JP7465552B2 - Substrate bonding device and substrate bonding method - Google Patents

Description

The present invention relates to a substrate bonding device and a substrate bonding method.

A substrate bonding device that bonds multiple substrates in a stacked state is known. This substrate bonding device has a plate (also called a pressing member or pressure plate) that presses the substrates when bonding them together, and a pressing mechanism that applies a pressing force to the plate. The pressing mechanism has one load shaft that applies a load to the center of the plate (see, for example, Patent Document 1). In recent years, substrates have become larger and thinner, and as a result, plates have also become larger. When a load is applied to a plate with one load shaft, a certain load is applied in the axial direction of the load shaft, but a shortage of load occurs away from this axial direction. In areas away from the axial direction, poor bonding of the substrates to each other may occur.

To solve this problem, it is necessary to thicken the plate to increase its rigidity, but this not only increases the manufacturing costs of the device, but also leads to increased operating costs due to the need to drive a heavy plate. In addition, a configuration has been proposed in which a pressing force is applied to the plate by multiple load axes (for example, Patent Documents 2, 3, 4, and 5). In this way, by pressing the plate with multiple load axes, the pressing force is distributed widely across the plate, reducing poor attachment of the substrates to each other.

JP 2007-311683 A JP 2002-323694 A JP 2003-241160 A JP 2004-268113 A JP 2008-147249 A

The substrate bonding devices of Patent Documents 2, 3, 4, and 5 apply a pressing force to the plate using multiple load axes, but the multiple load axes apply a pressing force to the plate using a single drive unit. In other words, the multiple load axes are not driven individually, and the pressing forces from the multiple load axes are almost the same, and the driving timing for applying the pressing forces is also almost simultaneous. In a situation where the substrate is larger and thinner as described above, the warping and distortion of the substrate also increases, and there is a problem that simply applying the same pressing force to the plate simultaneously using multiple load axes may result in insufficient pressing force in some parts of the substrates, making it impossible to properly bond the substrates to each other. Furthermore, in order to compensate for the parts where the pressing force is insufficient, it is necessary to maintain the pressed state for a long time to make the substrates compatible, which increases the time required for bonding the substrates and reduces processing efficiency.

The present invention aims to provide a substrate bonding device and a substrate bonding method that can properly bond substrates together in a short time, even when the substrates are large and thin.

A substrate bonding device according to an aspect of the present invention has a first plate and a second plate which sandwich multiple substrates in a stacked state, and a pressing mechanism which presses one of the first plate and the second plate against the other, the pressing mechanism comprising a central load shaft arranged corresponding to a central portion of the multiple substrates, a plurality of peripheral load shafts arranged corresponding to peripheral portions of the multiple substrates excluding the central portions, and a plurality of drive units which individually drive each of the central load shaft and the plurality of peripheral load shafts, the first plate being provided in a fixed state and capable of supporting the multiple substrates thereon, the second plate being capable of being raised and lowered above the first plate, the pressing mechanism lowering the second plate to press it against the first plate, the central load shaft and the plurality of peripheral load shafts being arranged spaced apart from the second plate and abutting against the second plate when the multiple substrates are sandwiched between the first plate and the second plate.
In addition, a substrate bonding device according to an aspect of the present invention has a first plate and a second plate that sandwich multiple substrates in a stacked state, and a pressing mechanism that presses one of the first plate and the second plate against the other, and the pressing mechanism includes a central load shaft arranged corresponding to the central portion of the multiple substrates, a plurality of peripheral load shafts arranged corresponding to the peripheral portions of the multiple substrates excluding the central portions, and a plurality of drive units that individually drive each of the central load shaft and the plurality of peripheral load shafts.

A substrate bonding method according to one aspect of the present invention provides a method for bonding multiple substrates by sandwiching the multiple substrates between a first plate and a second plate in a stacked state, the method including, when pressing either the first plate or the second plate against the other, individually setting a pressure applied by a central load shaft to a portion corresponding to the central portions of the multiple substrates, and a pressure applied by a plurality of peripheral load shafts to a plurality of portions corresponding to the peripheral portions of the multiple substrates excluding the central portions, the first plate being provided in a fixed state and capable of supporting the multiple substrates thereon, the second plate being capable of being raised and lowered above the first plate, the central load shaft and the plurality of peripheral load shafts being positioned at a distance from the second plate and abutting against the second plate when the multiple substrates are sandwiched between the first plate and the second plate.
Furthermore, a substrate bonding method according to an aspect of the present invention provides a method for bonding a plurality of substrates by sandwiching the plurality of substrates between a first plate and a second plate in a stacked state, the method including, when pressing either the first plate or the second plate against the other, individually setting a pressure on a portion corresponding to a central portion of the plurality of substrates, and each pressure on a plurality of portions corresponding to a peripheral portion of the plurality of substrates excluding the central portions, wherein the pressure on the portion corresponding to the central portion has a drive timing for reaching a target load earlier than the drive timing of each pressure on the plurality of portions corresponding to the peripheral portions, and has a drive timing for starting to reduce the load from the target load later than the drive timing of the portions corresponding to the peripheral portions.
In addition, a substrate bonding method according to an aspect of the present invention is a method of bonding multiple substrates by sandwiching the multiple substrates between a first plate and a second plate in a stacked state, and includes, when pressing either the first plate or the second plate against the other, individually setting a pressure on a portion corresponding to the center of the multiple substrates, and each of a plurality of pressures on a plurality of portions corresponding to the peripheral portions of the multiple substrates excluding the center.

According to the substrate bonding device and substrate bonding method of the present invention, the central load shaft and the multiple peripheral load shafts of the pressing mechanism are driven by multiple drive units, respectively, so that different pressing forces can be applied to the first plate or the second plate at different drive timings. As a result, the pressing force and the drive timing to be applied to the substrates to be bonded can be set arbitrarily, and even large and thin substrates can be properly bonded together in a short time.

