist film and the etching treatment of the resin layer containing the inorganic particles can be performed uniformly. The height and shape of the formed electrode can be uniform. The film thickness of the photoresist film (31) is usually from 1 to 40 μm, and preferably from 0.5 to 20 μm. (3) Exposure step of the photoresist film: In the step of printing, the Intellectual Property Office of the Intellectual Property Office of the Ministry of Economic Affairs, as shown in Fig. 3 (e), the photoresist film formed on the resin layer 21 containing inorganic particles The surface of the 3 1 is selectively irradiated (exposed) by radiation such as ultraviolet rays through a mask to form a latent image of a photoresist pattern. In the same figure, the light-transmitting portion and the light-shielding portion of the masks of the ΜΑ and MB are used. Here, the radiation irradiation device can be an ultraviolet irradiation device used in the photolithography method, an exposure device used in the manufacture of a semiconductor or a liquid crystal display device, and the like, and is not particularly limited. This paper scale applies to China National Standard (CNS) Α4 specification (21〇Χ297 mm) -27- 1295305 A7 B7 V. Invention description (%) Ζο (4) Development process of photoresist film: (Please read the back of the note first) In the next step, in this step, the photoresist pattern (latent image) is visualized by the development of the exposed photoresist film. Here, the development processing conditions may appropriately select the type, composition, concentration, development time, development temperature, and development method of the developer depending on the type of the photoresist film (3 1 ), etc. (for example, the immersion method, the shaking method, and the shower method) , spraying method, dipping method), developing device, and the like. Through the development step, as shown in FIG. 4, the photoresist residual portion 35 A and the photoresist removal portion 35 5 constitute a photo-sister stiffness 3 5 (corresponding to the pattern of the mask) Already formed. The photoresist pattern 35 is used as an etching mask in the next step (etching step), and the constituent material of the photoresist residual portion 3 5 (photo-cured photoresist) must be larger than the resin containing inorganic particles. The constituent material of layer 2 1 has a low dissolution rate for uranium engraving. (5) Etching step of resin layer containing inorganic particles: In the step of printing by the Ministry of Economic Affairs, the Intellectual Property Office of the Intellectual Property Bureau, the etching process is performed as a resin layer containing inorganic particles to form an electrode pattern corresponding to the photoresist pattern. Type layer (pattern of resin layer containing inorganic particles). That is, as shown in Fig. 4 (g), among the resin layer 21 containing inorganic particles, the portion corresponding to the photoresist removal portion (35B) of the photoresist pattern 35 is selectively dissolved by the etching liquid. Remove. Here, Fig. 4 (h) shows the state in the etching process. This paper scale applies to China National Standard (CNS) A4 specification (210X297 mm) -28- 1295305 Δ7 A 7 B7 V. Invention description (26) (Please read the note on the back and fill in this page) Then continue etching In the treatment, as shown in Fig. 4 (Xin), the selected portion of the resin layer (2 i ) containing the inorganic particles is completely removed to expose the transparent electrode 12 or the glass substrate 11. Thereby, the electrode layer layer (the pattern of the resin layer containing the inorganic particles) composed of the resin layer remaining portion 25 A and the resin layer removing portion 2 5 B can be formed. Here, the etching conditions may be based on the type of the resin layer (2 1 ) containing the inorganic particles, the type, composition, concentration, processing time, and processing temperature of the etching solution (for example, dipping method, shaking method, showering) Method, spraying method, immersion method, processing device, etc. are appropriately selected. Here, the photoresist residue portion (35) constituting the photoresist pattern (35) is slowly dissolved in the electrode pattern layer (pattern of the resin layer containing the inorganic particles) during the etching process ( 2 5) The stage of formation (when the engraving process is completed) is completely removed. Further, even if part or all of the photoresist residual portion (3 5 A ) remains after the uranium engraving treatment, the photoresist residual portion (3 5 A ) is removed in the subsequent calcination step. Printed by the Ministry of Economic Affairs, Intellectual Property Office, and the Consumer Cooperatives. (6) Pattern calcination step of the resin layer containing inorganic particles: In this step, the resin layer pattern (25) containing inorganic particles is subjected to calcination to form an electrode. Thereby, the organic substance in the resin layer remaining portion 2 5 A is burned off to form an electrode, and the panel material 5 formed by forming the electrode 40 on the surface of the transparent electrode 12 as shown in Fig. 4 (壬) can be obtained. . Here, the calcination treatment temperature must be such that the temperature of the organic substance in the residual portion of the resin layer (25 A) is completely burned, usually at 4 〇〇 to: the paper size is applicable to the Chinese National Standard (CNS) A4 specification ( 210X297 mm) ~ ' -29- 1295305 A7 B7 V. Description of invention (27) 6 0 0 °C. Also, the calcination time is usually from 1 Torr to 90 minutes. (Please read the precautions on the back side and fill out this page.) <Preferred embodiment of photo-resistance method> The method of forming the PDP in the present invention is not limited to those shown in the third and fourth aspects. method. Here, another preferred method for forming the constituent elements of P D P may be a method of forming the steps (1) to (3) below. After the formation of a photoresist film on the support film, the resin composition containing the inorganic particles of the present invention is coated on the photoresist film, and dried to form a laminated resin layer containing inorganic particles. Here, when a photoresist film and a resin layer containing inorganic particles are formed, a roll coater or the like can be used, whereby a laminated film having excellent film thickness uniformity can be formed on the support film. (2) A laminated film of a photoresist film formed on a support film and a resin layer containing inorganic particles is transferred onto a substrate. Here, the transfer conditions may be the same as those in the above-mentioned "transfer step of the resin layer containing the inorganic particles. Printed by the Ministry of Economic Affairs, Intellectual Property