JP2006287138A - Lamination film for forming passive component, sheet type passive component, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lamination film for forming a passive component, a sheet type passive component, and its manufacturing method to manufacture the sheet type passive component by the small number of processes, and to reduce the thickness of the same. <P>SOLUTION: A resistor capacitor film 6 includes a resin film 1, a resistor thin film 2 formed on the resin film 1, a common electrode film 3 formed on the resistor thin film 2, a dielectric film 4 formed on the common electrode film 3, and an upper electrode film 5 formed on the dielectric film 4. By using the resistor capacitor film 6, an inexpensive and thin sheet type passive component having a resistor and a capacitor can be manufactured. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a laminated film for forming a passive component used for forming a sheet-type passive component mounted with a resistor or a capacitor, a sheet-type passive component using the same, and a method for manufacturing the same.

  2. Description of the Related Art Conventionally, a sheet-type passive component technique in which a passive component is built in a sheet-like circuit board has been proposed in order to reduce the size and increase the mounting density in an electronic circuit. To make use of this sheet-type passive component, after forming a resistive thin film on a copper foil, the resistive thin film is attached to a resin film using an adhesive with the resistive thin film surface as the adhesive surface. (Copper resistance film) is commercially available. In addition, as a copper-clad resistive film by another manufacturing method, for example, Patent Document 1 proposes a resistive layer laminate in which a resistive thin film is formed on a resin film surface by sputtering or the like, and then a copper layer is formed by electrolytic plating or the like. Has been.

  On the other hand, a resin film having a capacitor function added as a passive component has also been proposed. For example, in Patent Document 2, a double-sided copper-clad resin film is used as a base material, and electrodes are formed at appropriate positions between copper foils. Techniques for multilayer printed wiring boards that form capacitors are described. In this technique, since a resin film serving as a dielectric layer is used as a base material, it is difficult to make the dielectric layer 10 μm or less due to problems such as handling, and the capacitor capacity cannot be increased. . In order to solve this problem, for example, in Patent Document 3, by forming a first metal electrode layer, a dielectric layer, and a second metal electrode layer in this order on a resin, a capacitor is formed between both metal electrode layers. A sheet material for producing a printed wiring board to be formed has been proposed.

  Further, in Patent Document 4, an insulating layer is formed on a mother substrate such as a silicon substrate via a release layer, and further a resistor and a capacitor are formed thereon by a thin film method such as sputtering. Techniques for manufacturing circuit block bodies that are manufactured by peeling are proposed.

JP 2004-128460 A (paragraph numbers 0010 to 0013, FIG. 1) JP 2001-339167 A (Claims, FIG. 1) Japanese Patent Laying-Open No. 2002-9416 (Claims, FIG. 1) JP 2002-164467 A (Claims, FIGS. 1 and 9)

The following problems remain in the conventional technology.
In recent years, there has been a demand for a film in which both a resistor and a capacitor are mounted as passive components. When the conventional copper-clad resin film and the resin film with a capacitor function described above are used for manufacturing, it is conceivable that these films are separately etched for element formation and then bonded to each other with an adhesive. However, the manufacturing process is complicated, and the completed element is also thickened by the adhesive layer, making it difficult to reduce the thickness. Also, as in Patent Document 4, when forming a passive component element by alternately stacking and patterning a film by a thin film method, the process becomes complicated by using a vacuum process many times. was there. Furthermore, in this technique, since film formation and patterning are repeated alternately, the unevenness increases as the number of stacked layers increases, and the film thickness accuracy and patterning accuracy are lowered, so that it is not possible to obtain highly accurate characteristics. was there. In particular, since the film is formed on the mother substrate through the separation layer, the unevenness of the separation layer affects the film formation and patterning even if the mother substrate is flattened, and the film thickness accuracy and patterning accuracy are lowered. There was a problem.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a laminated film for forming a passive component, a sheet-type passive component, and a manufacturing method thereof that can be manufactured with a small number of steps and can be thinned. To do.

