1287158 玖、發明說明： 發明領域 本發明係有關於一種基板貼合裝置及基板貼合方法， 5 更詳而言之，其係有關於一種適用於製造液晶顯示裝置 (Liquid Crystal Display : LCD)等將2片基板貼合之基板 (面板）時之基板貼合裝置及基板貼合方法。 近年來，LCD等平面顯示面板除了發展大型化、輕量 化（薄型化）外，並提高低成本化之要求。因此，在將2 10片基板貼合，而製造面板之裝置方面，乃要求增加產量， 以提高生產性。 I：先前技術3 發明背景BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate bonding apparatus and a substrate bonding method, and more particularly to a liquid crystal display device (LCD), etc. A substrate bonding apparatus and a substrate bonding method in a case where a substrate (panel) to which two substrates are bonded is bonded. In recent years, in addition to the development of large-scale and lightweight (thin-thin) flat panel display panels such as LCDs, the requirements for cost reduction have been increased. Therefore, in the case of assembling a substrate of 2 10 sheets and manufacturing a panel, it is required to increase the yield to improve productivity. I: Prior Art 3 Background of the Invention
液晶顯示面板之製造係將形成有矩陣狀之多數TFT 15 (薄膜電晶體）之基板與形成有彩色濾光片（紅、綠、藍）The liquid crystal display panel is manufactured by forming a matrix of a plurality of TFTs 15 (thin film transistors) and forming color filters (red, green, and blue).
或遮光膜之彩色濾光片（CF)基板相對極窄之間隔（數A mm)左右而設置，而於該2片基板間封入液晶者。遮光膜 係用以取得對比及遮蔽TFT，以防止光漏㈣流之產生。 陣列基板與CF |板係以含熱硬化性樹脂之密封材（黏著 2〇 劑）貼合。 在此液晶顯示面板之製程中，於相對之玻璃基板間封 入液晶之液晶封人程序-般係使用滴下注人法，該滴下注 入法係於在陣列基板周圍形成框狀之密封材框内之基板面 上，滴下規定量之液晶後，在真空中將陣列基板與cf基板 1287158 貼合’而進彳亍液晶封入者。 以往，2片基板（CF基板與陣列基板）之貼合係利用 加壓裝置（貼合裝置）而藉基板加壓程序進行。此貼人裝 置具有於處理㈣上下相對配置，以分別保持CF基板與陣 5列基板之2片保持板，且精密地維持兩保持板之平面度及 上下間之平行度，並將基板間之厚度方向經常維持相^， 在此狀態下，使兩基板靠近，藉此，進行貼合。與此貼合 裝置相關之習知技術如專敎獻丨（日本專利公·特° 2002-323694號）所揭示。 幵 1〇 然、而，在上述習知之貼合裝置中，為抑制使處理室内 真空時與外部（大氣壓力）之差壓造成之保持板的變形， 受差壓影響之處須高剛性，因而有使裝置之重量增加或裝 置大型化等問題。 近來年，隨著基板之大型化、薄型化，而在加工階段 15不易將保持板單體之平面度確保在一定之精確度，而難以 精確地維持兩基板之平行度。因此，在將大型且薄型之基 板貼合時，貼合時之位置偏離或基板間隔之不均一特別容 易發生。 此基板之位置偏離或基板間隔之不均一即為遮光部之 20漏光或顯示色彩不均等顯示不良之原因，而難以製造穩定 之製品，而成為產量下降之主要原因。 【菊^明内容】 發明概要 本發明即為解決上述問題而創作者。其目的在於提供 1287158 一種可精確且輕易地進行基板貼合之基板貼合裝置及基板 貼合方法。 10 15 為達成上述目的，按，申請專利範圍第丨項、第2項 及第14項之發明係將分別保持於相對配置於處理室内之第 1及第2保持板之2片基板貼合之基板貼合裝置，其並包含 有··多數重量檢測機構，係用以檢測作用於前述2片基板 之重量者；及多數加壓機構，係對應前述多數重量檢測機 構而設置，並產生用以將前述2片基板貼合之加工壓者； 而可依藉前述多數重量檢測機構檢測出之重量變化，個別 調整藉前述多數加壓機構產生之加工壓。藉此構造，可將 第1保持板與第2保持板，即第丨基板與第2基板之平行 度維持相等，且精確地進行貼合。結果，可防止基板之位 置偏離或基板間隔不均一，以降低顯示不良。 按，申請專利範圍第2項之發明係包含有：多數加壓 修正機構，係依作用於前述第！保持板之重量之分佈，修 正用以將前述第i及第2基板貼合之加卫壓者。藉此構造： 可將第1保持板與第2保持板，即第i基板與 平行度維射目等，且精確地騎貼合。結果，、可防^基板 之位置偏離或基板間隔不均一，以降低顯示不良。 按，申請專利範圍第3項之發明，前述加祕正機構 具有重f檢測機構與减機構。重量檢測機構係用以檢測 個於_第1簡板之重量者。加機構餘藉前述重 董檢測機構檢測出之重量變化，產生前述加工麼者。 按，申請專利範圍第4項之發明，更具有一控制部， 20 1287158 測機:之輪出，算出作用於前述第1 值，藉前述二：二^ 5 10 15 述重二Γ=範圍第5項之發明，前述控制部算出前 各重=值之減少_平均值，驗鮮均值與藉前述 力構檢測出之重量減少值之差，決定藉前述各 等，面#加工壓。藉此’可-面將重量分佈維持相 #，一面進行貼合。 按’申請專利範圍第8項之路日日+ 機構記錄各重量檢測機構檢測之重量變化=重： 里k化之趨向’贱修正藉前述减機構產生之加工 精此，可更高速且輕易地進行貼合作業。 以二申請專利範圍第12項之發明，前述第1保持板係 了柱為中介’可上下移動地懸吊支撐於支樓板上 …並“有防止位置偏離機構，該防止位置偏離機構係相 對刚述處理室，將前述第丨保持板與前述多數支柱連接一 體’而一面容許前述第1保持板之上下移動，-面限制該 第保持板之水平方向之移動者。藉此，可防止加壓時之 第1保持板之位置偏離。 2〇 按’申凊專利範圍第U項及第15項之發明，係分別將 第1基板與第2基板保持於相對配置於處理室内之第1保持 板與第2保持板，使第i保持板接近前述第2保持板，以將前 述第1基板與前述第2基板貼合之基板貼合裝置，其並包含 有··重量檢測機構，係用以檢測作用於前述第丨保持板之重 1287158 里者，及多數角度修正機構，係依作用於前述第1保持板之 重里分佈’修正前述第1保持板相對於水平面之傾斜者。藉 此構造，可將第丨保持板與第2保持板，即第1基板與第之基 板之平订度維持相等，且精確地進行貼合。結果， 5 其如 』丨万止 ^之位置偏離或基板間隔不均一，以降低顯示不良。且， 藉將加壓控制與兩基板之平行度之修正控制分離，可使控 制間易化。 圖式簡單說明 第1圖係顯示本發明第1實施形態之貼合裝置之正面 !〇 圖。 第2圖係第1圖之貼合裝置之平面圖。 第3圖係第丨圖之貼合裝置之部份擴大圖。 第4圖係顯示水平自由接頭之平面圖。 第5圖係顯示第1圖之貼合裝置之控制機構的塊圖。 15 第6圖係用以說明本發明第2實施形態之側面圖。 第7圖係第6圖之A-A截面圖。 t實施方式】 較佳實施形態之詳細說明 (第1實施形態） 以下’根據第1圖〜第5圖，說明將本發明具體化之第 1實施形態。 第1圖係第1實施形態之基板貼合裝置（以下稱為貼 合裝置）10之正面圖，第2圖係貼合裝置10之平面圖，第 3圖係貼合裝置1〇之部份擴大圖。此貼合裝置1〇預先於其 1287158 中之一滴下供給液晶之2種第1及第2基板W1、W2貼合， 以製造液晶顯示面板。 另，在本實施形態作成之液晶顯示面板為主動矩陣式 液晶顯示面板，第1基板W1為形成有彩色濾光片或遮光 5膜等之彩色濾光片基板（CF基板），第2基板為形成有TF T之陣列基板（TFT基板）。此時，於諸如第2基板W2之 周圍（貼合面）塗佈密封材成框狀，於其框内之基板面上 滴下液晶後，將兩基板Wl、W2搬入貼合裝置10。 此貼合裝置10具有底板11及固定於該底板11之支持 10單元12。且，底板Η及支持單元12係由具有相當高之剛 性之材質形成，支持單元12之内側具有作為處理室之室J 3，室13分割成上下，而由上侧容器13a與下側容器i3b 構成。如第3圖所示，室13之開口部，即，上側容器ΐ3& 與下側谷器13b接觸之處設置用以將該等之間密封，以保 15 持室13之氣密之〇型環i3c。 20The color filter (CF) substrate of the light-shielding film is disposed at a relatively narrow interval (approximately A mm), and a liquid crystal is sealed between the two substrates. The light-shielding film is used to obtain contrast and shield the TFT to prevent the occurrence of light leakage (four) flow. The array substrate and the CF sheet are bonded together with a sealing material (adhesive) containing a thermosetting resin. In the process of the liquid crystal display panel, a liquid crystal sealing process in which a liquid crystal is sealed between glass substrates is generally a drip-injecting method, and the dropping method is formed in a frame-shaped sealing material frame around the array substrate. After a predetermined amount of liquid crystal is dropped on the substrate surface, the array substrate and the cf substrate 1287158 are bonded together in a vacuum to enter the liquid crystal encapsulant. Conventionally, the bonding of two substrates (the CF substrate and the array substrate) is performed by a substrate pressurization program using a pressurizing device (bonding device). The affixing device is disposed in the upper and lower opposite sides of the processing (4) to respectively hold the CF substrate and the two holding plates of the five rows of substrates, and precisely maintain the flatness of the two holding plates and the parallelism between the upper and lower sides, and between the substrates The thickness direction is always maintained, and in this state, the two substrates are brought close to each other, whereby bonding is performed. A known technique related to this fitting device is disclosed in Japanese Laid-Open Patent Publication No. 2002-323694. In the above-mentioned conventional bonding apparatus, in order to suppress the deformation of the holding plate caused by the difference between the vacuum in the processing chamber and the outside (atmospheric pressure), the portion affected by the differential pressure must have high rigidity, and thus The problem is that the weight of the device is increased or the device is enlarged. In recent years, with the enlargement and thinning of the substrate, it is difficult to ensure the flatness of the holding plate unit at a certain degree of precision in the processing stage 15, and it is difficult to accurately maintain the parallelism of the two substrates. Therefore, when the large and thin substrate is bonded, the positional deviation at the time of bonding or the unevenness of the substrate interval is particularly likely to occur. The positional deviation of the substrate or the unevenness of the substrate spacing is a cause of display failure such as light leakage of the light-shielding portion or display color unevenness, and it is difficult to manufacture a stable product, which is a cause of a decrease in yield. [Chrysanthemum content] Summary of the Invention The present invention has been made to solve the above problems. The object of the invention is to provide a substrate bonding apparatus and a substrate bonding method which can accurately and easily perform substrate bonding. 