Office, and the Consumer Cooperatives (3), and the "exposure step of the photoresist film" described above, The development step of the photoresist film, the "etching step of the resin layer containing the inorganic particles" and the "pattern baking step of the resin layer containing the inorganic particles" are the same. In this case, it is preferable to continuously apply the "developing step of the photoresist film" and the "etching step of the resin layer containing the inorganic particles" in such a manner that the etching solution of the photoresist film and the resin layer containing the inorganic particles are the same solution. . According to the above method, since the resin layer containing the inorganic particles and the photoresist film are transferred onto the substrate, the manufacturing efficiency can be further improved by the simplification of the steps. This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) -30- 1295305 A7 B7 V. Invention description () 28 / <Photoresist composition> (Please read the notes on the back and fill in the form) In the manufacturing method of the present invention, a photoresist film is formed on a resin layer containing inorganic particles, and a resist pattern is formed on the resin layer containing the inorganic particles by exposure treatment and development treatment of the photoresist film. type. An alkali-developing type radiation-sensitive resist composition, an organic solvent-developing type radiation-sensitive resist group, and an aqueous developing type radiation-sensitive resist composition can be exemplified for forming a photoresist composition of a photoresist film. Etc., and an alkali-developed radiation sensitive photoresist composition is preferably used. In the present invention, "radiation" includes visible light, ultraviolet light, deep ultraviolet light, electron beam, X-ray, and the like. The alkali-developing type radiation sensitive photoresist composition contains an alkali-soluble resin and a radiation sensitive component as essential components. The alkali-soluble resin constituting the alkali-developing type radiation-sensitive resist composition is exemplified as the alkali-soluble resin exemplified as the binder resin constituting the resin composition containing the inorganic particles. The Ministry of Economic Affairs, the Intellectual Property Office, and the Employees' Cooperatives Co., Ltd. print the radiation sensitive components constituting the alkali-developing radiation-sensitive photoresist composition, and may exemplify a combination of (a) a polyacrylate and a photopolymerization initiator, (b) melamine. a combination of a resin and a photoacid generator which forms an acid by radiation, (c) a compound which is insoluble from alkali to alkali-soluble by radiation, and a combination of the above-mentioned (A), a polyacrylic acid and a photopolymerization initiator The negative combination and the positive type of (C) are particularly good. The polyvalent acrylate constituting the negative radiation sensitive component may be used in the (meth) acrylonitrile group-containing compound containing the inorganic particle-containing resin composition of the present invention, and has two or more (meth) groups. The size of acrylonitrile paper is applicable to China National Standard (CNS) A4 specification (210X297 mm) -31 - 1295305 A7 B7 V. Inventive Note () 29 base compound. These may be used alone or in combination of two or more. Further, specific examples of the photopolymerization initiator constituting the negative-type radiation sensitive component include benzyl group, benzoin, benzophenone, Michler's ketone, and 4,4-diethylamino benzene. Ketone, camphorquinone, 2-hydroxy-2-methyl-1-phenylpropanone-[1], 1-hydroxycyclohexyl phenyl ketone, 2,2-dimethoxy-2-phenylethyl hydrazine Benzene, 2-methyl-[4/mono(methylthio)phenyl]-2- morpholine-1-one acetone, 2-benzyl-2-cyclomethylamino-1-one (4-morpholine) Phenyl)-butyl-[1], 2,4-diethylthio fluorenone, isopropyl thioxanthone, etc.; bis(2,6-dimethoxybenzidine)-2 4,4-trimethylpentylphosphine oxide, bis(2,4,6-trimethylbenzhydrazide)phenylphosphine oxide, etc., phosphine oxide; azoisobutyronitrile, 4-azide An azo compound or an azide compound such as benzaldehyde; an organic sulfide such as a thiol disulfide; benzamidine peroxide, di-butylated peroxygen, tert-butyl peroxide, cumene hydroperoxide , hydrogen peroxide, organic matter such as methane 2, 4 a pair of (trichloromethyl)-6-(2/-chlorophenyl)-1,3,5-triazine, 2-[2_(2-phenyl)vinyl]- 4, 6 - bis (dimethyl)-1, 3, 5 - bis, etc. trihalide class; 2,2> - bis(2-chlorophenyl)-4,5,4 ^ , 5 - an imidazole dimer such as tetraphenyl-1,2/-diimidazole or the like, which may be used alone or in combination of two or more. Further, a sensitizer, a sensitizing aid, a hydrogen donor, and a chain transfer agent may be used. On the other hand, a positive type of radiation sensitive compound may be a 1,2-benzoquinonediazide-4-sulfonate of a polyvalent hydroxy compound, and the 1,2 - paper scale is applicable to the Chinese National Standard (CNS) A4 specification. (210X297 mm) ------------ (Please read the notes on the back and fill out this page) Order the Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed -32- 1295305 Μ Β7 V. DESCRIPTION OF THE INVENTION (3Q) Naphthoquinonediazide-4 sulfonate, 1,2-naphthoquinonediazide-5-sulfonate (please read the back of the note first, then fill in this page) Acidate and 1,2 - Naphthoquinone diazide-6-sulfonate, etc., particularly preferred, 1, 2-naphthoquinonediazide-4-sulfonate, 1,2-naphthoquinonediazide-5-sulfonate. The radiation sensitive compound can be obtained, for example, by reacting a polyvalent hydroxy compound with quinonediazide ruthenium chloride in the presence of a basic catalyst. In general, the ratio (average esterification ratio) of all the hydroxyl groups of the polyfluorene-based compound, II diazidosulfonate, is 20% or more and 10% or less, preferably 40% or more and 95%. the following. When the average esterification rate is too low, it is difficult to form a pattern, and if it is too high, the sensitivity is lowered. Here, the polyvalent hydroxy compound to be used is not particularly limited, and specific examples thereof include the compounds represented by the following general formula (1) to general formula (6). General formula 1

經濟部智慧財產局員工消費合作社印製 (式中，χι至Xi5各係相同或不同，爲氫原子，碳原子數1至4之烷基，碳原子數1至4之烷氧基，碳原子數6 至1 0之芳基或羥基。但乂1至乂5及X6至Χχ。之各組合中，至少其一係羥基。又，Υι係氫原子或碳原子數1至4 之烷基。）本紙張尺度適用中國國家標準（CNS ) Α4規格（2!0'〆297公釐） -33- 1295305 Α7 Β7 五、發明説明（31) 一般式2Printed by the Intellectual Property Office of the Ministry of Economic Affairs and the Consumer Cooperatives (in the formula, χι to Xi5 are the same or different, and are a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, and a carbon atom. An aryl group or a hydroxyl group of 6 to 10, but at least one of the groups 乂1 to 乂5 and X6 to Χχ. Further, Υι is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. This paper size is applicable to China National Standard (CNS) Α4 specification (2!0'〆297 mm) -33- 1295305 Α7 Β7 V. Invention description (31) General formula 2