FIG. 1 is a front view showing an example of a substrate bonding apparatus according to an embodiment. FIG. 2 is a plan view of the substrate bonding apparatus shown in FIG. FIG. 4 is a perspective view of the first plate as viewed from below. 1A and 1B show an example of an alignment operation, in which FIG. 1A shows a state before a substrate is positioned, and FIG. 1B shows a state after the substrate has been positioned. 1A and 1B show an example of the operation of a spacer, in which FIG. 1A shows a state in which the spacer is waiting, and FIG. 1B shows a state in which the spacer supports a substrate. 4 is a flowchart showing an example of a substrate bonding method according to the present embodiment. 6 is a flowchart showing an example of the substrate bonding method according to the present embodiment. 1A and 1B show an example of the operation of the substrate bonding apparatus, in which (A) is a diagram showing a state in which the gate valve of the chamber is opened, and (B) is a diagram showing a state in which the upper substrate is transferred from the arm to the lift pins. 1A and 1B show an example of the operation of the substrate bonding apparatus, in which FIG. 1A shows an alignment operation performed on an upper substrate, and FIG. 1B shows the upper substrate being raised to a predetermined position after the alignment operation. 1A and 1B show an example of the operation of the substrate bonding device, in which (A) shows a state in which an upper substrate is supported by spacers, and (B) shows a state in which a lower substrate is transferred from an arm to lift pins. 1A shows an example of the operation of the substrate bonding apparatus, in which (A) is a diagram showing the process of evacuating the chamber and performing a warp suppression bake process on the lower substrate, and (B) is a diagram showing the process of evacuating the chamber and performing a warp suppression bake process on the lower substrate in a vacuum atmosphere. 1A and 1B show an example of the operation of the substrate bonding apparatus, in which FIG. 1A shows an alignment operation performed on a lower substrate, and FIG. 1B shows the lower substrate being lifted after the alignment operation. 1 shows an example of the operation of the substrate bonding device, where (A) shows the state in which the second plate is lowered and the spring pin is pressing the upper substrate, and (B) shows the state in which the spacer is retracted and the upper substrate and lower substrate are brought into contact. 1 shows an example of the operation of a substrate bonding device, in which (A) shows the second plate being lowered while the lift pins are being lowered, and the lower substrate is placed on the first plate, and (B) shows the upper and lower substrates being sandwiched between the first and second plates. 11 is a graph showing the loads applied to a central load axis and a number of peripheral load axes and their drive timings. FIG. 1A shows an example of the operation of the substrate bonding device, in which (A) shows the second plate being raised and the lift pins being raised, and (B) shows the bonded upper and lower substrates being transferred from the lift pins to the arm. 13A and 13B are diagrams illustrating an example of a second plate according to a modified example. 18 is a diagram showing a state in which the upper substrate is pressed by the second plate shown in FIG. 17. FIG.

The following describes an embodiment of the present invention with reference to the drawings. However, the present invention is not limited to the following description. In addition, in the drawings, some parts are omitted in order to easily explain the embodiment. Furthermore, some parts are enlarged or emphasized, and the scale is appropriately changed, and the size and shape may differ from the actual product. In each of the following figures, the directions in the figures are explained using an XYZ Cartesian coordinate system. In this XYZ Cartesian coordinate system, a plane parallel to the horizontal plane is the XY plane. In this XY plane, the direction parallel to the transport direction of the substrates S1 and S2 is the X direction, and the direction perpendicular to the X direction is the Y direction. In addition, the direction perpendicular to the XY plane is expressed as the Z direction (height direction). The X direction, Y direction, and Z direction are explained assuming that the direction indicated by the arrow in the figure is the + direction, and the direction opposite to the direction indicated by the arrow is the - direction.

<Substrate bonding device>
A substrate bonding apparatus 100 according to an embodiment will be described. FIG. 1 is a diagram showing an example of the substrate bonding apparatus 100 according to an embodiment. FIG. 2 is a plan view of the substrate bonding apparatus 100 shown in FIG. 1. The substrate bonding apparatus 100 bonds a substrate S1 on which an adhesive layer F is formed and a substrate S2 on which an adhesive layer F is formed by bringing the adhesive layers F into contact with each other. The adhesive layer F is not limited to being formed on both the substrate S1 and the substrate S2, and may be formed on either the substrate S1 or the substrate S2. The adhesive layer F is formed by applying the adhesive layer F to the substrate S1 and the substrate S2 by, for example, a coating device or the like and drying the substrate S1 and the substrate S2 before being carried into the substrate bonding apparatus 100. The coating device may be provided in the substrate bonding apparatus 100.

Substrates S1 and S2 are, for example, glass substrates, but may be semiconductor substrates other than glass substrates, resin substrates, etc. In this embodiment, of the two substrates to be bonded, the upper substrate (first substrate) is called substrate S1, and the lower substrate (second substrate) is called substrate S2. The form in which substrates S1 and S2 are bonded is called substrate S (see FIG. 18). Substrates S1 and S2 are both rectangular (square, rectangular) substrates in plan view (as viewed from the Z direction), but are not limited to rectangular substrates and may be substrates that are circular, elliptical, oval, etc. in plan view.

As shown in Figures 1 and 2, the substrate bonding device 100 includes a chamber 10, a first plate 20, a second plate 30, a lift unit 40, a pressing mechanism 50, an alignment mechanism 60, a spacer mechanism 70, a block 80, and a control unit C. Note that in Figure 2, the top side of the chamber 10 is omitted to make the inside of the chamber 10 easier to understand. The control unit C controls the overall operation of each unit in the substrate bonding device 100.

The chamber 10 houses therein a first plate 20, a second plate 30, a lift section 40, a part of the pressing mechanism 50, an alignment mechanism 60, and a spacer mechanism 70. The chamber 10 is formed in a box shape, and has an opening 11 in part of the side wall. The opening 11 is formed on the -X side surface of the chamber 10, and connects the inside and outside of the chamber 10. The opening 11 is formed to a size that allows the substrates S1 and S2 held by the transport device 90 (see FIG. 8(B)), as well as the substrate S with both attached thereto, to pass through.

The substrates S1 and S2 are respectively carried into the chamber 10 through the opening 11 by the arm 91 (see FIG. 8B) of the transport device 90. The substrate S is carried out of the chamber 10 through the opening 11. In this embodiment, the transport device 90 has two flat-shaped arms 91. When the substrate S1 is carried into the chamber 10, the transport device 90 holds the substrate S1 by suction from the upper side of the substrate S1, and when the substrate S2 is carried in and when the substrate S is carried out of the chamber 10, the transport device 90 holds the substrates S2 and S by suction from the lower sides of the substrates S2 and S. When the substrates S2 and S are transported, the arm 91 may be in a form in which the substrates S2 and S are placed on the upper surface side of the arm 91 and held without suction. The number of arms 91 is not limited to two, and may be three or more. When the substrate S1 is carried into the chamber 10, the substrate S1 is transported with the adhesive layer F facing downward (-Z direction). Furthermore, when the substrate S2 is loaded into the chamber 10, the substrate S2 is loaded with the adhesive layer F facing upward (in the +Z direction).