10 15 In order to achieve the above objectives, the inventions of the second, second and fourth aspects of the patent application are respectively held in a two-piece substrate which is disposed opposite to the first and second holding plates disposed in the processing chamber. The substrate bonding apparatus further includes a plurality of weight detecting mechanisms for detecting the weight acting on the two substrates; and a plurality of pressing mechanisms are provided corresponding to the plurality of weight detecting mechanisms, and are generated for use The processing is performed by bonding the two substrates, and the processing pressure generated by the plurality of pressing mechanisms can be individually adjusted according to the weight change detected by the plurality of weight detecting mechanisms. With this configuration, the parallelism between the first holding plate and the second holding plate, i.e., the second substrate and the second substrate, can be made equal and precisely bonded. As a result, it is possible to prevent the position of the substrate from being deviated or the substrate spacing from being uneven, thereby reducing display defects. According to the invention of claim 2, the invention includes: a majority of the pressure correction mechanism, which acts according to the foregoing! The distribution of the weight of the plate is maintained, and the embossed person for bonding the aforementioned i-th and second substrates is corrected. According to this configuration, the first holding plate and the second holding plate, i.e., the i-th substrate, can be aligned with each other, and can be accurately ride-fitted. As a result, it is possible to prevent the position of the substrate from being deviated or the substrate spacing from being uneven, so as to reduce display defects. According to the invention of claim 3, the aforementioned secret mechanism has a heavy f detecting mechanism and a subtracting mechanism. The weight detecting mechanism is used to detect the weight of the _1st board. The adding mechanism borrows the weight change detected by the above-mentioned heavy-duty testing agency to generate the aforementioned processing. According to the invention of claim 4, there is a control department, 20 1287158 measuring machine: the round out, calculate the role of the first value, by the above two: two ^ 5 10 15 said the second Γ = range According to the invention of the fifth aspect, the control unit calculates the decrease/average value of the previous weight=value, the difference between the fresh-keeping average value and the weight-reduction value detected by the force structure, and determines the surface-machining pressure by the above-mentioned each. Thereby, the weight distribution can be maintained while maintaining the phase distribution. According to the 'Patent No. 8 of the scope of application patents day + agency records the weight change detected by each weight detection agency = weight: the trend of the k-turning '贱 correction by the above-mentioned reduction mechanism produced fine, can be faster and easier Conduct a post cooperation business. According to the invention of claim 12, the first holding plate is a column which is capable of being suspended and supported by the column on the support floor and has a position-preventing mechanism, and the position-preventing mechanism is relatively rigid. In the processing chamber, the first holding plate is integrally connected to the plurality of pillars, and the first holding plate is allowed to move up and down, and the surface is restricted from moving in the horizontal direction of the first holding plate. In the first aspect of the invention, the first substrate and the second substrate are respectively held by the first holding plate disposed in the processing chamber. And a second bonding board, the substrate holding device that bonds the first substrate and the second substrate to the second holding plate, and includes a weight detecting mechanism for the second holding plate Detecting that the weight of the first holding plate is 1287158, and the plurality of angle correcting means corrects the inclination of the first holding plate with respect to the horizontal plane by acting on the weight distribution of the first holding plate. The second holding plate and the second holding plate, that is, the flatness of the first substrate and the first substrate are maintained to be equal, and the bonding is accurately performed. As a result, the position of the second holding plate is offset or The substrate spacing is not uniform to reduce display defects, and the control between the pressurization control and the parallelism of the two substrates can be controlled to facilitate the control. The first embodiment shows the first embodiment of the present invention. The front view of the bonding device is shown in Fig. 2. Fig. 2 is a plan view of the bonding device of Fig. 1. Fig. 3 is a partial enlarged view of the bonding device of Fig. 3. Fig. 4 shows the horizontal free joint Fig. 5 is a block diagram showing a control mechanism of the bonding apparatus of Fig. 1. Fig. 6 is a side view for explaining a second embodiment of the present invention. Fig. 7 is a cross-sectional view taken along line AA of Fig. 6. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) Hereinafter, a first embodiment of the present invention will be described with reference to the first to fifth aspects. Fig. 1 is a first embodiment. Front view of a substrate bonding apparatus (hereinafter referred to as a bonding apparatus) 10, Fig. 2 is a plan view of the bonding apparatus 10, and Fig. 3 is a partially enlarged view of the bonding apparatus 1 . The bonding apparatus 1 is supplied with two kinds of first and second liquid crystals previously supplied to one of the 1287158 The liquid crystal display panel is an active matrix liquid crystal display panel, and the first substrate W1 is colored in which a color filter or a light-shielding film is formed, and the liquid crystal display panel is formed by bonding the substrates W1 and W2. The filter substrate (CF substrate), the second substrate is an array substrate (TFT substrate) on which TF T is formed. In this case, a sealing material is applied to the periphery (bonding surface) such as the second substrate W2 in a frame shape. After the liquid crystal is dropped on the substrate surface in the frame, the two substrates W1 and W2 are carried into the bonding apparatus 10. The bonding apparatus 10 has a bottom plate 11 and a support 10 unit 12 fixed to the bottom plate 11. Further, the bottom plate and the support unit 12 are formed of a material having a relatively high rigidity, and the inside of the support unit 12 has a chamber J 3 as a processing chamber, and the chamber 13 is divided into upper and lower sides, and the upper container 13a and the lower container i3b. Composition. As shown in Fig. 3, the opening portion of the chamber 13, that is, the upper container ΐ3& is in contact with the lower side sump 13b to seal the gap between the chambers 13 to maintain the airtightness of the chamber 13. Ring i3c. 20
