玖、發明說明： 【發明所屬之技術領域】 發明領域 本發明係有關於一種基板貼合方法，更詳而言之，係 有關於一種製造液晶顯示裝置(Liquid Crystal Display; LCD) 等之以預定間隔貼合2片基板之基板（面板）時適用之基板貼 合方法。 ittr 習知技術 近年來’於LCD等平面顯示面板逐漸趨向大型化、輕 里化（薄形化）之同時’亦更加需要降低低成本。因此，於貼 合2片基板而製造面板之裝置中，必需使良率提昇以提高生 產性。 如第10圖所示，液晶顯示裝置1係於保持預定間隔且對 向配置之玻璃基板2、3間充填有液晶材料4，且上下玻璃基 板2、3藉密封材5貼合。密封材5包含有用以使上下玻璃基 板2、3之間隔一致之分隔物6，而液晶材料4係藉液晶滴下 法配置於密封材5内側（參照例如日本專利公開公報 2002-229044號）。 以下’針對前述液晶滴下法，參照第11圖作說明。 〔第1步驟〕如第11(a)圖所示，首先，使在上面塗布有 密封材5之内側滴下有液晶材料4之下玻璃基板3，由可朝水 平方向移動之下桌8上之圖未示之吸著機構固定。接著，使 上玻璃基板2藉圖未示之吸著機構固定於上桌9之下面，並 將該上玻璃基板2以預定間隔配置成對向下玻璃基板3。 〔第2步驟〕接著，如第u(b)圖所示，使由上側容器10 與下側容HU構紅β處理$成為真錄驗，使吸著 玻离基板2之上桌9下降至預定位置，並使搭載下玻璃基 板3之下桌8水平㈣，而進行下_基板3與上玻璃基板2 之對位。 〔第3步驟〕，然後，如第u(e)圖所示，使吸著上玻璃基 板之上桌9下P牛’並加壓上玻璃基板2，使上玻璃基板2隔 著讼封材5及液晶材料4貼合下玻璃基板3。 〔第4步驟〕如第11(d)圖所示，使上桌9離開上玻璃基 板2，並藉設置於該上桌9之光源13(或由設置於外部之光源 以光纖導人真空處理室12内之光），使韻材5部分硬化， 而進行暫時固定。 〔第5步驟〕如第n(e)圖所示，將暫時固定之上下玻璃 基板2、3由真空處理室12搬送至硬化裝置15，並藉該硬化 裝置15之光源16對上下玻璃基板2、3整面照射光，使未硬 化之部分硬化。 此外，〔第4步驟〕中，亦可有一製造線，該製造線如 第11(f)圖所示，將貼合之上下玻璃基板2、3由真空處理室 12搬出至暫時固定裝置17，並藉該暫時固定裝置口之光源 18使洽、封材5部分地硬化而暫時固定後’再將暫時固定之上 下玻璃基板2、3朝〔第5步驟〕搬送。 然而，利用於真空處理室12内進行暫時停止之方法（製 造線）中，係於上桌9對應使密封材5硬化之部分而形成有用 以使硬化光導入上玻璃基板2之孔。因此，前述孔之部分無 法加壓上下玻璃基板2、3，而會使暫時固定之部分之上下 玻璃基板2、3之間隔（間隙）之精度降低。 於真空處理室12外進行暫時固定（設置有暫時裝置17) 之方法（製造線）中，使真空處理室12内大氣壓化時或由真空 處理室12搬送至暫時固定裝置17時，會發生錯位(上下玻璃 基板2、3相互錯開）之情況，而使液晶顯示裝置丨之良率降 低0 〔第2步驟〕中，由於真空處理室12内係真空環境，因 此係藉靜電吸著將上玻璃基板2保持於上桌9。因此，於〔第 4步驟〕中係先使上桌9去除靜電後，再使該上桌9上升。 然而，由於用以固持上玻璃基板2之上桌9之面之平面 度精度相當向，因此即使使上桌9去除靜電，上下玻璃基板 2、3仍會如第12(a)圖所示，附著於上桌9並上升，即，下玻 璃基板3會離開下桌8。此時，用以將上下玻璃基板2、3由 真空處理室12搬出之工作線將會停止。且，上下玻璃基板 2、3由上桌9剝離時會發生錯位。又，亦有如第12(b)圖所示， 上玻璃基板2與上桌9-起上升並自下朗基板3剝離之情 況。結果造成暫時固定所需之生產節拍時間增長。 L 明内】 發明概要 本毛月係為了解決月述缺點而形成者，其目的係提供 種基板貼σ方去，4基板貼合方法係可防止貼合基板之 錯位及間隙精度降低。 200410021 為了達成前述目的，第1態樣之發明係使2片已分別由 配置在處理室内且互相對向之第丨及第2固持板固持之基板 對位，並藉黏著劑貼合前述基板，再使該黏著劑硬化者， 又，為了使前述黏著劑硬化，係利用配置於前述處理室内 5且設置在前述固持板之可沿前述基板垂直方向移動之導管 前端，一面按壓一面照射來自該導管前端之光或熱於前述 基板，而使前述黏著劑硬化。因此，藉前述導管保持前述 基板間之間隔並使前述黏著劑硬化，可防止前述基板間之 間隙精度降低。 馨 10 如第2態樣之發明，前述導管連接壓力控制部，該壓力 控制部係可控制該導管前端按壓前述基板之壓力。 如第3態樣之發明，係於前述導管前端持續按壓前述基 板之狀態下使前述處理室内大氣壓化。因此，可防止大氣 壓化時前述基板錯位。又，與於前述黏著劑硬化後才進行 15 大氣壓化之情況相比，生產節拍時間縮短。 如第4態樣之發明’係於别述黏著劑硬化後，於前述導 管前端持續按壓前述基板之狀態下使前述保持板之其中一 ® 者離開前述基板。因此’可防止前述基板附著於離開之前 述固持板。 20 如第5態樣之發明，係藉設置於前述導管之防止不完全 抵接機構，使該導管之前端面密著前述基板。因此，可防 止不完全抵接造成前述基板破損。 圖式簡單說明 第1圖係基板貼合裝置之概略構成圖。 8 200410021 第2圖係施麵置之概略構成圖。 第3圖係況明知壓裝置之控制機構之方塊圖。 第4圖係導光管之外觀模式圖。 第5(a)〜(c)圖係完全密著機構之說明圖。 5 第6圖係壓力控制部之說明®。 第7圖係加壓支持部之說明圖。 第8(a)⑴圖係顯示本發明形態之製造步驟之說明圖。 第9圖係另一加壓支持部之說明圖。 第10圖係液晶顯示裝置之概略構成圖。 1〇 第U(a)〜⑴圖係顯示習知之製造步驟之說明圖。 第12(a)、（b)圖係顯示習知製造步驟之說明圖。 C實施方式]| 較佳實施例之詳細說明 以下，依據第1圖〜第8圖說明本發明具體化之一實施形 15 態。 第1圖係於液晶顯示裝置之製造步驟中，實施晶胞步驟 中之進行液晶注入及貼合之步驟之貼合基板製造裝置之概 略構成圖。 貼合基板製造裝置21，係於供給之2種基板wi、W2之 2〇 間密封液晶而製造液晶顯示面板。此外，以本實施形態之 裝置作成之液晶顯示面板，可舉例有主動矩陣型液晶顯示 面板，其中第1基板W1係於玻璃基板上形成有tft等之陣列 基板(TFT基板），而第2基板W2係於玻璃基板上形成有濾色 器或遮光膜等之濾色基板(CF基板）。該等基板wi、W2係藉 9 200410021 分別之步驟作成而供應。 貼合基板製造裝置21包含有控制裝置22、與其可控制 之密封描繪裝置23、液晶滴下裝置24、貼合裝置25、及檢 查裝置26。貼合裝置25具有施壓裝置27及硬化裝置28，該 5等裝置27、28係由控制裝置22控制。又，貼合基板製造裝 置21具有用以搬送供給之基板wi、W2之搬送裝置 29a〜29d。控制裝置22控制搬送裝置29a〜29d，以搬送W1、 W2及由其製成之貼合基板。 第1及第2基板Wl、W2係供給至密封描繪裝置23。密 10 封描繪裝置23係於第1及第2基板Wl、W2中任一者之(本實 施形態中係第1基板W1:陣列基板)上面，沿周邊於預定位置 上塗布作為黏著劑之密封材成框狀。密封材係使用至少含 有光硬化性黏著劑之黏著劑。然後，基板W1、W2係供給 至搬送裝置29a，搬送裝置29a係將Wl、W2視為1組而一併 15 搬送至液晶滴下裝置24。 液晶滴下裝置24係於搬來之基板Wl、W2中塗布有密 封材之基板W1之上面之多數事先設定好之預定位置滴下 液晶。滴有液晶之基板W1及基板W2藉搬送裝置29b搬送至 施壓裝置27。 20 施壓裝置27具有作為處理室之室，且該室内設置有用 以分別吸著固持基板Wl、W2之固持板之夾具。施壓裝置 27於藉下側夾具與上側夾具分別吸著固持搬入之基板 Wl、W2後’使室内排氣成真空狀態。然後，施壓裝置27 會供給預定之氣體至室内。供給之氣體係用於PDP(Plasma 10说明 Description of the invention: [Technical field to which the invention belongs] Field of the invention The present invention relates to a method for bonding substrates. More specifically, it relates to a method for manufacturing a liquid crystal display (Liquid Crystal Display; LCD) and the like. A substrate bonding method suitable for bonding substrates (panels) of two substrates at intervals. Ittr know-how In recent years, ‘while flat display panels such as LCDs are gradually becoming larger and lighter (thin),’ it is also necessary to reduce costs. Therefore, in a device for manufacturing a panel by bonding two substrates, it is necessary to improve the yield to improve productivity. As shown in FIG. 10, the liquid crystal display device 1 is filled with a liquid crystal material 4 between glass substrates 2 and 3 arranged opposite to each other at a predetermined interval, and the upper and lower glass substrates 2 and 3 are bonded together by a sealing material 5. The sealing material 5 includes a spacer 6 for keeping the distance between the upper and lower glass substrates 2 and 3 uniform, and the liquid crystal material 4 is disposed inside the sealing material 5 by a liquid crystal dropping method (see, for example, Japanese Patent Laid-Open Publication No. 2002-229044). Hereinafter, the liquid crystal dropping method will be described with reference to FIG. 11. [First step] As shown in FIG. 11 (a), first, a glass substrate 3 with a liquid crystal material 4 dripped on the inside coated with the sealing material 5 is moved from the lower table 8 to the horizontal direction. The suction mechanism (not shown) is fixed. Next, the upper glass substrate 2 is fixed below the upper table 9 by a suction mechanism (not shown), and the upper glass substrate 2 is arranged at a predetermined interval to form a pair of downward glass substrates 3. [Second step] Next, as shown in FIG. U (b), the red β treatment from the upper container 10 and the lower container HU constitutes the true recording test, and the suction glass is dropped from the table 9 on the substrate 2 to At a predetermined position, the lower table 8 on which the lower glass substrate 3 is mounted is leveled, and the lower substrate 3 and the upper glass substrate 2 are aligned. [Step 3] Then, as shown in FIG. U (e), the upper glass substrate is sucked on the table 9 times and the upper glass substrate 2 is pressed, so that the upper glass substrate 2 is sandwiched by a sealing material. 5 and the liquid crystal material 4 are bonded to the lower glass substrate 3. [Step 4] As shown in FIG. 11 (d), the upper table 9 is separated from the upper glass substrate 2 and the light source 13 provided at the upper table 9 (or the external light source is used to guide the vacuum treatment by the optical fiber) The light in the chamber 12) partially hardens the rhyme 5 and temporarily fixes it. [Fifth step] As shown in FIG. N (e), the temporarily fixed upper and lower glass substrates 2 and 3 are transferred from the vacuum processing chamber 12 to the curing device 15, and the upper and lower glass substrates 2 are lighted by the light source 16 of the curing device 15. , 3 The whole surface is irradiated with light to harden the unhardened part. In addition, in the [4th step], there may be a manufacturing line. As shown in FIG. 11 (f), the manufacturing line carries the bonded upper and lower glass substrates 2, 3 from the vacuum processing chamber 12 to the temporary fixing device 17, Then, the light source 18 at the mouth of the temporary fixing device is used to partially harden the sealing and sealing material 5 and temporarily fix it. Then, the temporarily fixed upper and lower glass substrates 2 and 3 are transported toward [5th step]. However, in the method (manufacturing line) used for temporarily stopping in the vacuum processing chamber 12, a hole is formed on the upper table 9 corresponding to the portion where the sealing material 5 is hardened so as to introduce the hardened light into the upper glass substrate 2. Therefore, the part of the aforementioned hole cannot press the upper and lower glass substrates 2, 3, and the accuracy of the interval (gap) between the upper and lower glass substrates 2, 3 that are temporarily fixed is lowered. In the method (manufacturing line) for temporarily fixing (the temporary device 17 is provided) outside the vacuum processing chamber 12, when the atmospheric pressure in the vacuum processing