JP7469817B2 - Substrate bonding device and substrate bonding method - Google Patents

Description

The present invention relates to a substrate bonding device and a substrate bonding method.

A substrate bonding device that bonds multiple substrates in a stacked state is known. For example, a configuration including a pressure receiving portion, a stress distribution portion arranged on the lower surface of the pressure receiving portion, and a component holding portion arranged on the lower surface of the stress distribution portion has been disclosed as such a substrate bonding device (see, for example, Patent Document 1). In this configuration, the component holding portion is attached to the lower surface of a stress distribution plate that constitutes the stress distribution portion. A pressure force from a pressure mechanism is applied as a point load to the center of the upper surface of the pressure receiving portion. The stress distribution plate has a contact portion with a trapezoidal cross section in a circular ring shape on its upper surface. The multiple substrates are sandwiched between the component holding portion and the stress distribution portion. The pressure force from the pressure mechanism is distributed to the periphery by the circular contact portion formed on the stress distribution plate. In this way, by providing a stress distribution plate, the pressure force applied to the joining surfaces between the multiple substrates is made uniform.

JP 2007-301593 A

The substrate bonding device of Patent Document 1 transmits pressure force via a circular contact part, so there is no part to transmit pressure force on the extension of the axial direction of pressure, and this is insufficient for uniformly distributing the pressure force. In order to properly bond substrates together, it is desirable to further uniformize the pressure force applied to the bonding surfaces of multiple substrates.

The present invention aims to provide a substrate bonding device and a substrate bonding method that can uniformly apply pressure to the bonding surfaces of multiple substrates.

A first aspect of the present invention is a substrate bonding device. The substrate bonding device includes a first plate and a second plate that sandwich a plurality of substrates in a stacked state. The substrate bonding device includes a pressing mechanism that presses either one of the first plate and the second plate against the other. At least one of the first plate and the second plate includes an abutment plate that abuts against the substrate. At least one of the first plate and the second plate includes a pressure-receiving plate that is disposed on the pressing mechanism side and receives a pressing force from the pressing mechanism. At least one of the first plate and the second plate includes an intermediate plate that is disposed between the abutment plate and the pressure-receiving plate. At least one of the first plate and the second plate includes a plurality of dispersion members that are disposed between the pressure-receiving plate and the intermediate plate . The plurality of dispersion members includes a central dispersion member that is disposed in correspondence with the central portions of the first plate and the second plate and is fixed to the intermediate plate . The plurality of dispersion members includes a plurality of peripheral dispersion members that are disposed so as to surround the central dispersion member and are fixed to the intermediate plate . The outer diameter dimension of the central dispersion member is equal to or larger than the outer diameter dimension of the peripheral dispersion member.

A second aspect of the present invention is a method for bonding a plurality of substrates by sandwiching the substrates between a first plate and a second plate in a stacked state. The substrate bonding method includes arranging the substrates between the first plate and the second plate in a stacked state . The substrate bonding method includes applying a pressing force to the substrates between the first plate and the second plate by pressing one of the first plate and the second plate toward the other . The pressing force is applied to a first region corresponding to the center of the substrates by a central dispersion member fixed to an intermediate plate arranged between a contact plate that contacts the substrates and a pressure-receiving plate that receives the pressing force . The pressing force is applied to a plurality of second regions corresponding to the outer periphery of the substrates by a plurality of peripheral dispersion members that are arranged to surround the central dispersion member and fixed to the intermediate plate . The outer diameter of the first region to which the pressing force is applied is equal to or larger than the outer diameter of the second region to which the pressing force is applied.

According to the present invention, the substrate bonding device includes a plurality of dispersion members disposed between the pressure-receiving plate and the intermediate plate, so that the pressing force of the pressing mechanism is transmitted from the pressure-receiving plate to the plurality of substrates via the plurality of dispersion members, the intermediate plate, and the abutment plate. The plurality of dispersion members include a central dispersion member and a plurality of peripheral dispersion members, so that the pressing force of the pressing mechanism is transmitted to the center and peripheral portions of the intermediate plate. Therefore, the pressing force applied to the bonding surfaces of the plurality of substrates can be made more uniform, and the plurality of substrates can be properly bonded together.

FIG. 2 is a diagram showing an example of a substrate bonding apparatus according to the embodiment; FIG. 4 is a front view showing the configuration of a first plate. FIG. 3 is a diagram showing a configuration along the AA cross section in FIG. 2. FIG. 4 is a vertical cross-sectional view showing the configuration of a second plate. 5 is a vertical cross-sectional view of the state in which the second plate in FIG. 4 is lowered and the contact plate is abutted against the substrate. FIG. FIG. 2 is a perspective view showing an intermediate plate and a plurality of dispersion members. FIG. 7 is a plan view of FIG. 6. 13 is a plan view showing the positional relationship between a plurality of dispersion members of a second plate and a plurality of support columns of a first plate. FIG. 4 is a cross-sectional view showing a mounting structure of each dispersion member to an intermediate plate. FIG. 8 is a cross-sectional view taken along the line BB of FIG. 7, showing a movably provided outer peripheral dispersion member. 4 is a flowchart showing an example of a substrate bonding method according to the present embodiment. 5A to 5C are process diagrams showing an example of the operation of the substrate bonding device. 5A to 5C are process diagrams showing an example of the operation of the substrate bonding device. 5A to 5C are process diagrams showing an example of the operation of the substrate bonding device. 5A to 5C are process diagrams showing an example of the operation of the substrate bonding device. 5A to 5C are process diagrams showing an example of the operation of the substrate bonding device.