-----------m衣-- (請先閲讀背面之注意事項再填寫本頁) (式中，X"至X"各係相同或不同，爲氫原子，碳原子數1至4之院基，碳原子數1至4之烷氧基，碳原子數6 至1 0之芳基或羥基。低X 1 6至X 2 〇，X 2 1至X 2 6及 X26至X3。之各組合中，至少其一係經基。又，y2至 Υ4係各相同或不同，爲氫原子或碳原子數1至4之烷基。一般式3-----------m clothes-- (please read the notes on the back and fill out this page) (where X" to X" are the same or different, are hydrogen atoms, carbon atoms a base of 1 to 4, an alkoxy group having 1 to 4 carbon atoms, an aryl group having 6 to 10 carbon atoms or a hydroxyl group. Low X 1 6 to X 2 〇, X 2 1 to X 2 6 and X26 to In each combination of X3, at least one of them is a trans group. Further, y2 to Υ4 are the same or different and each is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.

(式中，又31至义44各係相同或不同，爲氫原子，碳原子數1至4之烷基，碳原子數1至4之烷氧基，碳原子數6 至1 〇之方基或羥基。但：^31至又35中至少其一係羥基。又，Υ5至Υ8各係相同或不同，爲氫原子或碳原子數丄至本紙張尺度適用中國國家標準（CNS ) Λ4規格(17^97^^) -—— -34- 訂經濟部智慧財產局員工消費合作社印製 1295305 Α7 Β7 五、發明説明（） 32 4之烷基。）一般式4(wherein, 31 to 44 are the same or different, and are a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, and a square group having 6 to 1 carbon atoms. Or a hydroxyl group. However, at least one of the groups from ^31 to 35 is a hydroxyl group. Further, the Υ5 to Υ8 are the same or different, and the hydrogen atom or the number of carbon atoms 丄 to the paper scale is applicable to the Chinese National Standard (CNS) Λ4 specification ( 17^97^^) -—— -34- Order Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 1295305 Α7 Β7 V. Invention Description () 32 4 alkyl.) General 4

(式中，X45至X58各係相同或不同，爲氫原子，鹵素原子，碳原子數1至4之烷基，碳原子數1至4之烷氧基，碳原子數5至7之環烷基或羥基。但χ45至X48及χ49 至Χ 5 3之各組合中，至少其一係羥基。又，Υ 9及Υ 1 〇各係相同或不同，爲氫原子，碳原子數1至4之烷基或碳原子數5至7之環烷基。）一般式5 -----------MW-- (請先閲讀背面之注意事項再填寫本頁)(wherein X45 to X58 are the same or different and each is a hydrogen atom, a halogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, and a cycloalkane having 5 to 7 carbon atoms. a group or a hydroxyl group, but at least one of the groups of χ45 to X48 and χ49 to Χ5 3 is a hydroxyl group. Further, Υ 9 and Υ 1 〇 are the same or different and each are a hydrogen atom, and the number of carbon atoms is 1 to 4. Alkyl or a cycloalkyl group having 5 to 7 carbon atoms.) General formula 5 -----------MW-- (Please read the notes on the back and fill out this page)

、1T 經濟部智慧財產局員工消費合作社印製, 1T Ministry of Economic Affairs, Intellectual Property Bureau, employee consumption cooperative, printing

(式中，X59至X8。各係相同或不同，爲氫原子，鹵素原子，碳原子數1至4之烷基，碳原子數1至4之烷氧基，碳原子數5至7之環烷基或羥基。但Χ59至χ63, χ64 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） -35- 1295305 A7 B7 五、發明説明（33) 至X67，X72至X75及X76至X8Q之各組合中，至少其 (請先閲讀背面之注意事項再填寫本頁) 一係羥基。又，Yu至Y1S各係相同或不同，爲氫原子或碳原子數1至4之院基。）一般式6(wherein, X59 to X8. Each group is the same or different and is a hydrogen atom, a halogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, and a ring having 5 to 7 carbon atoms. Alkyl or hydroxy. But Χ59 to χ63, χ64 This paper scale applies to Chinese National Standard (CNS) Α4 size (210X 297 mm) -35- 1295305 A7 B7 V. Invention description (33) to X67, X72 to X75 and X76 To each of the X8Q combinations, at least (please read the note on the back and then fill out this page). A series of hydroxyl groups. Also, Yu to Y1S are the same or different, and are hydrogen atoms or a hospital base with 1 to 4 carbon atoms. .) General 6

(式中，Xsi至X9 ◦各係相同或不同，爲氫原子，碳原子數1至4之院氧基，碳原子數6至1〇之芳基或經基。但 X 8 i至X 9。之組合中至少其一係羥基。）該鹼顯影型放射性靈敏性光阻組成物中放射線靈敏性成分之含有比例，相對於鹼可溶性樹脂1 〇〇重量份，通常在1至2 0 0重量份，更佳者爲5至1 〇〇重量份。又，爲賦予驗顯影型放射線靈敏性光阻組成物以良好之成膜性，其中含適當有機溶劑。有關之有機溶劑，可舉例示爲構成含有無機粒子之樹脂組成物之溶劑者。經濟部智慧財產局J工消費合作社印製本發明所使用之光阻組成物中，亦可含顯影促進劑，粘著助劑，暈影防止劑，保存安定劑，消泡劑，抗氧化劑，紫外線吸收劑，表面張力調整劑，流平劑，充塡劑，螢光體，顏料，染料等各種添加劑作爲任意成分。又，亦可含用於本發明之含有無機粒子之樹脂組成物的上述無機粒子。本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -36- 1295305 A7 B7 五、發明説明（34) <顯影液> (請先閱讀背面之注意事項再填寫本頁) 使用於光阻膜之顯影步驟的顯影液，可依光阻膜（光阻組成物）之種類適當選擇。具體而言，鹼顯影型放射線靈敏性光阻組成物所成之光阻膜，可用鹼顯影液。鹼顯影液之有效成分，可舉例如，氫氧化鋰，氫氧化鈉，氫氧化鉀，磷酸氫鈉，磷酸氫二銨，磷酸氫二鉀，磷酸氫二鈉，磷酸二。氫銨，磷酸二氫鉀，磷酸二氫鈉，矽酸鋰，矽酸鈉，矽酸鉀，碳酸鋰，碳酸鈉，碳酸鉀，硼酸鋰，硼酸鈉，硼酸鉀，氨等無機鹼性化合物；氫氧化四甲銨，氫氧化三曱基羥基乙基銨，單甲胺，二甲胺，三甲胺，單乙胺，二乙胺，三乙胺，單異丙胺，二異丙胺，乙醇胺等之有機鹼性化合物。使用於光阻膜之顯影步驟之鹼顯影液，可由溶解一種或二種以上之上述鹼性化合物於水等而調製。在此，鹼顯影液中之鹼性化合物的濃度，通常係在〇 · 〇 0 i至i 〇重量％，較佳者爲0·01至5重量％。鹼顯影液亦可含非離子型界面活性劑及有機溶劑等添加劑。經濟部智慧財產局員工消費合作社印製又，以鹼顯影液作顯影處理完成後，通常係施以水洗處理。 <蝕刻液> 使用於含有無機粒子之樹脂層的蝕刻步驟之鈾刻液，係以鹼性溶液爲佳。藉此，含於含有無機粒子之樹脂層的鹼可溶性樹脂可容易地溶解去除。本紙張尺度適用中國國家標準（CNS ) A4規格（210X：297公釐） -37- 1295305 A7 B7 _ 五、發明説明（^ ) 35 (請先閱讀背面之注意事項再填寫本頁) 又，當含於含有無機粒子之樹脂層的無機粒子係藉鹼可溶性樹脂分散時，以驗性溶液溶解驗可溶性樹脂，再作清洗，可同時去除無機粒子。在此，使用作蝕刻液之鹼性溶液，係以與顯影液相同組成之溶液爲更佳。由於鈾刻液係與顯影步驟所用之鹼顯影液爲相同溶液，顯影步驟及蝕刻步驟即可連續實施，可得製程之簡化。又，以鹼性溶液作飩刻處理完成後，通常係施以水洗處理。而必要時，亦可包含將飩刻處理後殘留在含有無機粒子之樹脂層的圖型側面及基板外露部之不需要部份抹除之步驟。構成P D P之介電體，亦可將構成本發明之轉印薄膜的含有無機粒子之樹脂層轉印於基板表面，煅燒所轉印之含有無機粒子之樹脂層以形成。基於如第2圖所示之構造的轉印薄膜的含有無機粒子之樹脂層的轉印步驟之一例，係如下示。經濟部智慧財產局員工消費合作社印製 ① 將捲起成輥狀之轉印薄膜，裁切成取決於基板面積之大小。 ② 從所裁切之轉印薄膜的含有無機粒子之樹脂層（ F 2 )表面將覆蓋膜（F 3 )剝離後，於基板表面，使含有無機粒子之樹脂層（F 2 )表面抵接，將轉印薄膜貼合〇 ③ 在貼合於基板之轉印薄膜上移動加熱輥筒作熱壓合。本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐）~~ -38- 1295305 A7 B7 五、發明説明（Μ) 36 ④從藉熱壓合固定於基板之含有無機粒子之樹脂層 (F 2 )剝除支承膜（F 1 )。以如上述之操作，支承膜（F 1 )上之含有無機粒子之樹脂層（F 2 )可轉印於基板上。在此，轉印條件係例如，加熱輥筒之表面溫度6 0至1 2 0 °C，加熱輥筒之輥壓1至5公斤/平方公分，加熱輥筒之移動速率在〇 . 2 至1 0 · 0米/分鐘。如此之操作（轉印步驟），可用層合機裝置進行。又，亦可先將基板預熱，預熱溫度可係例如，4 0 至 1 0 0 °C。轉印形成於基板表面之含有無機粒子之樹脂層（F 2 )經煅燒即成燒結體（介電體）。在此，煅燒方法可舉，將轉印形成有含有無機粒子之樹脂層（F 2 )之基板配置於高溫條件下之方法。藉此，可分解去除含於含有無機粒子之樹脂層（F 2 )的有機物質，而無機粒子熔融燒結。〔實施例〕以下就本發明之實施例加以說明，但本發明並非僅限於此。又，以下「份」指「重量份」。 <實施例1 > (1 )含有無機粒子之樹脂組成物（電極形成用樹脂組成物）之調製： (A )將無機粒子平均粒徑1微米之A g粒子1 〇〇份，平均粒徑3微米之Bi2〇3— Zn〇一B2〇3 — 本紙張尺度適用中國國家標準（CNS ) Α4規格（21〇Χ：297公釐） -----------— (請先閱讀背面之注意事項再填寫本頁) 訂 #! 經濟部智慧財產局員工消費合作社印製 -39 ” 1295305 B7 五、發明説明（37) S i ◦ 2 — A 1 2〇3系低熔點玻璃料（無定形，軟化點 5 2 0 °C ) 1 0份，（B )粘結樹脂甲基丙烯酸正丁酯/ 甲基丙烯酸3—羥基丙酯/甲基丙烯酸=60/20/ 20 (重量％)共聚物（Mw=l〇〇，000) 30 份，（C )特定化合物「Cymel 3 00」（三井氰胺公司製） 1 0份，（D )溶劑丙二醇單甲醚醋酸酯1 0 0份，以及任意成分三羥甲基丙烷三丙烯酸酯1 0份，硬脂酸（分散劑）1份以珠磨機混練後，經不銹鋼網（5 0 0目，孔徑 2 5微米）過濾，調製本發明之含有無機粒子之樹脂組成物。 ~ (2 )鹼顯影型放射線靈敏性光阻組成物之調製：將鹼可溶性樹脂甲基丙烯酸甲酯/甲基丙烯酸=7 0 /30 (重量％)共聚物（Mw=60，000) 60 份，多元丙烯酸酯（放射線靈敏性成分）季戊四醇四丙烯酸酯4 0份，光聚合啓始劑（放射線靈敏性成分）2 -苯甲基一 2 —二甲胺基一 1 一（4 一嗎琳苯基）一丁酮—〔1 〕5份，及溶劑丙二醇單甲醚醋酸酯1 〇〇份混合、溶解之後，經筒式過濾器（孔徑1微米）過濾，以調製鹼顯影型放射線靈敏性光阻組成物（以下稱「光阻組成物1」。 )° (3 )轉印薄膜之製造：依下述（甲）、（乙）之操作，製作於支承膜上形成本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） I---------%~丨 (請先閱讀背面之注意事項再填寫本頁) 訂經濟部智慧財產局員工消費合作社印製 - 40- 1295305 A7 B7 經濟部智慧財產局員工消費合作社印製五、發明説明（38 ) 有光阻膜，及含有無機粒子之樹脂層的層合膜之本發明的轉印薄膜。 (甲）將上述（2 )中所調製之光阻組成物1，用模塗機塗布於預先經脫模處理之P E T膜（寬：4 0 0毫米，長：3 0米，厚3 8微米）所成之支承膜上，將塗膜於 1 0 0 °C乾燥5分鐘完全去除溶劑，於支承膜上形成厚度 5微米之光阻膜。 (乙）用模塗機塗布上述（1 )中所調製之含有無機粒子之樹脂組成物於光阻膜上，將塗膜於1 〇〇 °C乾燥5 分鐘完全去除溶劑，於光阻膜上形成厚度2 0微米之含有無機粒子之樹脂層。 (4 )轉印薄膜之可撓性評估：將上述（3 )中所製造之轉印薄膜折彎，以目視確認含有無機粒子之樹脂層的表面有無裂紋（彎曲龜裂）發生，進行該轉印薄膜之可撓性評估，於含有無機粒子之樹脂層表面無可辨認之裂紋，該含有無機粒子之樹脂層具優良可撓性。 (5 )含無機粒子之樹脂層之轉印（轉印薄膜之轉印性評估）：預先於熱板上加熱到8 0 °C之玻璃基板表面上，將上述（4 )中所製造之轉印薄膜貼合使含無機粒子之樹脂層表面抵接，將該轉印薄膜以加熱輥筒作熱壓合。