chamber 12 is increased or when the vacuum processing chamber 12 is transported to the temporary fixing device 17, a displacement occurs. (The upper and lower glass substrates 2 and 3 are staggered from each other), and the yield of the liquid crystal display device 丨 is reduced to 0. [Second step], the vacuum processing chamber 12 is a vacuum environment, so the upper glass is electrostatically absorbed. The substrate 2 is held on the upper table 9. Therefore, in [Step 4], the upper table 9 is first destaticized, and then the upper table 9 is raised. However, since the flatness accuracy of the surface used to hold the table 9 above the upper glass substrate 2 is quite high, even if the upper table 9 is destaticized, the upper and lower glass substrates 2 and 3 will still be as shown in FIG. Attach to the upper table 9 and rise, that is, the lower glass substrate 3 will leave the lower table 8. At this time, the work line for carrying the upper and lower glass substrates 2, 3 out of the vacuum processing chamber 12 will stop. In addition, when the upper and lower glass substrates 2 and 3 are peeled off from the upper table 9, a misalignment occurs. In addition, as shown in FIG. 12 (b), the upper glass substrate 2 and the upper table 9 are lifted up and separated from the lower substrate 3 in some cases. As a result, the production cycle time required for temporary fixation increases. L Ming Nai] Summary of the Invention The present month was created in order to solve the shortcomings of the monthly description, and its purpose is to provide a variety of substrate bonding methods. The 4 substrate bonding method can prevent misalignment of the bonded substrates and decrease the accuracy of the gap. 200410021 In order to achieve the foregoing object, the first aspect of the invention is to align the two substrates held by the first and second holding plates disposed in the processing chamber and facing each other, and bonding the aforementioned substrates with an adhesive, In order to harden the adhesive, in order to harden the adhesive, the front end of a catheter that is disposed in the processing chamber 5 and is disposed in the holding plate and can be moved in the vertical direction of the substrate is used to irradiate from the catheter while pressing. The light at the front end is heated to the substrate, so that the adhesive is hardened. Therefore, by maintaining the space between the substrates by the duct and hardening the adhesive, it is possible to prevent the accuracy of the gap between the substrates from decreasing. Xin 10 According to the second aspect of the invention, the catheter is connected to a pressure control unit, and the pressure control unit can control the pressure of the front end of the catheter to press the substrate. According to the third aspect of the invention, the atmospheric pressure in the processing chamber is increased while the front end of the catheter is continuously pressed on the substrate. Therefore, the substrate can be prevented from being displaced during atmospheric pressure. In addition, compared with the case where the pressure of 15 atmospheres is not applied until the adhesive is hardened, the production cycle time is shortened. The invention according to the fourth aspect 'is that after the other adhesive is hardened, one of the holding plates ® is separated from the substrate while the front end of the guide tube is continuously pressing the substrate. Therefore, 'the substrate can be prevented from being attached to the holding plate before it is separated. 20 According to the fifth aspect of the invention, the incomplete abutment prevention mechanism provided on the aforementioned duct makes the front end surface of the duct adhere to the aforementioned substrate. Therefore, it is possible to prevent the substrate from being damaged due to incomplete contact. Brief Description of Drawings Figure 1 is a schematic configuration diagram of a substrate bonding apparatus. 8 200410021 Figure 2 is a schematic configuration diagram of the application surface. Figure 3 is a block diagram of the control mechanism of the known pressure device. Fig. 4 is an appearance pattern diagram of the light guide tube. Figures 5 (a) to (c) are explanatory diagrams of the fully-closed mechanism. 5 Figure 6 illustrates the pressure control section ®. Fig. 7 is an explanatory diagram of the pressurizing support portion. Figure 8 (a) (i) is an explanatory diagram showing the manufacturing steps of the aspect of the present invention. Fig. 9 is an explanatory diagram of another pressurizing support portion. Fig. 10 is a schematic configuration diagram of a liquid crystal display device. 10. The U (a) ~ ⑴ diagrams are explanatory diagrams showing conventional manufacturing steps. Figures 12 (a) and (b) are explanatory diagrams showing a conventional manufacturing process. Embodiment C] | Detailed Description of the Preferred Embodiment Hereinafter, an embodiment 15 of the present invention will be described with reference to FIGS. 1 to 8. FIG. 1 is a schematic configuration diagram of a bonded substrate manufacturing device that performs liquid crystal injection and bonding steps in a unit cell step in the manufacturing steps of a liquid crystal display device. The bonded substrate manufacturing apparatus 21 is a liquid crystal display panel manufactured by sealing liquid crystal between two types of supplied substrates wi and W2. In addition, the liquid crystal display panel made by the device of this embodiment may be, for example, an active matrix liquid crystal display panel. The first substrate W1 is an array substrate (TFT substrate) having a tft or the like formed on a glass substrate, and the second substrate W2 is a color filter substrate (CF substrate) in which a color filter, a light-shielding film, and the like are formed on a glass substrate. The substrates wi and W2 are produced by separate steps of 9 200410021. The bonded substrate manufacturing device 21 includes a control device 22, a sealable drawing device 23 controllable therewith, a liquid crystal dropping device 24, a bonding device 25, and an inspection device 26. The bonding device 25 includes a pressure device 27 and a hardening device 28. The fifth-level devices 27 and 28 are controlled by the control device 22. The bonded substrate manufacturing device 21 includes transfer devices 29a to 29d for transferring the supplied substrates wi and W2. The control device 22 controls the conveying devices 29a to 29d to convey W1 and W2 and the bonded substrates made of them. The first and second substrates W1 and W2 are supplied to the sealed drawing device 23. The seal 10 seal drawing device 23 is applied to any one of the first and second substrates W1 and W2 (in this embodiment, the first substrate W1: the array substrate), and applies a seal as an adhesive at a predetermined position along the periphery. The material is framed. The sealing material is an adhesive containing at least a photocurable adhesive. The substrates W1 and W2 are supplied to the transfer device 29a, and the transfer device 29a transfers W1 and W2 as a group and transfers them to the liquid crystal dropping device 24 together. The liquid crystal dropping device 24 drips liquid crystal at a predetermined position set in advance on most of the substrates W1 and W2 on which the sealing material is coated on the substrate W1. The substrate W1 and the substrate W2 on which the liquid crystal is dropped are transferred to the pressure applying device 27 by the transfer device 29b. 20 The pressure applying device 27 has a chamber as a processing chamber, and a clamp for holding the holding plates holding the substrates W1 and W2 is provided in the room. The pressing device 27 sucks and holds the substrates W1 and W2 carried in by the lower clamp and the upper clamp, respectively, and evacuates the room to a vacuum state. Then, the pressure applying device 27 supplies a predetermined gas into the room. Supply gas system for PDP (Plasma 10