The following describes an embodiment of the present invention with reference to the drawings. However, the present invention is not limited to the following description. In addition, in the drawings, some parts are omitted in order to easily explain the embodiment. Furthermore, in the drawings, some parts are enlarged or emphasized, and the scale is appropriately changed, and the size and shape may differ from the actual product. In each of the following drawings, the directions in the drawings are explained using an XYZ Cartesian coordinate system. In this XYZ Cartesian coordinate system, a plane parallel to the horizontal plane is the XY plane. In this XY plane, the direction parallel to the transport direction of the substrates S1 and S2 is the X direction, and the direction perpendicular to the X direction is the Y direction. In addition, the direction perpendicular to the XY plane is expressed as the Z direction (height direction). The X direction, Y direction, and Z direction are explained by assuming that the direction indicated by the arrow in the drawing is the + direction, and the direction opposite to the direction indicated by the arrow is the - direction.

<Substrate bonding device>
A substrate bonding apparatus 100 according to an embodiment will be described. Fig. 1 is a diagram showing an example of the substrate bonding apparatus 100 according to an embodiment. The substrate bonding apparatus 100 bonds the substrates S1 and S2 together by applying a pressing force to the substrates S1 and S2 that have been temporarily bonded together in a previous process via an adhesive layer F. The adhesive layer F is provided on at least one of the substrates S1 and S2.

Substrates S1 and S2 are, for example, glass substrates, but may be semiconductor substrates other than glass substrates, resin substrates, etc. In this embodiment, of the two substrates to be bonded, the upper substrate is referred to as substrate S1, and the lower substrate is referred to as substrate S2. The form in which substrates S1 and S2 are bonded is referred to as substrate S. Substrates S1 and S2 are both circular substrates that are circular in plan view (when viewed from the Z direction), but are not limited to circular substrates, and may be rectangular (square, rectangular) substrates, elliptical, oval, etc. substrates in plan view.

As shown in FIG. 1, the substrate bonding device 100 includes a chamber 10, a first plate 20, a second plate 30, a pressing mechanism 50, and a control unit (not shown). In FIG. 2, the top side of the chamber 10 is omitted to make the interior of the chamber 10 easier to understand. The control unit (not shown) controls the overall operation of each unit in the substrate bonding device 100.

The chamber 10 is disposed on the base 15 of the substrate bonding device 100. The chamber 10 is formed in a box shape having a side wall 10a rising upward from the outer periphery of the base 15 and a top plate 10b covering the upper part of the side wall 10a. The chamber 10 accommodates the first plate 20, the second plate 30, and a part of the pressing mechanism 50. The chamber 10 is formed in a box shape and has an opening 11 in a part of the side wall 10a. The opening 11 is formed on the -X side surface of the chamber 10 and connects the inside and outside of the chamber 10. The opening 11 is formed to a size that allows the substrates S1 and S2 temporarily bonded together via the adhesive layer F in the previous process, and the substrate S with the substrates S1 and S2 bonded together to pass through. The substrates S1 and S2 are carried into the chamber 10 through the opening 11 by a transport device (not shown). The substrate S is also carried out of the chamber 10 through the opening 11.

The chamber 10 is equipped with a gate valve 12 that opens and closes the opening 11. The gate valve 12 is disposed on the outside of the -X side of the chamber 10, and can slide, for example, in the height direction (Z direction) by a drive unit (not shown). The gate valve 12 opens and closes the opening 11 by sliding, and can seal the inside of the chamber 10 by closing the opening 11. In addition, the upper surface of the chamber 10 is provided with a number of through-holes 10h through which a number of pressing shafts 51 (described later) pass. In each of the through-holes 10h, the pressing shaft 51 is inserted in a state that allows it to rise and fall, and a sealing member (not shown) maintains the inside of the chamber 10 in a sealed state.

The inside of the chamber 10 is connected to a suction device (not shown). By suctioning (exhausting) the inside of the chamber 10 with this suction device, the inside of the chamber 10 can be evacuated to create a vacuum atmosphere. The chamber 10 may be equipped with a valve that can be opened to the outside in order to release the internal vacuum atmosphere. The inside of the chamber 10 may also be connected to a gas supply device (not shown). By supplying a predetermined gas from this gas supply device into the chamber 10, the inside of the chamber 10 can be made into a predetermined gas atmosphere. As the predetermined gas, for example, a gas that is inert to the thin film formed on the substrates S1 and S2, such as nitrogen gas, or dry air is used. Note that the substrate bonding device 100 may or may not include the chamber 10, and may be of a type that does not include the chamber 10 (open to the atmosphere).

The first plate 20 supports the substrates S1 and S2 from below when they are loaded into the chamber 10. The first plate 20 has a circular shape when viewed from above, but is not limited to this shape and may be, for example, a rectangular shape (square shape, rectangular shape), an elliptical shape, an oval shape, etc. The first plate 20 is set to have an outer diameter dimension larger than the substrates S1 and S2.