本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） I---------MW------、玎------ (請先閱讀背面之注意事項再填寫本頁) -41 - 經濟部智慧財產局員工消費合作社印製 1295305 A7 B7 五、發明説明（39 ) 在此，壓合條件係加熱輥筒表面溫度1 2 0 °C，輥壓 4公斤/平方公分，加熱輥筒移動速率0·5米/分鐘（條件①）以及0 · 1米/分鐘（條件②）。以各條件作熱壓合處理完後，從轉印薄膜（光阻膜之表面）將支承膜剝除，以目視確認玻璃基板上的層合膜轉印後狀態，進行該轉印薄膜之轉印性評估，而所轉印之層合膜對玻璃基板之表面密合，即轉印性良好。 (6 )含無機粒子之樹脂層的煅燒（圖型形成特性之評估 )·· 對上述（5 )中轉印形成於玻璃基板上之層合膜中的光阻膜，經光罩（寬1 0 0微米之條紋圖型）從超高壓水銀燈以i線（波長3 6 5奈米之紫外線）照射（照射量 2 0 0毫焦耳/平方公分），其次，對經曝光處理之光阻膜，用0 · 1重量％之氫氧化四鉀銨水溶液（3 0°C)爲顯影液以淋灑法作光阻膜之顯影處理，連續於該顯影處理，用〇 · 1重量％之氫氧化四甲銨水溶液（3 0 °C )爲蝕刻液以淋灑法作含有無機粒子之樹脂層的蝕刻處理。處理時間合計9 0秒。其次，以超純水作水洗處理，並作乾燥處理，將形成含有無機粒子之樹脂層的圖型之玻璃基板，於煅燒爐內在大氣中，6 0 〇 °C之溫度條件下進行3 0分鐘之煅燒處理 ^藉此，得在玻璃基板表面形成燒結體所成之電極圖型而成之面板材料。本紙張尺度適用中國國家標準（CNS ) A4規格（210X29*7公釐） — 1------------MW------、訂II----- (請先閱讀背面之注意事項再填寫本頁) -42- 1295305 Α7 Β7 五、發明説明（Μ) 40 (請先閱讀背面之注意事項再填寫本頁) 對所得之面板材料的電極圖型，以光學顯微鏡觀察圖型的變形、剝落之有無，作圖型形成特性評估，結果無圖型的變形、剝落之發生。 <實施例2 > (1 )含有無機粒子之樹脂組成物（黑色電極形成用樹脂組成物）之調製： (A )將無機粒子平均粒徑1微米之A g粒子5 0份 /平均粒徑0 . 2微米之N i粒子（球狀）5 0份，平均 fei徑3微米之B i2〇3 — Zn〇一B 2 0 3 — Si〇2 — A 1 2〇3系低熔點玻璃料（無定形，軟化點5 2 0 °C ) 1 0份，（B )粘結樹脂甲基丙烯酸正丁酯/甲基丙烯酸 3 —羥基丙酯/甲基丙烯酸二6 0 / 2 0 / 2 0 (重量％ )共聚物（Mw 二 1〇〇，〇〇〇) 40 份，（C)特定經濟部智慧財產局員工消費合作社印製化合物「Cymel 300」（三井氰胺公司製）2 0份，（D ) 溶劑丙二醇單甲醚醋酸酯1 〇〇份，及任意成分三羥甲基丙烷三丙烯酸酯1 〇份，油酸（分散劑）1份以珠磨機混練後，經不銹鋼網（5 0 0目，孔徑2 5微米）過濾，以調製本發明之含有無機粒子的樹脂組成物。 (2 )鹼顯影型放射線靈敏性光阻組成物（兼電極形成用樹脂組成物）之調製：將鹼可溶性樹脂甲基丙烯酸正丁酯/曱基丙烯酸3 -羥基丙酯/甲基丙烯酸二6 0/2 0/2 0 (重量％)共本紙張尺度適用中國國家標準（CNS ) A4規格（210Χ297公釐） -43- 1295305 A7 _ __B7_ 五、發明説明（41 ) 聚物（M w = 1 〇 0 , 0 0 0 ) 6 0份，多元两嫌酸酯（ (請先閱讀背面之注意事項再填寫本頁) 放射線靈敏性成分）三羥甲基丙烷三丙烯酸酯4 0份，光聚合啓始劑（放射線靈敏性成分）2 -苯甲基一 2 —二甲胺基一 1 一（ 4 一嗎啉苯基）丁酮一〔1〕5份，無機粒子平均粒徑1微米之A g粒子2 5 0份，平均粒徑2微米之 B i 2〇3 — Ζ η 0 — Β 2 0 3 — S i 0 2 — A 1 2〇3 系低熔點玻璃料（無定形，軟化點5 4 0 °C ) 3 0份，及溶劑丙二醇單甲醚醋酸酯1 〇〇份，及任意成分硬脂酸（分散劑）1份以珠磨機混練後，經不銹鋼網（5 0 0目，孔徑 2 5微米）過濾，以調製鹼顯影型放射線靈敏性光阻組成物（以下稱「光阻組成物2」）。 (3 )轉印薄膜之製造：藉由下述（甲）、（乙）之操作，製作於支承膜上形成有光阻膜與含有無機粒子之樹脂層的層合膜之本發明之轉印薄膜。經濟部智慧財產局員工消費合作社印製 (甲）用刮刀塗布上述（2 )中所調製之光阻組成物 2於預先經脫模處理之P E T膜（寬：4 0 0毫米，長： 3 0米，厚：3 8微米）所成之支承膜上，將塗膜於 1 0 0 °C乾燥5分鐘完全去除溶劑，於支承膜上形成厚度 2 0微米之光阻膜。 (乙）用刮刀塗布上述（.1 )中所調製之含有無機粒子之樹脂組成物於光阻膜上，將塗膜於1 〇〇 °C乾燥5分鐘完全去除溶劑，於光阻膜上形成厚度1 〇微米之含有無本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -44- 1295305 A7 B7 五、發明説明（42) 機粒子的樹脂層。 (請先閲讀背面之注意事項再填寫本頁) (4 )轉印薄膜之可撓性評估：將上述（3 )所製造之轉印薄膜折彎，以目視確認含有無機粒子之樹脂層表面的裂紋（彎曲龜裂）的發生之有無，以作該轉印薄膜之可撓性評估，含有無機粒子之樹脂層表面無裂紋可見，該含有無機粒子之樹脂層具優良可撓性。 (5 )含有無機粒子之樹脂層的轉印（轉印薄膜之轉印性評估）：在預先於熱板上加熱到8 0 °C之玻璃基板表面，將上述（4 )中所製造之轉印薄膜使含有無機粒子之樹脂層的表面抵接貼合，以加熱輥筒熱壓合該轉印薄膜。經濟部智慧財產局員工消費合作社印製在此，壓合條件係加熱輥筒之表面溫度爲1 2 0 t：, 輥壓4公斤/平方公分，加熱輥筒之移動速率〇 . 5米/ 分鐘（條件①）以及〇 · 1米/分鐘（條件②）。以各條件作熱壓合處理完後，從轉印薄膜（光阻膜之表面）剝除支承膜，以目視確認玻璃基板表面之層合膜的轉印後狀態，作該轉印薄膜之轉印性評估，而所轉印之層合膜對玻璃基板表面密合，即轉印性係爲良好。 (6 )圖型形成特性之評估：對上述（5 )中轉印形成於玻璃基板上之層合膜中的本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -45- 1295305 A7 B7 五、發明説明（Μ) πτΟ (請先閲讀背面之注意事項再填寫本頁) 光阻膜，經光罩（寬1 〇〇微米之條紋圖型）以超高壓水銀燈之i線（波長3 6 5奈米之紫外線照射（照射量 2 0 0毫焦耳/平方公分），其次，對經曝光處理之光阻膜，用0 · 5重量％之碳酸鈉水溶液（3 0 °C )爲顯影液，以淋灑法作光阻膜之顯影處理，連續該顯影處理，用 0 · 5重量％之碳酸鈉水溶液（3 0 t )爲蝕刻液以淋灑法作含有無機粒子之樹脂層的蝕刻處理。處理時間合計 9 0秒。其次，作超純水之水洗處理，及乾燥處理，將形成含有無機粒子之樹脂層的圖型之禮璃基板，於煅燒爐內在大氣中，6 0 0 °C之溫度條件下進行3 0分鐘之煅燒處理。藉此，得於玻璃基板表面形成燒結體所成之電極圖型而成之面板材料。對所得之面板材料的電極圖型，以光學顯微鏡觀察圖型變形、剝落之有無，作圖型形成特性評估，結果無圖型變形、剝落之發生。經濟部智慧財產局員工消費合作社印製 <比較例1 > 除不使用特定化合物以外與實施例1 ( 1 )同樣，調製比較用之組成物，除使用該組成物以外與實施例1 ( 3 )同樣製作比較用之轉印薄膜。將如此所得之轉印薄膜與實施例1 ( 4 )同樣進行可撓性評估，該轉印薄膜折彎時，於該含有無機粒子之樹脂層的表面有顯著裂紋可見，該含有無機粒子之樹脂層可撓本紙張尺度適用中國國家標準（CNS〉A4規格（210X297公釐） -46- 1295305 A7 B7 五、發明説明（w) 44 性差。又，除用所得之轉印薄膜以外，與實施例1 ( 5 )同樣，作層合膜之轉印，進行轉印性評估，結果發現對玻璃基板表面不具良好之轉印性。再者，除用含有無機粒子之樹脂層轉印形成的玻璃基板以外，與實施例1 ( 6 )同樣，以鈾刻處理及煅燒處理，於玻璃基板表面形成燒結體所成之電極，進行圖型形成特性評估，確認有圖型變形、剝落之發生。以上之實施例1、2及比較例1有關之轉印薄膜的可撓性、轉印性及電極圖型之圖型形成特性的評估結果綜合示於下述表1。表1 可撓性轉印性圖型形成特性條件① 條件② 實施例1 良好良好良好良好實施例2 良好良好良好良好比較例1 不良不良不良不良經濟部智慧財產局員工消費合作社印製 -----------4—丨 (請先閱讀背面之注意事項再填寫本頁) 發明效果利用本發明之含有無機粒子之樹脂組成物，可以形成可撓性及轉印性優良，經蝕刻步驟及煅燒步驟形成之燒結體圖型不發生變形或脫落之含有無機粒子之樹脂層。 1 利用本發明之轉印薄膜，其中之含有無機粒子之樹脂本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -47- 1295305 A7 B7 五、發明説明（45) 層可確實形成目的燒結體圖型，因此，適用於形成電漿顯示面板之電極、間壁、電阻體、介電體、螢光體、濾色體及黑格陣。又，利用本發明之電漿顯示面板之製造方法，可形成尺寸精確度高之圖型，可得優良之工作性。圖式之簡單說明第1圖呈示交流型電漿顯示面板之剖面形狀之示意圖。第2圖 (甲）係呈示本發明之轉印薄膜之槪略剖視圖，（乙 )係呈示該轉印薄膜之層構造的剖視圖。第3圖呈示本發明之製造方法中電極形成步驟（轉印步驟、光阻膜之形成步驟、曝光步驟）之一例的槪略剖視圖° 第4圖經濟部智慧財產局員工消費合作社印製呈示本發明之製造方法中電極形成步驟（顯影步驟、蝕刻步驟、煅燒步驟）之一例的槪略剖視圖。圖號說明 1 玻璃基板（正面基板） 2 玻璃基板（背面基板） 3 間壁 4 透明電極本紙張尺度適用中國國家標準（CNS ) A4規格（210x297公釐） -48 - 1295305 Α7 Β7 五、發明説明（46) 經濟部智慧財產局員工消費合作社印製 5 母線電極 6 位址電極 7 螢光體 8 介電體 ( 正面基板 ) 9 介電體 ( 背面基板 ) 1 0 保護膜 F 1 支承膜 F 2 含有 Μ j\\\ 機企丄松子之樹 F 3 覆蓋膜 1 1 玻璃基板 1 2 透明電極 2 0 轉印薄膜 2 1 含有並 j\\\ 機子之樹 2 2 支承膜 2 5 含有 Μ j\\\ 機企丄松子之樹 2 5 A 樹脂層殘留部 2 5 B 樹脂層去除部 3 1 光阻膜 3 5 光阻圖型 3 5 A 光阻殘留部 3 5 B 光阻去除部 4 0 電極 5 〇面板材料 Μ 光罩 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） -49- 1295305 A7 B7 五、發明説明（47 ) Μ Α 透光部 MB 遮光部 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -50-(wherein, Xsi to X9 are the same or different in each, and are a hydrogen atom, an alkoxy group having 1 to 4 carbon atoms, an aryl group or a via group having 6 to 1 carbon atoms. However, X 8 i to X 9 At least one of the hydroxyl groups in the combination.) The content of the radiation sensitive component in the alkali-developing type radioactive sensitive photoresist composition is usually from 1 to 200% by weight based on 1 part by weight of the alkali-soluble resin. More preferably, it is 5 to 1 part by weight. Further, in order to impart a good film forming property to the developer-developing radiation-sensitive resist composition, a suitable organic solvent is contained therein. The organic solvent to be used may, for example, be a solvent constituting a resin composition containing inorganic particles. Printed by the Ministry of Economic Affairs, Intellectual Property Office, J Workers' Consumption Cooperative, the photoresist composition used in the present invention may also contain a development accelerator, an adhesion promoter, a vignette prevention agent, a preservation stabilizer, an antifoaming agent, an antioxidant, Various additives such as an ultraviolet absorber, a surface tension adjuster, a leveling agent, a sputum, a phosphor, a pigment, and a dye are optional components. Further, the above inorganic particles used in the resin composition containing inorganic particles of the present invention may be contained. This paper scale applies to Chinese National Standard (CNS) A4 specification (210X297 mm) -36- 1295305 A7 B7 V. Invention description (34) <Developing solution> (Please read the note on the back and fill in this page) The developer in the developing step of the photoresist film can be appropriately selected depending on the type of the photoresist film (photoresist composition). Specifically, an alkali developing solution can be used as the photoresist film formed of the alkali-developing type radiation-sensitive resist composition. The active ingredient of the alkali developer may, for example, be lithium hydroxide, sodium hydroxide, potassium hydroxide, sodium hydrogen phosphate, diammonium hydrogen phosphate, dipotassium hydrogen phosphate, disodium hydrogen phosphate or phosphoric acid. Ammonium hydroxide, potassium dihydrogen phosphate, sodium dihydrogen phosphate, lithium niobate, sodium citrate, potassium citrate, lithium carbonate, sodium carbonate, potassium carbonate, lithium borate, sodium borate, potassium borate, ammonia and other inorganic basic compounds; Tetramethylammonium hydroxide, trimethylol hydroxyethylammonium hydroxide, monomethylamine, dimethylamine, trimethylamine, monoethylamine, diethylamine, triethylamine, monoisopropylamine, diisopropylamine, ethanolamine, etc. Organic basic compound. The alkali developing solution used in the developing step of the photoresist film can be prepared by dissolving one or more of the above basic compounds in water or the like. Here, the concentration of the basic compound in the alkali developing solution is usually 〇· 〇 0 i to i 重量 by weight%, preferably from 0. 