The chamber 10 is equipped with a gate valve 12 that opens and closes the opening 11. The gate valve 12 is disposed on the outside of the -X side of the chamber 10, and can slide, for example, in the vertical direction (Z direction) by a drive unit (not shown). The gate valve 12 opens and closes the opening 11 by sliding, and can seal the inside of the chamber 10 by closing the opening 11. In addition, the upper surface of the chamber 10 is provided with a number of through-holes 10a through which a number of load shafts 51 (described later) pass. The load shafts 51 are inserted into each of the through-holes 10a in a state in which they can be raised and lowered, and a seal member (not shown) maintains the inside of the chamber 10 in a sealed state.

The inside of the chamber 10 is connected to a suction device (not shown). The inside of the chamber 10 can be made into a vacuum atmosphere by suctioning (exhausting) the inside of the chamber 10 with this suction device. The chamber 10 may be equipped with a valve that can be opened to the outside in order to release the internal vacuum atmosphere. The inside of the chamber 10 may also be connected to a gas supply device (not shown). The inside of the chamber 10 can be made into a predetermined gas atmosphere by supplying a predetermined gas from this gas supply device into the chamber 10. As the predetermined gas, for example, a gas that is inert to the thin film formed on the substrates S1 and S2, such as nitrogen gas, or dry air is used. Note that the substrate bonding device 100 may or may not include the chamber 10, and may be of a type that does not include the chamber 10 (open to the atmosphere).

The first plate 20 supports the substrates S1 and S2 from below when they are brought into the chamber 10. The first plate 20 is rectangular (square or rectangular) in plan view, but is not limited to this shape and may be, for example, circular, elliptical, or oval. The first plate 20 is set to have dimensions larger than the substrates S1 and S2 in the X and Y directions.

The first plate 20 has a support plate 21, a heater (heating unit) 22, and a base plate 23. The support plate 21, heater 22, and base plate 23 are stacked in this order from the bottom (-Z side). The first plate 20 is supported by a plurality of legs 24 provided on the bottom side of the support plate 21, and is fixed to the bottom of the chamber 10 via the legs 24. The support plate 21 and the heater 22, and the heater 22 and the base plate 23 are fixed by fastening members such as bolts. The support plate 21, the heater 22, and the base plate 23 have a plurality of through holes 20a in the vertical direction through which the lift pins 41 of the lift unit 40 described later pass.

The support plate 21 is a plate-like body made of, for example, a material such as metal, resin, or ceramic. The heater 22 is an example of a heating unit, and is, for example, a hot plate having a heating mechanism (heat source) such as an electric heating wire inside. The heater 22 heats the substrates S1 and S2 via the base plate 23. The heater 22 may be a laminated structure in which a sheet-like heat source is sandwiched between the substrates. The substrates S1, S2, and the substrate S are placed on the placement surface 23a on the +Z side, which is the upper surface of the base plate 23. The base plate 23 is a plate-like body made of, for example, ceramic, but may be made of metal, resin, or the like. The placement surface 23a of the base plate 23 is the contact surface with the substrate S2. Therefore, it is preferable that the placement surface 23a has a high flatness and a small surface roughness (or is a mirror surface).

Figure 3 is an oblique view of the first plate 20 as viewed from below. As shown in Figure 3, a plurality of legs 24 are provided on the underside of the support plate 21. The plurality of legs 24 are formed of leg 24A arranged in the center of the underside of the support plate 21, leg 24B arranged at each of the four corners of the support plate 21, and eight legs 24C arranged to surround leg 24A. Leg 24B has a lower rigidity than legs 24A and 24C. The pressing force when attaching substrates S1 and S2 is received mainly by legs 24A and 24C.

In this way, by supporting the first plate 20 with multiple legs 24, deformation of the first plate 20 is prevented even when a large pressing force is applied. The number and arrangement of the legs 24 are not limited to the above-mentioned form, and can be set arbitrarily depending on the size of the first plate 20, the amount of pressing force used, etc. For example, the legs 24 may be arranged at each of the four corners of the underside of the support plate 21, and one in the center.

As shown in FIG. 1 and FIG. 2, the second plate 30 presses the substrate S1 toward the substrate S2 side (the first plate 20 side) when the substrates S1 and S2 are attached to each other. The second plate 30 is rectangular (square or rectangular) in plan view, like the first plate 20, but is not limited to this shape and may be, for example, circular, elliptical, or oval. The second plate 30 is set to have dimensions larger than the substrates S1 and S2 in the X and Y directions. The dimensions of the second plate 30 in the X and Y directions are the same as those of the first plate 20, but are not limited to this shape. For example, the dimensions of the second plate 30 in the X and Y directions may be larger or smaller than those of the first plate 20.

The second plate 30 has a load plate 31, a heater (heating unit) 32, and a press plate 33. The load plate 31, heater 32, and press plate 33 are stacked in this order from the top. The second plate 30 is held at the lower end of a load shaft 51 of a pressing mechanism 50 (described later), and rises and falls as the load shaft 51 rises and falls. The load plate 31 and heater 32, and the heater 32 and press plate 33 are fixed by fastening members such as bolts.

The load plate 31 is preferably formed with a predetermined strength since it receives a pressing force from the load shaft 51 of the pressing mechanism 50. The load plate 31 is formed of, for example, metal, resin, ceramics, etc. The heater 32 is, for example, a hot plate having a heating mechanism (heat source) such as an electric heating wire inside, similar to the heater 22 of the first plate 20. The heater 32 heats the substrate S1 through the press plate 33. Note that, like the heater 22, the heater 32 may be a laminated structure in which a sheet-shaped heat source is sandwiched between the heaters. Note that, in this embodiment, both the first plate 20 and the second plate 30 are provided with the heaters 22, 32, respectively, but this is not limited to this form. For example, the heater 22 (32) may be provided on either the first plate 20 or the second plate 30. In addition, a heating unit that heats the inside of the chamber 10 may be provided separately from the heaters 22, 32.

The press plate 33 has a pressing surface 33a on the underside on the -Z side for pressing the substrate S1 towards the substrate S2. The press plate 33 is, for example, a plate-shaped body made of ceramics, but may also be made of metal, resin, etc. The pressing surface 33a of the press plate 33 becomes the contact surface with the substrate S1. Therefore, it is preferable that the pressing surface 33a has a high degree of flatness and a small surface roughness (or is a mirror surface).

The press plate 33 is provided with multiple spring pins 34 on the pressing surface 33a side. Each of the multiple spring pins 34 is provided in a state where it protrudes downward from the pressing surface 33a by a spring (not shown) or the like, and moves upward when subjected to an upward force, and retracts from the pressing surface 33a. Each spring pin 34 abuts against the upper surface of the substrate S1, applying a downward force to the substrate S1. It is optional whether or not the press plate 33 (second plate 30) is provided with spring pins 34. For example, the press plate 33 (second plate 30) may not have spring pins 34.