Figure 2 is a front view showing the configuration of the first plate 20. As shown in Figure 2, the first plate 20 has a support plate 21, a first heater (heating unit) 22, and a base plate 23. The support plate 21, the first heater 22, and the base plate 23 are stacked in this order from the lower side (-Z side). The first plate 20 is supported by a plurality of pillars 24 provided on the lower surface side of the support plate 21, and is fixed to the bottom of the chamber 10 via the pillars 24. The support plate 21 and the first heater 22, and the first heater 22 and the base plate 23 are fixed by fastening members such as bolts.

The support plate 21 is a plate-like body formed of a material such as metal, resin, ceramics, etc. The first heater 22 is an example of a heating unit, and is, for example, a hot plate having a heating mechanism (heat source) such as an electric heating wire inside. The first heater 22 heats the substrates S1 and S2 via the base plate 23. The first heater 22 may be a laminated structure in which a sheet-shaped heat source is sandwiched between the substrates. The substrates S1, S2, and the substrate S are placed on the placement surface 23a on the +Z side, which is the upper surface of the base plate 23. The base plate 23 is, for example, a ceramic plate formed into a plate shape from ceramics in order to reduce the thermal expansion coefficient of the substrates S1, S2, and the substrate S, but may be formed from metal, resin, etc. The placement surface 23a of the base plate 23 is the contact surface with the substrate S2. Therefore, it is preferable that the placement surface 23a has a high flatness and a small surface roughness (or is a mirror surface).

Figure 3 is a diagram showing the configuration along the A-A cross section in Figure 2. As shown in Figures 2 and 3, multiple support columns 24 are provided on the underside of the support plate 21. The multiple support columns 24 receive from below the pressing force acting on the first plate 20 when attaching the substrates S1 and S2. The multiple support columns 24 include a central support column 25 and peripheral support columns 26. The central support column 25 is disposed in the center of the underside of the support plate 21. The central support column 25 includes a support member 25a, a plate body 25b, and multiple support members 27.

The support member 25a extends upward from the base 15. The plate body 25b is supported on the support member 25a. The plate body 25b expands in diameter from the support member 25a toward the outer periphery. The plurality of support members 27 are arranged on the plate body 25b. The plurality of support members 27 include a central support member 27a arranged in the center of the lower side of the support plate 21 and an outer periphery support member 27b arranged on the outer periphery side of the central support member 27a. The outer periphery support member 27b is arranged at intervals in the circumferential direction of the support plate 21. In this embodiment, three outer periphery support members 27b are arranged at intervals in the circumferential direction. The central support member 27a and the outer periphery support member 27b are each formed in a circular shape when viewed from above. In this embodiment, the central support member 27a and the outer periphery support member 27b have approximately the same outer diameter. The central support member 27a and the outer peripheral support member 27b may have different outer diameters.

The outer peripheral support 26 is disposed on the outer periphery of the support plate 21. The outer peripheral support 26 is disposed on the outer periphery side of the outer peripheral support member 27b of the central support 25. The outer peripheral support 26 is disposed at intervals in the circumferential direction of the support plate 21. In this embodiment, six outer peripheral support columns 26 are disposed at intervals in the circumferential direction. Three of the six outer peripheral support columns 26 are aligned with the respective outer peripheral support members 27b in the circumferential direction. Additionally, the outer peripheral support columns 26 are rectangular, but may be circular, elliptical, oval, etc.

In this way, by supporting the first plate 20 with multiple support columns 24, deformation of the first plate 20 is prevented even when the pressing force from the pressing mechanism 50 is large. Note that the number and arrangement of the multiple support columns 24 are not limited to the above-mentioned form, and can be set arbitrarily depending on the size of the first plate 20, the magnitude of the pressing force used, etc.

As shown in FIG. 1, the second plate 30 presses the substrates S1 and S2 toward the first plate 20 (-Z side) when bonding the substrates S1 and S2 together. The second plate 30, like the first plate 20, is circular when viewed from above, but is not limited to this shape and may be rectangular (square, rectangular), elliptical, or oval. The second plate 30 is set to have a larger outer diameter than the substrates S1 and S2. The outer diameter of the second plate 30 is the same as that of the first plate 20, but is not limited to this shape. For example, the outer diameter of the second plate 30 may be larger or smaller than that of the first plate 20.

Figure 4 is a vertical cross-sectional view showing the configuration of the second plate 30. As shown in Figure 4, the second plate 30 is held at the lower end of the pressing shaft 51 of the pressing mechanism 50 described later, and rises and falls with the rising and falling of the pressing shaft 51. The second plate 30 includes a contact plate 31, a pressure-receiving plate 33, an intermediate plate 34, and a plurality of dispersion members 35. The contact plate 31 abuts against the substrates S1 and S2. The pressure-receiving plate 33, the plurality of dispersion members 35, the intermediate plate 34, and the contact plate 31 are stacked in this order from the top. The pressure-receiving plate 33, the intermediate plate 34, and the contact plate 31 are each circular plate-shaped in a plan view and have the same outer diameter. The plurality of dispersion members 35 are sandwiched between the pressure-receiving plate 33 and the intermediate plate 34, as described in detail later. The pressure-receiving plate 33, the intermediate plate 34, and the contact plate 31 are fixed by fastening members such as bolts.