01 to 5% by weight. The alkali developer may also contain an additive such as a nonionic surfactant and an organic solvent. Printed by the Consumers' Cooperative of the Intellectual Property Office of the Ministry of Economic Affairs. After the development of the alkali developer is completed, it is usually treated with water. <etching liquid> The uranium engraving used in the etching step of the resin layer containing the inorganic particles is preferably an alkaline solution. Thereby, the alkali-soluble resin contained in the resin layer containing the inorganic particles can be easily dissolved and removed. This paper scale applies to Chinese National Standard (CNS) A4 specification (210X: 297 mm) -37- 1295305 A7 B7 _ V. Invention description (^) 35 (Please read the note on the back and fill in this page) When the inorganic particles contained in the resin layer containing the inorganic particles are dispersed by the alkali-soluble resin, the soluble resin is dissolved in the test solution and washed, and the inorganic particles can be simultaneously removed. Here, it is more preferable to use an alkaline solution as an etching solution in a solution having the same composition as that of the developer. Since the uranium entraining system is the same solution as the alkali developing solution used in the developing step, the developing step and the etching step can be continuously performed, and the process can be simplified. Further, after the alkaline solution is used as the engraving treatment, it is usually subjected to a water washing treatment. Further, if necessary, a step of erasing the unnecessary side portion of the pattern side surface of the resin layer containing the inorganic particles and the exposed portion of the substrate after the etching treatment may be included. The dielectric layer constituting the P D P may be formed by transferring the inorganic particle-containing resin layer constituting the transfer film of the present invention onto the surface of the substrate, and firing the transferred resin layer containing the inorganic particles. An example of a transfer step of a resin layer containing inorganic particles based on a transfer film having a structure as shown in Fig. 2 is as follows. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the Consumers' Cooperative. 1 Roll the transfer film into a roll and cut it to the size of the substrate. 2 After the cover film (F 3 ) is peeled off from the surface of the inorganic particle-containing resin layer (F 2 ) of the cut transfer film, the surface of the resin layer (F 2 ) containing the inorganic particles is abutted on the surface of the substrate. The transfer film is bonded to the crucible 3, and the heating roller is moved on the transfer film attached to the substrate to be thermally pressed. This paper scale is applicable to China National Standard (CNS) A4 specification (210X 297 mm)~~ -38-1295305 A7 B7 V. Inventive Note (Μ) 36 4 Resin layer containing inorganic particles fixed by heat sealing (F 2 ) Stripping the support film (F 1 ). By the operation as described above, the resin layer (F 2 ) containing the inorganic particles on the support film (F 1 ) can be transferred onto the substrate. Here, the transfer conditions are, for example, a surface temperature of the heating roller of 60 to 1 2 0 ° C, a rolling pressure of the heating roller of 1 to 5 kg/cm 2 , and a moving speed of the heating roller of 〇. 2 to 1. 0 · 0 m / min. Such an operation (transfer step) can be carried out using a laminator device. Alternatively, the substrate may be preheated, for example, from 40 to 100 °C. The resin layer (F 2 ) containing the inorganic particles formed on the surface of the substrate is transferred into a sintered body (dielectric body) by calcination. Here, the calcination method is a method in which a substrate on which a resin layer (F 2 ) containing inorganic particles is transferred is disposed under high temperature conditions. Thereby, the organic substance contained in the resin layer (F 2 ) containing the inorganic particles can be decomposed and removed, and the inorganic particles are melt-sintered. [Examples] Hereinafter, examples of the invention will be described, but the invention is not limited thereto. In addition, the following "parts" means "parts by weight". <Example 1> (1) Preparation of resin composition containing inorganic particles (resin composition for electrode formation): (A) A g particles having an average particle diameter of 1 μm of inorganic particles, and an average particle size Bi2〇3—Zn〇B2〇3 with a diameter of 3 microns — This paper scale applies to the Chinese National Standard (CNS) Α4 specification (21〇Χ: 297 mm) -----------— (Please Read the notes on the back and fill out this page. Order #! Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed -39 ” 1295305 B7 V. Inventions (37) S i ◦ 2 — A 1 2〇3 Series Low Melting Glass Material (amorphous, softening point 5 2 0 °C) 10 parts, (B) binder resin n-butyl methacrylate / 3-hydroxypropyl methacrylate / methacrylic acid = 60/20 / 20 (weight %) Copolymer (Mw=l〇〇,000) 30 parts, (C) specific compound "Cymel 3 00" (manufactured by Mitsui Cyanamide Co., Ltd.) 10 parts, (D) Solvent propylene glycol monomethyl ether acetate 1 0 0 And 10 parts of trimethylolpropane triacrylate as an optional component, 1 part of stearic acid (dispersant) is mixed with a bead mill, and then passed through a stainless steel mesh (500 mesh, pore diameter 2 5 Micron) filtration to prepare a resin composition containing inorganic particles of the present invention. ~ (2) Preparation of alkali-developing radiation sensitive photoresist composition: Alkali-soluble resin methyl methacrylate / methacrylic acid = 70 / 30 (% by weight) copolymer (Mw = 60,000) 60 parts , polyacrylate (radiation sensitive component), tetrakis pentaerythritol tetraacrylate, 40 parts, photopolymerization initiator (radiation sensitive component) 2 -benzylmethyl-2-dimethylamino-1 1 (4 morphine benzene 5) Butanone-[1] 5 parts, and solvent propylene glycol