  The present invention employs the following configuration in order to solve the above problems. That is, the laminated film for forming a passive component of the present invention includes a resin film, a resistive thin film formed on the resin film, a first metal electrode film formed on the resistive thin film, and the first metal. A dielectric film formed on the electrode film and a second metal electrode film formed on the dielectric film are provided.

  The sheet-type passive component of the present invention is a sheet-type passive component having a resistance portion and a capacitor portion, and is formed by patterning the second metal electrode film of the laminated film for forming a passive component according to the present invention. The upper electrode of the capacitor part, the dielectric part of the capacitor part formed by patterning the dielectric film of the laminated film for forming passive parts, and the first metal of the laminated film for forming passive parts A common electrode of the resistor part and the capacitor part formed by patterning an electrode film, a resistance electrode of the resistor part, and the resistive thin film of the laminated film for forming a passive component to pattern the common electrode and the It has the said resistance part electrically connected to the electrode for resistance, and the said resin film of the said laminated film for passive component formation, It is characterized by the above-mentioned.

  The sheet-type passive component manufacturing method of the present invention is a sheet-type passive component manufacturing method having a resistance portion and a capacitor portion, and includes a resin film, a resistance thin film formed on the resin film, and the resistance thin film A first metal electrode film formed thereon; a dielectric film formed on the first metal electrode film; and a second metal electrode film formed on the dielectric film. Forming an upper electrode of the capacitor portion by performing pattern etching on the second metal electrode film of the laminated film for forming a passive component, and the dielectric film exposed in the upper electrode forming step Forming a dielectric portion of the capacitor portion by performing pattern etching on the first metal electrode film exposed in the dielectric portion forming step and the resistive thin film immediately below the dielectric portion forming step. The An electrode wiring forming step for performing turn etching to form a common electrode for the resistance portion and the capacitor portion and an electrode wiring to be a resistance electrode for the resistance portion; and the resistance to be the resistance portion after the common electrode formation step And a resistance portion forming step of forming only the common electrode, the resistance electrode, and the resistance portion by removing only the electrode wiring on the thin film region by pattern etching.

  In these laminated films for forming passive components, sheet-type passive components, and manufacturing methods thereof, a resistive thin film, a first metal electrode film, a dielectric film, and a first film are directly formed on the resin film without using a release layer or an adhesive layer. Since the two metal electrode films are formed in this order, a resistance thin film and a dielectric film having a high film thickness accuracy with a flat and thin film can be obtained while maintaining a flat surface state of the resin film. In addition, since the flatness is high, high patterning accuracy can be obtained, and a highly accurate sheet-type passive component having a resistance portion and a capacitor portion can be obtained by a thin film lamination method and pattern etching. In addition, by using the first metal electrode film as a common electrode for the resistor portion and the capacitor portion, the number of manufacturing steps can be reduced, and the resistor portion and the capacitor portion can be formed on the same surface. Furthermore, the whole can be reduced in thickness.

The laminated film for forming a passive component according to the present invention includes a thin film layer in which at least one of the first metal electrode film and the second metal electrode film is formed by sputtering, and an electrolytic plating method on the thin film layer. And a thick film layer.
That is, in this laminated film for forming passive components, a metal electrode film is formed by a thin film layer formed by sputtering with high adhesiveness and a thick film layer formed by an electroplating method that is easy to form a thick film at low cost. By configuring, it is possible to obtain both effects of high adhesiveness and reduction of manufacturing cost.

The laminated film for forming a passive component according to the present invention is characterized in that the dielectric film is formed of a photosensitive dielectric material.
That is, in this laminated film for forming passive parts, the dielectric film is formed of a photosensitive dielectric material, so that pattern etching can be easily and accurately performed in an exposure / development process using photolithography technology such as ultraviolet irradiation. Is possible.

In the laminated film for forming a passive component according to the present invention, the dielectric film is a resin film containing a ceramic filler.
That is, in this laminated film for forming a passive component, since the dielectric film is a resin film containing a ceramic filler, a higher dielectric constant can be obtained, and an arbitrary dielectric constant can be obtained by changing the ceramic filler content. It becomes possible to set with high accuracy.