The abutment plate 31 has an abutment surface 31a on the underside on the -Z side that abuts against the substrate S1 from above. The abutment plate 31 is, for example, a ceramic plate formed into a plate shape from ceramics in order to reduce the thermal expansion coefficients of the substrates S1, S2, and substrate S, but may also be formed into a plate shape from metal, resin, etc. The abutment surface 31a of the abutment plate 31 becomes the contact surface with the substrate S1. Therefore, it is preferable that the abutment surface 31a has a high degree of flatness and small surface roughness (or is a mirror surface).

The contact plate 31 has a built-in second heater (not shown). The second heater (not shown), like the first heater 22 of the first plate 20, is, for example, a hot plate having a heating mechanism (heat source) such as an electric heating wire inside. The second heater (not shown) heats the substrate S1 via the contact plate 31. Note that the second heater (not shown) may be a laminated structure in which a sheet-shaped heat source is sandwiched between the layers, like the first heater 22.

The pressure-receiving plate 33 is disposed on the pressing mechanism 50 side, i.e., on the upper side. The pressure-receiving plate 33 is preferably formed with a predetermined strength in order to receive a pressing force from the pressing shaft 51 of the pressing mechanism 50. The pressure-receiving plate 33 is formed, for example, from metal, resin, ceramics, etc. In this embodiment, the pressure-receiving plate 33 is a metal plate. The upper surface 33t of the pressure-receiving plate 33 is formed so as to gradually bulge upward from the outer periphery toward the inside in the radial direction.

The pressure plate 33 is supported by the pressing shaft 51 via a bracket 38 so as to be movable relative to the pressing shaft 51 in the height direction. The bracket 38 includes a bracket plate 38a and an attachment member 38b. The bracket plate 38a is circular in plan view and has an insertion hole 38h in its center through which the shaft portion 51a of the pressing shaft 51 is inserted. The lower end of the pressing shaft 51 is formed with an expanded diameter portion 51b that expands radially outward from the shaft portion 51a. The inner diameter of the insertion hole 38h is larger than the outer diameter of the shaft portion 51a and smaller than the outer diameter of the expanded diameter portion 51b.

Therefore, the bracket plate 38a is supported above the enlarged diameter portion 51b along the shaft portion 51a so as to be relatively movable in the height direction. The mounting member 38b connects the bracket plate 38a and the pressure-receiving plate 33. A plurality of mounting members 38b are arranged at intervals in the circumferential direction on the outer periphery of the bracket plate 38a and the pressure-receiving plate 33. Each mounting member 38b extends in the height direction and is fastened with a screw to the outer periphery of the bracket plate 38a and the outer periphery of the pressure-receiving plate 33, respectively.

Figure 5 is a vertical cross-sectional view of the second plate 30 in Figure 4 lowered so that the abutment plate 31 abuts against the substrate S1. When the pressing shaft 51 is pulled upward during normal operation, when the substrates S1 and S2 are not being pressed, the enlarged diameter portion 15b of the pressing shaft 51 abuts against the bracket plate 38a from below around the insertion hole 38h. With this configuration, the second plate 30 is supported by the pressing shaft 51 via the bracket 38, and is disposed above the first plate 20 with a gap therebetween.

When the pressing shaft 51 is moved downward to press the substrates S1 and S2, the second plate 30 moves downward together with the pressing shaft 51. When the contact plate 31 hits the upper surface of the substrate S1, the downward movement of the second plate 30 is restricted. In this state, when the pressing shaft 51 is further lowered, as shown in FIG. 5, the pressing shaft 51 slides downward within the insertion hole 38h, and the enlarged diameter portion 51b hits the upper surface 33t of the pressure-receiving plate 33. With this configuration, the pressing force of the pressing mechanism 50 is transmitted to the pressure-receiving plate 33 via the pressing shaft 51.

As shown in FIG. 4, the intermediate plate 34 is disposed between the contact plate 31 and the pressure-receiving plate 33. The intermediate plate 34 is disposed on the upper surface of the contact plate 31. The intermediate plate 34 is formed of, for example, metal, resin, ceramics, etc. In this embodiment, the intermediate plate 34 is a metal plate. The intermediate plate 34 holds a plurality of dispersion members 35. The plurality of dispersion members 35 are disposed between the pressure-receiving plate 33 and the intermediate plate 34.

Figure 6 is a perspective view showing the intermediate plate 34 and the multiple dispersion members 35. Figure 7 is a plan view of Figure 6. As shown in Figures 4, 6, and 7, the multiple dispersion members 35 are arranged on the upper surface of the intermediate plate 34. The dispersion members 35 are formed of, for example, metal, resin, ceramic, etc. The multiple dispersion members 35 include a central dispersion member 36 and multiple peripheral dispersion members 37. The central dispersion member 36 is arranged corresponding to the central parts of the first plate 20 and the second plate 30. The central dispersion member 36 is arranged at a position overlapping with the pressing shaft 51 when viewed from above. The central dispersion member 36 is circular in plan view and has a predetermined thickness in the height direction. The central dispersion member 36 has, for example, approximately the same outer diameter as the enlarged diameter part 51b of the pressing shaft 51.