The lift unit 40 is provided below the first plate 20. The lift unit 40 supports the substrates S1, S2, S above the first plate 20 and raises and lowers the substrates S1, S2, S. The lift unit 40 has a number of lift pins 41, a moving unit 42 connected to the lower ends of the lift pins 41 and raised and lowered in the Z direction, and a lift pin drive unit 43 that raises and lowers the moving unit 42.

The lift pins 41 are arranged by penetrating each of the multiple through holes 20a provided in the first plate 20. Although two lift pins 41 are shown in FIG. 1, at least three lift pins 41 are arranged at a predetermined interval to support the substrates S1, S2, and S. The heights of the upper ends of the multiple lift pins 41 are the same or almost the same. The lift pins 41 may be formed of, for example, a non-conductive material (for example, resin, metal, ceramics, etc.). The moving unit 42 rises and falls by driving the lift pin driving unit 43, and raises and lowers the multiple lift pins 41 simultaneously as the moving unit 42 rises and falls. The lift pin driving unit 43 is, for example, an electric rotary motor, a linear motor, an air cylinder device, a hydraulic cylinder device, etc., and the driving force is transmitted to the moving unit 42 by a transmission mechanism not shown.

The pressing mechanism 50 lowers the second plate 30 and presses the substrate S1 toward the substrate S2 side (the first plate 20 side) when bonding the substrates S1 and S2 together. The pressing mechanism 50 includes a plurality of load shafts 51 and a plurality of drive units 52 that drive the plurality of load shafts 51 individually.

The multiple load shafts 51 include a first load shaft 51A, which is a central load shaft, and a second load shaft 51B, a third load shaft 51C, a fourth load shaft 51D, and a fifth load shaft 51E, which are multiple peripheral load shafts. The first load shaft 51A is arranged in the center of the load plate 31 in a plan view, and applies a load (pressure) to the center of the load plate 31. The second load shaft 51B, the third load shaft 51C, the fourth load shaft 51D, and the fifth load shaft 51E are arranged at the four corners of the load plate 31, respectively, and apply loads to the corners of the load plate 31, respectively. Each load shaft 51 is inserted into the chamber 10 through the through portion 10a. The first load shaft 51A is arranged corresponding to the center of the substrate S1 to be attached. The second load shaft 51B, the third load shaft 51C, the fourth load shaft 51D, and the fifth load shaft 51E are arranged to correspond to the four corners of the substrate S1 to be attached. The lower ends of the load shafts 51 are aligned at the same height, so that the second plate 30 held by the lower ends of the load shafts 51 is parallel to the horizontal plane.

In this embodiment, five load shafts 51 are used, but the present invention is not limited to this. For example, three load shafts 51 or six or more load shafts 51 may be used. For example, when three load shafts 51 are used, a central load shaft may be arranged in the center of the load plate 31, and peripheral load shafts may be arranged on both sides of the central load shaft. Each load shaft 51 is a rod-shaped body with a circular cross section, and is formed with an outer diameter and a material (e.g., metal, resin, ceramics, etc.) that does not deform or is suppressed from deforming due to the applied load. Each load shaft 51 may have the same shape or different shapes. For example, the first load shaft 51A may have a larger outer diameter of the circular cross section than the other load shafts 51. Furthermore, each load shaft 51 is not limited to having a circular cross section, and may have an elliptical, oval, or polygonal cross section, for example.

The drive units 52 are provided corresponding to each load shaft 51, and include a first drive unit 52A that drives the first load shaft 51A, a second drive unit 52B that drives the second load shaft 51B, a third drive unit 52C that drives the third load shaft 51C, a fourth drive unit 52D that drives the fourth load shaft 51D, and a fifth drive unit 52E that drives the fifth load shaft 51E. These multiple drive units 52 drive the first load shaft 51A to the fifth load shaft 51E individually. Each drive unit 52 may be, for example, an air cylinder device, a hydraulic cylinder device, or a ball screw mechanism using an electric rotary motor. The multiple drive units 52 can apply different loads to each load shaft 51 at different drive timings.

The drive unit 52 is controlled by the control unit C. The load applied to each load axis 51 by each drive unit 52 and the drive timing for applying the load are controlled by the control unit C based on a preset program or the like. In addition, some or all of the operation of the drive unit 52 may be performed by an operator. In this way, since the substrates S1 and S2 are attached by the loads and drive timings set on the multiple load axes 51, the substrates S1 and S2 can be appropriately attached in a short time when a load is applied by a single load axis, compared to when the same load is applied at the same drive timing by multiple load axes.

The alignment mechanism 60 positions the substrates S1 and S2 relative to the first plate 20 and the second plate 30. The alignment mechanism 60 includes a plurality of alignment drive units 61 and a plurality of alignment blocks 62A or a plurality of alignment blocks 62B. The alignment blocks 62A and 62B are used by replacing them with brackets or the like provided in the alignment mechanism 60. The alignment block 62A is a single-use alignment block used to align the substrates S1 and S2 alone. The alignment block 62B is a simultaneous-use alignment block used to align the substrates S1 and S2 simultaneously. The alignment block 62A is shorter in the height direction (Z direction) than the alignment block 62B. The alignment drive units 61 are provided in a block 80 provided in the chamber 10. The alignment drive unit 61 moves the plurality of alignment blocks 62A (62B) in the X direction or the Y direction. The alignment drive unit 61 has, for example, a drive source such as a cylinder device or an electric motor, and a transmission mechanism that transmits the driving force generated by the drive source to the alignment block 62A (62B).

The alignment block 62A (62B) can move in the X or Y direction by a guide (not shown). As shown in FIG. 2, the two alignment blocks 62A (62B) on the -Y side move forward and backward in the +Y direction, and the two alignment blocks 62A (62B) on the +Y side move forward and backward in the -Y direction. The two alignment blocks 62A (62B) on the -X side move forward and backward in the +X direction, and the two alignment blocks 62A (62B) on the +X side move forward and backward in the -X direction. The alignment block 62A (62B) is formed of a material that is less hard than the substrates S1 and S2, for example, to prevent damage to the substrates S1 and S2. In addition, the alignment block 62A (62B) is preferably formed of a conductive material to prevent the substrates S1 and S2 from being charged.

