KR100850239B1 - Apparatus for joining of substrate - Google Patents

Abstract

A substrate assembling apparatus is provided to prevent damage of a portion fastened with a lower chamber even when the lower chamber moves due to a difference between inner and outer pressures of a chamber when performing vacuum exhaust of air within the chamber. An upper chamber holds an upper substrate. A lower chamber holds a lower substrate to be assembled with the upper substrate, and forms a substrate assembling space capable of assembling the upper substrate with the lower substrate by being coupled with the upper chamber. An align stage(320) supports the lower chamber, and is disposed in a lower part of the lower chamber so as to move the lower chamber for alignment of the substrates. Plural lifting modules(910) are coupled with the align stage through plural fastening units(800,810). A part of the fastening units is fastened as having a clearance of a predetermined size so as to enable the align stage to move. The plural lifting modules lift the align stage so as to lift the lower chamber. Plural stage fixing units(880) restrict movement of the align stage so as to prevent the align stage from being moved when aligning the substrate.

Description

Apparatus for joining of substrate}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate bonding apparatus, and more particularly, to a substrate bonding apparatus for forming a substrate bonding space in a vacuum state and adhering the substrate therein.

Recently, with the development of the information society, the interest in information and communication devices is increasing, and the demand for display devices essential for the information and communication devices is also diversified. Accordingly, various display devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs) are being developed. The user of such a display device is required to increase the size of the display device as well as the size of the display device. Therefore, in recent years, 50-inch or larger ultra-large LCD has been developed and commercialized.

An LCD is a display device that displays information on a screen by using anisotropy of refractive indices of liquid crystals. LCDs are produced by adding and bonding liquid crystals between two substrates. One of the two substrates is a drive element array substrate, and the other is a color filter substrate. Driving element Array A plurality of pixels are formed on the substrate, and a driving element such as a thin film transistor is formed in each pixel. A color filter layer is formed on the color filter substrate, and an alignment layer for orienting the pixel electrode, the common electrode, and the liquid crystal molecule is coated.

In the manufacturing process of such a display device, the process of bonding the two substrates is very important. In particular, as the size of the display device increases, the size of the substrate bonding device that bonds the substrates also increases, and as a result, the viscosity required for the substrate bonding device gradually increases.

On the other hand, the substrate bonding apparatus has an upper chamber and a lower chamber forming a substrate bonding space so as to contact each other and the substrate bonding process proceeds, and the substrate bonding process is a vacuum state between the upper chamber and the lower chamber. Proceeds.

At this time, the upper chamber is fixed, and the lower chamber is lifted by an elevating module for elevating the lower chamber along an axis perpendicular to the surface of the lower chamber, that is, the Z axis, and is selectively contacted with the upper chamber. In other words, the lower chamber is all screwed to the elevating module by its bolts, and the lower chamber is lifted by the driving of the elevating module to contact the upper chamber or spaced apart from the upper chamber. Therefore, the substrates before bonding are held in the upper chamber and the lower chamber, respectively, and then bonded together in the chamber, which is a space in which the vacuum state is maintained by the lower chamber movement as described above.

However, since the substrate bonding process of the substrate bonding apparatus as described above proceeds in a vacuum state, the chamber inside and the chamber in which the process proceeds when vacuuming the air in the chamber, which is a process progress space, in order to proceed with the process of bonding the substrates. There is a pressure difference between the outside. As a result, the pressure difference in the opposite direction of gravity acts on the lower chamber, which is installed to be liftable, among the upper chamber and the lower chamber which are in contact with each other and maintain the vacuum state, which causes the lower chamber to move.

Therefore, the lower chamber and the parts fastened thereto may be damaged or broken due to the movement of the lower chamber. In particular, since the fastening portion between the lower chamber screwed by the bolt and the elevating module is restrained and coupled in a tight fit without any play, it is very easily damaged or broken when the lower chamber moves as described above. do.

In addition, the lower chamber is lifted in the Z-axis direction by four lift modules. In other words, the lower chamber is formed to have four corners, and at each corner, the elevating module is fastened by bolts, and is formed at right angles between each side of the fastened portion, for example, the bottom of each corner of the lower chamber and the bolts. It is. Therefore, the lower chamber is lifted in the Z-axis direction because the four lift modules are driven at the same time.