The present invention has the following effects.
That is, according to the laminated film for forming a passive component, the sheet-type passive component, and the manufacturing method thereof according to the present invention, the resistive thin film and the first metal electrode film are directly formed on the resin film without using a release layer or an adhesive layer. Since the dielectric film and the second metal electrode film are formed, a sheet having a thin film and good flatness, high film thickness accuracy and patterning precision, and a highly accurate resistance portion and capacitor portion can be obtained. Type passive parts are obtained. In addition, the first metal electrode film is used as a common electrode for the resistor portion and the capacitor portion, and the resistor portion and the capacitor portion are formed on the same surface, thereby reducing the number of manufacturing steps and reducing the overall thickness. be able to. Therefore, according to the present invention, it is possible to reduce the thickness and shorten the manufacturing process, and it is possible to obtain a highly accurate sheet-type passive component suitable for a high-density electronic circuit.

  Hereinafter, the configuration of a laminated film for forming a passive component, a sheet-type passive component, and a manufacturing method thereof according to the present invention will be described together with the manufacturing method with reference to FIGS.

  First, as shown in FIG. 1A, a resistance thin film 2 such as a NiCr thin film is formed on a resin film 1 such as a polyimide film, and a common electrode film (first layer) that is a Cu layer is further formed on the resistance thin film 2. Metal electrode film) 3 is formed. The resistive thin film 2 is formed with a predetermined thickness of about 10 to 100 nm by sputtering. The common electrode film 3 is composed of a thin film layer 3a formed by sputtering and a thick film layer 3b formed by electrolytic plating, and is formed with a predetermined thickness of about 5 to 10 μm as a whole.

Next, as shown in FIG. 1B, a resin paint in which ceramic fillers (TiO ₂ , BaTiO ₃ , (Ba, Sr) TiO ₃ , PbZrO _3, etc.) are kneaded is applied on the common electrode film 3. Then, the dielectric film 4 having a predetermined thickness is formed by drying and curing. At this time, the resin and the amount of the ceramic filler are adjusted so as to obtain a desired dielectric constant, and further the solvent amount and the coating amount are adjusted, so that a desired film thickness is obtained after drying. Further, it is desirable that the matrix (base material) resin is used as an epoxy-based adhesive in order to maintain the adhesiveness with the common electrode film 3. A gravure coater is suitable as a method for applying the dielectric film 4 for the purpose of producing a thin and uniform film, but the method is not particularly limited.
Thus, by using the dielectric film 4 as a resin film containing a ceramic filler, a higher dielectric constant can be obtained, and an arbitrary dielectric constant can be set with high accuracy by changing the ceramic filler content. It becomes possible to do. As the resin used for the dielectric film 4, a photosensitive resin (photosensitive dielectric material) is preferably used in order to enable patterning using a photolithography technique.

  Further, as shown in FIG. 1C, by forming an upper electrode film (second metal electrode film) 5 which is a Cu layer on the dielectric film 4, a resistance capacitor film (for forming passive components) is formed. Multilayer film) 6 is obtained. The upper electrode film 5 includes a thin film layer 5a formed by sputtering and a thick film layer 5b formed by electrolytic plating, and is formed to a predetermined thickness.

  In order to fabricate a sheet-type passive member using the resistor capacitor film 6, as shown in FIG. 2, the upper electrode film 5 is subjected to pattern etching by wet etching using a ferric chloride etchant, a cupric chloride etchant, or an alkali etchant. To form an internal electrode 9 to be one electrode of the capacitor portion 8 (upper electrode forming step).

  Next, as shown in FIG. 3, the dielectric film 4 exposed by pattern etching of the upper electrode film 5 is subjected to pattern etching by dry etching or the like using reactive plasma to form the dielectric part 10 of the capacitor part. (Dielectric part forming step). When a photosensitive resin is used as the resin for the dielectric film 4, pattern etching can be easily performed in an exposure / development process using a photolithography technique such as ultraviolet irradiation. The photosensitive resin may be a commonly used resin such as a resin containing an acrylic group that is cross-linked by a radical polymerization reaction (so-called resist material).

