TWI289610B - Heated substrate support and method of fabricating same - Google Patents
Heated substrate support and method of fabricating same Download PDFInfo
- Publication number
- TWI289610B TWI289610B TW94128097A TW94128097A TWI289610B TW I289610 B TWI289610 B TW I289610B TW 94128097 A TW94128097 A TW 94128097A TW 94128097 A TW94128097 A TW 94128097A TW I289610 B TWI289610 B TW I289610B
- Authority
- TW
- Taiwan
- Prior art keywords
- trench
- heat sink
- substrate support
- groove
- aluminum
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 122
- 238000004519 manufacturing process Methods 0.000 title description 25
- 238000000034 method Methods 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims description 46
- 238000010438 heat treatment Methods 0.000 claims description 42
- 239000010410 layer Substances 0.000 claims description 39
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 35
- 229910052782 aluminium Inorganic materials 0.000 claims description 35
- 239000011248 coating agent Substances 0.000 claims description 4
- 239000011247 coating layer Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 238000013022 venting Methods 0.000 claims description 2
- 229910000838 Al alloy Inorganic materials 0.000 claims 7
- 238000005476 soldering Methods 0.000 claims 2
- 238000007599 discharging Methods 0.000 claims 1
- 238000005242 forging Methods 0.000 claims 1
- 238000007788 roughening Methods 0.000 claims 1
- 238000005253 cladding Methods 0.000 description 26
- 238000012545 processing Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 9
- 239000007789 gas Substances 0.000 description 7
- 238000009826 distribution Methods 0.000 description 6
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- 230000007480 spreading Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000013529 heat transfer fluid Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Vapour Deposition (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/965,601 US20060075970A1 (en) | 2004-10-13 | 2004-10-13 | Heated substrate support and method of fabricating same |
| US11/115,575 US7674338B2 (en) | 2004-10-13 | 2005-04-26 | Heated substrate support and method of fabricating same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200632124A TW200632124A (en) | 2006-09-16 |
| TWI289610B true TWI289610B (en) | 2007-11-11 |
Family
ID=36380726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW94128097A TWI289610B (en) | 2004-10-13 | 2005-08-17 | Heated substrate support and method of fabricating same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4817791B2 (OSRAM) |
| KR (1) | KR20060052233A (OSRAM) |
| TW (1) | TWI289610B (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200185202A1 (en) * | 2018-12-07 | 2020-06-11 | Applied Materials, Inc. | Component, Method Of Manufacturing The Component, And Method Of Cleaning The Component |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007126228A1 (en) * | 2006-04-28 | 2007-11-08 | Dansung Electron Co., Ltd. | Manufacturing method for susceptor and susceptor using this method |
| JP2023166746A (ja) * | 2022-05-10 | 2023-11-22 | 東京エレクトロン株式会社 | 加熱装置及び基板処理装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2222192A (en) * | 1938-10-12 | 1940-11-19 | Westinghouse Electric & Mfg Co | Flatiron |
| US2389588A (en) * | 1942-10-29 | 1945-11-27 | Westinghouse Electric Corp | Heating apparatus |
| US2541118A (en) * | 1945-04-11 | 1951-02-13 | Birtman Electric Co | Resistance element for electric irons |
| US5104459A (en) * | 1989-11-28 | 1992-04-14 | Atlantic Richfield Company | Method of forming aluminum alloy sheet |
| US5844205A (en) * | 1996-04-19 | 1998-12-01 | Applied Komatsu Technology, Inc. | Heated substrate support structure |
| US6376815B1 (en) * | 1998-01-12 | 2002-04-23 | Furukawa Electric Co., Ltd. | Highly gas tight substrate holder and method of manufacturing the same |
| JP3345852B2 (ja) * | 1998-06-18 | 2002-11-18 | 古河電気工業株式会社 | 半導体製造装置の基盤ホルダー及びその製造方法 |
| JP2000243542A (ja) * | 1999-02-24 | 2000-09-08 | Nhk Spring Co Ltd | ヒータユニット及びその製造方法 |
| US6897411B2 (en) * | 2002-02-11 | 2005-05-24 | Applied Materials, Inc. | Heated substrate support |
| US7154070B2 (en) * | 2004-10-08 | 2006-12-26 | Furukawa-Sky Aluminum Corp. | Heater plate and a method for manufacturing the heater plate |
-
2005
- 2005-08-17 TW TW94128097A patent/TWI289610B/zh not_active IP Right Cessation
- 2005-10-11 JP JP2005296615A patent/JP4817791B2/ja not_active Expired - Fee Related
- 2005-10-12 KR KR1020050096102A patent/KR20060052233A/ko not_active Ceased
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200185202A1 (en) * | 2018-12-07 | 2020-06-11 | Applied Materials, Inc. | Component, Method Of Manufacturing The Component, And Method Of Cleaning The Component |
| US11694879B2 (en) * | 2018-12-07 | 2023-07-04 | Applied Materials, Inc. | Component, method of manufacturing the component, and method of cleaning the component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4817791B2 (ja) | 2011-11-16 |
| KR20060052233A (ko) | 2006-05-19 |
| JP2006111973A (ja) | 2006-04-27 |
| TW200632124A (en) | 2006-09-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |