TWI293016B - - Google Patents
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- Publication number
- TWI293016B TWI293016B TW94138396A TW94138396A TWI293016B TW I293016 B TWI293016 B TW I293016B TW 94138396 A TW94138396 A TW 94138396A TW 94138396 A TW94138396 A TW 94138396A TW I293016 B TWI293016 B TW I293016B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- circuit board
- layer
- adhesive layer
- manufacturing
- Prior art date
Links
- 239000010410 layer Substances 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 34
- 239000012790 adhesive layer Substances 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 241000283973 Oryctolagus cuniculus Species 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000002184 metal Substances 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000000463 material Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094138396A TW200719788A (en) | 2005-11-02 | 2005-11-02 | Method for manufacturing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094138396A TW200719788A (en) | 2005-11-02 | 2005-11-02 | Method for manufacturing circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200719788A TW200719788A (en) | 2007-05-16 |
| TWI293016B true TWI293016B (enExample) | 2008-01-21 |
Family
ID=45067699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094138396A TW200719788A (en) | 2005-11-02 | 2005-11-02 | Method for manufacturing circuit board |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200719788A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI386144B (zh) * | 2010-10-25 | 2013-02-11 | Zhen Ding Technology Co Ltd | 雙面電路板之製作方法 |
-
2005
- 2005-11-02 TW TW094138396A patent/TW200719788A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW200719788A (en) | 2007-05-16 |
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