However, since each corner of the lower chamber is fastened to the elevating module by bolts so as not to flow from the elevating module at all, and is formed at right angles between the bolts and the respective surfaces of the fastened module, If the four-axis synchronous control of the elevating modules is not perfect, or if there is no right angle between each side of the bolted part and the bolt even if perfect synchronous control is performed, the load between the lower chamber and the elevating modules This may cause damage to the lower chamber or the elevating modules or damage of the bolts that fasten them.

Accordingly, the present invention has been made in view of the above problems, and the problem to be solved by the present invention is the lower chamber due to the pressure difference between the chamber and the outside of the chamber when evacuating the air inside the chamber, which is a process progress space. To provide a substrate bonding apparatus that can prevent the portion is fastened to the lower chamber is damaged even when the movement.

In addition, another problem to be solved by the present invention is that when the four-axis synchronous control of the elevating module is not completely achieved in driving the elevating modules or the part connecting the lower chamber and the elevating module, that is, the respective surfaces of the bolt is fastened The alignment stage is interposed between the lower chamber and the elevating module to prevent the load from being generated between the lower chamber and the elevating module even when there is no right angle between the bolt and the bolt. To provide a substrate bonding apparatus that can be flowed.

In addition, another technical problem to be solved by the present invention is to provide a substrate bonding apparatus that can not flow the alignment stage disposed under the lower substrate when the upper substrate and the lower substrate is aligned.

According to a first aspect of the present invention for solving the above problems, the upper chamber for holding the upper substrate; A lower chamber holding a lower substrate to be bonded to the upper substrate and forming a substrate bonding space in which the upper substrate and the lower substrate are combined with the upper chamber; An alignment stage disposed below the lower chamber to support the lower chamber and to move the lower chamber for alignment of the substrates; A plurality of elevating modules fastened to the alignment stage through a plurality of fastening portions, some of the fastening portions being fastened with a predetermined size so that the alignment stage can flow, and elevating the alignment stage so that the lower chamber is elevated; And a plurality of stage holders for constraining the movement of the alignment stage such that the alignment stage does not flow upon alignment of the substrates.

At this time, the stage holders are respectively installed in the elevating modules, it is possible to restrain the movement of the alignment stage by pushing different sides of the alignment stage, respectively. In this case, the stage holder may comprise a pneumatic or hydraulic cylinder.

And, the alignment stage may be formed to have four corners, the elevating modules and the fastening portions may be provided at the corners, respectively, the portion of the fastening portion is fastened with a certain amount of clearance adjacent to each other of the corners. It may be provided in each of two corners or two corners facing each other. In addition, the stage holders may be installed at both sides of the elevating modules, respectively, to constrain the movement of the alignment stage by pushing the sides of the alignment stage adjacent to the corners.

In addition, the fastening portion of the fastening portion having a predetermined size of the fastening portion is formed in any one of the alignment stage and the elevating module, the pin hole is formed in a certain size of the diameter, and the other of the alignment stage and the elevating module, the diameter of the pin hole It can be fastened to each other by pins formed with a diameter size smaller than the size.

On the other hand, according to a second aspect of the present invention for solving the above problems, the upper chamber for holding the upper substrate; A lower chamber holding a lower substrate to be bonded to the upper substrate and forming a substrate bonding space in which the upper substrate and the lower substrate are combined with the upper chamber; An alignment stage disposed below the lower chamber to support the lower chamber and to move the lower chamber for alignment of the substrates; A plurality of lifting modules each having a support arm supporting a lower portion of the alignment stage, and lifting and lowering the alignment stage through the support arm such that the lower chamber is lifted and lowered; Fastening the alignment stage and the support arms to each other, a part of which restrains the alignment stage so that the alignment stage does not flow from the support arm, and the other part includes a plurality of fastening portions loosely fastened to allow the alignment stage to flow at a predetermined interval; And a plurality of stage holders for constraining the movement of the alignment stage such that the alignment stage does not flow upon alignment of the substrates.

At this time, the stage holders are respectively installed in the elevating modules, it is possible to restrain the movement of the alignment stage by pushing different sides of the alignment stage, respectively. In this case, the stage holder may comprise a pneumatic or hydraulic cylinder.

In addition, the alignment stage may be formed to have four corners, the lifting modules and the coupling parts may be provided at the corners, respectively. It may be provided at the corners of the place or two corners facing each other. In addition, the stage holders may be installed at both sides of each lifting module, thereby restraining the movement of the alignment stage by pushing the sides of the alignment stage adjacent to the corners, respectively.