The multiple peripheral dispersion members 37 are arranged to surround the central dispersion member 36. Each of the multiple peripheral dispersion members 37 is circular in plan view and has the same thickness as the central dispersion member 36 in the height direction. Each of the multiple peripheral dispersion members 37 has a smaller outer diameter than the central dispersion member 36. In other words, the outer diameter dimension of the central dispersion member 36 is larger than the outer diameter dimension of the peripheral dispersion member 37. Since the outer diameter dimension of the central dispersion member 36 is larger than the outer diameter dimension of the peripheral dispersion member 37, the number of peripheral dispersion members 37 installed can be reduced. The outer diameter dimension of the central dispersion member 36 may be the same as the outer diameter dimension of the peripheral dispersion member 37. In other words, the outer diameter dimension of the central dispersion member 36 may be set to be greater than or equal to the outer diameter dimension of the peripheral dispersion member 37.

In this embodiment, the multiple outer peripheral dispersion members 37 include multiple first outer peripheral dispersion members 37A and multiple second outer peripheral dispersion members 37B. The multiple first outer peripheral dispersion members 37A are arranged at intervals in the circumferential direction around the center of the intermediate plate 34 so as to surround the central dispersion member 36. The multiple first outer peripheral dispersion members 37A are arranged on the outer periphery of the intermediate plate 34. In this embodiment, the multiple first outer peripheral dispersion members 37A, for example six pieces, are arranged at equal intervals in the circumferential direction of the intermediate plate 34.

The multiple second outer peripheral dispersion members 37B are arranged between the multiple first outer peripheral dispersion members 37A and the central dispersion member 36 in the radial direction of the intermediate plate 34. The multiple second outer peripheral dispersion members 37B are arranged at intervals in the circumferential direction around the center of the intermediate plate 34 so as to surround the central dispersion member 36. In this embodiment, the multiple second outer peripheral dispersion members 37B, for example three in number, are arranged at equal intervals in the circumferential direction of the intermediate plate 34. The multiple second outer peripheral dispersion members 37B are arranged at different positions in the circumferential direction with respect to the multiple first outer peripheral dispersion members 37A.

The pressing force of the pressing mechanism 50 is transmitted from the pressure-receiving plate 33 through the multiple dispersion members 35, the intermediate plate 34, and the contact plate 31 to the multiple substrates S1 and S2. The multiple dispersion members 35 include a central dispersion member 36 and multiple outer peripheral dispersion members 37, so that the pressing force of the pressing mechanism 50 is transmitted more uniformly to the intermediate plate 34. By providing the multiple outer peripheral dispersion members 37, which are the central dispersion member 36, the multiple second outer peripheral dispersion members 37B arranged on the outer peripheral side thereof, and the multiple first outer peripheral dispersion members 37A arranged on the outer peripheral side thereof, the pressing force applied to the joint surfaces of the multiple substrates S1 and S2 can be further uniformed. In particular, by providing the central dispersion member 36, it is easy to uniformize the pressing force applied to the joint surfaces of the multiple substrates S1 and S2. In addition, by pressing a wide range with the central dispersion member 36, which has a large outer diameter, and pressing the outer periphery with the multiple outer peripheral dispersion members 37, the pressing force on the entire substrates S1 and S2 can be well adjusted.

Figure 8 is a plan view showing the positional relationship between the multiple dispersion members 35 of the second plate 30 and the support columns 24 of the first plate 20. As shown in Figure 8, the central dispersion member 36 of the second plate 30 and the central support column 25 and central support member 27a of the first plate 20 are arranged to overlap when viewed from above. The multiple outer peripheral dispersion members 37 (first outer peripheral dispersion member 37A, second outer peripheral dispersion member 37B) of the second plate 30 are arranged at different positions relative to the outer peripheral support column 26 and outer peripheral support member 27b of the first plate 20 so as not to overlap when viewed from above. The first outer peripheral dispersion member 37A and the outer peripheral support column 26 are arranged at the same position in the radial direction and at different positions in the circumferential direction. The second outer peripheral dispersion member 37B and the outer peripheral support member 27b are arranged at the same position in the radial direction and at different positions in the circumferential direction.

By moving the second plate 30 downward, a pressure force acts on the multiple substrates S1, S2 sandwiched between the first plate 20 and the second plate 30 from the position where the multiple dispersion members 35 are arranged, while a reaction force is received from the position of the multiple support columns 24 supporting the first plate 20. The first plate 20 is arranged below the second plate 30 and is supported by multiple support columns 24 arranged at different positions from the multiple outer peripheral dispersion members 37 when viewed from above. As a result, the multiple substrates S1, S2 are subjected to a pressure force acting from above and a reaction force acting from below at different positions. This makes it possible to prevent the contact plate 31 and the intermediate plate 34 from being deflected by the pressure of the multiple outer peripheral dispersion members 37, and further makes it possible to uniformize the pressure force applied to the joint surfaces between the multiple substrates S1, S2.