The alignment mechanism 60 drives the alignment drive unit 61 to advance the alignment block 62A (62B) and presses each side of the substrates S1 and S2 to position the substrates S1 and S2 relative to the first plate 20 and the second plate 30. The operation of the alignment mechanism 60 is controlled by the control unit C. When the alignment block 62A is used, the control unit C reads the shapes of the substrates S1 and S2 acquired by another unit (not shown), for example, and determines the alignment positions for the substrates S1 and S2, and then operates the alignment block 62A. When the alignment block 62B is used, the control unit C operates the alignment block 62B so that when aligning the substrate S2, it also aligns the substrate S1 at the same time. Note that both the alignment block 62A and the alignment block 62B are shown in FIG. 1, but when the substrate bonding device 100 is in operation, either one of them is attached.

Figure 4 shows an example of an alignment operation by the alignment mechanism 60, where (A) shows the state before the substrate S1 or substrate S2 is positioned, and (B) shows the state after the substrates S1 and S2 are positioned. As shown in Figure 4 (A), after the substrate S1 (substrate S2) is placed on the lift pins 41 (see Figure 1) in the chamber 10, the alignment drive unit 61 is driven to advance the alignment block 62A (62B). As a result, as shown in Figure 4 (B), the substrates S1 and S2 are positioned by being pushed by the multiple alignment blocks 62A (62B) (by being sandwiched between the alignment blocks 62A (62B)), and are positioned, for example, at approximately the center of the first plate 20 and the second plate 30 in a plan view. After the positioning of the substrates S1 and S2 is completed, the alignment block 62A (62B) retreats to its original position and moves away from the substrates S1 and S2.

The alignment mechanism 60 is not limited to the above-mentioned form. For example, the two alignment blocks 62A (62B) on the -Y side and the two alignment blocks 62A (62B) on the -X side may be fixed, and the two alignment blocks 62A (62B) on the +Y side and the two alignment blocks 62A (62B) on the +X side may be movable forward and backward. In this form, guides for moving the alignment blocks 62A (62B) on the -Y side and the alignment blocks 62A (62B) on the -X side forward and backward, and the alignment drive unit 61 are not required.

The spacer mechanism 70 receives and supports the substrate S1 from the lift pins 41. The spacer mechanism 70 includes a plurality of spacer drivers 71 and a plurality of spacers 72. The plurality of spacer drivers 71 are provided in a block 80 provided in the chamber 10. The spacer driver 71 moves the spacer 72 in the X direction or the Y direction. The spacer driver 71 includes, for example, a drive source such as a cylinder device or an electric motor, and a transmission mechanism that transmits the drive force generated by the drive source to the spacer 72.

The spacers 72 can move in the X or Y direction by a guide (not shown). As shown in FIG. 2, the two spacers 72 on the -Y side move forward and backward in the +Y direction, and the two spacers 72 on the +Y side move forward and backward in the -Y direction. The two spacers 72 on the -X side move forward and backward in the +X direction, and the two spacers 72 on the +X side move forward and backward in the -X direction. The spacers 72 are preferably made of a conductive material to prevent the substrates S1 and S2 from being charged. The spacer mechanism 70 drives the spacer drive unit 71 to advance the spacers 72 and position them below each side of the substrate S1, thereby supporting the substrate S1 placed on the lift pins 41. The operation of the spacer mechanism 70 is controlled by the control unit C.

Figure 5 shows an example of the operation of the spacer 72, where (A) shows the spacer 72 in a standby state, and (B) shows the spacer 72 supporting a substrate. As shown in Figure 5(A), with substrate S1 placed on lift pins 41, the spacer driver 71 is driven to advance the spacer 72. As a result, as shown in Figure 5(B), the spacer 72 is positioned below substrate S1, and by lowering the lift pins 41 in this state, substrate S1 is supported by the spacer 72. When substrates S1 and S2 are to be attached, the spacer 72 retreats to its original position and moves away from substrates S1 and S2.

The spacer mechanism 70 is not limited to the above-described form. The number and arrangement of the spacers 72 can be set as desired as long as they can support the substrate S1. For example, the spacers 72 may be arranged one each on the +Y side, -Y side, +X side, and -X side. In this form, the number of spacers 72 and spacer drive units 71 can be reduced.

As shown in Figures 1 and 2, the block 80 supports the alignment driver 61 and the spacer driver 71 while cooling them when they are driven. The block 80 is provided along the side of the chamber 10 and has a flow path for circulating cooling water and the like. The cooling water flows into the block 80 from a supply port 81, passes through the block 80, and is discharged from an exhaust port 82. Note that the block 80 is not limited to a form in which cooling water is circulated. For example, the block 80 may be used as a member for supporting the alignment driver 61 and the spacer driver 71 without circulating cooling water.

<Substrate attachment method>
Next, a substrate bonding method according to the present embodiment will be described. Figures 6 and 7 are flow charts showing an example of the substrate bonding method according to the present embodiment. This substrate bonding method is executed, for example, by instructions from the control unit C. Figures 8 to 14 and 16 are process diagrams showing an example of the operation of the substrate bonding device 100. Note that in these process diagrams, descriptions are simplified so that the operation of each part can be easily understood. Below, a description will be given along the flow charts of Figures 6 and 7.

First, the gate valve 12 of the chamber 10 is opened (step S01). As shown in FIG. 8A, the control unit C drives the driving unit (not shown) to lower the gate valve 12 and open the opening 11. Next, the substrate S1 (upper substrate) is carried into the chamber 10 (step S02). At this time, as shown in FIG. 8B, the control unit C raises the lift pins 41 to the transfer height of the substrate S1. The arm 91 of the transport device 90 enters the inside of the chamber 10 from the opening 11 while holding the substrate S1 on the lower surface side, and places the substrate S1 above the lift pins 41. The arm 91 holds the substrate S1 by suction with a suction pad (not shown) provided on the lower surface. Then, the control unit C lowers the arm 91 and transfers the substrate S1 from the arm 91 to the lift pins 41. Then, the arm 91 exits the chamber 10. Note that the adhesive layer F of the substrate S1 is on the lower side when it is carried into the chamber 10.

Next, an alignment operation is performed on the substrate S1 (step S03). In the following, an example will be described in which a single alignment block 62A is used. This alignment operation may be referred to as a single alignment operation. As shown in FIG. 9(A), after the arm 91 is withdrawn, the lift pins 41 are raised to position the substrate S1 at a height for the alignment operation. Thereafter, the control unit C drives the alignment drive unit 61 to advance the alignment block 62A, and positions the substrate S1 by sandwiching the substrate between the multiple alignment blocks 62A. After the alignment operation, as shown in FIG. 9(B), the control unit C withdraws the alignment block 62A, and then raises the lift pins 41 to position the substrate S1 above the spacer 72.

