TW200719788A - Method for manufacturing circuit board - Google Patents
Method for manufacturing circuit boardInfo
- Publication number
- TW200719788A TW200719788A TW094138396A TW94138396A TW200719788A TW 200719788 A TW200719788 A TW 200719788A TW 094138396 A TW094138396 A TW 094138396A TW 94138396 A TW94138396 A TW 94138396A TW 200719788 A TW200719788 A TW 200719788A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- circuit board
- adhesive layers
- multilayer circuit
- board bodies
- Prior art date
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to a method for manufacturing a circuit board, comprising the following steps of: arranging adhesive layers on upper and lower surfaces of a substrate by positioning along edges of the substrate, wherein the adhesive layers inside form a central hollow area so that the adhesive layers are adhesively attached to the upper and lower surfaces of the substrate in a circular frame configuration; sequentially laminating multilayer circuit board bodies on the upper and lower surfaces of the substrate provided with the adhesive layers; cutting off the portions where the multilayer circuit board bodies are adhered to the adhesive layers in order to remove the adhesion between the multilayer circuit board bodies and the substrate; separating the multilayer circuit board bodies from the substrate, whereby since the substrate is provided with the adhesive layers that have a central hollow area in a positioned-along-edges manner, there is no need to use double metal layers to carry out adhesion and separation between the multilayer circuit board bodies and the substrate, and further, no any hole punching operation is necessary to be carried out on the substrate. Thus, costs of material and operation can be reduced and the manufacturing yield of products can be enhanced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094138396A TW200719788A (en) | 2005-11-02 | 2005-11-02 | Method for manufacturing circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094138396A TW200719788A (en) | 2005-11-02 | 2005-11-02 | Method for manufacturing circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200719788A true TW200719788A (en) | 2007-05-16 |
TWI293016B TWI293016B (en) | 2008-01-21 |
Family
ID=45067699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094138396A TW200719788A (en) | 2005-11-02 | 2005-11-02 | Method for manufacturing circuit board |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200719788A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI386144B (en) * | 2010-10-25 | 2013-02-11 | Zhen Ding Technology Co Ltd | Method for manufacturing double-sided printed circuit board |
-
2005
- 2005-11-02 TW TW094138396A patent/TW200719788A/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI386144B (en) * | 2010-10-25 | 2013-02-11 | Zhen Ding Technology Co Ltd | Method for manufacturing double-sided printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
TWI293016B (en) | 2008-01-21 |
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