TW200719788A - Method for manufacturing circuit board - Google Patents

Method for manufacturing circuit board

Info

Publication number
TW200719788A
TW200719788A TW094138396A TW94138396A TW200719788A TW 200719788 A TW200719788 A TW 200719788A TW 094138396 A TW094138396 A TW 094138396A TW 94138396 A TW94138396 A TW 94138396A TW 200719788 A TW200719788 A TW 200719788A
Authority
TW
Taiwan
Prior art keywords
substrate
circuit board
adhesive layers
multilayer circuit
board bodies
Prior art date
Application number
TW094138396A
Other languages
Chinese (zh)
Other versions
TWI293016B (en
Inventor
Wilson Yang
yan-qing Jiang
Chia-Hua Pai
Kai-His Lee
Original Assignee
Compeq Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compeq Mfg Co Ltd filed Critical Compeq Mfg Co Ltd
Priority to TW094138396A priority Critical patent/TW200719788A/en
Publication of TW200719788A publication Critical patent/TW200719788A/en
Application granted granted Critical
Publication of TWI293016B publication Critical patent/TWI293016B/zh

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The present invention relates to a method for manufacturing a circuit board, comprising the following steps of: arranging adhesive layers on upper and lower surfaces of a substrate by positioning along edges of the substrate, wherein the adhesive layers inside form a central hollow area so that the adhesive layers are adhesively attached to the upper and lower surfaces of the substrate in a circular frame configuration; sequentially laminating multilayer circuit board bodies on the upper and lower surfaces of the substrate provided with the adhesive layers; cutting off the portions where the multilayer circuit board bodies are adhered to the adhesive layers in order to remove the adhesion between the multilayer circuit board bodies and the substrate; separating the multilayer circuit board bodies from the substrate, whereby since the substrate is provided with the adhesive layers that have a central hollow area in a positioned-along-edges manner, there is no need to use double metal layers to carry out adhesion and separation between the multilayer circuit board bodies and the substrate, and further, no any hole punching operation is necessary to be carried out on the substrate. Thus, costs of material and operation can be reduced and the manufacturing yield of products can be enhanced.
TW094138396A 2005-11-02 2005-11-02 Method for manufacturing circuit board TW200719788A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094138396A TW200719788A (en) 2005-11-02 2005-11-02 Method for manufacturing circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094138396A TW200719788A (en) 2005-11-02 2005-11-02 Method for manufacturing circuit board

Publications (2)

Publication Number Publication Date
TW200719788A true TW200719788A (en) 2007-05-16
TWI293016B TWI293016B (en) 2008-01-21

Family

ID=45067699

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094138396A TW200719788A (en) 2005-11-02 2005-11-02 Method for manufacturing circuit board

Country Status (1)

Country Link
TW (1) TW200719788A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI386144B (en) * 2010-10-25 2013-02-11 Zhen Ding Technology Co Ltd Method for manufacturing double-sided printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI386144B (en) * 2010-10-25 2013-02-11 Zhen Ding Technology Co Ltd Method for manufacturing double-sided printed circuit board

Also Published As

Publication number Publication date
TWI293016B (en) 2008-01-21

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