Next, the substrate S1 is supported by the spacer 72 (step S04). As shown in FIG. 10(A), the control unit C drives the spacer driving unit 71 to advance the spacer 72 and place the spacer 72 on the lower surface side of the substrate S1. Then, the lift pin 41 is lowered, so that the substrate S1 is supported by the spacer 72. Next, the substrate S2 (lower substrate) is carried into the chamber 10 (step S05). As shown in FIG. 10(B), the control unit C lowers the lift pin 41 to the transfer height of the substrate S2. Then, as shown in FIG. 10(B), the arm 91 carries the substrate S2 into the chamber 10 and places it above the lift pin 41. The arm 91 holds the substrate S2 by suction on the lower surface side. Then, the control unit C lowers the arm 91 and transfers the substrate S2 from the arm 91 to the lift pin 41. Then, the arm 91 exits the chamber 10. When the substrate S2 is loaded into the chamber 10, the adhesive layer F is on the upper side.

Then, the gate valve 12 is closed and a warp suppression bake process is performed to suppress warping of the substrate S2 (step S06). As shown in FIG. 11(A), after the gate valve 12 is closed, the chamber 10 is evacuated by a suction device (not shown) while the substrate S2 is heated by, for example, the heaters 22 and 32 to perform the warp suppression bake process. By baking the substrate S2, the shape of the substrate S2 can be stabilized and warping of the substrate S2 can be suppressed. This warp suppression bake process is performed by maintaining the temperature in the chamber 10 at, for example, 150°C to 250°C. The warp suppression bake process can be performed with the gate valve 12 open (i.e., open to the atmosphere).

Then, a vacuum atmosphere is created in the chamber 10 (step S07). The chamber 10 is evacuated by a suction device (not shown), thereby creating a vacuum atmosphere in the chamber 10. Then, as shown in FIG. 11(B), the lift pins 41 are lowered to place the substrate S2 on the first plate 20. The substrate S2 may then be heated by the heater 22, and a warp suppression bake process may be performed in a vacuum atmosphere. This warp suppression bake process is performed by setting the temperature of the heater 22 to, for example, 150°C to 250°C.

Next, an alignment operation is performed on the substrate S2 (step S08). As shown in FIG. 12(A), the control unit C raises the lift pins 41 to position the substrate S2 at a height where the alignment operation is performed. The control unit C drives the alignment drive unit 61 to advance the alignment block 62A, and positions the substrate S2 by sandwiching the substrate S2 between the alignment blocks 62A. The alignment operation in step S08 is similar to the alignment operation in step S03. Therefore, the substrates S1 and S2 are positioned at approximately the same position in a plan view. Thereafter, as shown in FIG. 12(B), the control unit C retreats the alignment block 62A to its original position. Note that, in the above, the substrates S1 and S2 are each individually aligned, but this is not limited to this form. For example, when the alignment block 62B is used, the substrate S1 may not be individually aligned in the above step S03, and may be aligned simultaneously with the substrate S2 in step S08. The operation of simultaneously aligning substrates S1 and S2 may be referred to as a simultaneous alignment operation. When performing a simultaneous alignment operation, as shown by the dotted lines in FIG. 12(A), the control unit C drives the alignment drive unit 61 to advance the alignment block 62B, and simultaneously sandwiches substrates S1 and S2 between the alignment block 62B to position both substrates S1 and S2.

Subsequently, the substrate S2 is raised, and the substrate S1 is pressed downward by the spring pin 34 (step S09). As shown in FIG. 13(A), the control unit C raises the lift pin 41 to bring the substrate S2 into contact with the lower surface of the spacer 72. In this state, the spacer 72 is sandwiched between the substrates S1 and S2. The control unit C also drives the drive unit 52 to lower the second plate 30 together with the load shaft 51, and presses the substrate S1 downward by the spring pin 34. By pressing the substrate S1, the spring pin 34 is sunk into the pressing surface 33a against the elastic force of a spring (not shown). Note that the substrates S1 and S2 may be in contact in the portion where the spacer 72 is not present.

Then, the spacer 72 is retracted to its original position (step S10). As shown in FIG. 13(B), the control unit C retracts the spacer 72 sandwiched between the substrates S1 and S2 to its original position. As the spacer 72 is retracted, the substrate S1 is pushed downward by the spring pin 34 and abuts against the substrate S2. That is, the adhesive layer F of the substrate S1 and the adhesive layer F of the substrate S2 abut against each other.

Then, the control unit C lowers the lift pins 41 supporting the substrates S1 and S2, and performs a preheating process on the substrates S1 and S2 (step S11). As shown in FIG. 14(A), after lowering the lift pins 41, the control unit C drives the drive unit 52 to lower the second plate 30 together with the load shaft 51. After that, the control unit C performs a preheating process by heating the substrates S1 and S2 for a predetermined time with the heaters 22 and 32 while the substrates S1 and S2 are placed on the placement surface 23a of the first plate 20 and the spring pins 34 of the second plate 30 are pressing the upper surface of the substrate S1. The preheating process is performed for the next process of attaching the substrates S1 and S2. The preheating process is performed by setting the temperature of the heaters 22 and 32 to, for example, 150°C to 250°C.

Substrate S1 and substrate S2 are then bonded together (step S12). As shown in FIG. 14B, in a vacuum atmosphere, control unit C drives drive unit 52 to lower second plate 30 together with load shaft 51, and bonds substrate S1 and substrate S2 between first plate 20 and second plate 30. At this time, heating by heaters 22 and 32 may be continued to maintain first plate 20 and second plate 30 at a predetermined temperature. Substrates S1 and S2 are fused together by heat at adhesive layer F, and further substrate S1 and substrate S2 are firmly bonded together by pressure from substrate S1 side by second plate 30.

In the attachment process of step S12, the load applied to the second plate 30 is set individually by the first drive unit 52A to the fifth drive unit 52E via the first load shaft 51A to the fifth load shaft 51E. Furthermore, the drive timing for applying the load is also set individually by the first drive unit 52A to the fifth drive unit 52E. The value of the load applied by the first load shaft 51A to the fifth load shaft 51E, the drive timing for applying the load, and the time are set appropriately depending on the type, size, etc. of the substrates S1 and S2.

Figure 15 is a graph showing the loads applied and their drive timing for the first load axis 51A, which is the central load axis, and the second load axis 51B to the fifth load axis 51E, which are the multiple peripheral load axes. In the graph of Figure 15, the vertical axis represents the load (unit: kgf) and the horizontal axis represents time (unit: seconds). In the graph of Figure 15, the first load axis 51A, which is the central load axis, is represented by a black circle, and the second load axis 51B to the fifth load axis 51E, which are the peripheral load axes, are represented by black squares.