Display Panel)之激發氣體等反應氣體、與包含有氮氣、及 潔淨乾燥空氣等惰性氣體之置換氣體。藉該等氣體進行前 處理，即，使黏著於基板或顯示元件之表面之不純物或生 成物接觸反應氣體或置換氣體一段時間。 該處理係用以維持於貼合後不能分開之貼合面之性 質，使其穩定化。第1及第2基板Wl、W2之表面狀態會因 氧化膜等膜之生成或空氣中之浮游物附著於表面而改變。 由於該狀態之改變係依基板而異，因此不能製造穩定之面 板。因此，該等處理可防止膜之生成或不純物附著，且可 藉處理已附著之不純物而防止基板表面之狀態變化，而可 謀求面板品質之穩定化。 接著，施壓裝置27使用對位標誌(對準標誌）光學地使兩 基板Wl、W2非接觸地對位（至少基板W2沒有接觸基板W1 上面之密封材）。接著，施壓裝置27對兩基板wi、W2施加 預定壓力，並持續施壓直至形成後述之預定之基板間隔（至 少密封材密著兩基板W1、W2之間隔）後，使室内對大氣開 放。藉此，兩基板W卜W2會因大氣壓與基板w卜W2間之 壓力差，壓縮至最終之形成預定之晶胞厚度（晶胞間隙）之基 板間隔。 此外，控制裝置22監視兩基板Wl、W2自搬入施壓裝 置27内起經過之時間，並控制第丨及第2基板Wl、W2暴露 於供給至施壓裝置27内之氣體之時間（自搬入至進行貼合 刚之時間）。藉此，可維持於貼合後不能分開之貼合面之性 質，使其穩定化。 200410021 搬送裝置29c由施壓裝置27内取出已貼合之液晶面 板，並將其搬送至硬化裝置28。此時，控制裝置22監視液 晶面板自開始施壓起經過之時間，並於經過預先設定之時 間時驅動搬送裝置29c，將基板供給至硬化裝置28。硬化裝 置28對搬來之液晶面板照射具有預定波長之光，使密封材 硬化。 ίο 即，貼合後之基板於由開始施壓起經過預定時間後， 照射用以使密封材硬化之光。該預定時間係藉由液晶之擴 散速度、與因施壓殘留於基板之應力之解放所需之時間， 事先進行實驗而求出。 藉施壓裝置27，封入基板Wl、W2間之液晶因施壓及 對大氣開放而擴散。於該液晶之擴散結束前，即液晶擴散 至密封材之前，使該密封材硬化。 15 ❿ 且，基板Wl、W2會因施壓之加壓等變形。由搬送裝 置29c搬送時之貼合基板(液晶面板）中，密封材尚未硬化， 因=殘留於基板Wl、W2之應力解放。因此，於密封材硬 化時，由於殘留應力少，所以可防止錯位。 20 壯密封材已硬化之液晶面板由搬送裝置29d搬送至檢查 裝置26。檢查裝置26測定搬來之液晶面板之基板^ =立置偏差(錯位之方向及錯位量），並將該測定值輸出至控 制裝置22。 且，控制裝置22基於檢查裝置％之檢查結果，對施壓 羞置27中之對位施予修正。 曰 即事先使岔封材已硬化之液 曰曰面板中之兩基板W1、w，其錯位方向相反之方向移動 12 200410021 錯位量，以防止接下來製造之液晶面板錯位。 接著，針對施加裝置27作說明。 第2圖係對基板Wl、W2賦予壓力而進行貼合之施壓裝 置27之機構之側視概略圖。 5施歷衣置27具有底板31及固定於該底板之η之門狀之支持 框32。a亥等底板31及支持框32係由具有極高剛性之材質形 成。该支持框32之支柱部内側面之兩側安裝有導執、 33b ’且由其支持線性引導器34a、34b，使其可上下移動。 兩側之線性引導器34a、34b之間’橫撐第1及第2支持板35、 10 36，弟1支持板35係由苐3支持板懸吊，而該第3支持板可藉 安裝於支持框32上部之馬達37上下移動。 詳述時，馬達37之輸出軸連接滾珠螺桿39，使其可一 體旋轉，且該滾珠螺桿39螺合設置於第3支持板38之螺帽 40。因此，藉驅動馬達使滾珠螺桿39正反旋轉時，第3支持 15板38會上下移動。第3支持板38形成為η字型，其上部側之 板設置有螺帽40。第3支持板38之下部側之板上面安裝有多 數(本實施形態中例如4個）負荷感知器41,且該負荷感知器 41上抵接第1支持板35之下面。 施壓裝置27係於支持框32之支柱部内側具有作為處理 〇 至之真工至’且该真空室42分割成上下，且由上側容器 42a與下側容器42b構成。且，該室42内對向設置有作為第i 及第2固持板之加壓板43a及桌43b，前述第1及第2固持板具 有用以吸著固持基板Wl、W2之夹具機構。此外，本實施 形態中，加壓板43a係用以固持第2基板W2(CF基板），而桌 13 43b係用以固持第1基板W1(TFT基板）。 加壓板43a係設置於上侧容器42a内，且由第2支持板36 支持並懸吊。詳而言之，第2支持板36於預定位置形成有多 數(本實施形態中例如4個）貫通上下方向之孔，且該等孔中 5 插穿有支柱44。各支柱44形成為上端直徑較大而不會朝下 脫落，且其下端安裝有加壓板43a。即，加壓板43a由4條支 柱44支持而懸吊於第2支持板36。 第2支持板36與上側容器42a之間設置有伸縮管45，伸 縮管45係可使室42包圍前述各支柱44之處保持密閉之彈性 10 體。且，上側容器42a藉由伸縮管45由第2支持板36支持並 懸吊。 桌43b係設置於下側容器42b内，並由定位台46支持。 詳而言之，定位台46係固定設置於底板31，並由多數已設 置於該台46上之預定位置之支柱47支持桌43b。該定位台46 15具有使桌43b朝水平方向（X方向及Y方向）移動之機構及水 平旋轉(Θ方向）之機構。 定位台46與下側容器42b之間，設置有可使室42包圍前 述各支柱47之處保持密閉之伸縮管48。下側容器42b之下面 文叙有多數直立設置於底板31上之支持構件49。且，下側 20容器42b藉由支持構件49支持於底板31。 用以懸吊且支持前述加壓板43a之各支柱44之上端與 第2支持板36之間設置有校平（平行度）調整部（圖示省略）。 板平调整部例如與形成於支柱44之螺桿螺合之螺帽，利用 將其正反旋轉，使支柱44上升或下降，而可調整加壓板43a 14 200410021 之水平值。例如，加壓板仏與桌杨之平行度，藉校平調 整部調整成50//m以下。 刖述結構之施壓裝置27中，馬達37驅動，第3支持板38 上下移動時，透過負荷感知純、第丨支持板35使線性引導 5器沿導執33a、3扑上下移動，再透過第2支持板36、伸縮管 45使上側容i§42a上下移動。因此，朝線性引導器3如、3仆 下降方向旋轉馬達時，上側容器42a下降，且該上側容器42a 與下側容器42b密封，室42關閉。且，於該狀態下，再朝線 性引導器34a、34b下降方向旋轉馬達時，按壓前述伸縮管 10 45，並透過第2支持板36、支柱44僅使加壓板43a下降。藉 此，施壓裝置27對固持於加壓板43a及桌43b之基板W2、谓 施予加工力而進行貼合。 於貼合時，負荷感知器41(4個）測出作用於該負荷感知 器41之壓力，並將該檢測結果輸出至施壓裝置27之控制裝 15置51。該壓力係支持於第3支持板38之構件（第1支持板35、 線性引導器34a、34b、第2支持板36、支柱44、校平調整部 40、加壓板43a、及基板W2)之重量（本身之重量）a、及與支 柱44之截面積成正比例之作用於加壓板43a之大氣壓力b 之載重之總和（A + B)。 20 施加於該負荷感知器41之壓力之總和，會因藉驅動馬 達37使加壓板43a下降而使兩基板Wl、W2貼合時該等基板 Wl、W2之反力而減少。因此，如前述，根據各負荷感知 為’ 41測出之堡力之總和值之減少’可得知實際施加於基板 之每個時期之載重，即貼合時之基板Wl、W2之加工壓力。 15 200410021 控制裝置51將由負荷感知器41輸出之電氣信號轉換而 求出各負荷感知器41所測出之壓力之值，並算出各個時期 施加於基板Wl、W2之載重（加工壓力）。且，控制裝置51基 於各個時期之加工壓力之值，由附屬之馬達控制器（圖示省 5略)將生成之馬達驅動信號輸出至馬達驅動器52,以使施加 於基板Wl、W2之壓力固定。馬達驅動器52將對應來自該 控制裝置51之馬達驅動信號所生成之預定數之脈衝信號輸 出至馬達37，且馬達37回應該脈衝信號而旋轉驅動。 上側容器42a藉導光管53安裝有加壓支持部54。導光管 1〇 53為了暫時固定基板Wl、W2，對應該暫時固定之位置設 置。導光官53連接光源55，而加壓支持部54連接壓力控制 部56。光源55及壓力控制部56由控制裝置51控制。 如第4圖所示，導光管53於其前端具有防止不完全抵接 機構57，且透過連接部58連接纖維狀體狀體％。該纖維狀 15體59連接可產生用以使基板W1、W2間之密封材硬化之光 之光源55(茶照第2圖）。 光源55可產生用以使基板W1、貿2暫時固定，即，使 基板Wl、W2間之密封材硬化所必f之光，光邸所產生 之光，經由光纖59傳導至導光管53，再由該導光管53照射 20 至基板Wl、W2之間之密封材。 加壓支持部54支料絲，使其可沿上下㈣（導光管 53之前端可接觸且離開基板W1之方向）移動。即，加壓板价 對應使基板W1、W2暫時固定之位置形成有朝上下方向貫 通之插穿孔，且加壓支持部54支持插穿於該插穿孔中之導 16 200410021 光管53，使其可朝上下方向移動。 5 10 加壓支持部54與壓力控制部56係設置來利用導光管53 前端按壓基板W2前端，且控制其按壓力（外加壓力）。 如第7圖所示，加壓支持部54具有固定板61、金屬套筒 62、伸縮官63、及可動板64。固定板61固定於第2圖之上側 容器42a。固定板61形成有貫通孔61a，該貫通孔6u插入有 大致形成為圓筒狀且上端形成有凸緣之金屬套筒62，固定 板61與金屬套筒62之間密封。金屬套筒62插穿有導光管 53，該金屬套筒62支持導光管53，使其可朝上下方向滑動 接觸。金屬套筒62之上面藉固定構件62b固定用以㈣該金 屬套筒62與導光管53之間之密封材62a。Display panel) and other reactive gases such as excitation gas and replacement gas containing nitrogen and inert gas such as clean dry air. Pretreatment with these gases is to make the impurities or products adhered to the surface of the substrate or display element contact the reaction gas or the replacement gas for a period of time. This treatment is used to maintain the properties of the bonding surface that cannot be separated after bonding and stabilize it. The surface states of the first and second substrates W1 and W2 are changed due to the formation of a film such as an oxide film or the adherence of floating matter in the air to the surface. Since the change of this state varies depending on the substrate, a stable panel cannot be manufactured. Therefore, these treatments can prevent the formation of a film or the attachment of impurities, and can prevent the state of the substrate surface from changing by treating the impurities that have been attached, and can stabilize the quality of the panel. Next, the pressing device 27 optically aligns the two substrates W1 and W2 using an alignment mark (alignment mark) (at least the substrate W2 does not contact the sealing material on the substrate W1). Next, the pressure applying device 27 applies a predetermined pressure to the two substrates wi and W2, and continues to apply pressure until a predetermined substrate interval (at least the interval between the two substrates W1 and W2 is tightly sealed by the sealing material) described later, and then the room is opened to the atmosphere. As a result, the two substrates W2 and W2 will be compressed to the final substrate interval that forms a predetermined cell thickness (cell gap) due to the pressure difference between the atmospheric pressure and the substrates W2 and W2. In addition, the control device 22 monitors the time that has elapsed since the two substrates W1 and W2 were carried into the pressure applying device 27 and controls the time when the second and second substrates W1 and W2 are exposed to the gas supplied to the pressure applying device 27 (since being carried To the time just for fitting). Thereby, the properties of the bonding surface that cannot be separated after bonding can be maintained and stabilized. 200410021 The transfer device 29c takes out the bonded liquid crystal panel from the pressure applying device 27 and transfers it to the curing device 28. At this time, the control device 22 monitors the time elapsed since the liquid crystal panel started to apply pressure, and drives the transfer device 29c to supply the substrate to the curing device 28 when a preset time elapses. The hardening device 28 irradiates the liquid crystal panel carried with light having a predetermined wavelength to harden the sealing material. That is, after a predetermined period of time has elapsed from the start of pressure application, the bonded substrates are irradiated with light for hardening the sealing material. The predetermined time is obtained by performing an experiment in advance based on the diffusion speed of the liquid crystal and the time required for the liberation of the stress remaining on the substrate due to pressure. By the pressure applying device 27, the liquid crystal enclosed between the substrates W1 and W2 diffuses due to pressure and opening to the atmosphere. Before the diffusion of the liquid crystal is completed, that is, before the liquid crystal diffuses to the sealing material, the sealing material is hardened. 