下侧容器13b為支持單元12所支撐，上侧容器^ 室開閉部14支撐為可上下移動。室開閉部14為於—端 成公螺紋之移_桿，並與安裝於上侧容器以之母 螺合構成滾珠螺桿15。此移動螺桿之另—端（在第（圖 為下端）連接於減速器16，而使該移動螺桿以齒 為中介’而為第2圖所示之馬達所旋轉驅動。Μ 因此’當移動螺桿藉馬達ΐ7驅動而正反旋 轉動作以滾珠螺桿15為中介轉換成直線動作 、 器㈣對下物13b上㈣。藉此，可進 10 1287158 開閉動作。 於室13内相對設置作為用以吸附保持第i基板（cF 基板）W1之第1保持板之加廢板19與作為用以吸附保持 第2基板（TFT基板）W2之工作台20。加壓板19與工作 5台20具有使吸引吸附力與靜電吸附力中至少一者作用，而 分別吸附保持第1基板W1與第2基板W2之機構。 工作台20為設置於底板π上之定位台n所支撐而可 於水平方向（X方向及Y方向）移動及水平旋轉（0 更 詳而言之，於定位台21直立設置多數（在本實施形態為4 10個）之支柱22,該工作台便以各支柱22為中介支撐於定位 台21。此外，定位台21藉為來自後述之馬達驅動器之控制 脈衝驅動之台驅動馬達所驅動而可水平移動。 於此定位台21與下側容器13b間分別設置作為圍住上 述各支柱22，以將室13保持氣密之彈性體之波紋管23。 15波紋管23於兩端之突緣部具有0型環，藉該0型環密封 定位台21與下側容器13b之間。 加壓板19為支撐板24所懸掛支撐而可於上下方向（z 方向）移動。更詳而言之，多數支柱（本實施形態為4個） 25藉螺合於形成在該等上端之螺紋之螺帽26，而固定於支 20撐板24。然後’如第3圖所示，各支柱25插通安裝於上側 容器13a之固定構件27之插通孔27a，而安裝於加壓板19 之上面（外面）。 固定構件27與支柱25以作為防止位置偏離機構之水 平自由接頭28為中介而連接成一體。如第4圖所示，水平 1287158 自由接頭28略呈圓形，内側瑗t J &28b與外側環28c相對形成 於其中央之插通孔28a之中心土垂 T、相連結而形成。此水平自由 接頭28安裝在固定構件27之π品 之下面’以將該固定構件27與 外側環28c鎖緊〇又，固定構侔π爲u τ 傅仵27及水平自由接頭28之 各插通孔27a、28a為上述支拄25所插通，而將該支柱25 與内側環28b鎖緊。即’各支柱25分別將加壓板19及室i 3 (具體而言為上侧容器13a)加以固定。 10 此水平自由接頭28限㈣13對各支柱％之水平方 ^即彳28 向之移動。另—方面，則容許室13 對各支柱之上下方向，即往接頭28之軸向移動。藉此，除 了可使貼合時之加壓板19上下移料，尚可防止該加壓板 19往橫向偏離。 如第1圖所示，於支撐板24與上側容器13a間分別設 置作為圍住各支柱25’以將室13保持氣密之彈性體之波紋 15答29。與剷述相同地波紋管29於兩端之突緣部具有〇型 環，藉該Ο型環密封支撐板24與上側容器Ua之間。 支撐板24藉作為為後述之電動氣動調節器所驅動之加 壓機構的加壓氣壓彈簀30而可上下移動。此支撐板24與 加壓氣壓彈簧30間設置測力器31，該測力器31係作為重 20量檢測機構，係直接接觸支撐板24下面，而依從該支撐板 24所承受之壓力，檢測貼合時之重量者。 又，上述支撐板24藉設置於該支揮板24之多數（在 本實施形態為4個）加壓修正機構32a〜32d而可上下移動。 更詳而言之，於上側容器13a之上面對應各加壓修正機構3 12 1287158 2a〜32d直立設置導軌33，支撐板24可沿各導軌33上下移 動。各加壓修正機構32a〜32d配置於距支撐板24之中心（即 第1基板W1之中心）相等之位置，此時，更佳為配置於 支撐支撐板24之各支柱25附近。 5 各加壓修正機構32a〜32d分別具有作為加壓機構並附 設編碼器之馬達34a〜34d、為各馬達34a〜34d所驅動之滾珠 螺桿35及作為重量檢測機構之測力器36a〜36d。馬達3如〜 34d為來自後述之馬達驅動器之控制脈衝所旋轉驅動，該驅 動力並分別傳達至滾珠螺桿35。 10 各滾珠螺桿35連接於第1線形滑軌37,此第1線形滑 執37可沿相對對應之馬達34a〜34d安裝之導執38而上下 移動。此導執38固定於支撐板24，支撐板24並安裝於設 置為可沿上述導執33上下移動之第2線形滑軌39。 各測力器36a〜36d分別設置於各導軌33之上端部。各 15測力器36a〜36d直接接觸對應之滾珠螺桿35之下面，以依 從該滾珠螺桿35承受之壓力，檢測貼合時之重量。 如此構成之加壓修正機構32a〜32d於例如馬達34a〜34 d於正向旋轉驅動時’藉承受其驅動力而於下方移動之各滾 珠螺桿35，將測力器36a〜36d按壓至下方，而藉其反作用 2〇力，使支撐板24上升。相反地，當馬達34a〜34d於反方旋 轉驅動時，藉承受該驅動力，使各滚珠螺桿35移動至上方， 而使支撑板24下降。 第5圖係顯示本實施形態之貼合裝置1〇之控制機構概 略之塊圖。與第1圖相同之構造部份則附上相同之標號。 13 1287158 貼合裝置10具有控制使加壓板19上下移動之加壓氣 壓彈簧30及馬達34a〜34d之驅動之控制部41。此控制部4 1 由一般之 PLC (Programmable Logic Controllers)所構 成，並依測力器31、36a〜36d之輸出，控制分別用以驅動 5加壓氣壓彈簧30及馬達34a〜34d之電動氣動調節器42及 馬達驅動器43a〜43d之動作。又，控制部41根據以藉cc D照相機等所拍攝用以使兩基板wi、W2位置對齊之定位 標記之結果為基礎，所算出之位置偏離之影像處理裝置44 之輸出，控制用以驅動台驅動馬達45之馬達驅動器46之 10 動作。 控制部41轉換從測力器31、36a〜36d輸出之電信號， 以算出施加於載置於測力器3卜36a〜36d之重量之總和值。 然後，於貼合時，依從該重量總和值減少之重量值，辨識 作用於兩基板Wl、W2之加工壓。 15 在此，當室13關閉，而處於減壓狀態（真空狀態）時， 施加於支撐板24之重量（基板w卜加壓板19、支柱25、 加壓修正機構32a〜32d等之總重量）A及與支柱25之截面 積成比例，而作用於加壓板19之大氣壓力與室13内壓力 之差壓B的和（A+B)為重量總和值。此重量總和值（A+ 20 B)於兩基板Wl、W2靠近而進行貼合時，因其加工壓成 為反作用力而逐漸減少。因此，上述控制部41於貼合時， 將施予兩基板Wl、W2之加工壓辨識作作用於各測力器3 1、36a〜36d之重量總和之減少值。 此加工壓實際上因面板（基板W1、W2)之尺寸或液 14 1287158 晶、密封材之量、種類等而不同，在本實施形態則為約10 OKg。在此，例如施加於支撐板24之重量A約lOOOKg， 大氣壓力與室13之内壓力之差壓B約1 〇〇〇Kg時，重量總 和值（A+B)則約2000Kg。此時，控制部41調整加工壓， 5俾使重量總和值約190〇Kg，即重量總和值之減少值為100The lower container 13b is supported by the support unit 12, and the upper container opening/closing portion 14 is supported to be movable up and down. The chamber opening and closing portion 14 is a male threaded shifting rod, and is screwed to the female container attached to the upper container to constitute the ball screw 15. The other end of the moving screw (connected to the speed reducer 16 at the lower end of the drawing (the lower end of the drawing) is rotated by the motor shown in Fig. 2, so that the moving screw is moved. By the motor ΐ7 drive, the forward and reverse rotation operation is converted into a linear motion by the ball screw 15, and the fourth (4) is placed on the lower object 13b. Thus, the opening and closing operation can be performed in 10 1287158. The chamber 13 is relatively disposed to be held by the suction and hold. The scraping plate 19 of the first holding plate of the i-th substrate (cF substrate) W1 and the table 20 for sucking and holding the second substrate (TFT substrate) W2. The pressurizing plate 19 and the working 5 table 20 have suction adsorption A mechanism for adsorbing and holding the first substrate W1 and the second substrate W2 respectively by at least one of a force and an electrostatic adsorption force. The table 20 is supported by a positioning table n provided on the bottom plate π and is horizontally movable (X direction) And the Y direction) movement and horizontal rotation (0 in more detail, the plurality of pillars 22 in the present embodiment are erected on the positioning table 21 (the present embodiment is 4 10), and the table is supported by the pillars 22 for positioning. Table 21. In addition, the positioning table 21 is borrowed The drive motor of the motor driver, which is described later, is driven by the drive motor to be horizontally movable. An elastic body that surrounds each of the support posts 22 to keep the chamber 13 airtight is provided between the positioning table 21 and the lower container 13b. The bellows 23. The bellows 23 has a 0-ring at the flange portion at both ends, and the 0-ring seals between the positioning table 21 and the lower container 13b. The pressure plate 19 is supported by the support plate 24 It can be moved in the up and down direction (z direction). More specifically, most of the pillars (four in this embodiment) 25 are fixed to the branch 20 by screwing on the nut 26 formed at the upper ends. 24. Then, as shown in Fig. 3, each of the stays 25 is inserted into the insertion hole 27a of the fixing member 27 of the upper container 13a, and is attached to the upper surface (outer surface) of the pressure plate 19. Fixing member 27 and pillar 25 The horizontal free joint 28 is integrally connected as a medium to prevent the positional deviation mechanism. As shown in Fig. 4, the horizontal 1287158 free joint 28 is slightly circular, and the inner side Jt J & 28b is formed opposite to the outer ring 28c. Center of the central insertion hole 28a The horizontal free joint 28 is mounted under the π of the fixing member 27 to lock the fixing member 27 and the outer ring 28c, and the fixed structure π is u τ Fu 仵 27 and the horizontal free joint 28 Each of the insertion holes 27a and 28a is inserted into the above-mentioned support 25, and the support 25 and the inner ring 28b are locked. That is, 'the respective pillars 25 respectively pressurize the plate 19 and the chamber i 3 (specifically, upper The side container 13a) is fixed. 