Of the multiple supports 24, the central support 25 located in the center of the first plate 20 is positioned so that it overlaps with the central dispersion member 36 when viewed from above. This ensures that the pressure and reaction force are transmitted reliably to the central portions of the multiple substrates S1, S2 sandwiched between the first plate 20 and the second plate 30 by the central dispersion member 36 and the central support 25. This allows the central portions of the multiple substrates S1, S2 to be bonded together more reliably.

Figure 9 is a cross-sectional view showing the mounting structure of each dispersion member 35 to the intermediate plate 34. In this embodiment, as shown in Figure 9, each dispersion member 35 (central dispersion member 36, peripheral dispersion member 37) is removably attached to the intermediate plate 34 by bolts 90. Each dispersion member 35 is fixed to the intermediate plate 34 by, for example, inserting two bolts 90 into bolt insertion holes 34h formed in the intermediate plate 34 and fastening them to female threaded holes 35h formed in each dispersion member 35. Note that the manner in which each dispersion member 35 is fixed to the intermediate plate 34 is not limited to this embodiment, and may be, for example, a form in which a bolt insertion hole is provided in the dispersion member 35, a bolt 90 is inserted from the dispersion member 35 side, and the bolt is fastened to a female threaded hole formed in the intermediate plate 34.

In addition, a shim 39 can be inserted between each dispersion member 35 and the intermediate plate 34. When viewed from above, the shim 39 has the same circular shape as each dispersion member 35 and a predetermined thickness. Each shim 39 is fixed to the intermediate plate 34 together with each dispersion member 35 by a bolt 90. The shim 39 adjusts the unevenness of the thickness of the pressure plate 33, intermediate plate 34, and abutment plate 31 by inserting it between the multiple dispersion members 35 and the intermediate plate 34. In other words, the shim 39 is arranged according to the unevenness of the thickness of the pressure plate 33, intermediate plate 34, and abutment plate 31. The shim 39 may be arranged only in some of the dispersion members 35 according to the unevenness of the thickness of the pressure plate 33, intermediate plate 34, and abutment plate 31. The number and thickness of the shims 39 may be different according to the unevenness of the thickness of the pressure plate 33, intermediate plate 34, and abutment plate 31.

Figure 10 is a diagram showing the movably mounted first outer peripheral dispersion member 37A, and is a cross-sectional view taken along the B-B section of Figure 7. As shown in Figures 7 and 10, of the multiple dispersion members 35, the first outer peripheral dispersion member 37A can change its mounting position relative to the intermediate plate 34. An attachment groove 34m extending in the radial direction of the intermediate plate 34 is formed on the upper surface of the intermediate plate 34. Each first outer peripheral dispersion member 37A is disposed within each attachment groove 34m, and its position in the direction in which the attachment groove 34m extends can be adjusted. Each first outer peripheral dispersion member 37A can change its mounting position in the radial direction of the intermediate plate 34 along the attachment groove 34m.

The intermediate plate 34 has a plurality of bolt insertion holes 34h spaced apart in the radial direction of the mounting groove 34m. The first outer periphery dispersion member 37A is fastened to the female screw hole 35h formed in the dispersion member 35 by inserting a bolt 90 into one of the bolt insertion holes 34h provided in the mounting groove 34m. In this embodiment, the mounting position of the first outer periphery dispersion member 37A is changeable, but the mounting position of the second outer periphery dispersion member 37B may be changeable. In addition, the mounting position of the first outer periphery dispersion member 37A is changeable in the radial direction, but it may be in another direction, such as the circumferential direction of the intermediate plate 34.

As shown in FIG. 4 and FIG. 5, the pressing mechanism 50 presses the substrate S1 toward the substrate S2 side (the first plate 20 side) when the second plate 30 is lowered and the substrate S1 and the substrate S2 are attached. The pressing mechanism 50 includes a pressing shaft 51 and a driving unit (not shown) for driving the pressing shaft 51. The pressing shaft 51 is disposed in the center of the pressure-receiving plate 33 when viewed from above, and applies a load (pressing force) to the center of the pressure-receiving plate 33. The pressing shaft 51 is inserted into the chamber 10 through the through-hole 10h. The pressing shafts 51 are each a rod-shaped body with a circular cross section, and are formed of an outer diameter and a material (e.g., metal, resin, ceramics, etc.) that does not deform or is suppressed from deforming under the applied load. The driving unit (not shown) drives the pressing shaft 51. For example, an air cylinder device, a hydraulic cylinder device, a ball screw mechanism using an electric rotary motor, etc. are used as the driving unit.

The drive unit is controlled by a control unit (not shown). The load applied to the pressing shaft 51 by the drive unit (not shown) and the drive timing for applying the load are controlled by the control unit (not shown) based on a preset program or the like. In addition, some or all of the operation of the drive unit (not shown) may be performed by an operator.

The second plate 30 is configured to be movable downward by the pressing mechanism 50. The multiple substrates S1, S2 are sandwiched and pressed between the second plate 30, which is moved downward by the pressing mechanism 50, and the first plate 20. The pressing force of the pressing mechanism 50 is transmitted from the pressure-receiving plate 33 through the multiple dispersion members 35, the intermediate plate 34, and the abutment plate 31 to the multiple substrates S1, S2. Since the multiple dispersion members 35 include a central dispersion member 36 and multiple peripheral dispersion members 37, the pressing force of the pressing mechanism 50 is transmitted more uniformly not only to the peripheral portion of the abutment plate 31 but also to the center.