Further, restraining fastening the alignment stage at the fastening portions may include fastening the alignment stage and the support arm to each other with bolts, and loosely fastening the alignment stage at the fastening portions is formed at either of the alignment stage and the support arms. The pin hole is formed to a certain size of the diameter, and the other one of the alignment stage and the support arm may include fastening to each other by a pin formed in a diameter size less than the diameter of the pin hole.

According to the substrate bonding apparatus according to the present invention, the alignment stage for supporting the lower chamber is fastened to the plurality of lifting modules through a plurality of fastening portions, but some of the fastening portions have a certain size of play so that the alignment stage can flow Therefore, when evacuating the air inside the chamber, which is a process progress space, even if the lower chamber moves due to the pressure difference between the chamber and the outside of the chamber, the alignment stage supporting the lower chamber may flow by a predetermined interval, so that the lower chamber The impact due to the movement of the portion is canceled in a certain portion is fastened to the lower chamber has an effect that is not damaged.

In addition, according to the substrate bonding apparatus according to the present invention, since the alignment stage is fastened so as to flow to some of the elevating module by a predetermined interval, when driving the elevating modules, the four-axis synchronous control of the elevating modules is not made completely or Since the alignment stage supporting the lower chamber can be flown by a predetermined interval even when the angle between the lower chamber and the elevating module, that is, the bolt is fastened to each side of the bolt, and the bolt is not at right angles, the elevating modules are driven. As the impact is canceled to some extent there is an effect that the load is not generated between the lower chamber and the elevating module.

In addition, the substrate bonding apparatus according to the present invention includes a plurality of stage holders for restraining the movement of the alignment stage so that the alignment stage does not flow when the upper substrate and the lower substrate are aligned, so that the alignment operation of the substrates can be performed more accurately. It is effective.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided to ensure that the disclosed subject matter is thorough and complete, and that the scope of the invention to those skilled in the art will fully convey. Like numbers refer to like elements throughout.

1 is a cross-sectional view showing an embodiment of a substrate bonding apparatus according to the present invention, Figure 2 is a perspective view showing an enlarged portion A of Figure 1, Figure 3 is an alignment stage and lifting of the substrate bonding apparatus according to the present invention A plan view of one embodiment of a fastener arrangement between modules. And, Figure 4 is a plan view showing another embodiment of the arrangement of the fastening portion between the alignment stage and the elevating module of the substrate bonding apparatus according to the present invention.

1 to 4, the substrate bonding apparatus according to the present invention includes an outer frame 100, an upper chamber 200 fixed to the outer frame 100, and a lower portion of the upper chamber 200 to form an appearance of the device. A lower chamber 300, a vacuum unit 500 for forming a vacuum, and a substrate receiving the substrate, the lower chamber 300 forming a sealed substrate bonding space in which the upper and lower substrates may be bonded to the upper chamber 200. The unit 600, an alignment unit 700 for aligning the bonding points of the substrate, and an elevating module 910 for elevating the lower chamber 300 are provided.

The outer frame 100 is provided with a door 110 for carrying in and out of the substrate. The door 110 is opened only when the substrate is brought in and taken out so that foreign substances such as dust do not enter the substrate bonding apparatus. At this time, the transfer robot (not shown) is in charge of loading and unloading the substrate into the substrate bonding apparatus. The transfer robot includes a robot arm for transporting the upper substrate S1 and a robot arm for transporting the lower substrate S2, and sequentially bring the upper substrate S1 and the lower substrate S2 into the substrate bonding apparatus. The bonded substrate is carried out to the outside of the substrate bonding apparatus.

The upper chamber 200 is fixed to the inner wall of the outer frame 100 via the support 220. The upper chamber 200 is provided with an upper chuck 210 for holding the upper substrate S1. The upper chuck 210 may be an electrostatic chuck (ESC) that holds the upper substrate S1 with an electrostatic force. The upper chuck 210 may form an integrated chamber structure configured to be embedded in the upper chamber 200.

The lower chamber 300 is provided at an upper portion of the alignment stage 320 connected with the elevating module 910 to elevate. The lower chamber 300 is provided with a lower chuck 310 holding the lower substrate S2. Like the upper chuck 210 described above, the lower chuck 310 may be an electrostatic chuck holding the lower substrate S2 with an electrostatic force. In addition, the lower chuck 310 may form an integrated chamber structure configured to be embedded in the lower chamber 300.