10 The horizontal free joint 28 is limited to (four) 13 to the horizontal level of each of the pillars, that is, the horizontal direction 28, and the other is to allow the chamber 13 to the upper and lower directions of the pillars, that is, to the joint 28 Axial movement. Thereby, in addition to the fact that the pressurizing plate 19 at the time of bonding can be moved up and down, the pressurizing plate 19 can be prevented from being laterally displaced. As shown in Fig. 1, between the support plate 24 and the upper container 13a, corrugations 15 are provided as an elastic body surrounding each of the pillars 25' to keep the chamber 13 airtight. Similarly to the description, the bellows 29 has a serpentine ring at the flange portions at both ends, and the crucible ring seals between the support plate 24 and the upper container Ua. The support plate 24 is movable up and down by the pressurized pneumatic magazine 30 which is a pressing mechanism driven by an electro-pneumatic regulator to be described later. A dynamometer 31 is disposed between the support plate 24 and the pressurized gas spring 30. The dynamometer 31 is used as a weight 20 detecting mechanism to directly contact the underside of the support plate 24, and is responsive to the pressure received by the support plate 24. The weight of the fit. Further, the support plate 24 is vertically movable by a plurality of (four in the present embodiment) pressurization correction mechanisms 32a to 32d provided in the support plate 24. More specifically, the guide rails 33 are erected on the upper surface of the upper container 13a corresponding to the respective pressure correcting mechanisms 3 12 1287158 2a to 32d, and the support plate 24 can be moved up and down along the respective guide rails 33. Each of the pressure correcting mechanisms 32a to 32d is disposed at a position equal to the center of the support plate 24 (i.e., the center of the first substrate W1). In this case, it is more preferable to be disposed in the vicinity of each of the stays 25 supporting the support plate 24. Each of the pressurizing correction mechanisms 32a to 32d has a motor 34a to 34d as a pressurizing mechanism and an encoder, and a ball screw 35 driven by each of the motors 34a to 34d and load cells 36a to 36d as weight detecting means. The motor 3 is rotatably driven by a control pulse from a motor driver to be described later, and the driving force is transmitted to the ball screw 35, respectively. Each of the ball screws 35 is connected to the first linear rail 37, and the first linear slider 37 is movable up and down along the guide 38 attached to the corresponding motor 34a to 34d. The guide 38 is fixed to the support plate 24, and the support plate 24 is attached to a second linear slide 39 which is provided to be movable up and down along the guide 33. Each of the load cells 36a to 36d is provided at an upper end portion of each of the guide rails 33. Each of the 15 dynamometers 36a to 36d directly contacts the lower surface of the corresponding ball screw 35 to detect the weight at the time of bonding in accordance with the pressure received by the ball screw 35. When the motors 34a to 34d are driven in the forward direction, for example, the respective roller screws 35 that move downward by the driving force thereof press the load cells 36a to 36d downward, for example, when the motors 34a to 34d are driven in the forward direction. And by its reaction 2, the support plate 24 is raised. Conversely, when the motors 34a to 34d are rotationally driven in the opposite directions, the respective driving forces are applied to move the respective ball screws 35 upward, and the support plate 24 is lowered. Fig. 5 is a block diagram showing an outline of a control mechanism of the bonding apparatus 1 of the present embodiment. The same components as those in Fig. 1 are given the same reference numerals. 13 1287158 The bonding apparatus 10 has a control unit 41 that controls the driving of the pressurized gas spring 30 and the motors 34a to 34d that move the pressing plate 19 up and down. The control unit 4 1 is composed of a general PLC (Programmable Logic Controllers), and controls the electropneumatic adjustment for driving the 5 pressurized gas springs 30 and the motors 34a to 34d respectively according to the outputs of the force measuring devices 31, 36a to 36d. The operation of the device 42 and the motor drivers 43a to 43d. Further, the control unit 41 controls the output of the image processing device 44 whose position is deviated based on the result of the positioning mark for positioning the two substrates wi and W2 by the cc D camera or the like, and controls the driving table. The motor driver 46 of the drive motor 45 operates 10. The control unit 41 converts the electric signals output from the load cells 31, 36a to 36d to calculate the sum of the weights applied to the load cells 3 to 36d. Then, at the time of bonding, the processing pressure acting on the two substrates W1, W2 is identified in accordance with the weight value obtained by subtracting the total weight value. Here, when the chamber 13 is closed and the pressure is reduced (vacuum state), the weight applied to the support plate 24 (the total weight of the substrate w, the pressure plate 19, the support 25, the pressure correcting mechanisms 32a to 32d, etc.) A and the cross-sectional area of the strut 25 are proportional to each other, and the sum (A+B) of the difference B between the atmospheric pressure acting on the pressurizing plate 19 and the pressure in the chamber 13 is the sum of the weights. When the total weight value (A + 20 B) is applied when the two substrates W1 and W2 are close to each other, the processing pressure is gradually reduced due to the reaction force. Therefore, when the control unit 41 is bonded, the processing pressure applied to the two substrates W1 and W2 is recognized as a decrease in the sum of the weights of the respective load cells 31 and 36a to 36d. This processing pressure is actually different depending on the size of the panels (substrates W1, W2), the amount of liquid 14 1287158, the amount and type of the sealing material, and is about 10 OKg in the present embodiment. Here, for example, when the weight A applied to the support plate 24 is about 100 gram, and the difference between the atmospheric pressure and the pressure inside the chamber 13 is about 1 〇〇〇 Kg, the total weight value (A + B) is about 2000 kg. At this time, the control unit 41 adjusts the machining pressure, and the total weight value is about 190 〇 Kg, that is, the reduction value of the weight total value is 100.
