1293016 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種電路板製造方法，尤其係指一種可 節省成本並提高產品良率之電路板製造方法。 【先前技術】 由於現在的電子產品體積已逐漸朝微小化發展趨勢演 進，因此傳統的硬質印刷並無法完全的符合小體積之電子 產⑽電路。又置之需求，因此電路板、或稱之為電路軟板便 廣泛的被使用在小體積之電子產品上。 由於電路板質地較為柔軟，因此在線路成型上必須要 搭配支撐用之基板，依成型方法之不同依序在基板上成型 電路板。 上述之電路板製造方法，如本國發明專利第92136864 號「製造電路之方法」申請案，其中揭露有利用在硬質之 芯基板上以兩層金屬層來進行多層本體之設置及分離，但 是該專利案實際在操作時，由於芯基板上必須要設置兩層 金屬層，因此會造成成本上的提高，又金屬層之間很容易 會造成皺折，導致多層本體層積設置時之誤差產生，又， 清芩看第二圖所示，上述的雙層金屬層在對位上，係利用 對位孔之方式進行，而為了對位孔之設置，又必須在芯基 板及金屬層上鑽設對位孔而需增設沖孔製程，因此造成成 本進一步的增加，另外，當雙層金屬層進行對位時，係利 作業’但是其對位效 由於對位的不準確， 用雷射投影對位燈進行金屬層之對位 果仍然無法達到誤差在1 mm以内，又， 1293016 在該金屬層上層積多層本體時，其線路十分容易產生誤差 位移而導致電路板之報廢，形成報廢的主要原因在於金屬 層無覆蓋的地方，其上方之印刷電路板將會因為黏著層而 2下面的芯基板黏合，當進行印刷電路板裁切以與芯基板 分離時，非常容易切割到線路部份導致報廢，再者，爲了 後面製程可順利將上方之印刷電路板與芯基板分離，必須 浪費多餘的區域去涵蓋對位不準之問題，進而會導致板面 利用率下降以及物料之浪費，造成成本進—步的增力” 【發明内容】 本發明人有㈣上述電路板在製造時所遇到的種種問 乃積極的者手從事研發，以期可改進上述既有習用製 玉之缺點，經過不斷的研究及努力，終於開發出本發明。 2明之主要目的在於提供一種可以節省成本並提高 座叩良率之電路板製造方法。 段予广"月目的，本發明係採取以下燦 、成，其中本發明係包括有以下製程： 在 基板之上、下而μ丨、/丘、鱼 層，該黏著Μ邊對位之方式設置有黏著 環狀;t f S 、形成有巾空區域’使得該黏著層係以一 衣狀框體之結構黏荽抓 偁钻者叹置在基板之上、下面處； 於設置有點著層之美姑μ 板本體； 層之基板上、下面依序層積有多層電路1293016 IX. Description of the Invention: [Technical Field] The present invention relates to a method of manufacturing a circuit board, and more particularly to a method of manufacturing a circuit board which can save cost and improve product yield. [Prior Art] Since the volume of electronic products has gradually evolved toward a trend of miniaturization, conventional hard printing cannot fully conform to small-volume electronic (10) circuits. There is also a need for this, so boards, or circuit boards, are widely used in small-volume electronics. Since the circuit board is relatively soft in texture, it is necessary to match the supporting substrate in the line forming, and the circuit board is formed on the substrate in order according to the molding method. The above-mentioned method for manufacturing a circuit board, such as the application method of the method for manufacturing a circuit of the invention patent No. 92136864, which discloses the use of two metal layers on a hard core substrate for setting and separating a plurality of layers, but the patent When the case is actually in operation, since two metal layers must be disposed on the core substrate, the cost is increased, and wrinkles are easily caused between the metal layers, resulting in errors in the stacking of the multilayer body, and As shown in the second figure, the above two-layer metal layer is in the alignment position by means of the alignment hole, and in order to set the alignment hole, it is necessary to drill the core substrate and the metal layer. The hole hole needs to be added with a punching process, which causes a further increase in cost. In addition, when the two-layer metal layer is aligned, the operation is profitable 'but the alignment effect is inaccurate due to the alignment, and the laser projection is used. The alignment of the metal layer of the lamp still cannot reach the error within 1 mm. Moreover, when 1293016 laminates the multilayer body on the metal layer, the circuit is very prone to error displacement. The main reason for the scrapping of the circuit board