The vacuum unit 500 includes a first vacuum pump 510 that provides a vacuum suction force to the upper receiving unit 610 that receives the upper substrate S1, and a second vacuum pump that forms a vacuum in the chamber that is the substrate bonding space. 520. The first vacuum pump 510 is fixed to the outer frame 100 and is connected to the upper receiving part 610 of the upper chamber 200 through the first vacuum pipe 515. The second vacuum pump 520 is provided outside the outer frame 100 and is connected to the substrate bonding space formed by combining the upper chamber 200 and the lower chamber 300 through the second vacuum pipe 525. . In this case, the vacuum pump 500 may be a dry pump, a turbomolecular pump (TMP), a mechanical booster pump, or the like. In addition, the vacuum pump is preferably connected to a rotary vane pump (RVP) that can discharge the vacuum-pumped extract to the outside.

The substrate receiving unit 600 is configured to transfer each substrate to the upper chamber 200 and the lower chamber 300 when the upper substrate S1 and the lower substrate S2 are brought into the chamber by the transfer robot. It serves to receive each substrate, and separates the bonded substrate from the lower chamber 300 so that the transfer robot can receive the bonded substrate when the bonded substrate is taken out of the chamber. The upper receiving part 610 receiving the S1 and the lower receiving part 620 receiving the lower substrate S2 are included. However, the substrate receiving unit 600 may be modified in other forms.

The upper receiver 610 includes a substrate receiver pin 611 and a driver 612. The substrate receiving pin 611 is provided to receive the upper substrate S1 from the transfer robot and seats the upper chamber 200. The substrate receiving pin 611 protrudes to the lower side of the upper chamber 200 by the driving unit 612 and the upper chamber ( Drive up and down to squeeze into the inside of 200). In this case, the substrate receiving pin 611 may be connected to the first vacuum pump 510 that provides the vacuum adsorption force to adsorb the upper substrate S1 by the vacuum adsorption force. The driving unit 612 may be provided with a driving motor (not shown) and a screw (not shown) capable of driving the substrate receiving pin 611.

The lower receiving part 620 is a fixed plate 622 fixed at a specific position irrespective of lifting of the lower chamber 300, a vertical support 621 formed in an upper vertical direction of the fixed plate 622, and a vertical support ( The horizontal support 623 formed in the horizontal direction at the end of the 621 and bellows (624) is installed around the vertical support 621.

At this time, the fixing plate 622 is fixed to the outer frame 100 is provided to maintain a specific position without being affected by the lifting of the lower chamber 300. In addition, the vertical support 621 is fixed by the fixing plate 622, when the lower chamber 300 descends and passes through the through-hole vertically penetrating the lower chamber 300 protrudes to the upper side of the lower chamber 300 When the lower chamber 300 rises, the lower chamber 300 is provided to be inserted into the through hole of the lower chamber 300. The vertical support 621 may be configured in the form of a plurality of pins (pin) having a predetermined thickness.

In addition, the horizontal support 623 is coupled to the end of the vertical support 621 is formed in the horizontal direction. The horizontal support 623 may be configured in the form of a bar connected to the plurality of vertical supports 621. In addition, the horizontal support 623 may be formed in a direction parallel to the longitudinal direction of the robot arm so as not to affect the movement of the robot arm of the transfer robot for transporting the substrate. In addition, a groove may be provided on the upper side of the lower chamber 300 such that the horizontal support 623 is inserted into the lower chamber 300 when the lower chamber 300 is raised.

In addition, the bellows 624 is wrapped around the vertical support 621, one end of the bellows 624 is provided to be connected to the lower end of the lower chamber 300 and the other end is connected to the fixing plate 622. The bellows 624 is a hermetic member having flexibility and sealability, and welded bellows, molded bellows, and the like made of metal may be used. Accordingly, the bellows 624 may seal the space between the through hole and the vertical support 621 even when the lower chamber 300 is elevated.

Alignment unit 700 is a device for aligning the upper substrate (S1) and the lower substrate (S2) to be bonded at the exact bonding point, the camera 710 is installed on the upper chamber 200, the lower chamber 300 The lighting device 720 is installed at the bottom of the, and includes a UVW 730 to adjust the position of the chamber.