Kg〇 此外，在本實施形態中，使用可以約〇1Kg程度之解 相力檢測出測力器31、36a〜36d分別為重量總和值之 者。即，重量總和值如上述為約2000Kg時，各測力器31、 10 36a〜36d使用可以約O.lKg之解相力檢測出約4〇〇Kg之重 量者。 控制部41如此進行，而算出重量總和之減少值，再依 算出結果，將令施加於兩基板Wl、W2之加工壓為規定壓 力而生成之信號輸出至電動氣動調節器42及馬達驅動器4 15 3a〜43d。 電動氣動調節器42,回應來自控制部41之信號，而調 整加壓氣壓彈簣30之壓力。且馬達驅動器43a〜43d回應來 自控制部41之信號，輸出僅以預定數之脈衝驅動馬達43a 〜43d之脈衝信號。 20 此時，控制部41算出藉各加壓修正機構32a〜32d之測 力器36a〜36d檢測出之重量之減少值與藉測力器36a〜36d 檢測出之重量總和之減少值的平均值之差（每單位時間）， 而依該算出值，生成馬達34a〜34d之驅動信號。 舉例言之，若加壓修正機構32a之測力器36a檢測出 15 1287158 之重量之減少值較上述平均值大時，表示藉此加壓修正機 所施予之加工壓較其他加壓修正機構32b〜32d之加工廢 鬲。換言之，此即表示於加壓板19面内產生傾斜，而破壞 加壓板19與工作台20 (第1基板W1與第2基板W2)之 5平行度。此時，控制部41於抬高支撐板24之方向驅動加 壓修正機構32a之馬達34a，或使馬達34a之驅動停止，以 修正使依其馬達34a之驅動之施加於加壓板19之重量（加 工壓）減少至變成上述平均值為止。 舉例言之，在本實施形態中，各加壓修正機構32a〜32 10 d藉各測力器36a〜36d檢測出之重量之減少值較上述平均 值大諸如o.iKg以上時，使對應之馬達34a〜34d之驅動停 止，以抑制因此而造成之加工壓之增大。之後，當重量之 減少值在O.iKg以内時，使停止之馬達再度驅動，對兩基 板Wl、W2進行加壓。 15 如此，馬達34a〜34d之驅動藉來自各自對應之測力器3 6a〜36d之重量檢測結果個別加以控制，藉此，在貼合之過 程中’當其中一方於重量分佈產生偏差時，便可依此，一 面修正面内之傾斜，一面進行加壓至最後之加工壓（約1〇 OKg)為止。是故，可一面將兩基板wi、W2之平行度維 20 持精密，一面進行貼合。 此外，在本實施形態中，一面以各測力器31、36a〜36 d之重量檢測結果為基礎，進行適當修正（調整），一面進 行加壓，亦可對各加壓修正機構32a〜32d記錄加壓板”之 面内之重量變化之趨向，以預先配合該趨向，修正加工壓。 16 1287158 更詳而言之，如上述一面適當地進行加工壓之修正， 一面進行諸如ίο次之基板加壓程序。然後，各加壓修正機 構32a〜32d每10分鐘算出各馬達3扣〜34(1之平均脈衝數。 以此算出結果為基礎，一面保持各加壓修正機構32a〜32d 5之脈衝數差，一面使加壓氣壓彈簧30及馬達34a〜34d控制 之加壓板之下降速度分別在一定速度，以進行加壓至加壓 板19之加工壓成為最後之加工壓（在本實施形態約1〇〇Kg) 為止。此方法可省略調整加工壓之控制。是故，由於可簡 易且高速地進行貼合作業，故可有助面板製造時間之縮短 10 化。 其次，說明構造成如上述之貼合裝置10之作用。 貼合裝置10將搬入之第1基板及第2基板W1、W2 分別吸附保持於加壓板19與工作台2〇後，將室13内排氣 成真空，以將預定之氣體供給室13。此氣體為供pDp (pl 15 aSma DiSplay Panel )用之激發氣體等反應氣體或含有氮 氣、潔淨壓縮乾燥空氣（clean dry air)等惰性氣體之置換 氣體。藉該等氣體，進行使附著於基板或顯示元件表面之 雜質或生成物曝露於反應氣體或置換氣體一定時間之前處 理。 此處理可維持貼合後不可打開之貼合面之性質穩定 化。=1，第2基板W1、W2於該等表面生成氧化膜等膜 或附著I氣中之浮游物，而使表面之狀態產生變化。由於 此狀態之變化依基板而異，而無法製造穩定之面板。因此， 地了抑制膜之生成或雜質之附著或者處理附著之雜 17 Ϊ287158 質，而可抑制基板表面之狀態變化，達成面板品質之穩定 化。 然後，貼合裝置10利用定位標記以光學（CCD照相機 5等）’使兩基板W卜W2在不接觸下（至少使第丨基板W1 5不致接觸第2基板W2上之密封材），進行對齊。 接著，貼合裝置10控制加壓氣麼彈簧3〇之壓力及各 加壓修正機構32a〜32d之馬達34a〜34d之驅動，而以諸如5 众喊之一定速度使支撐板24，即加壓板19下降至第1基 _ 板Wl接觸第2基板W2 (具體而言為塗佈於第2基板W2 之密封材）為止。此時，藉各測力器31、36a〜36d檢測出 之重量總和值變成約2000Kg。 §第1基板W1接觸第2基板W2，而於加壓板19開 始產生加工壓時，上述重量總和值開始逐漸減少，貼合裝 置丨〇便進行加壓使該重量總和值從約2000Kg變成1900K 15 §為止，即，最後加工壓變成l〇〇Kg為止。此時，貼合裝 置10控制馬達34a〜34d之驅動，以使各加壓修正機構32a φ 〜32d之測力器36a〜36d檢測出之重量減少值相對上述重量 總和之減少值之平均值在〇.1Kg以内，以一面修正加工壓 (即加壓板19之面内之傾斜），一面進行加壓。此外，從 2〇此加壓板19開始產生加工壓至使加壓板19之移動停止為 止之距離（下降距離）大約l〇〇/zm左右。 順便一提，貼合時，隨著加工壓逐漸增加，藉該加工壓 之反作用力，使加壓板19往橫向（水平方向）移動之力產 生作用。然而，此往水平方向之反作用力為用以將懸吊支 18 1287158 撐加壓板19之支柱25與室13之上側容器連接成一體 之水平自由接頭28所吸收。因而，可防止隨加工壓之增加， 發生加壓板19之位置偏離。 貼合裝置10進行加壓至最後之加工壓後，開放室13 5内，使之成大氣壓。藉此，兩基板Wl、W2因大氣壓與兩 基板Wl、W2間之壓力差，均一地壓縮至預定之晶胞厚度 (晶胞間隙）之基板間隔為止。 如以上所述，本實施形態可發揮以下之效果。 (1) 貼合裝置10具有加壓修正機構32a〜32d，該等加 1〇壓修正機構32a〜32d係於兩基板Wl、W2貼合時，檢測加 壓板19之重量變化，依該重量變化一面調整加工壓，以使 加壓板19之重量之分佈均一，一面進行加壓者。藉此構造， 可依藉各加壓修正機構32a〜32d檢測出之重量變化，修正 加壓板19之面内之傾斜，而一面將加壓板19與工作台2〇, 15即兩基板WhW2之平行度維持相等，一面精確地進行貼 合。是故，可防止基板之位置偏離或基板間隔不均一，而 減少顯示不良。 (2) 在本實施形態中，依重量分佈之偏差是否在容許 之範圍内（例如是否在諸如O.lKg以上），進行加工壓之調 2〇整。藉此方法，可極輕易地進行加壓時之兩基板Wl、W2 之平行度之調整。 (3) 依多次之基板加壓程序之執行，對每一加壓修正 機構32a〜32d記錄加壓板19之重量變化之趨向，以預先配 合該趨向’控制加壓修正機構32a〜32d之馬達34a〜34d之 19 1287158 驅動，進行加工壓之調整，因而，可更高速地進行貼合作 業。是故，可達成面板製造時間之縮短化。又，由於此方 法可省略用以調整加工壓之複雜控制，故可更簡易地進行 貼合作業。 5 ( 4)具有固定於支撐板24，並將用以懸吊支撐加壓板 B之支柱25連接於室13而與室13成一體之水平自由接頭 28。藉此，可防止隨著加工壓增加，而使支柱乃因其反作 用力於水平方向移動。即，可防止加壓板19相對工作台2 〇之水平方向之移動（位置偏離）。又，此使用水平自由接 1〇頭28之結構在室13之減壓（真空）下，因與大氣壓之差 壓而於室13產生變形時，亦僅容許加壓板19之上下方向 之移動，而可確實地防止水平方向之位置偏離。 (5)在本實施形態中，由於使加壓板19之重量之分 佈相等，而可一面使兩基板W1、W2之平行度維持精密， 15 一面加壓，故可使於貼合時施加於密封材之重量相等。這 是指可以適當之加工壓進行貼合。藉此，可防止因其中一 者造成之重量分佈之不均一，進而防止加工壓之增大，而 可防止於貼合時因密封材或液晶，於上下基板W1、W2間 產生剪切力，而發生貼合偏離。 2〇 (6)在本實施形態中，依重量變化之檢測結果，修正 加壓板19之面内之傾斜，可將兩基板W1、W2之平行度 維持相等，且可輕易地進行貼合。因此，可抑制以高剛性 構件構成受到因室13之減壓，與外部之差壓之影響之處而 造成之裝置之重量增加及大型化等。 20 1287158 (第2實施形態） 以下，根據第6圖及第7圖說明將本發明具體化之第2 實施形態。 另，在本實施形態中，與上述第1實施形態相同之結 5 構部份則附上相同之符號，並省略部份說明。 第6圖係顯示第2實施形態之基板貼合裝置（以下稱 為貼合裝置）50之概略構造之側面圖，第7圖係第6圖所 示之貼合裝置50之A-A截面圖。與第1實施形態同樣地貼 合裝置50將第1及第2基板Wl、W2貼合，以製造液晶 10 顯示面板。 如第6圖所示，貼合裝置50具有室51，並於該室51 之上側容器51a設置用以吸附保持第1基板wi之加壓板5 2 。此外，在第6圖中省略室51之下側容器及用以吸附保 持第2基板W2之工作台等。 15 加壓板52連接於環架53,該環架53以支柱54為中介 〜吊支撐於支撐板55。環架53由覆蓋加壓板52之上面（外 及外周面之第1支撲部53a及連接於加壓板52之外周 及第1支撐部53a之内周面之第2支撐部53b所構成。 2〇門酉柃加壓板52之上面與覆蓋其之第1支撐部53a之内面 置夕數（在本實施形態為4個）測力器56a〜56d，且各 滴J力$ 。56a〜56d依從第1支撐部53a所承受之壓力，檢測 出站合時之重量。 、 内周如第7圖所示，第1支撐部53a與第2支撐部53b在 °兩”外周面相接之各邊（4邊）之中央以接頭57a〜57d 21 1287158 連接。且於第1支撐部53a與第2支撐部53b連接之相對 任2邊（在圖中沿第！及第2支撑部&、53b之短向之2 邊）設置角度修正機構58a、58b。 角度修正機構58a、58b具有馬達59a、59b與上述接 5頭57a、57b，並依馬達59a、59b之驅動，調整第2支撐部 53b之長向之水平角度（相對於水平面之傾斜）。 第2支撐部53b與加壓板52在内周面與外周面相接之 各邊（4邊）之中央以接頭6〇a〜60d連接。且於第2支撐部 53b與加壓板52連接之相對任2邊（在圖中沿第2支撐部 10 53b及加壓板52之長向之2邊）設置角度修正機構58e、5 8d ° 角度修正機構58c、58d具有馬達59c、59d與上述接 頭60c、60d，並依馬達59c、59d之驅動，調整加壓板52 之短向之水平角度。 15 如此構成之貼合裝置50於加壓板52開始產生加工壓 時，將藉各測力器56a〜56d檢測出之重量變化輸出至圖中 未示之控制部（PLC)，而依來自該控制部之信號，驅動控 制對應各測力器56a〜56d之馬達59a〜59d。 舉例言之，當測力器56A檢測出之重量之減少值大於 20其他測力器56b〜56d時（即大於重量總和之減少值之平均 值時），於抬起加壓板52之方向驅動角度修正機構58a之 馬達59a。因而，與第1實施形態同樣地，可依各測力器5 6a〜56d之重量檢測結果’修正加壓板52之傾斜，而使該加 壓板之重量分佈均一。 22 1287158 以上所記述之本實施形態除了第1實施形態所發揮之 效果外，更可發揮以下之效果。 (1)在本實施形態中，相對於使加壓板52產生加工 麼之機構，分別具有用以調整該加壓板52之平行度之角度 5調整機構58a〜58d。藉此構造，由於可將於加壓板52產生 加工壓之控制與角度修正機構58a〜58d之控制分離，故可 使控制簡易化。 另，上述各實施形態亦可以以下態樣實施。 在第1實施形態中，藉4個測力器36a〜36d檢測第1 10 基板W1周緣之重量，但並不限4個。即，可依第1基板 及第2基板w卜W2之尺寸等，而有2個、3個或5個以 在第1實施形態中，依作成之面板亦可省略用以檢測 加壓板19 (第1基板wi)中央附近之重量之測力器或作 15 為加壓機構之加壓氣壓彈簧30。 第1實施形態之測力器36a〜36d之配置並不限第2圖 所示之位置。各測力器36a〜36d之配置為依第i基板及第2 基板Wl、W2之尺寸等適當變更者，並距支撐板24之中 心（即第1基板W1之中心）相等之位置，而可檢測出第1 20基板W1之周緣之重量之位置即可。此時，以在支柱25附 近，而可檢測第1基板W1之4個角部附近之重量之配置 為佳。此外，第2實施形態之測力器56a〜56d之配置亦同 樣地不限第7圖所示之位置。 如以上詳述，本發明可提供可精確且輕易地進行基板 23 1287158 貼合之基板貼合裝置及基板貼合方法。 【圖式簡單說明】 第1圖係顯示本發明第1實施形態之貼合裝置之正面 圖。 5 第2圖係第1圖之貼合裝置之平面圖。 第3圖係第1圖之貼合裝置之部份擴大圖。 第4圖係顯示水平自由接頭之平面圖。 第5圖係顯示第1圖之貼合裝置之控制機構的塊圖。 第6圖係用以說明本發明第2實施形態之側面圖。 10 第7圖係第6圖之A-A截面圖。 【圖式之主要元件代表符號表】 10...基板貼合裝置 20...工作台 11…底板 21...定位台 12…支持單元 22...支柱 13···室 23...伸縮囊 13a.··上側容器 24...支撐板 13b...下側容器 25…支柱 13c... 0 型環 26...螺帽 14...室開閉部 27…固定構件 15...滾珠螺桿 28...水平自由接頭 16..。減速器 28a...插通孔 17...馬達 28b...内側環 18...齒輪箱 28c…外側環 19...加壓板 29...伸縮囊 24 1287158 30.. .加壓氣壓彈簧 31.··測力器 32a...加壓修正機構 32b...加壓修正機構 32c...加壓修正機構 32d...加壓修正機構 33…導執 34a...馬達 34b...馬達 34c...馬達 34d...馬達 35.. .滾珠螺桿 36a···測力器 36b···測力器 36c···測力器 36d···測力器 37.. .第1線形滑執 38…導軌 39.. .第2線形滑執 41.. .控制部 42…電動氣動調節器 43a···馬達驅動器 43b...馬達驅動器 43c...馬達驅動器 43d...馬達驅動器 50.. .基板貼合裝置 51···室 51a···上側容器 52.. .加壓板 53.. .環架 53a···第1支撐部 53b··.第2支撐部 54.. .支柱 55.. .支撐板 56a···測力器 56b···測力器 56c·.·測力器 56d…測力器 57a...接頭 57b...接頭 57c...接頭 57d...接頭 58a.··角度修正機構 58b...角度修正機構 58c...角度修正機構 58d…角度修正機構 59a...