is that the metal layer is not covered. The printed circuit board above it will be bonded to the core substrate under the adhesive layer 2 when the printed circuit board is cut to separate from the core substrate. When it is very easy to cut to the part of the line, it will be scrapped. Furthermore, in order to separate the printed circuit board from the core substrate smoothly, the excess area must be wasted to cover the problem of misalignment, which may lead to the board surface. The utilization rate is reduced and the waste of materials is caused by the increase of the cost. [Invention] The present inventors have (4) the various problems encountered in the manufacture of the above-mentioned circuit boards are actively carried out in research and development, with a view to improving the above The invention has been developed through the continuous research and efforts. The main purpose of the invention is to provide a circuit board manufacturing method that can save costs and improve the yield of the seat. The invention adopts the following processes, wherein the invention includes the following processes: above and below the substrate, μ丨, / mound, In the fish layer, the adhesive edge is disposed in an adhesive ring shape; the tf S is formed into a towel empty area, so that the adhesive layer is adhered to the substrate by a structure of a garment-like frame. Above and below; in the setting of a layer of Meigu μ board body; layered on the substrate, under the layered multi-layer circuit
將黏者層盘^ ^ Ό/r I 得多岸泰路杌 “ ％反本體黏合之部位裁切去除，使 夕層电路板本體與基板之間失去黏性； 將多層電路板本體與基板加以分離。 1293016 藉由上述以靠邊對位方式於基板上設置具The adhesive layer disk ^ ^ Ό / r I 岸 泰 泰 杌 % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % 1293016 by means of the above-mentioned edge-to-edge alignment on the substrate
厂 工^ lEHL 之站著層，因此不需要利用雙層金屬層來達到多層電— 本體及基板之黏著及分離，更不f要在基板上進行任何= 孔作業’故可以降低材料及作業成本’並提高產二 後的良率。 、表& 【實施方式】 請參看第一圖所示，本發明電路板製造方法係包括右 以下製程： 括有 在-基板（1 〇)之上、下面上以靠邊對位之方式$ 置有黏著層（1 1 )，兮# μ 、 ）忒黏者層（1 1 )中央係使用機械 裁刀之方式將不需要點合之部位加以移除以形成有中 空區域（12)，使得該黏著層（1 1 )係以-環狀框體 之結構黏著設置在基板（1(η之上、下面處； 於設置有黏著層（Ί Ί、 ^ 續111)之基板（10)上、下面依 序層積有至少各包含一爲〜人β g鋼金屬層（21)、介電層（2 2)及銅金屬層 之多層電路板本體（20); 將黏著層（1 1 )盥夕a _ 丄^ -、夕層電路板本體（2 0)黏合之 部位裁切去除，僥犋客思 于夕層％路板本體（2 〇)與基板（1 0)之間因中空區域（1 、丄^ )之存在而失去黏性； 將多層電路板太驊r。 本體（2 〇 )與基板（1 〇 )加以分離， 完成電路板之製作。 L之夕層電路板本體（2 0 )於成型時所進行之光 罩、顯影：_等方法係與一般既有之電路板製作方式相 同，因此省略其詳細說明。 1293016 由於本發明H邊對位方式於基板（丨q)上設置 j中空區域(12)之黏著層（11)，因此不需要利 ^層金屬層來達到多層電路板本體（20)纟基板（1 、，之黏著及分離，更不需要在基板（1 0 )上進行任何 冲孔作業’故可以降低材料及作業成本， 造後的良率。 衣 … 適貫施型態之黏著層（1 1 )係以具有黏性之 不需要另外設置用以將多層電路板本體（2◦)及基板q 0)之黏著、分離用的金屬[故可以降低成本，又由ς 上述兩實施型態均是利用靠邊對位之方式將黏著層（工 1 )與基板（i 〇 )結合，因此不會有位差的問題產生， 可以更精確的在基板（工〇 )上成型具所需線路的多層電 路板本體（2 0 )。 構成除上述之成型方法外，亦可藉由黏性足夠之油 墨’藉由印刷方式在基板（工〇 )上印刷出中央具有中空 區域（"）之油墨黏著層（i i)，之後再於該具有油 墨黏著層（11)之基板（1〇)上依序層積有多層電路 板本體（20) ’如此一來，便可與上述實施型態同樣， 【圖式簡單說明】 第一圖係本發明之製造方法流程示意圖。 第二圖係習用金屬層定位示意圖。 【主要元件符號說明】 (1 0)基板 (1 1 )黏著層The factory worker l lEHL stands on the layer, so there is no need to use double-layer metal layer to achieve multi-layer electricity - the adhesion and separation of the body and the substrate, and not to do any hole operation on the substrate, so the material and operation cost can be reduced. 