The camera 710 photographs an alignment mark displayed on the upper substrate S1 and the lower substrate S2 through the imaging hole 715 penetrating the upper chamber 200 so that the substrate is positioned at the correct bonding point. Check if it is done. In this case, the lighting device 720 provides the illumination light so that the camera 710 can photograph the alignment mark through the illumination hole 725 penetrating the lower chamber 300.

The UVW 730 supports the lower chamber 300 and an alignment stage disposed below the lower chamber 300 to move the lower chamber 300 for the alignment of the upper and lower substrates S1 and S2. It is provided in the upper part of 320, and is comprised in multiple numbers. That is, the upper side of the UVW 730 is in contact with the lower end of the lower chamber 300, and the lower side of the UVW 730 is fixed to the alignment stage 320 supporting the lower chamber 300. At this time, the UVW 730 moves the lower chamber 300 in the X, Y direction and the rotation direction. Preferably, the UVW 730 may be provided at three points of the lower chamber 300 to move the lower chamber 300 in the X, Y and rotation directions.

The elevating module 910 includes a support arm 920 supporting a lower portion of the alignment stage 320, and serves to elevate and align the alignment stage 320 through the support arm 920 such that the lower chamber 300 is elevated. do. The lifting module 910 is configured in plural to be able to lift while maintaining the alignment stage 320 horizontally. As an example, the alignment stage 320 may be formed in a quadrangular shape having four corners, as shown in FIGS. 3 and 4, and the elevating module 910 has an angle of the alignment stage 320. Four can be configured to support each corner. In this case, each elevating module 910 may be disposed at each corner of the alignment stage 320, and each support module 910 supports each corner of the corresponding alignment stage 320 through the support arm 920, respectively. ) Can be elevated.

Meanwhile, a plurality of fastening parts 800 and 810 for fastening the alignment stage 320 and the support arms 920 are provided at each corner, that is, four corners of the alignment stage 320.

At this time, a part 810 of the fastening parts 800 and 810 is restrained and fastened so that the alignment stage 320 does not flow from the support arm 920, and the other part 800 is the alignment stage 320 from the support arm 920. It is loosely fastened so that it can flow finely at regular intervals. In other words, the other portion 800 of the fastening parts 800 and 810 may be fastened with a certain amount of play so that the alignment stage 320 may be minutely flowed from the support arm 920.

In more detail, the restraining fastening of the alignment stage 320 in the fastening parts 800 and 810 includes fastening the alignment stage 320 and the support arm 920 to each other with bolts, as shown in FIG. 1. can do.

In addition, loosely fastening the alignment stage 320 at the fastening parts 800 and 810 may be any one of the alignment stage 320 and the support arms 920, for example, the alignment stage 320, as illustrated in FIG. 2. A pin hole 840 formed in a predetermined size, and the other of the alignment stage 320 and the support arms 920, for example, the support hole 920 is formed in the pin hole 840. It may include fastening to each other by the pin 830 formed in a diameter size less than the diameter size of the. In one embodiment, when the diameter of the pin 830 formed on the support arm 920 is 40 mm, the diameter D of the pin hole 840 formed on the alignment stage 320 may be 40 mm <D <42 mm. Accordingly, the alignment stage 320 may be minutely flowed from the support arm 920 by a difference in diameter between the pin 830 and the pin hole 840.

In addition, the portions 800 for loosely fastening the alignment stage 320 in the fastening portions 800 and 810 are two edges diagonally facing each other among four corners of the alignment stage 320 as shown in FIG. 3. Each of the four edges of the alignment stage 320, as shown in FIG. 4, may be provided in two adjacent corners of each other.

On the other hand, the support arm 920 is provided with a fixing block 850 for preventing the alignment stage 320 supported by the support arm 920 flows in the upper direction, the Z-axis direction of the support arm 920. . The fixed block 850 is installed at a portion where the alignment stage 320 is loosely fastened, and is formed in a '┓' shape or a '┏' shape so as to press a portion of the alignment stage 320. Therefore, the alignment stage 320 loosely fastened so as to flow at a predetermined interval from the support arm 920 does not flow freely in the Z-axis direction, except that the alignment stage 320 is fine in only the X and Y directions, which are the front and rear directions and the left and right directions. It flows freely in size. In this case, the fixing block 850 may be fastened to the upper portion of the support arm 920 by a fastening member 860 such as a bolt.