Furthermore, by inserting shims 39 between the multiple dispersion members 35 and the intermediate plate 34, it is possible to adjust unevenness in the thickness of the pressure plate 33, intermediate plate 34, and abutment plate 31. In addition, since the multiple dispersion members 35 can be attached to the intermediate plate 34 at different positions, it is possible to appropriately adjust the distribution of the pressing force by the pressing mechanism 50. Furthermore, since the attachment position of the first outer peripheral dispersion member 37A can be changed along the attachment groove 34m of the intermediate plate 34, it is possible to easily adjust the attachment position of the first outer peripheral dispersion member 37A.

<Substrate attachment method>
Next, a substrate bonding method according to this embodiment will be described. FIG. 11 is a flow chart showing an example of the substrate bonding method according to this embodiment. This substrate bonding method is executed, for example, by instructions from a control unit (not shown). FIG. 12 to FIG. 15 are process diagrams showing an example of the operation of the substrate bonding apparatus 100. In these process diagrams, the description is simplified so that the movement of each unit can be easily understood. The following will be described with reference to the flow chart of FIG. 11.

First, the gate valve 12 of the chamber 10 is opened and the substrate S is loaded (step S01). As shown in FIG. 12, the control unit (not shown) drives the drive unit (not shown) to raise the gate valve 12 and open the opening 11. Next, the transfer device (not shown) loads the multiple substrates S1 and S2 that have been stacked in advance with an adhesive layer F interposed therebetween in the previous process into the chamber 10. At this time, the second plate 30 is spaced upward from the first plate 20. The transfer device (not shown) enters the chamber 10 through the opening 11 while holding the substrates S1 and S2, and places the stacked substrates S1 and S2 on the base plate 23 of the first plate 20 (step S02).

Next, as shown in FIG. 13, the gate valve 12 is closed, and the chamber 10 is evacuated using a suction device (not shown), creating a vacuum atmosphere in the chamber 10 (step S03).

Then, as shown in FIG. 14, the control unit (not shown) drives the drive unit (not shown) to lower the second plate 30 together with the pressing shaft 51, and abuts the abutment plate 31 of the second plate 30 against the substrates S1 and S2 supported on the base plate 23 of the first plate 20 (step S04). Next, in this state, the substrates S1 and S2 are heated for a predetermined time by the first heater 22 and the second heater (not shown) to perform a preheating process. The preheating process is performed by setting the temperature of the first heater 22 and the second heater (not shown) to, for example, 150°C to 250°C.

Next, a load is applied by the pressing shaft 51 to bond the substrates S1 and S2 together (step S05). The control unit (not shown) drives the drive unit (not shown) in a vacuum atmosphere to lower the second plate 30 together with the pressing shaft 51, and presses the substrates S1 and S2 between the first plate 20 and the second plate 30 to bond the substrates S1 and S2 together. At this time, heating by the first heater 22 and the second heater (not shown) may be continued to keep the first plate 20 and the second plate 30 at a predetermined temperature. The substrates S1 and S2 are bonded together by melting the adhesive layer F by heat, and the substrates S1 and S2 are firmly bonded together by the pressure from the substrate S1 side by the second plate 30.

After the attachment of the substrates S1 and S2 is completed, as shown in FIG. 15, the drive unit (not shown) is driven to raise the second plate 30 together with the pressing shaft 51 (step S06). After that, a valve (not shown) is opened to open the chamber 10 to the atmosphere, or a specified gas is supplied into the chamber 10 to purge the chamber 10 (step S07). Examples of the specified gas include nitrogen gas and dry air.

Next, as shown in FIG. 16, the gate valve 12 is opened to unload the substrate S from the chamber 10 (step S08). After the gate valve 12 is raised to open the opening 11, the substrate S placed on the support plate 21 of the first plate 20 is unloaded from the chamber 10 by a transport device (not shown). Thereafter, the control unit (not shown) closes the gate valve 12 to end the series of processes.

As described above, the substrate bonding device 100 according to this embodiment includes a plurality of dispersion members 35 arranged between the pressure-receiving plate 33 and the intermediate plate 34, so that the pressing force of the pressing mechanism 50 is transmitted from the pressure-receiving plate 33 through the plurality of dispersion members 35, via the intermediate plate 34, and the abutment plate 31 to the plurality of substrates S1 and S2. Since the plurality of dispersion members 35 include a central dispersion member 36 and a plurality of peripheral dispersion members 37, the pressing force of the pressing mechanism 50 is transmitted more uniformly to the intermediate plate 34. Therefore, according to the substrate bonding device 100 according to this embodiment, it is possible to further uniformize the pressing force applied to the bonding surfaces between the plurality of substrates S1 and S2.

Although the embodiment has been described above, the present invention is not limited to the above description, and various modifications are possible within the scope of the present invention. For example, in the above embodiment, the second plate 30 arranged on the upper side is moved by the pressing mechanism 50, and the second plate 30 is provided with an intermediate plate 34 and multiple dispersion members 35, but the present invention is not limited to this. For example, the first plate 20 arranged on the lower side may be moved by the pressing mechanism 50, and the first plate 20 may be provided with an intermediate plate 34 and multiple dispersion members 35.