'And improve the yield after the second production. [Embodiment] Referring to the first figure, the circuit board manufacturing method of the present invention includes the following process: including the on-substrate (1 〇) and the lower side on the opposite side. The adhesive layer (1 1 ), 兮 # μ , ) 忒 adhesive layer (1 1 ) centrally uses a mechanical cutter to remove the portion that does not need to be joined to form a hollow region (12), so that The adhesive layer (1 1 ) is adhered to the substrate (1 (n above, below); on the substrate (10) provided with the adhesive layer (Ί Ί, ^ continued 111), under the structure of the ring-shaped frame Forming at least one multilayer circuit board body (20) each comprising a metal layer (21), a dielectric layer (2 2) and a copper metal layer; the adhesive layer (1 1 ) a _ 丄 ^ -, the layer of the circuit board body (20) is cut and removed, and the hollow area is between the main body of the board (2 〇) and the substrate (10). , 丄^), the loss of viscosity; the multi-layer circuit board is too r. The body (2 〇) and the substrate (1 〇) are separated to complete the production of the board. The method of forming the mask and the developing of the layer board body (20) at the time of molding is the same as that of the conventional board, and therefore the detailed description thereof is omitted. 1293016 Since the H-side alignment method of the present invention is The adhesive layer (11) of the hollow region (12) is disposed on the substrate (丨q), so that the metal layer of the multilayer circuit board body (20) is not required to reach the substrate (1, the adhesion and separation, and not It is necessary to perform any punching operation on the substrate (10), so that the material and the operating cost can be reduced, and the yield after the manufacturing. The suitable adhesive layer (1 1 ) of the conforming type is not required to have a viscosity. In addition, a metal for adhering and separating the multilayer circuit board body (2 ◦) and the substrate q 0) is provided [therefore, the cost can be reduced, and the above two embodiments are all using the edge-to-edge alignment method. (Work 1) is combined with the substrate (i 〇), so that there is no problem of the difference in the difference, and the multilayer circuit board body (20) having the desired wiring can be formed more accurately on the substrate (work). In addition to the above molding method, it is also sufficient by stickiness The ink 'prints the ink-adhesive layer (ii) having a hollow region (" in the center on the substrate (printer), and then on the substrate (1) having the ink-adhesive layer (11) The multi-layer circuit board body (20) is laminated in sequence. Thus, the same as the above embodiment, the following is a schematic diagram of the manufacturing method of the present invention. The second figure is a conventional metal. Layer positioning diagram. [Main component symbol description] (1 0) Substrate (1 1 ) adhesive layer
1293016 (1 2 )中空區域 (20)多層電路板本體 (2 1 )銅金屬層 (2 2 )介電層 91293016 (1 2 ) Hollow area (20) Multi-layer circuit board body (2 1 ) Copper metal layer (2 2 ) Dielectric layer 9