15 基板 Moreover, the substrates W1 and W2 are deformed by pressure or the like. In the bonded substrate (liquid crystal panel) at the time of transfer by the transfer device 29c, the sealing material has not yet hardened, because the stress remaining on the substrates W1 and W2 is released. Therefore, when the sealing material is hardened, since the residual stress is small, misalignment can be prevented. The liquid crystal panel with the hardened sealing material is transferred from the transfer device 29d to the inspection device 26. The inspection device 26 measures the substrate ^ of the liquid crystal panel that has been carried, and indicates the vertical deviation (the direction and amount of misalignment), and outputs the measured value to the control device 22. In addition, the control device 22 corrects the alignment in the pressure applying position 27 based on the inspection result of the inspection device%. That is, the liquid in which the sealing material has been hardened in advance. The two substrates W1 and W in the panel are shifted in opposite directions. 12 200410021 The amount of misalignment is to prevent misalignment of the liquid crystal panel manufactured next. Next, the application device 27 will be described. Fig. 2 is a schematic side view of the mechanism of the pressure applying device 27 for applying pressure to the substrates W1 and W2 and bonding them together. The 5th calendar clothing set 27 has a bottom plate 31 and a gate-shaped support frame 32 fixed to n of the bottom plate. The bottom plate 31 and the support frame 32 such as ai are made of a material having extremely high rigidity. Guides, 33b 'are mounted on both sides of the inner side of the pillar portion of the support frame 32, and the linear guides 34a, 34b are supported by the guides, so that they can move up and down. Between the linear guides 34a and 34b on both sides, the first and second support plates 35 and 10 36 are horizontally supported. The first support plate 35 is suspended by the 苐 3 support plate, and the third support plate can be installed by The motor 37 on the upper part of the support frame 32 moves up and down. In detail, the output shaft of the motor 37 is connected to a ball screw 39 so that it can rotate as a whole, and the ball screw 39 is screwed to the nut 40 of the third support plate 38. Therefore, when the ball screw 39 is rotated forward and backward by the drive motor, the third support plate 38 moves up and down. The third support plate 38 is formed in an n-shape, and a nut 40 is provided on the upper plate. A plurality of (for example, four in the present embodiment) load sensors 41 are mounted on the plate on the lower side of the third support plate 38, and the load sensors 41 abut on the lower surface of the first support plate 35. The pressure applying device 27 is provided inside the support portion of the support frame 32 with a handle of 0 to 0, and the vacuum chamber 42 is divided into upper and lower portions, and is composed of an upper container 42a and a lower container 42b. The chamber 42 is provided with pressure plates 43a and tables 43b as the i-th and second holding plates facing each other. The first and second holding plates have a jig mechanism for holding and holding the substrates W1 and W2. In this embodiment, the pressure plate 43a is used to hold the second substrate W2 (CF substrate), and the table 13 43b is used to hold the first substrate W1 (TFT substrate). The pressure plate 43a is installed in the upper container 42a, and is supported and suspended by the second support plate 36. In detail, the second support plate 36 has a plurality of holes (for example, four in this embodiment) penetrating in the up-down direction at predetermined positions, and a pillar 44 is inserted in 5 of these holes. Each of the pillars 44 is formed so that the diameter of the upper end is large so as not to fall downward, and a pressure plate 43a is attached to the lower end. That is, the pressure plate 43a is supported by the four support columns 44 and is suspended from the second support plate 36. A telescopic tube 45 is provided between the second support plate 36 and the upper container 42a. The telescopic tube 45 is an elastic body that allows the chamber 42 to surround the respective pillars 44 to be kept closed. The upper container 42a is supported and suspended by the second support plate 36 via the telescopic tube 45. The table 43 b is set in the lower container 42 b and is supported by the positioning table 46. In detail, the positioning table 46 is fixedly disposed on the bottom plate 31, and the table 43b is supported by a plurality of pillars 47 which have been set at predetermined positions on the table 46. The positioning table 461 has a mechanism for moving the table 43b in the horizontal direction (X direction and Y direction) and a mechanism for horizontal rotation (θ direction). A telescopic tube 48 is provided between the positioning table 46 and the lower container 42b so that the chamber 42 surrounds each of the pillars 47 described above and keeps hermetically sealed. Below the lower container 42b are described a plurality of support members 49 which are erected on the bottom plate 31. The lower container 20b is supported on the bottom plate 31 by a support member 49. A leveling (parallelism) adjustment unit (not shown) is provided between the upper end of each of the pillars 44 for supporting and supporting the pressure plate 43a and the second support plate 36. The plate-level adjusting portion is, for example, a nut which is screwed with a screw formed on the pillar 44 and rotates the pillar 44 forward or backward to raise or lower the pillar 44 to adjust the level of the pressure plate 43a 14 200410021. For example, the parallelism of the pressure plate 仏 and the table poplar can be adjusted to less than 50 // m by the leveling and adjusting section. In the pressure applying device 27 of the described structure, the motor 37 is driven, and when the third support plate 38 moves up and down, the load sensing device is pure, and the third support plate 35 causes the linear guide 5 to move up and down along the guides 33a and 3, and then passes The second support plate 36 and the telescopic tube 45 move the upper side volume i§42a up and down. Therefore, when the motor is rotated in the downward direction of the linear guides 3 and 3, the upper container 42a is lowered, the upper container 42a and the lower container 42b are sealed, and the chamber 42 is closed. When the motor is rotated in the downward direction of the linear guides 34a and 34b in this state, the telescopic tube 10 45 is pressed, and only the pressure plate 43a is lowered through the second support plate 36 and the support 44. Accordingly, the pressure applying device 27 applies the processing force to the substrate W2 held on the pressure plate 43a and the table 43b, and attaches them. At the time of bonding, the load sensors 41 (4) measure the pressure acting on the load sensors 41 and output the detection results to the control device 15 of the pressure device 27. This pressure is supported by the members of the third support plate 38 (the first support plate 35, the linear guides 34a, 34b, the second support plate 36, the stay 44, the leveling adjustment portion 40, the pressure plate 43a, and the substrate W2) The sum (A + B) of the weight (the weight itself) a and the atmospheric pressure b acting on the pressure plate 43a in proportion to the cross-sectional area of the pillar 44. 20 The sum of the pressures applied to the load sensor 41 is reduced by the reaction force of the substrates W1 and W2 when the two substrates W1 and W2 are bonded by driving the motor 37 to lower the pressure plate 43a. Therefore, as mentioned above, according to each load perception, the reduction of the sum of the fortress forces measured by '41' can be understood as the actual load applied to the substrate at each stage, that is, the processing pressure of the substrates W1 and W2 at the time of bonding. 