馬達 59b.. ·馬達Further, in the present embodiment, the load cells 31, 36a to 36d are each detected as a total weight value by using a phase difference force of about 1 Kg. That is, when the total weight value is about 2,000 kg as described above, each of the load cells 31, 10 36a to 36d is used to detect a weight of about 4 〇〇 Kg by a phase-dissociation force of about 0.1 kg. The control unit 41 calculates the reduction value of the total weight, and outputs a signal generated by applying the machining pressure applied to the two substrates W1 and W2 to a predetermined pressure to the electropneumatic regulator 42 and the motor driver 4 15 3a. ~43d. The electro-pneumatic regulator 42 adjusts the pressure of the pressurized pneumatic magazine 30 in response to a signal from the control unit 41. Further, the motor drivers 43a to 43d respond to the signals from the control unit 41, and output pulse signals for driving the motors 43a to 43d with only a predetermined number of pulses. At this time, the control unit 41 calculates the average value of the decrease value of the weight detected by the load cells 36a to 36d of each of the pressure correcting mechanisms 32a to 32d and the sum of the weights detected by the load cells 36a to 36d. The difference (per unit time) generates drive signals for the motors 34a to 34d based on the calculated values. For example, if the force measuring device 36a of the pressure correcting mechanism 32a detects that the weight reduction value of 15 1287158 is larger than the average value, it means that the processing pressure applied by the pressure correcting machine is higher than other pressure correcting mechanisms. Processing waste from 32b to 32d. In other words, this means that the inclination of the pressure plate 19 is generated in the plane, and the parallelism between the pressure plate 19 and the table 20 (the first substrate W1 and the second substrate W2) is broken. At this time, the control unit 41 drives the motor 34a of the pressurizing correction mechanism 32a in the direction in which the support plate 24 is raised, or stops the driving of the motor 34a to correct the weight applied to the pressurizing plate 19 by the driving of the motor 34a. (Processing pressure) is reduced until it becomes the above average value. For example, in the present embodiment, when the reduction values of the weights detected by the respective force measuring devices 36a to 36d are larger than the average value, such as o.iKg or more, the pressure correction means 32a to 32d are corresponding to each other. The driving of the motors 34a to 34d is stopped to suppress an increase in the processing pressure caused thereby. Thereafter, when the weight reduction value is within O.iKg, the stopped motor is driven again, and the two substrates W1 and W2 are pressurized. Thus, the driving of the motors 34a to 34d is individually controlled by the weight detection results from the respective dynamometers 36a to 36d, whereby during the fitting process, when one of the weight distributions is deviated, Accordingly, the inclination of the surface can be corrected while the pressure is applied to the final processing pressure (about 1 〇 OKg). Therefore, it is possible to perform the bonding while maintaining the parallelism of the two substrates wi and W2. Further, in the present embodiment, each of the pressure correcting mechanisms 32a to 32d may be applied while being appropriately corrected (adjusted) based on the weight detection results of the load cells 31, 36a to 36d. Recording the tendency of the weight change in the surface of the pressure plate to correct the processing pressure by preliminarily matching the tendency. 16 1287158 More specifically, the substrate is appropriately subjected to the correction of the processing pressure as described above, while performing a substrate such as ί Then, each of the pressurizing correction mechanisms 32a to 32d calculates the average number of pulses of each of the motors 3 to 34 (1). The pressure correction mechanisms 32a to 32d 5 are held based on the calculation result. When the number of pulses is different, the lowering speeds of the pressure plates controlled by the pressurized gas springs 30 and the motors 34a to 34d are respectively at a constant speed, so that the processing pressure applied to the pressure plate 19 becomes the final machining pressure (in this embodiment). Since the shape is about 1 〇〇Kg), this method can omit the control of adjusting the processing pressure. Therefore, since the bonding work can be performed easily and at a high speed, it is possible to shorten the manufacturing time of the panel. The bonding apparatus 10 is configured to function as the above-described bonding apparatus 10. The bonding apparatus 10 adsorbs and holds the first substrate and the second substrates W1 and W2 carried in the pressure plate 19 and the table 2, respectively, and exhausts the chamber 13 Vacuum is applied to supply a predetermined gas to the chamber 13. This gas is a reaction gas such as an excitation gas for pDp (pl 15 aSma DiSplay Panel) or a replacement gas containing an inert gas such as nitrogen or clean dry air. By using these gases, the impurities or products adhering to the surface of the substrate or the display element are exposed to the reaction gas or the replacement gas for a predetermined period of time. This treatment stabilizes the properties of the bonding surface which cannot be opened after bonding. =1, the second substrates W1 and W2 form a film such as an oxide film on the surfaces or adhere to the floating matter in the I gas, and the state of the surface changes. Since the change in the state varies depending on the substrate, it is impossible to manufacture a stable one. Therefore, it is possible to suppress the formation of a film or the adhesion of impurities or the adhesion of the process, and it is possible to suppress the state change of the surface of the substrate and stabilize the panel quality. The bonding apparatus 10 optically (the CCD camera 5 or the like) aligns the two substrates W2 without contact (at least the second substrate W1 5 does not contact the sealing material on the second substrate W2). Next, the bonding apparatus 10 controls the pressure of the pressurizing gas 3's and the driving of the motors 34a to 34d of the respective pressurizing correcting mechanisms 32a to 32d, and presses the supporting plate 24 at a constant speed such as 5 The plate 19 is lowered until the first substrate W1 contacts the second substrate W2 (specifically, the sealing material applied to the second substrate W2). At this time, the weights detected by the force measuring devices 31, 36a to 36d are used. The sum value becomes about 2000 Kg. § The first substrate W1 contacts the second substrate W2, and when the pressurizing plate 19 starts to generate the processing pressure, the total weight value starts to gradually decrease, and the bonding device pressurizes the total weight value from about 2000 Kg to 1900 K. 15 § So far, that is, the final machining pressure becomes l〇〇Kg. At this time, the bonding apparatus 10 controls the driving of the motors 34a to 34d so that the average value of the weight reduction value detected by the force measuring devices 36a to 36d of the respective pressure correcting mechanisms 32a to 32d with respect to the sum of the weights is 〇. Within 1 Kg, the processing pressure (i.e., the inclination in the plane of the pressure plate 19) is corrected while being pressed. Further, the machining pressure is generated from the pressure plate 19 to a distance (falling distance) at which the movement of the pressure plate 19 is stopped by about 1 〇〇/zm. Incidentally, at the time of bonding, as the processing pressure is gradually