In addition, in the substrate bonding apparatus according to the present invention, when the substrates, that is, the upper substrate S1 and the lower substrate S2 are aligned with each other by the alignment unit 700 described above, the alignment stage 320 is installed to be finely flowable. A plurality of stage holders 880 are provided to constrain the movement of the alignment stage 320 so that the flow does not flow. These, stage fixtures 880 are respectively installed on the elevating modules 910, and pushes different sides of the alignment stage 320, respectively, to restrain the movement of the alignment stage 320. For example, as shown in FIG. 3 and the like, the alignment stage 320 is formed to have four corners, and the lifting modules 910 fastened thereto are provided at the corners, respectively, and the stage holders 880 are respectively installed on both sides of the elevating modules 910 and each of the side of the alignment stage 320 corresponding to each other, that is, the side of the alignment stage 320 adjacent to the corners by pushing the alignment stage ( The movement of 320 may be restrained. In this case, the stage holders 880 may be implemented as a pneumatic cylinder driven by pneumatic or a hydraulic cylinder driven by hydraulic pressure.

As described above, although omitted in the drawings, a pressing means for pressurizing the substrate may be included in the substrate bonding apparatus. The pressurizing means includes mechanical pressurizing to directly press the substrate and pressurization using gas pressure. When the pressure of the gas is used as the pressurizing means, a gas tank for supplying an inert gas such as nitrogen gas, a gas supply pipe, and a gas pressurizing hole for releasing the gas into the bonding space may be included.

Hereinafter, an operation state and a substrate bonding process of the substrate bonding apparatus having such a configuration will be described in detail with reference to FIGS. 2 and 5A to 5C.

5a to 5c is an operation diagram showing the operating conditions of the substrate bonding apparatus according to the present invention. In detail, FIG. 5A illustrates a state in which the upper substrate S1 and the lower substrate S2 are carried in the substrate bonding apparatus, and FIG. 5B shows the bonding where the upper chamber 200 and the lower chamber 300 are combined and hermetically sealed. 5 illustrates a state in which the lower chamber 300 descends and the bonded substrate is seated on the lower receiving part 620.

2 and 5a to 5c, in order to bring the substrate into the substrate bonding apparatus, the lower chamber 300 is lowered and spaced apart from the upper chamber 200 by a maximum distance, and the door of the outer frame 100 110 is open.

Thereafter, the transfer robot carries the upper substrate S1 into the substrate bonding apparatus in a state where the transfer robot adsorbs the upper substrate S1 to the robot arm. When the upper substrate S1 is loaded, the substrate receiving pins 611 of the upper chamber 200 descend to vacuum suction the upper substrate S1.

Next, the substrate receiving pin 611 which vacuum-adsorbs the upper substrate S1 is raised to seat the upper substrate S1 in the upper chamber 200. In this case, the upper chuck 210 of the upper chamber 200 holds the upper substrate S1 with electrostatic force.

Subsequently, when the upper substrate S1 is adsorbed to the upper chamber 200 and the robot arm of the transfer robot exits to the outside of the substrate bonding device, the robot arm of the transfer robot rests on the lower substrate S2. S2) is carried into the substrate bonding apparatus. The robot arm of the transfer robot has a horizontal support of the lower receiving part 620 where the lower substrate S2 protrudes from the lower chamber 300 when the lower substrate S2 is brought into the substrate bonding apparatus and reaches an appropriate position. Descend to seat 623. When the lower substrate S2 is seated on the horizontal support 623, the robot arm exits to the outside of the substrate bonding apparatus and the door 110 of the outer frame 100 is closed.

Subsequently, the elevating module 910 raises the lower stage 300 supported by the alignment stage 320 by raising the alignment stage 320 by a predetermined height. Therefore, the lower chamber 300 rises to a predetermined height and seats the lower substrate S2 seated on the lower receiving part 620 on the lower chamber 300. In this case, the lower chuck 310 of the lower chamber 300 holds the lower substrate S2 by electrostatic force, and the lower receiving part 620 is inserted into the lower chamber 300 as the lower chamber 300 rises.

Next, when the lower substrate S2 is seated in the lower chamber 300, the lifting module 910 raises the lower chamber 300 again. Accordingly, the lower chamber 300 is raised to be coupled to the upper chamber 200 and forms a substrate bonding space between the upper chamber 200 and the upper chamber 200. At this time, the upper substrate (S1) and the lower substrate (S2) is in close proximity, the second vacuum pump 520 discharges the air in the vacuum bonding space to the outside to maintain the vacuum bonding space in a vacuum state.