15 200410021 The control device 51 converts the electrical signals output by the load sensor 41 to obtain the value of the pressure measured by each load sensor 41, and calculates the load (processing pressure) applied to the substrates W1 and W2 in each period. In addition, the control device 51 outputs the generated motor driving signal to the motor driver 52 based on the value of the processing pressure in each period to the motor driver 52 to fix the pressure applied to the substrates W1 and W2. . The motor driver 52 outputs a predetermined number of pulse signals generated in response to the motor driving signal from the control device 51 to the motor 37, and the motor 37 responds to the pulse signal and rotates and drives. The upper container 42 a is mounted with a pressurizing support portion 54 via a light guide tube 53. In order to temporarily fix the substrates W1 and W2, the light guide tube 105 is set at a position to be temporarily fixed. The light guide officer 53 is connected to the light source 55, and the pressurizing support portion 54 is connected to the pressure control portion 56. The light source 55 and the pressure control unit 56 are controlled by the control device 51. As shown in Fig. 4, the light guide tube 53 has an incomplete abutment prevention mechanism 57 at its front end, and the fibrous body-like body% is connected through the connection portion 58. The fibrous 15 body 59 is connected to a light source 55 (tea picture 2) that generates light for hardening the sealing material between the substrates W1 and W2. The light source 55 may generate light necessary to temporarily fix the substrates W1 and T2, that is, harden the sealing material between the substrates W1 and W2, and the light generated by the light house is transmitted to the light guide tube 53 through the optical fiber 59. The light guide tube 53 is irradiated with a sealing material between the substrates W1 and W2. The pressurizing support portion 54 supports the wire so that it can move along the upper and lower shafts (in a direction where the front end of the light guide tube 53 can contact and leave the substrate W1). That is, the pressing plate price corresponds to the position where the substrates W1 and W2 are temporarily fixed, and an insertion hole penetrating upward and downward is formed, and the pressing support portion 54 supports the guide 16 200410021 light pipe 53 inserted in the insertion hole, so that Can move up and down. 5 10 The pressurizing support portion 54 and the pressure control portion 56 are provided to press the front end of the substrate W2 with the front end of the light guide tube 53 and control the pressing force (applied pressure). As shown in Fig. 7, the pressure support portion 54 includes a fixed plate 61, a metal sleeve 62, a telescopic officer 63, and a movable plate 64. The fixing plate 61 is fixed to the upper container 42a in Fig. 2. The fixing plate 61 is formed with a through hole 61a, and the through hole 6u is inserted into a metal sleeve 62 formed in a substantially cylindrical shape with a flange formed on the upper end thereof, and the fixing plate 61 and the metal sleeve 62 are sealed. The light guide tube 53 is inserted through the metal sleeve 62, and the metal sleeve 62 supports the light guide tube 53 so as to be able to slide in a vertical direction. The upper surface of the metal sleeve 62 is fixed by a fixing member 62b to seal a sealing material 62a between the metal sleeve 62 and the light guide tube 53.
15 20 固定板61透過伸縮管63支持並懸吊可動板料。伸縮管 63形成為 ’㈣包導光管53。可動板64職有貫通孔 ^，且該貫軌㈣龄有導衫53。可動板6績導光管 3 =密封。可動板64係、設置有卡止片65，並藉該卡止片65 疋使‘光管53不能相對於可動板64移動。 固定板61形成有貫穿顧定板61且連通伸縮管幻之内 ，、外部之管路66。固定板61 661 # — 工甸°又置有用以連接管路 弟6圖所不之壓力控制部56之連接哭67。 *如第6圖所示，壓力控制部56具有調節器7ι、72，電動 礼動式調節器73,電磁閥74、75，殘壓 檢測器78。 认排，77,及壓力15 20 The fixed plate 61 supports and suspends the movable plate through a telescopic pipe 63. The telescopic tube 63 is formed as a packaged light guide tube 53. The movable board 64 has a through hole ^, and the guide rail 53 has a guide shirt 53. Movable plate 6 performance light pipe 3 = sealed. The movable plate 64 is provided with a locking piece 65, and the 'light pipe 53 cannot move relative to the movable plate 64 by the locking piece 65'. The fixing plate 61 is formed with a pipe 66 that penetrates the Guding plate 61 and communicates with the inside and outside of the telescopic tube. Fixing plate 61 661 # — Gongdian ° is also used to connect the pipeline. The connection of the pressure control unit 56 shown in Figure 6 is not clear. * As shown in FIG. 6, the pressure control unit 56 includes regulators 7i, 72, electric courtesy regulators 73, solenoid valves 74, 75, and residual pressure detector 78. Recognition, 77, and pressure
弟_"71係供給敎壓力之㈣⑽如，工❹ 向離猜a)以上之氣體調節器7ι連接第^ 17 200410021 器72及電動氣動式調節器73。第1及第2調節器72具有作為 開關閥之機能，與降低供給之氣體之壓力之機能。第丨調節 器71對電動氣動式調節器73及第2調節器72,進行調整至預 定之第1壓力（本實施形態中為〇.5MPa)之供給/停止。第2調 5 節器72則對電磁閥74進行調整至預定之第2壓力（本實施形 態中為OMPa)之氣體之供給/停止。 電動氣動式調節器73係可變壓力控制調節器，回應來 自第2圖之控制裝置51之電氣信號並透過殘壓排氣閥76調 整輸出至第1電磁閥74之氣體之壓力。 # 10 第1電磁閥74回應來自控制裝置51之電氣信號，並切換 管路以將來自第2調節器72或電動氣動式調節器73之氣體 供給至第2電磁閥75。 第2電磁閥75回應來自控制裝置51之電氣信號，並相對 於加壓支持部54切換管路，以與第1電磁閥74或真空調節器 15 77連接。 真空調節器77連接具有低真空（本實施形態中為 -70MPa)之能力之真空泵（圖示省略），而可發揮作為回應來 自控制裝置51之電氣信號而開關之閥之功用。 第2電磁閥75與加壓支持部54之間之配管設置有壓力 20檢測為78。壓力檢測器78檢測第2電磁閥75與壓力檢測器78 之間之配管中之壓力，並輸出已配合該壓力之信號至控制 裝置51。 控制裝置51於液晶顯示裝置之製造步驟中適當控制光 源55及壓力控制部56，藉導光管53之前端（詳細的說就是防 18 200410021 止不完全抵接機構57)—面加壓基板W2，一面由導光管53 照射光使基板Wi、W2間之密封材硬化而暫時固定該基板Brother 71 is connected to the gas pressure regulator 7m above the a) above the pressure of the supply pressure, such as the ^ 17 200410021 controller 72 and electro-pneumatic regulator 73. The first and second regulators 72 have a function as an on-off valve and a function of reducing the pressure of the supplied gas. The first regulator 71 adjusts the supply / stop of the electro-pneumatic regulator 73 and the second regulator 72 to a predetermined first pressure (in this embodiment, 0.5 MPa). The second controller 5 adjusts the supply / stop of the gas of the solenoid valve 74 to a predetermined second pressure (OMPa in the present embodiment). The electropneumatic regulator 73 is a variable pressure control regulator, which responds to the electrical signal from the control device 51 in FIG. 2 and adjusts the pressure of the gas output to the first solenoid valve 74 through the residual pressure exhaust valve 76. # 10 The first solenoid valve 74 responds to the electric signal from the control device 51 and switches the pipeline to supply the gas from the second regulator 72 or the electro-pneumatic regulator 73 to the second solenoid valve 75. The second solenoid valve 75 responds to an electric signal from the control device 51, and switches the line with respect to the pressurizing support portion 54 to be connected to the first solenoid valve 74 or the vacuum regulator 15 77. The vacuum regulator 77 is connected to a vacuum pump (not shown) having a low vacuum capability (-70 MPa in this embodiment), and can function as a valve that is opened and closed in response to an electrical signal from the control device 51. The piping between the second solenoid valve 75 and the pressurizing support portion 54 is provided with a pressure of 20 and a pressure of 78 is detected. The pressure detector 78 detects the pressure in the piping between the second solenoid valve 75 and the pressure detector 78, and outputs a signal corresponding to the pressure to the control device 51. The control device 51 appropriately controls the light source 55 and the pressure control part 56 in the manufacturing steps of the liquid crystal display device, and uses the front end of the light guide tube 53 (in detail, it prevents 18 200410021 from not completely abutting the mechanism 57)-the surface pressure substrate W2 On one side, light is irradiated by the light guide tube 53 to harden the sealing material between the substrates Wi and W2 to temporarily fix the substrate.