increased, the force of moving the pressing plate 19 in the lateral direction (horizontal direction) by the reaction force of the processing pressure acts. However, the reaction force in the horizontal direction is absorbed by the horizontal free joint 28 for integrally connecting the strut 25 of the suspension branch 18 1287158 to the pressure plate 19 and the upper container of the chamber 13. Therefore, it is possible to prevent the positional deviation of the pressure plate 19 from occurring as the machining pressure is increased. After the bonding apparatus 10 pressurizes to the final processing pressure, it is opened in the chamber 13 5 to be at atmospheric pressure. Thereby, the two substrates W1 and W2 are uniformly compressed to a predetermined substrate cell gap (cell gap) due to the atmospheric pressure and the pressure difference between the two substrates W1 and W2. As described above, the present embodiment can exert the following effects. (1) The bonding apparatus 10 includes pressure correcting mechanisms 32a to 32d that detect the weight change of the pressure plate 19 when the two substrates W1 and W2 are bonded together, depending on the weight The processing pressure is adjusted while changing, so that the weight distribution of the pressure plate 19 is uniform, and the pressure is applied. With this configuration, the inclination of the surface of the pressure plate 19 can be corrected by the weight change detected by each of the pressure correcting mechanisms 32a to 32d, and the pressing plate 19 and the table 2, 15, that is, the two substrates WhW2 can be corrected. The parallelism is maintained equal and the fit is precisely performed. Therefore, it is possible to prevent the position of the substrate from being deviated or the substrate spacing from being uneven, and the display defect is reduced. (2) In the present embodiment, whether or not the deviation of the weight distribution is within an allowable range (e.g., whether it is at least 0.1 g or more) is adjusted by the processing pressure. According to this method, the adjustment of the parallelism of the two substrates W1 and W2 at the time of pressurization can be extremely easily performed. (3) The tendency of the weight change of the pressurizing plate 19 is recorded for each of the pressurizing correction mechanisms 32a to 32d in accordance with the execution of the plurality of substrate pressurizing programs to preliminarily cooperate with the tendency to control the pressurizing correction mechanisms 32a to 32d. The motors 19a to 34d are driven by 19 1287158 to adjust the processing pressure, so that the bonding work can be performed at a higher speed. Therefore, the shortening of the panel manufacturing time can be achieved. Moreover, since this method can omit complicated control for adjusting the processing pressure, it is easier to carry out the cooperation. 5 (4) has a horizontal free joint 28 fixed to the support plate 24 and connected to the chamber 13 for suspending the support post 25 of the pressurizing plate B to be integrated with the chamber 13. Thereby, it is possible to prevent the pillar from moving in the horizontal direction due to the reaction force as the machining pressure is increased. That is, it is possible to prevent the horizontal movement (positional deviation) of the pressurizing plate 19 from the table 2 in the horizontal direction. Further, in the case where the horizontally freely connected first boring head 28 is used, under the decompression (vacuum) of the chamber 13, when the chamber 13 is deformed due to the difference pressure from the atmospheric pressure, only the upper and lower directions of the pressure plate 19 are allowed to move. , and it is possible to surely prevent the positional deviation in the horizontal direction. (5) In the present embodiment, since the distribution of the weight of the pressurizing plates 19 is made equal, the parallelism of the two substrates W1 and W2 can be maintained while being fine, and 15 can be pressed, so that it can be applied to the bonding. The weight of the sealing material is equal. This means that it can be applied by appropriate processing pressure. Thereby, it is possible to prevent the unevenness of the weight distribution caused by one of them, thereby preventing an increase in the processing pressure, and preventing the shearing force from being generated between the upper and lower substrates W1 and W2 by the sealing material or the liquid crystal at the time of bonding. And the fitting deviation occurs. (2) In the present embodiment, the inclination of the surface of the pressure plate 19 is corrected by the detection result of the change in weight, so that the parallelism of the two substrates W1 and W2 can be kept equal and the bonding can be easily performed. Therefore, it is possible to suppress an increase in weight and an increase in size of the device due to the influence of the pressure reduction of the chamber 13 and the difference with the outside due to the high rigidity member. 20 1287158 (Second Embodiment) Hereinafter, a second embodiment in which the present invention is embodied will be described based on Fig. 6 and Fig. 7 . In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted. Fig. 6 is a side view showing a schematic structure of a substrate bonding apparatus (hereinafter referred to as a bonding apparatus) 50 of the second embodiment, and Fig. 7 is a cross-sectional view taken along line A-A of the bonding apparatus 50 shown in Fig. 6. In the same manner as in the first embodiment, the bonding apparatus 50 bonds the first and second substrates W1 and W2 to manufacture a liquid crystal 10 display panel. As shown in Fig. 6, the bonding apparatus 50 has a chamber 51, and a pressure plate 5 2 for sucking and holding the first substrate wi is provided in the upper container 51a of the chamber 51. Further, in Fig. 6, the lower container of the chamber 51 and the table for holding and holding the second substrate W2 are omitted. 15 The pressure plate 52 is connected to the ring frame 53, which is supported by the support plate 55 by the support 54. The ring frame 53 is composed of a first cover portion 53a that covers the upper surface of the pressure plate 52 (the outer and outer peripheral surfaces, and the second support portion 53b that is connected to the outer circumference of the pressure plate 52 and the inner circumferential surface of the first support portion 53a). 