Thereafter, the alignment unit 700 aligns the upper substrate S1 and the lower substrate S2 to be bonded at the correct bonding point. That is, the camera 710 of the alignment unit 700 photographs the alignment marks of the upper substrate S1 and the lower substrate S2 to check the alignment state of the substrate. At this time, when the alignment state of the substrate is poor, a plurality of UVW 730 installed on the alignment stage 320 to move the lower chamber 300 so that the upper substrate (S1) and the lower substrate (S2) to be bonded at the correct bonding point. Sort it. Here, the stage holders 880 constrain the movement of the alignment stage 320 in advance so that the alignment stage 320 does not flow when the alignment unit 700 aligns the substrates. Thus, when the UVW 730 proceeds to move the lower chamber 300 to align the substrates, the alignment stage 320 is pre-fixed by these stage holders 880, so that the alignment stage Only the lower chamber 300 above the 320 is moved, and the alignment stage 320 is not moved in any direction. As a result, the substrate alignment operation by the alignment unit 700 is made very accurately.

Subsequently, when the alignment state of the substrate is good, the electrostatic force of the upper chuck 210 that absorbs the upper substrate S1 is removed to allow the upper substrate S1 to fall and bond to the lower substrate S2. At this time, the upper substrate S1 and the lower substrate S2 are in a state of being temporarily bonded by a sealant.

Next, when the upper substrate S1 and the lower substrate S2 are in a state where the upper substrate S1 and the lower substrate S2 are temporarily attached to each other, the upper substrate S1 and the lower substrate S2 are bonded to each other by pressing the substrate by pressing means not shown. At this time, when the substrate is pressurized by the pressure of the gas, the gas is introduced into the substrate bonding space, the upper substrate (S1) and the lower substrate ( S2) is bonded.

Subsequently, when the upper substrate S1 and the lower substrate S2 are bonded together, the lower chamber 300 is lowered by the driving of the elevating module 910, and the lower receiving part 620 fixed to the lower chamber 300 is performed. ) Protrudes from the lower chamber 300 to separate the bonded substrate from the lower chamber 300. At this time, the lower chuck 310 of the lower chamber 300 should be a state in which the electrostatic force is removed.

Thereafter, the door 110 of the outer frame 100 is opened, the robot arm of the transfer robot enters into the chamber, seats the bonded substrate, and takes it out of the chamber, and one substrate bonding process is completed.

On the other hand, since the lower chamber 300 is installed to be elevated by the elevating module 910 in the substrate bonding process as described above, in order to proceed with the substrate bonding process, the air inside the chamber, which is a process progress space, to the outside. When evacuating, a pressure difference occurs between the inside of the chamber and the outside of the chamber, which eventually causes the lower chamber 300 to move. Therefore, when the entire connecting portion of the lower chamber 300 is tightly fastened by a bolt or the like so that the lower chamber 300 cannot flow at all, the lower chamber 300 and the parts fastened thereto are such a lower chamber 300. May be damaged or broken due to the movement of the), in the case of the substrate bonding apparatus according to the present invention, since the alignment stage 320 supporting the lower chamber 300 may flow by a predetermined interval due to its fastening structure, etc. The shock caused by the movement of the lower chamber 300 is partially offset so that the portion fastened to the lower chamber 300 is not damaged.

In addition, according to the substrate bonding apparatus according to the present invention, since the alignment stage 320 is fastened so as to flow to a part of the elevating module 910 by a predetermined interval, the elevating modules (910) in driving the elevating modules 910 ( When the four-axis synchronous control of the 910 is not completely performed or when the right angle between the bolts and the respective parts of the bolt connection portion, that is, the portion connecting the lower chamber 300 and the elevating module 910 is not made In addition, since the alignment stage 320 supporting the lower chamber 300 may flow by a predetermined interval, the impact of driving the elevating modules 910 is partially canceled so that the lower chamber 300 and the elevating module ( No load is generated between the 910.

In addition, in the substrate bonding apparatus according to the present invention, when the upper substrate S1 and the lower substrate S2 are aligned by the alignment unit 700, the movement of the alignment stage 320 is prevented so that the alignment stage 320 does not flow. Since a plurality of stage holders 880 are constrained in advance, the alignment operation of the substrates by the alignment unit 700 is performed more accurately.