Wl、W2。此時，控制裝置51基於來自壓力檢測部78之信 號，切換並控制各調節器71〜73、77及電磁閥74、75。 5 於待機狀態下，加壓支持部54藉第2電磁閥75連接真空 凋即裔77。因xt匕，加壓支持部54之伸縮管63内成為真孔狀 態’因此該伸縮管63收縮且導光f 53前端收容於加麼板仏 内0 為了使導光管53下降，首先，使第2電磁閥乃與第1電 10磁閥74連接，並使加壓支持部5^〇Mpa連接。此係為了連 接電動氣動式調節器73與加壓支持部54之前準備，且可防 止電動氣動式調節器73與真空電路直接連接。這是因為電 動氣動式調節器73並非真空對應，且可用以保護電動氣動 式調節器73。 15 接著’使第1電磁閥74連接電動氣動式調節器73，並藉 電氣信號調整電動氣動式調節器73之輸出壓力。藉該電動 氣動式調節器73之輪出壓力使加壓支持部54之伸縮管63内 加壓，該伸縮管63延伸且導光管53下降，而利用該導光管 53之前端加壓基板W2。欲使導光管53上升時，則進行前述 20下降操作之反操作。 且’控制裝置51於藉導光管53加壓基板W2之狀態下， 使光源55所產生之光透過導光管兄照射基板wi、W2間之 山封材。雄、封材因該光之照射部分地硬化，基板Wi、W2 暫時固定。 19 200410021 如第5(a)圖所示，防止不完全抵接機構57由抵接部81 與按壓部82構成。抵接部81大致形成為覆蓋導光管前端之 有底之筒狀，且其底部形成有用以使光透過之導出孔81a。 抵接部81之内周面沿周緣方向形成有卡止部81b。 5 導光管53之外周面形成有2條沿其周緣方向延伸之 溝，且該溝安裝有〇形之彈性構件之環83、84。抵接部81 安裝於導光管53前端，使卡止部81b配置於較前端側之環83 更後端側。且，抵接部81之内周面藉環83、84與導光管53 之外周面隔開預定間隔，且使導光管53之前端面至抵接部 10 81之底部内面保持隔開預定間隔。 按壓部82形成為大致圓筒狀，且其内徑形成為與導光 管53之外徑大致相同。且，按壓部82藉旋入沿導光管53之 直徑方向形成之螺絲孔82a之卡止螺絲85固定於導光管53。 抵接部81與按壓部82於軸方向上互相對向之面之間挾 15 持有按壓環86。 該按壓環86將藉前述壓力控制部56控制之按壓力傳導 至抵接部81，且於藉該抵接部81按壓基板％2時，防止抵接 部81與導光管53接觸。即，按壓環86將其彈力及截面尺寸 设疋成可傳導壓力及防止接觸。換言之，藉按壓環86之形 2〇狀及性質（彈力），決定按壓部82之形狀（導光管53與按壓部 82之間隙）與按壓部82之安裝位置。 如第5(b)圖所示，導光管53下降時，首先，抵接部81 之前端抵接基板W2之上面。此時，導光管53之軸線於角度 上大多不會與基板W2之垂直線一致。因此，抵接部81沒有 20 200410021 完全抵接基板W2。此外，使導光管53之軸線垂直基板W2， 於機械精度上是困難的，且即使欲藉調整使其一致，亦不 易一致。當於不完全抵接之狀態下持續按壓時，由於其按 壓力集中於接觸之點，因此基板會破損。 5 又，再使導光管53下降時，如第5(c)圖所示，抵接部81 因導光管53之按壓力，壓迫導光管53(抵接部81)之軸線傾斜 之側之環83、84，抵接部81相對於導光管傾斜，且抵接部 81之前端面81c密著基板W2之上面。因此，基板W2由抵接 部81之前端面按壓，基板W2不會破損。 10 接著，針對該施壓裝置27之其他控制機構，一面參照 第3圖一面作說明。且，對與第2圖說明之構成相同之構成 部分附上同一標號並省略一部份之詳細說明。 如前述，控制裝置51將各負荷感知器41之輸出加總而 算出載重值（載重之總和值），並將基於其載重值生成之馬達 15驅動信號輪出至馬達驅動器52。馬達驅動器52將回應其而 生成之脈衝信號輸出至馬達37(圖中，加壓板上下馬達），藉 此馬達37朝使加壓板43a上升或下降之方向旋轉驅動。 又，控制裝置51基於來自影像處理裝置91之輸出信 5虎’將用以驅動定位台馬達92之馬達驅動信號供給I馬達 2〇驅動器93。詳而言之，施壓裝置27具有於基板貼合時攝影 用以使兩基板Wl、W2對位之對準標誌之CCD攝影機94。 該CCD攝影機94於貼合時攝影形成於基板wi、w2之對準 ^魂’並將其影像資料輸出至影像處理裝置91。控制裝置 51將配合該影像處理裝置91之演算結果（錯位量之算出資 21 200410021 料）生成之馬達驅動信號輸出至馬達驅動器93，且馬達驅動 為93將回應其生成之預定之數之脈衝信號輸出至定位台馬 達92。根據該馬達92之旋轉驅動，驅動支持台43b之定位台 46，藉此進行兩基板*1、冒2之對位。 5 依據第8圖說明使用本實施形態之施壓裝置之液晶顯 示I置之製造方法（貼合實施方法）。且，對液晶顯示裝置之 一部份構件，使用與習知（第9圖）相同之標號進行說明。 〔第1步驟〕如第8(a)圖所示，首先，將基板wi、W2 搬入真空室42内，即，使在上面塗布有密封材5之内側滴下 10有液晶材料4之基板W1，搭載於可朝水平方向移動之桌43b 上，且該基板W1係由圖未示之吸著機構吸著固定於桌 43b。使基板W2藉圖未示之吸著機構吸著固定於加壓板43a 之下面，並將兩基板Wl、W2以預定間隔配置成對向。其 中，壓力控制部56於待機狀態下，且導光管53前端收容於 15 加壓板43a。 〔第2步驟〕接著，如第8(b)圖所示，使真空處理室42 内成為真空狀悲後，使吸著基板W2之加壓板43a下降至預 定位置，並使搭載基板W1之桌43b水平移動，而進行基板 W1與基板W2之對位。 20 〔第3步驟〕然後，如第8(c)圖所示，使吸著基板W2 之加壓板43a下降，並加壓上玻璃基板2，使上玻璃基板2隔 者密封材5及液晶材料4貼合基板W1。 〔第4步驟〕如第8(d)圖所示，接著控制壓力控制部56 使導光管53下降，按壓該基板W2上面，使兩基板Wl、W2 22 200410021 間隔著預定間隔，並由導光管53前端照射光，使密封材5硬 化，進行基板Wi、W2之暫時固定。然後，於藉導光管53 按壓基板W2同時使真空室42内由真空回到大氣狀態下。 〔第5步驟〕如第8(e)圖所*，於藉導光管53按壓基板 5 W2之狀態下使加壓板43a上升後，控制壓力控制部56使導 光管53上升。 〔第6步驟〕如第8⑴圖所示，將暫時固定之兩基板 W1、W2由真空室42内搬送至硬化裝置28，並藉該硬化裝 置28對基板W1、W2間之密封材5全體照射光使密封材5硬 # 10 化，結束基板W1與基板W2之貼合。 如前述，依據本實施形態，可發揮以下之效果。 (1) 為了使欲封材5部分地硬化，以配置於真空室42内， 且没置於加壓板43 a之可沿基板W2之垂直方向移動之導光 管53之前端按壓基板W2,且同時照射來自該導光管53前端 15之光使密封材5硬化。其結果為，由於係藉導光管保持基板 Wl、W2間之間隔且使密封材硬化，因此可防止基板wi、 W2之間之間隙精度降低。 · (2) 導光管53連接壓力控制部56，該壓力控制部56係可 控制該導光管53前端按壓基板W2之壓力。因此，可適當地 20 變更按壓基板W2之按壓力。 (3) 於前述導光管53前端持續按壓基板W2之狀態下使 真空室42内大氣壓化。因此可防止大氣壓化時之基板W1、 W2互相錯開。 (4) 由於係在前述導光管53前端持續按壓基板W2之狀 23 200410021 態下使真空室42内大氣壓化，因此與使密封材5硬化後再使 真空室42内大氣壓化之情況相比，更可縮短生產節拍時間。 (5) 係於密封材5部分地硬化後，於前述導光管％前端持 續按壓基板W2之狀態下使加壓板43&上升並離開基板W2。 5因此可防止基板W1、W2附者加壓板43a，且可防止基板W2 由基板W1剝離。 (6) 係藉設置於導光管53之防止不完全抵接機構57，使 抵接部81之前端面81c密著基板W2。因此可防止因不完全 抵接造成基板W2破損。 # 10 (7)支持導光管53之加壓支持部54係安裝於上側容器 42a。因此即使使加壓板43a上升，仍可藉穩定之按壓力由 導光管53按壓基板W2。 此外，本實施形態可變更成以下態樣。 本實施形態係使用含有光硬化性黏著劑之密封材5，然 15 而亦可使用含有熱硬化性黏著劑、光+熱硬化性黏著劑之 密封材。其中，可形成由導光管53對基板Wl、W2間之密 封材照射熱光線之結構。 貼合基板製造裝置21之形態並不限定為第1圖所示之 形態。例如各裝置22〜24、27、28可配合需要設置有多數個。 20 本實施形態中，室42係分割成上下之結構，然而室42 之構造並不止於本實施形態中限定者，亦可使用具有門之 室。 本實施形態中，防止不完全抵接機構57係設置於導光 管53前端，然而亦可設置於導光管53後端（連接部58侧端 24 部）、或前端與後端之間來實施。 —本實施形態中，亦可適當變更加壓支持部54之結構來 、包例如，構成如第9圖所示之加壓支持部1〇1。該加壓 $支持部101除了第7圖所示之加壓支持部54之結構之外，尚 5具有卡止構件1G2與辅助彈簧1G3。卡止構件⑽係不能移動 地固定於導光管53,而辅助彈簣1〇3係界於固定板Μ與卡止 構件102之間。辅助彈簧1〇3係壓縮彈簧，於待機狀態下， 輔助伸縮管63内成為真空狀態且使導光管辦端收容 壓板43a内。 、17 10發明效果 如以上之詳述，依據本發明，可提高基板間之間隙精 度。 【圖式簡單說明】 1 第1圖係基板貼合裝置之概略構成圖。 15 第2®係施壓裝置之概略構成圖。 第3圖係說明施㈣置之控制機構之方塊圖。 第4圖係導光管之外觀模式圖。 第5(a)〜(e)®係完全密著機構之說明圖。 第6圖係壓力控制部之說明圖。 第7圖係加壓支持部之說明圖。 第8(a)〜(f)圖係顯示本發明形態之製造步驟之說明圖。 第9圖係另-加壓支持部之說明圖。 第1〇圖係液晶顯示裝置之概略構成圖。 第ll(a)〜(f)圖係顯示習知之製造步驟之說明圖。 25 200410021 第12(a)、（b)圖係顯示習知製造步驟之說明圖 【圖式之主要元件代表符號表】 1…液晶顯不裝置 32...支持框 2,3...玻璃基板 33a，33b··.導執 4...液晶材料 34a，34b…線性引導器 5,62a...密封材 35…第1支持板 6...分隔物 36...第2支持板 8...下桌 37...馬達 9...上桌 38…第3支持板 10,42a...上側容器 39...滾珠螺桿 ll，42b...下側容器 40...螺帽 12...真空室 41…負荷感知器 13，16，18,55...光源 42...真空管 15,28...硬化裝置 43a，43b...加壓板 17...暫時固定裝置 44,47…支柱 21...貼合基板製造裝置 45,48·.·伸縮管 22...控制裝置 46...定位台 23...密封描繪裝置 49...支持構件 24...液晶滴下裝置 51...控制裝置 25…貼合裝置 52,93…馬達驅動器 26...檢查裝置 53...導光管 27...施壓裝置 54...加壓支持部 29&，2%，29〇,29(1...搬送裝置 56...壓力控制部 31...底板 57...不完全抵接機構 26 200410021 58...連接部 78.··壓力檢測器 59...纖維狀體 81…抵接部 61...固定板 8 la···導出孔 61a，64a···貫通孔 81b...卡止部 62…金屬套筒 81c...前端面 62b...固定構件 82...按壓部 63...伸縮管 82a...螺絲孔 64...可動板 83,84···環 65·.·卡止片 85…卡止螺絲 66…管路 86...按壓環 67...連接器 91...影像處理裝置 71，72··.調節器 92...定位台馬達 73...電動氣動式調節器 94...CCD攝影機 74…第一電磁閥 101…輔助彈簧 75…第二電磁閥 102…卡止構件 76.. .殘壓排氣閥 77.. .真空調節器 W1，W2...基板 27Wl, W2. At this time, the control device 51 switches and controls each of the regulators 71 to 73 and 77 and the solenoid valves 74 and 75 based on a signal from the pressure detection unit 78. 5 In the standby state, the pressurizing support section 54 is connected to the vacuum faucet 77 via the second solenoid valve 75. Due to the xt dagger, the telescopic tube 63 of the pressurizing support portion 54 is in a true hole state. Therefore, the telescopic tube 63 is contracted and the front end of the light guide f 53 is accommodated in the Jia plate. 0 In order to lower the light guide tube 53, first, The second solenoid valve is connected to the first electric solenoid valve 74, and the pressurizing support portion 5 ^ 〇Mpa is connected. This is prepared before connecting the electro-pneumatic regulator 73 and the pressurizing support portion 54, and prevents the electro-pneumatic regulator 73 from being directly connected to the vacuum circuit. This is because the electro-pneumatic regulator 73 is not vacuum-compatible and can be used to protect the electro-pneumatic regulator 73. 15 Next, the first solenoid valve 74 is connected to the electro-pneumatic regulator 73, and the output pressure of the electro-pneumatic regulator 73 is adjusted by an electric signal. By the pressure of the wheel-out of the electro-pneumatic regulator 73, the telescopic tube 63 of the pressurizing support portion 54 is pressurized, the telescopic tube 63 extends and the light guide tube 53 is lowered, and the front end of the light guide tube 53 is pressurized W2. When the light guide tube 53 is to be raised, the reverse operation of the aforementioned lowering operation is performed. In addition, the control device 51 allows the light generated by the light source 55 to pass through the light guide tube and irradiate the mountain sealing material between the substrates wi and W2 in a state where the substrate W2 is pressed by the light guide tube 53. The male and sealing materials are partially hardened by the irradiation of the light, and the substrates Wi and W2 are temporarily fixed. 19 200410021 As shown in Fig. 5 (a), the incomplete abutment prevention mechanism 57 is composed of an abutment portion 81 and a pressing portion 82. The abutting portion 81 is formed substantially in a bottomed cylindrical shape covering the front end of the light guide tube, and a lead-out hole 81a is formed in the bottom portion for transmitting light. The inner peripheral surface of the abutting portion 81 is formed with a locking portion 81b along the peripheral direction. 