monomethyl ether acetate 1 〇〇 mixed, dissolved, filtered through a cartridge filter (pore size 1 μm) to prepare alkali-developed radiation-sensitive light Resistive composition (hereinafter referred to as "photoresist composition 1".) ° (3) Manufacture of transfer film: According to the following operations (A) and (B), it is produced on the support film to form the paper scale. Standard (CNS) A4 specification (210X297 mm) I---------%~丨 (please read the notes on the back and fill out this page) Printed by the Ministry of Economic Affairs, Intellectual Property Bureau, Staff Consumer Cooperatives - 40 - 1295305 A7 B7 Ministry of Economic Affairs, Intellectual Property Bureau, Staff Consumption Cooperative, Printed, issued Description (38) of the transfer film of the present invention has a resist film, and the laminated film of the resin layer containing an inorganic particle layer. (a) The photoresist composition 1 prepared in the above (2) was applied to a PET film previously subjected to release treatment by a die coater (width: 400 mm, length: 30 m, thickness: 38 μm) On the support film formed, the coating film was dried at 100 ° C for 5 minutes to completely remove the solvent, and a photoresist film having a thickness of 5 μm was formed on the support film. (b) coating the resin composition containing the inorganic particles prepared in the above (1) on the photoresist film by a die coater, and drying the coating film at 1 ° C for 5 minutes to completely remove the solvent on the photoresist film. A resin layer containing inorganic particles having a thickness of 20 μm was formed. (4) Evaluation of the flexibility of the transfer film: The transfer film produced in the above (3) was bent, and it was visually confirmed that the surface of the resin layer containing the inorganic particles was cracked (curved crack), and the transfer was performed. The flexibility of the printed film was evaluated as an unrecognizable crack on the surface of the resin layer containing the inorganic particles, and the resin layer containing the inorganic particles had excellent flexibility. (5) Transfer of resin layer containing inorganic particles (transferability evaluation of transfer film): The surface of the glass substrate heated to 80 ° C in advance on a hot plate, and the transfer produced in the above (4) The surface of the resin layer containing the inorganic particles is brought into contact with the printing film, and the transfer film is thermally pressed by a heating roll. This paper scale applies to Chinese National Standard (CNS) A4 specification (210X 297 mm) I---------MW------, 玎------ (Please read the back of the note first) Matters fill out this page) -41 - Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 1295305 A7 B7 V. Invention Description (39) Here, the pressing condition is the surface temperature of the heating roller 1 2 0 °C, rolling pressure 4 Kg/cm 2 , heating roller movement rate 0·5 m/min (condition 1) and 0 · 1 m/min (condition 2). After the thermal compression bonding treatment was carried out under the respective conditions, the support film was peeled off from the transfer film (the surface of the photoresist film), and the state after the transfer of the laminated film on the glass substrate was visually confirmed, and the transfer film was transferred. The printed property was evaluated, and the transferred laminated film was in close contact with the surface of the glass substrate, that is, the transfer property was good. (6) Calcination of the resin layer containing inorganic particles (evaluation of pattern formation characteristics) · The photoresist film transferred to the laminated film formed on the glass substrate in the above (5), through the mask (width 1) The 0 0 micron stripe pattern) is irradiated from an ultra-high pressure mercury lamp with an i-line (ultraviolet light having a wavelength of 3 6 5 nm) (irradiation amount of 200 mJ/cm 2 ), and secondly, for the exposed photoresist film, Using a 0. 1% by weight aqueous solution of tetrapotassium hydroxide (30 ° C) as a developing solution to develop a photoresist film by a shower method, continuously in the development treatment, using 〇·1% by weight of hydrogen hydroxide The aqueous solution of ammonium methoxide (30 ° C) is an etching treatment of the etching liquid as a resin layer containing inorganic particles by a shower method. The processing time is a total of 90 seconds. Next, the ultra-pure water is washed with water and dried to form a glass substrate of a pattern containing a resin layer of inorganic particles, which is subjected to a temperature of 60 ° C for 30 minutes in a calciner. By calcination treatment, a panel material obtained by forming an electrode pattern formed of a sintered body on the surface of a glass substrate is obtained. This paper scale applies to China National Standard (CNS) A4 specification (210X29*7 mm) — 1------------MW------, set II----- (please Read the notes on the back and fill out this page.) -42- 1295305 Α7 Β7 5. Inventor's Note (Μ) 40 (Please read the note on the back and fill in this page.) The electrode pattern of the obtained panel material is optical. The microscope was used to observe the deformation and peeling of the pattern, and the pattern formation characteristics were evaluated. As a result, no deformation or peeling occurred. <Example 2> (1) Preparation of resin composition containing inorganic particles (resin composition for forming black electrode): (A) 50 parts/average particle of A g particles having an average particle diameter of 1 μm of inorganic particles 0.5 μm of N i particles (spherical) 50 parts, average fei diameter of 3 μm B i2〇3 — Zn〇—B 2 0 3 — Si〇2 — A 1 2〇3 series low melting glass frit (amorphous, softening point 5 2 0 °C) 10 parts, (B) binder resin n-butyl methacrylate / 3-hydroxypropyl methacrylate / methacrylic acid 2 6 / 2 0 / 2 0 (% by weight) Copolymer (Mw 2 〇〇, 〇〇〇) 40 parts, (C) 20 copies of the compound "Cymel 300" (manufactured by Mitsui Cyanamide Co., Ltd.) printed by the Intellectual Property Office of the Intellectual Property Office of the Ministry of Economic Affairs. (D) Solvent propylene glycol monomethyl ether acetate 1 〇〇 part, and optional component trimethylolpropane triacrylate 1 〇, oleic acid (dispersant) 1 part mixed with a bead mill, through stainless steel mesh (5 0 0 mesh, pore size 2 5 μm) was filtered to prepare a resin composition containing the inorganic particles of the present invention. (2) Preparation of an alkali-developing radiation-sensitive resist composition (a resin composition for forming an electrode): an alkali-soluble resin n-butyl methacrylate/3-hydroxypropyl methacrylate/methacrylic acid 2 0/2 0/2 0 (% by weight) Common paper scale applicable to Chinese National Standard (CNS) A4 specification (210Χ297 mm) -43- 1295305 A7 _ __B7_ V. Description of invention (41) Polymer (M w = 1 〇0 , 