As shown in FIG. 15, the first load axis 51A starts applying a load at time T1, and sets the load to P1. The second load axis 51B to the fifth load axis 51E start applying a load at time T2, and sets the load to P1. Next, the first load axis 51A maintains the load P1 until time T3, and then increases the load to P2. The second load axis 51B to the fifth load axis 51E maintain the load P1 until time T4, and then increases the load to P2. Next, the first load axis 51A maintains the load P2 until time T5, and then increases the load to P3. The second load axis 51B to the fifth load axis 51E maintain the load P2 until time T6, and then increases the load to P3. Next, the first load axis 51A maintains the load P3 until time T7, and then increases the load to P4. The second load axis 51B to the fifth load axis 51E maintain the load P3 until time T8, and then increases the load to P4. Next, the first load axis 51A maintains the load P4 until time T9, and then increases the load to load P5. The second load axis 51B to the fifth load axis 51E maintain the load P4 until time T10, and then increase the load to load P5. In this way, the first load axis 51A to the fifth load axis 51E increase the load in five stages up to the target load P5, and the first load axis 51A increases the load before the second load axis 51B to the fifth load axis 51E. Note that in the load application operation, the load P1 to the target load P5 are in five stages, but the number of stages can be changed by the control of the control unit C. Also, as described above, the first load axis 51A increases the load before the second load axis 51B to the fifth load axis 51E, but the timing of applying such loads can also be changed by the control of the control unit C.

After the first load shaft 51A to the fifth load shaft 51E reach the target load P5, the second load shaft 51B to the fifth load shaft 51E maintain the load P5 until time T11, then reduce the load, and set the load to zero at time T12. The first load shaft 51A maintains the load P5 until time T13, then reduce the load, and set the load to zero at time T14. When releasing (setting to zero) the loads of the first load shaft 51A to the fifth load shaft 51E, the second load shaft 51B to the fifth load shaft 51E are released first, and the first load shaft 51A is released last. Note that when releasing the load, the load is not released in stages, but if the above-mentioned first drive unit 52A to the fifth drive unit 52E adopt a configuration that allows for the release of the load in stages, the load may be released in stages under the control of the control unit C.

As shown in the graph of FIG. 15, the first load axis 51A applies the target load P5 for a longer period of time than the second load axis 51B to the fifth load axis 51E apply the target load P5. The first load axis 51A also has an earlier drive timing to reach the target load P5 than the second load axis 51B to the fifth load axis 51E, and a later drive timing to start reducing the load from the target load P5 than the second load axis 51B to the fifth load axis 51E. The second load axis 51B also has a greater load reduction rate from the target load P5 than the second load axis 51B to the fifth load axis 51E.

By the operation shown in the graph of FIG. 15, the substrate S1 and the substrate S2 can be appropriately attached in a short time. In the example shown in the graph of FIG. 15, the operation of applying the load of the first load axis 51A to the fifth load axis 51E is performed in five stages from load P1 to the target load P5, but this is not limited to this form. For example, the number of stages is variable, such as performing the operation of the first load axis 51A to the fifth load axis 51E in two stages, three stages, or six stages or more up to the target load P5. When performing the operation in two stages up to the target load P5, for example, the load P1 may be applied first and then the target load P5 may be applied. In addition, the second load axis 51B to the fifth load axis 51E are driven at the same drive timing, but this is not limited to this form, and for example, the second load axis 51B to the fifth load axis 51E may be driven at different drive timings. In addition, the operation of applying the load of the first load axis 51A to the fifth load axis 51E may be performed in a non-step manner up to the load P5. In this case, the load increase per time on the first load axis 51A to the fifth load axis 51E may be the same or different.

After the bonding process in step S12, the second plate 30 is raised, and then the lift pins 41 are raised (step S13). The control unit C performs a heat treatment for a predetermined time using the heaters 22 and 32, and then drives the drive unit 52 to raise the second plate 30 together with the load shaft 51, as shown in FIG. 16(A). Note that the control unit C does not stop the temperature control of the heaters 22 and 32, for example. That is, the heaters 22 and 32 are maintained constant at the set temperatures. Thereafter, the control unit C raises the lift pins 41 to position the substrate S, for which bonding has been completed, at a height for carrying out. This step S13 causes the substrate S to separate from both the first plate 20 and the second plate 30. Thereafter, a valve (not shown) is opened to open the chamber 10 to the atmosphere, or a predetermined gas is supplied into the chamber 10 to purge the chamber 10 (step S14). For example, nitrogen gas, dry air, etc. are used as the predetermined gas.

Then, the gate valve 12 is opened to unload the substrate S from the chamber 10 (step S15). After lowering the gate valve 12 to open the opening 11, the arm 91 of the transport device 90 is advanced into the chamber 10 from the opening 11, and the arm 91 is positioned below the substrate S supported by the lift pins 41. Then, as shown in FIG. 16B, the control unit C raises the arm 91 and transfers the substrate S from the lift pins 41 to the arm 91 by suction-holding the substrate S on the upper surface of the arm 91. The arm 91 may be configured to hold the substrate S by placing it on the upper surface of the arm 91 instead of suction-holding the substrate S. Then, the arm 91 exits the chamber 10, and the substrate S is unloaded to the outside of the chamber 10. Then, the control unit C closes the gate valve 12 to end the series of processes.

<Modification>
In the above embodiment, the second plate 30 is described as being joined to the lower ends of the multiple load shafts 51, but the present invention is not limited to this embodiment. FIG. 17 is a diagram showing an example of a second plate 30A according to a modified example. The same members as those in the above embodiment are given the same reference numerals, and their description is omitted or simplified. As shown in FIG. 17, a support 35 is provided on the upper surface side of the load plate 31. The support 35 is attached to the upper surface 31a of the load plate 31 by an attachment portion 35a. The support 35 is provided so as to cover the upper surface side of the load plate 31. The support 35 has five holes 35b into which the first load shaft 51A to the fifth load shaft 51E are inserted. Each hole 35b is circular in plan view, and the inner diameter is formed slightly larger than the outer diameter of the first load shaft 51A, etc.

A flange portion 510 is provided at the lower end of each of the first load shaft 51A to the fifth load shaft 51E. The outer diameter of the flange portion 510 is larger than the inner diameter of the hole portion 35b. Therefore, the support body 35 is engaged and suspended by the flange portion 510. In other words, the second plate 30A is held in a suspended state by the first load shaft 51A to the fifth load shaft 51E. At this time, a gap V is formed between the upper surface 31a of the load plate 31 and the lower surface 510a of the flange portion 510.