5 The light guide tube 53 has two grooves extending along its peripheral direction formed on the outer peripheral surface, and the grooves 83 and 84 are provided with O-shaped elastic members. The abutting portion 81 is attached to the front end of the light guide tube 53, and the locking portion 81 b is disposed on the rear end side of the ring 83 on the front end side. In addition, the inner peripheral surface of the abutment portion 81 is spaced a predetermined distance from the outer peripheral surface of the light guide tube 53 by the ring 83, 84, and a predetermined interval is maintained between the front end surface of the light guide tube 53 and the bottom inner surface of the abutment portion 81. . The pressing portion 82 is formed in a substantially cylindrical shape, and its inner diameter is formed to be substantially the same as the outer diameter of the light guide tube 53. In addition, the pressing portion 82 is fixed to the light guide tube 53 by a locking screw 85 which is screwed into a screw hole 82a formed in a diameter direction of the light guide tube 53. Between the surfaces of the abutting portion 81 and the pressing portion 82 facing each other in the axial direction 挟 15 holds a pressing ring 86. The pressing ring 86 conducts the pressing force controlled by the aforementioned pressure control section 56 to the abutting section 81, and prevents the abutting section 81 from contacting the light guide tube 53 when the substrate% 2 is pressed by the abutting section 81. That is, the pressing ring 86 has its elastic force and cross-sectional dimensions set to conduct pressure and prevent contact. In other words, the shape of the pressing ring 86 and its nature (elastic force) determine the shape of the pressing portion 82 (the gap between the light guide tube 53 and the pressing portion 82) and the installation position of the pressing portion 82. As shown in FIG. 5 (b), when the light guide tube 53 is lowered, first, the front end of the contact portion 81 is in contact with the upper surface of the substrate W2. At this time, most of the axis of the light guide tube 53 does not coincide with the vertical line of the substrate W2 in angle. Therefore, the contact portion 81 does not completely contact the substrate W2. In addition, it is difficult to make the axis of the light guide tube 53 perpendicular to the substrate W2 in terms of mechanical accuracy, and it is difficult to make the same even if it is adjusted by adjusting. When the pressing is continued under the incomplete contact state, the substrate is damaged because the pressing force is concentrated on the contact point. 5 When the light guide tube 53 is lowered again, as shown in FIG. 5 (c), the abutment portion 81 is pressed by the pressing force of the light guide tube 53 to press the axis of the light guide tube 53 (abutment portion 81) to tilt. On the side rings 83 and 84, the contact portion 81 is inclined with respect to the light guide tube, and the front end surface 81c of the contact portion 81 is in close contact with the upper surface of the substrate W2. Therefore, the substrate W2 is pressed by the front end face of the abutting portion 81, and the substrate W2 is not damaged. 10 Next, other control mechanisms of the pressure applying device 27 will be described with reference to FIG. 3. In addition, the same components as those illustrated in FIG. 2 are assigned the same reference numerals, and a detailed description of a part is omitted. As described above, the control device 51 calculates the load value (the sum of the load values) by adding up the outputs of the load sensors 41, and outputs the motor 15 drive signal to the motor driver 52 based on the load value. The motor driver 52 outputs a pulse signal generated in response to the motor 37 (in the figure, the pressure plate upper and lower motors), whereby the motor 37 rotates and drives the pressure plate 43a upward or downward. In addition, the control device 51 supplies a motor driving signal for driving the positioning table motor 92 to the I motor 20 driver 93 based on the output signal from the image processing device 91. In detail, the pressure applying device 27 has a CCD camera 94 that images the alignment marks used to align the two substrates W1 and W2 when the substrates are bonded. This CCD camera 94 photographs the alignment formed on the substrates wi and w2 at the time of bonding and outputs its image data to the image processing device 91. The control device 51 outputs a motor driving signal generated in accordance with the calculation result (calculation data of the misalignment amount 21 200410021) of the image processing device 91 to the motor driver 93, and the motor driving 93 will respond to a predetermined number of pulse signals generated by it Output to positioning table motor 92. According to the rotation driving of the motor 92, the positioning table 46 of the support table 43b is driven, whereby the alignment of the two substrates * 1 and 2 is performed. 5 The manufacturing method of the liquid crystal display I using the pressure applying device of this embodiment (lamination method) will be described with reference to FIG. 8. In addition, a part of the components of the liquid crystal display device will be described using the same reference numerals as in the conventional art (FIG. 9). [First Step] As shown in FIG. 8 (a), first, the substrates wi, W2 are carried into the vacuum chamber 42, that is, the substrate W1 having the liquid crystal material 4 is dripped onto the inside of the substrate 5 coated with the sealing material 5, It is mounted on a table 43b that can be moved horizontally, and the substrate W1 is fixed to the table 43b by a suction mechanism (not shown). The substrate W2 is sucked and fixed under the pressure plate 43a by a suction mechanism (not shown), and the two substrates W1 and W2 are arranged to face each other at a predetermined interval. Among them, the pressure control section 56 is in a standby state, and the front end of the light guide tube 53 is housed in the 15 pressure plate 43a. [Second step] Next, as shown in FIG. 8 (b), the inside of the vacuum processing chamber 42 is vacuum-shaped, and then the pressure plate 43a of the suction substrate W2 is lowered to a predetermined position, and the substrate W1 is mounted thereon. The table 43b is moved horizontally, and the substrate W1 and the substrate W2 are aligned. 