0 0 0 ) 60 parts, multiple bismuth acid esters ((Please read the back of the precautions and fill out this page) Radiation sensitive component) 40 parts of trimethylolpropane triacrylate, photopolymerization Starting agent (radiation sensitive component) 2 - benzyl di 2- dimethylamino - 1 - ( 4 - morpholinyl phenyl ) butanone - 1 [5], inorganic particles having an average particle diameter of 1 μm Particles 250 parts, average particle size 2 μm B i 2〇3 — Ζ η 0 — Β 2 0 3 — S i 0 2 — A 1 2 〇 3 series low melting glass frit (amorphous, softening point 5 4 0 °C) 30 parts, and solvent propylene glycol monomethyl ether acetate 1 〇〇, and any component stearic acid (dispersant) 1 part after mixing with a bead mill By stainless steel mesh (500 mesh, pore size 25 [mu] m) filter to modulate the radiation sensitivity of the alkali-developable resist composition (hereinafter referred to as "resist composition 2"). (3) Production of transfer film: The transfer of the present invention in which a laminated film of a resist film and a resin layer containing inorganic particles is formed on a support film by the following operations (A) and (B) film. Printed by the Ministry of Economic Affairs, Intellectual Property Office, Staff and Consumers Co., Ltd. (A) The photoresist film prepared in the above (2) is coated with a photoresist film previously prepared by demoulding (width: 400 mm, length: 3 0) On the support film formed by m, thickness: 3 8 μm, the film was completely dried at 100 ° C for 5 minutes to completely remove the solvent, and a photoresist film having a thickness of 20 μm was formed on the support film. (b) coating the resin composition containing the inorganic particles prepared in the above (.1) on the photoresist film with a doctor blade, and drying the coating film at 1 ° C for 5 minutes to completely remove the solvent and form on the photoresist film. Thickness 1 〇 micron Contains no paper size Applicable to China National Standard (CNS) A4 specification (210X297 mm) -44- 1295305 A7 B7 V. Inventive Note (42) Resin layer of machine particles. (Please read the precautions on the back and fill out this page.) (4) Evaluation of the flexibility of the transfer film: The transfer film manufactured in (3) above is bent to visually confirm the surface of the resin layer containing inorganic particles. The occurrence of cracks (bending cracks) is evaluated as the flexibility of the transfer film, and the surface of the resin layer containing the inorganic particles is free from cracks, and the resin layer containing the inorganic particles has excellent flexibility. (5) Transfer of resin layer containing inorganic particles (evaluation of transfer property of transfer film): The surface of the glass substrate heated to 80 ° C in advance on a hot plate, and the transfer produced in the above (4) The printed film is brought into contact with the surface of the resin layer containing the inorganic particles, and the transfer film is thermally pressed by a heating roll. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the consumer cooperative is here. The pressing condition is that the surface temperature of the heating roller is 1 2 0 t:, the rolling pressure is 4 kg/cm 2 , and the moving speed of the heating roller is 〇. 5 m / min. (Condition 1) and 〇·1 m/min (Condition 2). After the thermal compression bonding treatment was carried out under various conditions, the support film was peeled off from the transfer film (the surface of the photoresist film), and the state after the transfer of the laminated film on the surface of the glass substrate was visually confirmed, and the transfer film was transferred. The printability was evaluated, and the transferred laminate film was adhered to the surface of the glass substrate, that is, the transfer property was good. (6) Evaluation of pattern formation characteristics: The Chinese National Standard (CNS) A4 specification (210×297 mm) is applied to the paper scale of the above-mentioned (5) laminated film formed on a glass substrate -45-1295305 A7 B7 V. Inventive Note (Μ) πτΟ (Please read the note on the back and fill in this page) Photoresist film, through the mask (width 1 〇〇 micron stripe pattern) to the i-line of ultra-high pressure mercury lamp (wavelength 3 6 5 nm ultraviolet irradiation (irradiation amount of 200 mJ/cm 2 ), and secondly, development of the exposed photoresist film with 0. 5 wt% aqueous sodium carbonate solution (30 ° C) The liquid is subjected to a development treatment of a photoresist film by a shower method, and the development treatment is continued, and etching of a resin layer containing inorganic particles is carried out by a shower method using a 0.5% by weight aqueous sodium carbonate solution (30 t) as an etching liquid. The treatment time is 90 seconds in total. Next, as a water washing treatment of ultrapure water, and drying treatment, a pattern of a glass substrate containing a resin layer containing inorganic particles is formed in a calciner in the atmosphere, 60 ° ° The calcination treatment was carried out for 30 minutes under the temperature condition of C. Thereby, a panel material obtained by forming an electrode pattern formed by a sintered body on the surface of the glass substrate is obtained. The electrode pattern of the obtained panel material is observed by an optical microscope, and the presence or absence of patterning and peeling is performed. As a result of the evaluation, there was no pattern deformation or spalling. The Ministry of Economic Affairs, Intellectual Property Office, Staff Consumer Cooperative, printed <Comparative Example 1 > The composition for comparison was prepared in the same manner as in Example 1 (1) except that no specific compound was used. A transfer film for comparison was produced in the same manner as in Example 1 (3) except that the composition was used. The transfer film thus obtained was subjected to flexibility evaluation in the same manner as in Example 1 (4), and the transfer film was bent. When the surface of the resin layer containing the inorganic particles is marked with significant cracks, the resin layer containing the inorganic particles can be flexed to the paper scale applicable to the Chinese national standard (CNS>A4 specification (210×297 mm) -46-1295305 A7 B7 In the same manner as in the first embodiment (5), the transfer film was transferred and the transfer property was evaluated, and it was found that the transfer property was evaluated. The surface of the glass substrate does not have good transferability. Further, in the same manner as in Example 1 (6), the uranium engraving treatment and the calcination treatment were carried out on the surface of the glass substrate except for the glass substrate formed by transfer of the resin layer containing the inorganic particles. The electrode formed of the sintered body was formed, and the pattern formation characteristics were evaluated to confirm the occurrence of pattern deformation and peeling. The flexibility and transferability of the transfer film according to Examples 1 and 2 and Comparative Example 1 above were as follows. The results of the evaluation of the pattern formation characteristics of the electrode pattern are shown in Table 1 below. Table 1 Flexibility transfer pattern formation characteristic condition 1 Condition 2 Example 1 Good good Good Good Example 2 Good good Good good good comparison Example 1 Bad Defects and Bad Defects Ministry of Economic Affairs Intellectual Property Bureau Employees Consumption Cooperatives Printing ---------------------------------------------------------------------------------------------------------- The resin composition of the inorganic particles is excellent in flexibility and transferability, and the sintered body pattern formed by the etching step and the calcination step does not deform or fall off. Son resin layer. 