In addition, in the above embodiment, specific configurations and arrangements of the multiple dispersion members 35 and multiple support columns 24 are described as examples, but this is not limited to these and other configurations may be used as appropriate.

In the above embodiment, the substrates S1 and S2, which have been temporarily bonded together via the adhesive layer F in the previous process, are bonded by the substrate bonding device 100, but this is not limiting. For example, the substrates S1 and S2 may be sequentially loaded into the substrate bonding device 100, and after the substrates S1 and S2 are bonded together via the adhesive layer F, the substrates S1 and S2 may be pressed between the first plate 20 and the second plate 30 to bond the substrates S1 and S2.

DESCRIPTION OF SYMBOLS 10...Chamber 20...First plate 24...Support 30...Second plate 31...Abutment plate 33...Pressure plate 34...Intermediate plate 34m...Mounting groove 35...Dispersion member 36...Central dispersion member 37...Outer peripheral dispersion member 37A...First outer peripheral dispersion member 37B...Second outer peripheral dispersion member 39...Shim 50...Pressing mechanism 51...Pressing shaft 90...Bolt 100...Substrate bonding device 202...First outer peripheral dispersion member S, S1, S2...Substrate

Claims (12)

A first plate and a second plate that sandwich a plurality of substrates in a stacked state;
a pressing mechanism that presses one of the first plate and the second plate against the other,
At least one of the first plate and the second plate is
a contact plate that contacts the substrate;
a pressure-receiving plate disposed on the pressing mechanism side and receiving a pressing force from the pressing mechanism;
an intermediate plate disposed between the contact plate and the pressure plate;
a plurality of dispersion members disposed between the pressure plate and the intermediate plate;
The plurality of dispersion members include
a central dispersion member disposed in correspondence with central portions of the first plate and the second plate and fixed to the intermediate plate ;
a plurality of peripheral dispersion members disposed around the central dispersion member and fixed to the intermediate plate ;
A substrate bonding apparatus , wherein an outer diameter dimension of the central dispersion member is equal to or larger than an outer diameter dimension of the peripheral dispersion member . The substrate attachment device according to claim 1, wherein the plurality of dispersion members are removably attached to the intermediate plate, and a shim can be inserted between the dispersion members and the intermediate plate. The substrate bonding apparatus according to claim 2 , wherein the positions at which the plurality of dispersion members are fixed to the intermediate plate are changeable. The intermediate plate includes a mounting groove extending in a radial direction of the intermediate plate,
4. The substrate bonding device according to claim 2, wherein the outer periphery dispersion member is attached to the attachment groove, and the attachment position of the outer periphery dispersion member in the radial direction of the intermediate plate is changeable along the attachment groove. The substrate attachment device according to claim 4, wherein the outer peripheral dispersion member is attached by a bolt through one of a plurality of holes provided in the attachment groove. The plurality of peripheral dispersion members are
a plurality of first peripheral dispersion members arranged at intervals so as to surround the central dispersion member;
6. The substrate bonding device according to claim 1, further comprising: a plurality of second outer peripheral dispersion members arranged at intervals between the plurality of first outer peripheral dispersion members and the central dispersion member so as to surround the central dispersion member. The substrate bonding device according to claim 1 , wherein the pressing mechanism includes a pressing shaft arranged corresponding to the central dispersion member. the second plate includes the contact plate, the pressure-receiving plate, the intermediate plate, and the plurality of dispersion members, and is movable downward by the pressing mechanism;
the first plate is disposed below the second plate and is supported by a plurality of columns;
8. The substrate bonding device according to claim 1, wherein each of the plurality of support columns is disposed at a different position from the plurality of outer periphery dispersion members when viewed from above. The substrate bonding device according to claim 8 , wherein a central support pillar arranged at a center of the first plate among the plurality of support pillars is arranged at a position overlapping with the central dispersion member when viewed from above. the abutment plate is a ceramic plate,
The substrate bonding device according to claim 1 , wherein the pressure-receiving plate and the intermediate plate are metal plates. 11. The substrate bonding device according to claim 1, wherein the first plate and the second plate have contact surfaces that come into contact with the substrate with high flatness and small surface roughness. A method for bonding a plurality of substrates by sandwiching the substrates between a first plate and a second plate in a stacked state, comprising the steps of:
disposing the plurality of substrates in a stacked state between the first plate and the second plate;
pressing one of the first plate and the second plate toward the other to apply a pressing force to the plurality of substrates between the first plate and the second plate;
The pressing force is
the pressure is applied to a first region corresponding to a center portion of the plurality of substrates by a central dispersion member fixed to an intermediate plate disposed between a contact plate that contacts the substrates and a pressure-receiving plate that receives the pressing force ,
a plurality of second regions corresponding to the outer periphery of the plurality of substrates are provided by a plurality of outer periphery dispersion members fixed to the intermediate plate and arranged so as to surround the central dispersion member ;
A substrate bonding method , wherein an outer diameter dimension of the first region to which the pressing force is applied is equal to or greater than an outer diameter dimension of the second region to which the pressing force is applied.

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