  Further, as shown in FIG. 4, the common electrode film 3 exposed by pattern etching of the dielectric film 4 and the resistance thin film 2 directly below the common electrode film 3 are simultaneously subjected to pattern etching by ferric chloride etching, etc. An electrode wiring 11 is formed to be a common electrode with the capacitor unit 8 and a resistance electrode of the resistance unit (electrode wiring forming step). Further, only the electrode wiring 11 on the region of the resistance thin film 2 to be the resistance portion is removed by pattern etching with an alkali etchant to form the common electrode 12, the resistance electrode 13, and the resistance portion 15 as shown in FIG. (Resistance part forming step). That is, a strip-shaped resistance portion 15 electrically connected to the common electrode 12 and the resistance electrode 13 is formed.

  Subsequently, as shown in FIG. 6, a resin-coated copper foil 16 composed of a resin layer 16 a and a copper foil 16 b is attached to the upper surface of the patterned resistor capacitor film 6, and a laser via 17 is formed to form a passive component. The electrodes (common electrode 12, resistance electrode 13 and upper electrode 9) of each element are exposed (electrode exposure step). Next, as shown in FIG. 7, after the panel plating is performed in the laser via 17, the copper foil 16 b is removed to form the outer layer wiring circuits 18, 19, 20, thereby forming the resistance portion 15 and the capacitor portion 8. The sheet-type passive component mounted is manufactured (outer layer wiring circuit forming step).

  As an example of use of the sheet-type passive component configured in this way, as shown in the equivalent circuit of FIG. 8, the resistor portion 15 and the capacitor portion 8 are connected by the common electrode 12, and the capacitor portion 8 is electrically connected to the ground G. Connected.

  As described above, in this embodiment, the resistive thin film 2, the common electrode film 3, the dielectric film 4, and the upper electrode film 5 are formed directly in this order on the resin film 1 without using a peeling layer or an adhesive layer. In addition, the resistance thin film 2 and the dielectric film 4 having a high film thickness accuracy with a flat and thin film can be obtained while maintaining the flat surface state of the resin film 1. Moreover, since the flatness is high, high patterning accuracy can be obtained, and a highly accurate sheet-type passive component having the resistance portion 15 and the capacitor portion 8 can be obtained by a thin film stacking method such as sputtering and pattern etching.

Further, by using the common electrode film 3 as the common electrode 12 for the resistor portion 15 and the capacitor portion 8, the number of manufacturing steps is reduced and the resistor portion 15 and the capacitor portion 8 are formed on the same surface. It is possible to further reduce the overall thickness.
Furthermore, the common electrode film 3 and the upper electrode film 5 are formed by thin film layers 3a and 5a formed by sputtering with high adhesion, and a thick film layer 3b formed by a low-cost electroplating method that is easy to form a thick film. 5b, it is possible to obtain both effects of high adhesiveness and reduction in manufacturing cost as compared with the case where the film is formed only by sputtering or only by electroless plating.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

For example, the resin film 1 is not limited to polyimide, and other materials such as a liquid crystal polymer and an epoxy resin may be used. Further, the resistance thin film 2 is not limited to Ni—Cr-based materials, and Ni—Cr—Si, Ni—Cr—Al, Ti—N, Ta—Si—O, carbon, Ru ₂ O _{3 and the} like. The conductive oxide may be used.
Further, as a means for forming the resistance thin film 2, the common electrode film 3, and the upper electrode film 5, a vacuum vapor deposition method, an ion plating method, or the like may be used, but as described above, the common electrode film 3 and the upper electrode film In the formation of 5, it is preferable in terms of adhesive strength and cost to use a combination of the formation of the thin film layers 3a and 5a by sputtering and the formation of the thick film layers 3b and 5b by electrolytic plating.