Figure 18 is a diagram showing the state in which the second plate 30A shown in Figure 17 is pressed against the substrate S1. When the substrates S1 and S2 are attached, the first load shaft 51A to the fifth load shaft 51E are lowered, and first, the lower end of the spring pin 34 abuts against the substrate S1. When the first load shaft 51A to the fifth load shaft 51E are further lowered, the second plate 30A does not lower, and the first load shaft 51A to the fifth load shaft 51E lower relative to the second plate 30A. In other words, the gap V gradually becomes smaller. When the lower surface 510a of the flange portion 510 abuts against the upper surface 31a of the load plate 31, the second plate 30A lowers together with the first load shaft 51A to the fifth load shaft 51E, causing the spring pin 34 to sink. After the spring pin 34 is retracted, the first load shaft 51A to the fifth load shaft 51E are lowered, causing the second plate 30A to press against the substrate S1.

When the second plate 30A is raised after pressing the substrate S1, the state shown in FIG. 17 is returned to by the reverse operation. In this way, when the second plate 30A is not pressing the substrate S1, the first load shaft 51A to the fifth load shaft 51E are kept away from the load plate 31, so that the heat of the heater 32 is prevented from being transferred to the first load shaft 51A to the fifth load shaft 51E when the substrate S1 is not being pressed. In the above, the mounting portion 35a of the support 35 is attached to the upper surface 31a of the load plate 31, but this is not limited to the above. For example, the mounting portion 35a may extend below the press plate 33 and engage the lower surface side of the press plate 33.

Although the above describes the embodiments and modifications, the present invention is not limited to the above description, and various modifications are possible within the scope of the gist of the present invention. In the above embodiment, an example is given in which two substrates S1 and S2 are bonded together, but the present invention is not limited to this. For example, the present invention may be configured such that another substrate is bonded to the substrate S to which substrates S1 and S2 are bonded.

In addition, in the above embodiment, the first plate 20 is fixed in the chamber 10, and the second plate 30 is lowered by the pressing mechanism 50, but the present invention is not limited to this. For example, the second plate 30 may be fixed in the chamber 10, and the first plate 20 may be raised by the pressing mechanism 50, or the second plate 30 may be lowered by the pressing mechanism 50 and the first plate 20 may be raised by another pressing mechanism 50.

C: Control section S, S1, S2: Substrate 10: Chamber 11: Opening 12: Gate valve 20: First plate 22: Heater (heating section)
30, 30A: Second plate 32: Heater (heating unit)
40: Lift portion 41: Lift pin 50: Pressing mechanism 51: Load shaft 51A: First load shaft (central load shaft)
51B: Second load shaft (peripheral load shaft)
51C: Third load shaft (peripheral load shaft)
51D: Fourth load axis (peripheral load axis)
51E: Fifth load axis (peripheral load axis)
52: Drive unit 51A: First load shaft (central load shaft)
51B: Second load shaft (peripheral load shaft)
51C: Third load shaft (peripheral load shaft)
51D: Fourth load axis (peripheral load axis)
51E: Fifth load axis (peripheral load axis)
60: alignment mechanism 70: spacer mechanism 100: substrate attachment device

Claims (12)

A first plate and a second plate that sandwich a plurality of substrates in a stacked state;
a pressing mechanism that presses one of the first plate and the second plate against the other,
The pressing mechanism includes:
a central load shaft disposed corresponding to a central portion of the plurality of substrates;
a plurality of peripheral load shafts arranged corresponding to peripheral portions of the plurality of substrates excluding the central portions;
a plurality of drive units that individually drive the central load shaft and the plurality of peripheral load shafts ,
the first plate is provided in a fixed state and is capable of supporting the plurality of substrates;
The second plate is movable up and down above the first plate,
The pressing mechanism lowers the second plate and presses it against the first plate,
A substrate bonding device, wherein the central load shaft and the multiple peripheral load shafts are positioned at a distance from the second plate and abut against the second plate when the multiple substrates are sandwiched between the first plate and the second plate . The substrate bonding device according to claim 1, wherein each of the peripheral load axes has the same distance from the central load axis. Each of the plurality of substrates is rectangular in plan view,
The substrate bonding apparatus according to claim 2 , wherein the plurality of peripheral load axes are arranged to correspond to four corners of the substrate. 4. The substrate bonding device according to claim 1 , wherein the first plate is fixed by being supported at upper ends of a plurality of legs. 5 . The substrate bonding device according to claim 1 , further comprising a lift pin that is provided through the first plate and raises and lowers the plurality of substrates or one of the substrates relative to the second plate. 6 . The substrate bonding apparatus according to claim 1 , wherein one or both of the first plate and the second plate are provided with a heating portion for heating the plurality of substrates. The substrate bonding apparatus according to claim 1 , further comprising a chamber that houses the first plate and the second plate. A control unit that controls the plurality of drive units,
The substrate bonding apparatus according to claim 1 , wherein the control unit controls one or both of a drive timing and a load for each of the central load shaft and the plurality of peripheral load shafts individually. A method for bonding a plurality of substrates by sandwiching the substrates between a first plate and a second plate in a stacked state, comprising the steps of:
when pressing either one of the first plate and the second plate against the other, pressing a portion corresponding to a center portion of the plurality of substrates by a central load shaft , and pressing a plurality of portions corresponding to a peripheral portion of the plurality of substrates excluding the center portion by a plurality of peripheral load shafts are set individually and respectively ;
the first plate is provided in a fixed state and is capable of supporting the plurality of substrates;
The second plate is movable up and down above the first plate,
A substrate bonding method, wherein the central load shaft and the multiple peripheral load shafts are positioned at a distance from the second plate and abut against the second plate when the multiple substrates are sandwiched between the first plate and the second plate . The substrate bonding method according to claim 9 , wherein the pressing of the portion corresponding to the central portion and the pressing of each of the portions corresponding to the peripheral portion are performed by increasing the load stepwise until each target load is reached. 11. The substrate bonding method according to claim 9 , wherein the pressing of the portion corresponding to the central portion and the pressing of each of the plurality of portions corresponding to the peripheral portion are performed at different drive timings. A method for bonding a plurality of substrates by sandwiching the substrates between a first plate and a second plate in a stacked state, comprising the steps of:
when pressing one of the first plate and the second plate against the other, pressing pressure against a portion corresponding to a center portion of the plurality of substrates and pressing pressure against a plurality of portions corresponding to peripheral portions of the plurality of substrates excluding the center portion are set individually and separately,
A substrate bonding method, wherein the pressure applied to the portion corresponding to the central portion has a drive timing at which the target load is reached earlier than the drive timing of each of the pressures applied to the multiple portions corresponding to the peripheral portion, and the drive timing at which the load starts to decrease from the target load is later than the drive timing of each of the pressures applied to the multiple portions corresponding to the peripheral portion.

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