1 Using the transfer film of the present invention, the resin containing the inorganic particles is applicable to the Chinese National Standard (CNS) A4 specification (210×297 mm) -47-1295305 A7 B7 5. Invention Description (45) The layer can be formed The purpose of the sintered body pattern is therefore suitable for forming electrodes, partitions, resistors, dielectrics, phosphors, color filters and black grids of the plasma display panel. Further, with the manufacturing method of the plasma display panel of the present invention, it is possible to form a pattern having a high dimensional accuracy, and excellent workability can be obtained. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the cross-sectional shape of an AC type plasma display panel. Fig. 2 (a) is a schematic cross-sectional view showing a transfer film of the present invention, and (b) is a cross-sectional view showing a layer structure of the transfer film. Fig. 3 is a schematic cross-sectional view showing an example of an electrode forming step (transfer step, a step of forming a photoresist film, and an exposing step) in the manufacturing method of the present invention. Fig. 4 Printed presentation of the Ministry of Economic Affairs Intellectual Property Office employee consumption cooperative A schematic cross-sectional view of an example of an electrode forming step (developing step, etching step, calcining step) in the manufacturing method of the invention. Figure No. 1 Glass substrate (front substrate) 2 Glass substrate (back substrate) 3 Wall 4 Transparent electrode This paper scale applies to China National Standard (CNS) A4 specification (210x297 mm) -48 - 1295305 Α7 Β7 V. Description of invention (46) Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative Printed 5 Busbar Electrode 6 Addressed Electrode 7 Phosphor 8 Dielectric (front substrate) 9 Dielectric (back substrate) 1 0 Protective film F 1 Support film F 2 Μ j\\\ machine enterprise pine tree F 3 cover film 1 1 glass substrate 1 2 transparent electrode 2 0 transfer film 2 1 containing j\\\ machine tree 2 2 support film 2 5 containing Μ j \\\ Machine Enterprise Pine Tree 2 5 A Resin layer Residue 2 5 B Resin layer removal part 3 1 Resistive film 3 5 Photoresist pattern 3 5 A Resistive residual part 3 5 B Photoresist removal part 4 0 Electrode 5 〇 Panel material Μ Photomask (please read the precautions on the back) Write this page) This paper size is applicable to China National Standard (CNS) Α4 specification (210X 297 mm) -49- 1295305 A7 B7 V. Invention description (47) Μ Α Translucent part MB shading part (please read the back of the note first) Please fill out this page again) Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperatives Printed Paper Size Applicable to China National Standard (CNS) A4 Specification (210X297 mm) -50-

Claims

A8 B8 C8 1295305

Sixth, apply for a patent Fan¥ sound 1 · A resin composition' is characterized by containing ------^---·! loading - r clearing the back of the law on the back of the matter and then fill out this page) (A) by At least one inorganic particle selected from the silver particles and the nickel particles, and 100 parts by weight of (B) as the (meth)acrylic resin of the alkali-soluble resin in a ratio of 30 to 1% by weight of the binder resin. 5 to 200 parts by weight (C) a compound having an average of two or more methoxymethyl groups in the repeating unit, 0.5 to 100 parts by weight of (D) a compound having two or more (meth)acryl fluorenyl groups 0.1 to 500 parts by weight, and (E) at least one solvent selected from the group consisting of ethers, esters, ether esters, and ketones, and 10 to 100 parts by weight. A transfer film comprising a resin layer containing an inorganic particle-containing resin composition of the first aspect of the invention, which is formed on the support film. The Ministry of Economic Affairs Intellectual Property Office employee consumption cooperative prints a method for manufacturing a plasma display panel, which comprises the steps of: containing inorganic particles by a transfer film constituting the second item of the patent application scope The resin layer is transferred onto the substrate, and a photoresist film is formed on the transferred resin layer containing the inorganic particles, and the photoresist film is exposed to form a latent image of the photoresist pattern, and the photoresist film is developed. A photoresist pattern is developed, and the resin layer containing the inorganic particles is subjected to uranium engraving to form a pattern of a resin layer containing inorganic particles corresponding to the photoresist pattern, and the pattern is calcined to form an electrode and a black matrix. At least one of them. 4 · A method for manufacturing a plasma display panel, which is characterized by including the following Chinese paper standard (CNS) Α4 specification (210Χ297 mm) -51 - Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 1295305 A8 B8 C8 D8 VI. Patent application scope: a laminated film of a resin layer containing an inorganic particle which is formed on a support film by a photoresist film and a resin composition containing inorganic particles of the first item of the scope of the application j. Transferring the laminated film on the substrate, exposing the photoresist film constituting the laminated film to form a photoresist pattern latent image, and developing the photoresist film to develop a photoresist pattern, The resin layer containing the inorganic particles is subjected to an etching treatment to form a resin layer pattern containing inorganic particles corresponding to the resist pattern, and the pattern is subjected to a calcination treatment to form at least one of an electrode and a black matrix. This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the notes on the back and fill out this page)

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