FIG. 3 is a cross-sectional view showing a method for manufacturing a laminated film for forming passive components in the order of steps in an embodiment of the laminated film for forming passive components, the sheet-type passive component, and the manufacturing method thereof according to the present invention. In the manufacturing method of the sheet type passive component concerning this embodiment, it is a sectional view and a top view showing an upper electrode formation process. In the manufacturing method of the sheet type passive component concerning this embodiment, it is a sectional view and a top view showing a dielectric part formation process. In the manufacturing method of the sheet type passive component concerning this embodiment, they are sectional drawing and a top view showing an electrode wiring formation process. In the manufacturing method of the sheet type passive component which concerns on this embodiment, it is sectional drawing and a top view which show a resistance part formation process. In the manufacturing method of the sheet type passive component which concerns on this embodiment, it is sectional drawing and a top view which show an electrode exposure process. In the manufacturing method of the sheet type passive component concerning this embodiment, it is a sectional view and a top view showing an outer layer wiring circuit formation process. It is an equivalent circuit diagram which shows the sheet type passive component which concerns on this embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Resin film, 2 ... Resistance thin film, 3 ... Common electrode film (1st metal electrode film), 3a, 5a ... Thin film layer, 3b, 5b ... Thick film layer, 4 ... Dielectric film, 5 ... Upper electrode film (Second metal electrode film), 6 ... resistive capacitor film (laminated film for forming passive components), 8 ... capacitor part, 9 ... upper electrode, 10 ... dielectric part, 12 ... common electrode, 13 ... resistive electrode, 15 ... Resistance part

Claims (6)

A resin film;
A resistive thin film formed on the resin film;
A first metal electrode film formed on the resistive thin film;
A dielectric film formed on the first metal electrode film;
A laminated film for forming passive components, comprising: a second metal electrode film formed on the dielectric film. In the laminated film for passive component formation according to claim 1,
At least one of the first metal electrode film and the second metal electrode film is composed of a thin film layer formed by sputtering and a thick film layer formed by electrolytic plating on the thin film layer. A laminated film for forming passive components. In the laminated film for passive component formation according to claim 1 or 2,
A laminated film for forming a passive component, wherein the dielectric film is formed of a photosensitive dielectric material. In the laminated film for passive component formation as described in any one of Claim 1 to 3,
A laminated film for forming a passive component, wherein the dielectric film is a resin film containing a ceramic filler. A sheet-type passive component having a resistor portion and a capacitor portion,
An upper electrode of the capacitor portion formed by patterning the second metal electrode film of the laminated film for forming a passive component according to any one of claims 1 to 4,
A dielectric portion of the capacitor portion formed by patterning the dielectric film of the laminated film for forming the passive component;
A common electrode of the resistor part and the capacitor part formed by patterning the first metal electrode film of the laminated film for forming a passive component, and a resistor electrode of the resistor part;
The resistance part electrically patterned to the common electrode and the resistance electrode by patterning the resistive thin film of the laminated film for forming passive components;
A sheet-type passive component comprising: the resin film of the passive component-forming laminated film. A method for manufacturing a sheet-type passive component having a resistor portion and a capacitor portion,
A resin film; a resistive thin film formed on the resin film; a first metal electrode film formed on the resistive thin film; a dielectric film formed on the first metal electrode film; A second metal electrode film formed on the dielectric film, and pattern etching is performed on the second metal electrode film of the laminated film for forming a passive component to form an upper electrode of the capacitor unit An upper electrode forming step,
A dielectric portion forming step of forming a dielectric portion of the capacitor portion by performing pattern etching on the dielectric film exposed in the upper electrode forming step;
The first metal electrode film exposed in the dielectric portion forming step and the resistive thin film immediately below the first metal electrode film are subjected to pattern etching, and a common electrode for the resistance portion and the capacitor portion, and a resistance electrode for the resistance portion An electrode wiring forming step of forming an electrode wiring to be
A resistance portion forming step of forming only the common electrode, the resistance electrode, and the resistance portion by removing only the electrode wiring on the region of the resistance thin film that becomes the resistance portion after the common electrode formation step by pattern etching; And a method for manufacturing a sheet-type passive component.

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