TW200719788A - Method for manufacturing circuit board - Google Patents

Method for manufacturing circuit board

Info

Publication number
TW200719788A
TW200719788A TW094138396A TW94138396A TW200719788A TW 200719788 A TW200719788 A TW 200719788A TW 094138396 A TW094138396 A TW 094138396A TW 94138396 A TW94138396 A TW 94138396A TW 200719788 A TW200719788 A TW 200719788A
Authority
TW
Taiwan
Prior art keywords
substrate
circuit board
adhesive layers
multilayer circuit
board bodies
Prior art date
Application number
TW094138396A
Other languages
English (en)
Chinese (zh)
Other versions
TWI293016B (enExample
Inventor
Wilson Yang
yan-qing Jiang
Chia-Hua Pai
Kai-His Lee
Original Assignee
Compeq Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compeq Mfg Co Ltd filed Critical Compeq Mfg Co Ltd
Priority to TW094138396A priority Critical patent/TW200719788A/zh
Publication of TW200719788A publication Critical patent/TW200719788A/zh
Application granted granted Critical
Publication of TWI293016B publication Critical patent/TWI293016B/zh

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
TW094138396A 2005-11-02 2005-11-02 Method for manufacturing circuit board TW200719788A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094138396A TW200719788A (en) 2005-11-02 2005-11-02 Method for manufacturing circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094138396A TW200719788A (en) 2005-11-02 2005-11-02 Method for manufacturing circuit board

Publications (2)

Publication Number Publication Date
TW200719788A true TW200719788A (en) 2007-05-16
TWI293016B TWI293016B (enExample) 2008-01-21

Family

ID=45067699

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094138396A TW200719788A (en) 2005-11-02 2005-11-02 Method for manufacturing circuit board

Country Status (1)

Country Link
TW (1) TW200719788A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI386144B (zh) * 2010-10-25 2013-02-11 Zhen Ding Technology Co Ltd 雙面電路板之製作方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI386144B (zh) * 2010-10-25 2013-02-11 Zhen Ding Technology Co Ltd 雙面電路板之製作方法

Also Published As

Publication number Publication date
TWI293016B (enExample) 2008-01-21

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