20 [Step 3] Then, as shown in FIG. 8 (c), the pressure plate 43a of the suction substrate W2 is lowered, and the upper glass substrate 2 is pressed, so that the upper glass substrate 2 is separated from the sealing material 5 and the liquid crystal. The material 4 is bonded to the substrate W1. [Step 4] As shown in FIG. 8 (d), the pressure control unit 56 is then controlled to lower the light guide tube 53 and press the upper surface of the substrate W2 so that the two substrates W1 and W2 22 200410021 are spaced at a predetermined interval and guided by the guide. The front end of the light pipe 53 is irradiated with light to harden the sealing material 5 and temporarily fix the substrates Wi and W2. Then, the substrate W2 is pressed by the light guide tube 53 and the inside of the vacuum chamber 42 is returned from the vacuum to the atmospheric state. [Fifth step] As shown in FIG. 8 (e), after the pressure plate 43a is raised with the light guide tube 53 pressing the substrate 5W2, the pressure control unit 56 is controlled to raise the light guide tube 53. [Step 6] As shown in FIG. 8 (a), the two substrates W1 and W2 temporarily fixed are transferred from the vacuum chamber 42 to the curing device 28, and the entire sealing material 5 between the substrates W1 and W2 is irradiated by the curing device 28 The light hardens the sealing material 5 to 10, and the bonding of the substrate W1 and the substrate W2 is completed. As described above, according to this embodiment, the following effects can be exhibited. (1) In order to partially harden the material 5 to be sealed, it is arranged in the vacuum chamber 42 and is not placed on the pressure plate 43 a, and the front end of the light guide tube 53 that can move in the vertical direction of the substrate W2 presses the substrate W2, At the same time, the light from the front end 15 of the light guide tube 53 is irradiated to harden the sealing material 5. As a result, since the space between the substrates W1 and W2 is held by the light guide tube and the sealing material is hardened, the accuracy of the gap between the substrates wi and W2 can be prevented from decreasing. (2) The light guide tube 53 is connected to a pressure control section 56 which can control the pressure of the front end of the light guide tube 53 against the substrate W2. Therefore, the pressing force for pressing the substrate W2 can be changed as appropriate. (3) The atmospheric pressure in the vacuum chamber 42 is increased while the substrate W2 is continuously pressed by the front end of the light guide tube 53 described above. Therefore, the substrates W1 and W2 can be prevented from being staggered from each other during the atmospheric pressure. (4) The atmospheric pressure in the vacuum chamber 42 is increased under the condition that the front end of the light guide pipe 53 is continuously pressed on the substrate W2. 23 200410021, compared with the case where the sealing material 5 is hardened and then the atmospheric pressure in the vacuum chamber 42 is increased. , Can also shorten the production cycle time. (5) After the sealing material 5 is partially hardened, the pressure plate 43 & is raised and separated from the substrate W2 while the substrate W2 is continuously pressed on the front end of the light guide tube. 5 Therefore, the substrates W1 and W2 can be prevented from being attached to the pressure plate 43a, and the substrate W2 can be prevented from being peeled from the substrate W1. (6) The incomplete abutment prevention mechanism 57 provided on the light guide tube 53 makes the front end surface 81c of the abutment portion 81 adhere to the substrate W2. Therefore, damage to the substrate W2 due to incomplete contact can be prevented. # 10 (7) The pressurizing support portion 54 supporting the light guide tube 53 is attached to the upper container 42a. Therefore, even if the pressure plate 43a is raised, the substrate W2 can be pressed by the light guide tube 53 by a stable pressing force. In addition, this embodiment can be changed to the following aspects. In this embodiment, a sealing material 5 containing a photocurable adhesive is used. However, a sealing material containing a thermosetting adhesive and a light + thermosetting adhesive may also be used. Among them, a structure in which the light guide tube 53 irradiates the sealing material between the substrates W1 and W2 with hot light can be formed. The form of the bonded substrate manufacturing apparatus 21 is not limited to the form shown in Fig. 1. For example, a plurality of devices 22 to 24, 27, and 28 may be provided according to need. 20 In the present embodiment, the chamber 42 is divided into an upper and lower structure. However, the structure of the chamber 42 is not limited to that in this embodiment, and a chamber having a door may be used. In this embodiment, the incomplete abutment prevention mechanism 57 is provided at the front end of the light guide tube 53, however, it may be provided at the rear end of the light guide tube 53 (connecting portion 58 side end 24), or between the front end and the rear end. Implementation. -In this embodiment, the structure of the pressure support portion 54 may be changed as appropriate, for example, the pressure support portion 101 shown in FIG. 9 may be configured. The pressurizing support portion 101 includes a locking member 1G2 and an auxiliary spring 1G3 in addition to the structure of the pressurizing support portion 54 shown in Fig. 7. The locking member ⑽ is immovably fixed to the light guide tube 53, and the auxiliary elastic 篑 103 is bounded between the fixed plate M and the locking member 102. The auxiliary spring 103 is a compression spring. In the standby state, the inside of the auxiliary telescopic tube 63 becomes a vacuum state and the light guide tube end receives the pressure plate 43a. Effects of the Invention As described in detail above, according to the present invention, the accuracy of the gap between substrates can be improved. [Brief description of the drawings] 1 FIG. 1 is a schematic configuration diagram of a substrate bonding apparatus. 15 The schematic diagram of the 2® series pressure device. Fig. 3 is a block diagram illustrating Shi Zhizhi's control mechanism. Fig. 4 is an appearance pattern diagram of the light guide tube. Sections 5 (a) to (e) ® are explanatory diagrams of the fully-closed mechanism. Fig. 6 is an explanatory diagram of a pressure control unit. Fig. 7 is an explanatory diagram of the pressurizing support portion. Figures 8 (a) to (f) are explanatory diagrams showing manufacturing steps according to the aspect of the present invention. Fig. 9 is another explanatory diagram of the pressurizing support portion. Fig. 10 is a schematic configuration diagram of a liquid crystal display device. Figures ll (a) to (f) are explanatory diagrams showing conventional manufacturing steps. 25 200410021 Figures 12 (a) and (b) are explanatory diagrams showing the conventional manufacturing steps [List of main symbols of the main components of the drawings] 1 ... LCD display device 32 ... Support frame 2,3 ... Glass Substrates 33a, 33b ... Guide 4 ... Liquid crystal materials 34a, 34b ... Linear guides 5, 62a ... Sealing material 35 ... First support plate 6 ... Divider 36 ... Second support plate 8 ... lower table 37 ... motor 9 ... upper table 38 ... third support plate 10, 42a ... upper container 39 ... ball screw 11, 42b ... lower container 40 ... Nut 12 ... Vacuum chamber 41 ... Load sensor 13,16,18,55 ... Light source 42 ... Vacuum tube 15,28 ... Hardening device 43a, 43b ... Pressure plate 17 ... Temporary fixing devices 44, 47 ... Pillars 21 ... Laminated substrate manufacturing devices 45, 48 ... Telescopic tubes 22 ... Control devices 46 ... Positioning tables 23 ... Sealing drawing devices 49 ... Support members 24 ... liquid crystal dropping device 51 ... control device 25 ... bonding device 52,93 ... motor driver 26 ... inspection device 53 ... light guide tube 27 ... pressure applying device 54 ... pressurizing Support section 29 &, 2%, 29〇, 29 (1 ... conveying device 56 ... pressure control section 31 ... bottom plate 57 ... incomplete abutment mechanism 26 200410021 58 ... connection part 78 ... pressure detector 59 ... fibrous body 81 ... abutment part 61 ... fixing plate 8la ... lead-out holes 61a, 64a ... through-hole 81b ... .Locking portion 62 ... metal sleeve 81c ... front end surface 62b ... fixing member 82 ... pressing portion 63 ... retractable tube 82a ... screw hole 64 ... movable plate 83, 84 ... · Ring 65 ··· Locking piece 85 ... Locking screw 66 ... Pipe 86 ... Pressing ring 67 ... Connector 91 ... Image processing device 71, 72 ... Regulator 92 ... Positioning Table motor 73 ... Electro-pneumatic regulator 94 ... CCD camera 74 ... First solenoid valve 101 ... Assist spring 75 ... Second solenoid valve 102 ... Locking member 76 .. Residual pressure exhaust valve 77 .. .Vacuum regulator W1, W2 ... substrate 27