2. The upper surface of the sill pressure plate 52 and the inner surface of the first support portion 53a covering the yoke are provided with a number of oximeters (four in the present embodiment) of the force measuring devices 56a to 56d, and each drop J force is $56a. ～56d detects the weight at the time of standing in accordance with the pressure received by the first support portion 53a. As shown in Fig. 7, the inner peripheral portion of the first support portion 53a and the second support portion 53b are connected to each other on the outer circumference of the "two" outer peripheral surface. The center of each side (four sides) is connected by joints 57a to 57d 21 1287158. The two sides of the first support portion 53a and the second support portion 53b are connected to each other (in the figure, along the second and second support portions & The angle correction mechanisms 58a and 58b are provided with the motors 59a and 59b and the fifth heads 57a and 57b, and are driven by the motors 59a and 59b to adjust the second. The horizontal direction of the longitudinal direction of the support portion 53b (inclination with respect to the horizontal plane). The second support portion 53b and the side of the pressure plate 52 that are in contact with the outer circumferential surface of the inner circumferential surface The center of the (four sides) is connected by the joints 6〇a to 60d, and the second support portion 53b is connected to the pressurizing plate 52 on either side (in the figure, along the second support portion 10 53b and the pressure plate 52). The two sides of the long direction are provided with angle correcting mechanisms 58e and 58d. The angle correcting mechanisms 58c and 58d have motors 59c and 59d and the joints 60c and 60d, and are driven by the motors 59c and 59d to adjust the short direction of the pressing plate 52. When the pressurizing plate 52 starts to generate the machining pressure, the bonding device 50 configured as described above outputs the weight change detected by the load cells 56a to 56d to a control unit (PLC) not shown. And according to the signal from the control unit, the motors 59a to 59d corresponding to the respective load cells 56a to 56d are driven and controlled. For example, when the weight detected by the force measuring device 56A is greater than 20, the other force measuring devices 56b to 56d At the time (that is, when the average value of the reduction values of the weight sum is larger), the motor 59a of the angle correcting mechanism 58a is driven in the direction in which the pressing plate 52 is lifted. Therefore, similarly to the first embodiment, each of the force measuring devices 5 can be used. The weight detection result of 6a to 56d 'corrects the inclination of the pressure plate 52, and makes the pressure In the present embodiment, the following effects are exhibited in addition to the effects of the first embodiment. (1) In the present embodiment, the pressurizing plate 52 is processed. The mechanism has angle 5 adjusting mechanisms 58a to 58d for adjusting the parallelism of the pressing plate 52. With this configuration, the control and angle correcting mechanisms 58a to 58d which can generate the machining pressure on the pressing plate 52 are provided. The control is separated, so that the control can be simplified. Further, each of the above embodiments may be implemented in the following aspects. In the first embodiment, the weights of the periphery of the first 10th substrate W1 are detected by the four load cells 36a to 36d, but they are not limited to four. In other words, there may be two, three or five depending on the size of the first substrate and the second substrate w2, etc., in the first embodiment, the panel to be formed may be omitted for detecting the pressure plate 19 (1st substrate wi) A force measuring device near the center or a pressurized gas spring 30 as a pressurizing mechanism. The arrangement of the load cells 36a to 36d of the first embodiment is not limited to the position shown in Fig. 2. Each of the load cells 36a to 36d is appropriately changed according to the size of the i-th substrate and the second substrates W1 and W2, and is located at a position equal to the center of the support plate 24 (that is, the center of the first substrate W1). The position of the weight of the periphery of the 1st 20th substrate W1 may be detected. At this time, it is preferable to arrange the weight in the vicinity of the four corners of the first substrate W1 in the vicinity of the pillars 25. Further, the arrangement of the load cells 56a to 56d of the second embodiment is also not limited to the position shown in Fig. 7. As described in detail above, the present invention can provide a substrate bonding apparatus and a substrate bonding method which can accurately and easily bond the substrate 23 1287158. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front view showing a bonding apparatus according to a first embodiment of the present invention. 5 Fig. 2 is a plan view of the bonding apparatus of Fig. 1. Figure 3 is a partial enlarged view of the bonding apparatus of Figure 1. Figure 4 is a plan view showing a horizontal free joint. Fig. 5 is a block diagram showing the control mechanism of the bonding apparatus of Fig. 1. Figure 6 is a side view for explaining a second embodiment of the present invention. 10 Figure 7 is a cross-sectional view taken along line A-A of Figure 6. [Main component representative symbol table of the drawing] 10...substrate bonding apparatus 20...Workbench 11...Backplane 21...Positioning table 12...Support unit 22...Pillar 13···室23.. The bellows 13a.·the upper container 24...the support plate 13b...the lower container 25...the pillar 13c...the 0-ring 26...the nut 14...the chamber opening and closing portion 27...the fixing member 15 ...ball screw 28... horizontal free joint 16... Reducer 28a... insertion hole 17...motor 28b...inner ring 18...gearbox 28c...outer ring 19...pressure plate 29... bellows 24 1287158 30.. plus Pressure gas spring 31.··Dynamometer 32a...Pressure correction mechanism 32b...Pressure correction mechanism 32c...Pressure correction mechanism 32d...Pressure correction mechanism 33...Guide 34a... Motor 34b...motor 34c...motor 34d...motor 35.. ball screw 36a···force caliper 36b···forcer 36c···force estimator 36d··· dynamometer 37.. .1 linear slider 38...guide 39.. 2nd linear slide 41.. control unit 42...electropneumatic regulator 43a···motor driver 43b...motor driver 43c...motor Driver 43d...Motor Driver 50.. Substrate Bonding Device 51···Room 51a···Upper Container 52.. Pressurizing Plate 53.. Ring Frame 53a···First Supporting Port 53b·· .2nd support part 54.. . pillar 55.. support plate 56a··· dynamometer 56b··· dynamometer 56c·.·forcer 56d... dynamometer 57a...joint 57b.. . joint 57c... joint 57d... joint 58a. · angle correcting mechanism 58b... angle correcting mechanism 58c... angle correcting mechanism 58d... angle repair Positive mechanism 59a...motor 59b.. ·motor
25 1287158 60c...接頭 59c...馬達 59d...馬達 60d···接頭 60a…接頭 Wl···第1基板 60b…接頭 W2…第2基板25 1287158 60c...connector 59c...motor 59d...motor 60d···connector 60a...connector Wl···first substrate 60b...connector W2...second substrate
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