As mentioned above, preferred embodiments of the present invention have been described in detail, but those skilled in the art to which the present invention pertains should understand the present invention without departing from the spirit and scope of the present invention as defined in the appended claims. It will be appreciated that various modifications or changes can be made. Accordingly, modifications to future embodiments of the present invention will not depart from the technology of the present invention.

1 is a cross-sectional view showing an embodiment of a substrate bonding apparatus according to the present invention.

FIG. 2 is an enlarged perspective view of portion A of FIG. 1.

Figure 3 is a plan view showing an embodiment of the arrangement of the fastening portion between the alignment stage and the elevating module of the substrate bonding apparatus according to the present invention.

Figure 4 is a plan view showing another embodiment of the arrangement of the fastening portion between the alignment stage and the elevating module of the substrate bonding apparatus according to the present invention.

5a to 5c is an operation diagram showing the operating conditions of the substrate bonding apparatus according to the present invention.

Claims (10)

An upper chamber holding the upper substrate; A lower chamber holding a lower substrate to be bonded to the upper substrate and forming a substrate bonding space in which the upper substrate and the lower substrate are bonded to the upper chamber; An alignment stage disposed below the lower chamber to support the lower chamber and to move the lower chamber for alignment of the substrates; A plurality of lifting modules which are fastened to the alignment stage through a plurality of fastening portions, some of the fastening portions are fastened with a predetermined size so that the alignment stage can flow, and a plurality of lifting modules for elevating the alignment stage to raise and lower the lower chamber. ; And, And a plurality of stage holders for constraining the movement of the alignment stage such that the alignment stage does not flow upon alignment of the substrates. The method of claim 1, Each of the stage holders is installed on the elevating modules, and pushes different sides of the alignment stage to restrain the movement of the alignment stage. The method according to claim 1 or 2, And the stage holder includes a pneumatic or hydraulic cylinder. The method of claim 1, The alignment stage is formed to have four corners, The elevating modules and the fastening parts are provided at the corners, respectively. Part of the fastening portion is fastened with a predetermined size of play is provided in each of the two adjacent corners of the corners or two corners facing each other, Each of the stage holders is installed on both sides of the elevating modules to restrain the movement of the alignment stage by pushing the sides of the alignment stage adjacent to the corners, respectively. The method according to claim 1 or 4, The fastening portion of the fastening portion having a predetermined size of clearance is formed in any one of the alignment stage and the elevating module, the pin hole is formed in a predetermined size of the diameter, and is formed in the other of the alignment stage and the elevating module Substrate bonding apparatus comprising the mutual fastening by the pin formed in a diameter size less than the diameter of the pin hole. An upper chamber holding the upper substrate; A lower chamber holding a lower substrate to be bonded to the upper substrate and forming a substrate bonding space in which the upper substrate and the lower substrate are bonded to the upper chamber; An alignment stage disposed below the lower chamber to support the lower chamber and to move the lower chamber for alignment of the substrates; A plurality of elevating modules each having a support arm supporting a lower portion of the alignment stage, and elevating the alignment stage through the support arm such that the lower chamber is elevated; The alignment stage and the support arms are fastened to each other, a part of which restrains the alignment stage from flowing from the support arm, and the other part loosely fastens so that the alignment stage can be flown at a predetermined interval from the support arm. A plurality of fastenings; And, And a plurality of stage holders for constraining the movement of the alignment stage such that the alignment stage does not flow upon alignment of the substrates. The method of claim 6, Each of the stage holders is installed in the lifting modules, and pushes different sides of the alignment stage to restrain the movement of the alignment stage. The method according to claim 6 or 7, And the stage holder includes a pneumatic or hydraulic cylinder. The method of claim 6, The alignment stage is formed to have four corners, The elevating modules and the fastening parts are provided at the corners, respectively. Loosely fastening the alignment stage in the fastening portion is provided on each of the two adjacent corners of the corners or two corners facing each other, Each of the stage holders is installed on both sides of the elevating modules to restrain the movement of the alignment stage by pushing the sides of the alignment stage adjacent to the corners, respectively. The method according to claim 6 or 9, Constraining and fastening the alignment stage at the fastening portions includes fastening the alignment stage and the support arm to each other with bolts, Loosely fastening the alignment stage in the fastening portion is formed in any one of the alignment stage and the support arms, and is formed in the pin hole formed of a predetermined diameter and the other of the alignment stage and the support arms, Substrate bonding apparatus comprising the mutual fastening by the pin formed in a diameter size less than the diameter of the pin hole.

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