JP2019031018A - Thermoforming apparatus and thermoforming method - Google Patents

Abstract

To make it possible to eliminate necessity for confirmation of mutual synchronization by eliminating interference between an upper heating plate and a lower base material and to reduce labor and time required for confirmation work.SOLUTION: The thermoforming apparatus includes: an upper frame 10; a lower frame 20 capable of housing a molding base material U; a heating plate 7 disposed in the upper frame 10; a lower base material 8 provided in the lower frame 20; an upper bar 3 fixed to the heating plate 7 and provided so as to be relatively movable in the vertical direction with respect to the upper frame 10; and a lower bar 4 fixed to the lower base material 8 and provided so as to be relatively movable in the vertical direction with respect to the lower frame 20. A sheet S is pinched by a lower end of a frame peripheral edge portion of the upper frame and an upper end of a frame peripheral edge portion of the lower frame 20. In a state in which an upper supporting portion and a lower supporting portion are in contact with each other in the vertical direction, a heating plate 7 is separated from the molding base material U held by the lower base material 8. In a space between the heating plate 7 and the lower base material 8, at least one of pressurizing means which pressurizes from the heating plate side and decompression means which suctions from the lower base material is provided.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a thermoforming apparatus and a thermoforming method.

  Generally, as an apparatus for adhering a sheet to the outer surface of a molding substrate, for example, a vacuum press lamination molding apparatus that performs radiant heating in upper and lower chambers as shown in Patent Document 1, and a thermoforming apparatus that performs hot plate heating. A configuration in which the sheet gripper moves is known.

  In Patent Document 1, a base having a base material holding part capable of holding a base material, a sheet gripping part that is provided in the lower frame, grips the outer peripheral edge of the sheet over the entire circumference without gaps, and a frame bottom part A sealing frame that protrudes from the base installation surface and surrounds the entire circumference of the base material holding part in a plan view, communicates with the space in the lower frame, and passes through at least the bottom of the frame inside the sealing frame. The sheet gripping portion is provided so as to be vertically movable between a rising position where the sheet is heated by the hot plate and a descending position closely contacting the upper end surface of the sealing frame, and is sealed with the base material holding portion. The upper surface in the sealed frame between the frame and the frame is provided at a position lower than the outer peripheral upper edge of the base material holding portion and the upper end surface of the sealed frame, and the vacuum vent is described for a configuration that opens to the upper surface in the sealed frame. ing.

Japanese Patent No. 5957131

  However, in the thermoforming apparatus of Patent Document 1 described above, it is necessary to confirm and adjust the timing of synchronization so that the upper heating plate and the lower substrate do not interfere with each other, and complicated control is required. There was room for improvement.

  The present invention has been made in view of the above circumstances, and by eliminating the interference between the upper heating plate and the lower base material, it is not necessary to confirm the synchronization of both, thereby reducing labor and time associated with the confirmation work. An object of the present invention is to provide a thermoforming apparatus and a thermoforming method.

  In order to achieve the above object, a thermoforming apparatus according to the present invention is a thermoforming apparatus that molds a sheet softened by heating a forming base material or adheres the sheet to the forming base material. A lower frame having a space that can form a sealed space between the upper frame and the upper frame and accommodate the molding substrate, a hot plate disposed in the upper frame, and A lower base that is provided and holds the molding base from below; an upper support that is fixed to the hot plate and is movable relative to the upper frame in the vertical direction; and the lower base A lower support portion that is fixed and is movable relative to the lower frame in the vertical direction, and a lower end of a frame peripheral portion of the upper frame, and an upper end of a frame peripheral portion of the lower frame In the state where the sheet is sandwiched by the upper support part and the lower support part in the vertical direction, A plate is spaced apart from the molding substrate held by the lower substrate, and in the space between the hot plate and the lower substrate, pressurizing means for compressing air from the hot plate side, and the lower substrate It is characterized in that at least one of the decompression means for sucking from is provided.

  Moreover, the thermoforming method according to the present invention uses the above-described thermoforming apparatus to mold a softened sheet by heating the forming substrate, or to bond the sheet to the forming substrate. A thermoforming method for holding the forming base material in the lower frame with the lower base material, and bringing the upper frame and the lower frame into close contact with each other, and a lower end of a peripheral edge portion of the upper frame; A step of sandwiching the sheet by an upper end of a frame peripheral portion of the lower frame, and a step of heating the sheet by the hot plate in a state where the upper support portion and the lower support portion are in contact with each other in the vertical direction And when the sheet is softened, in the space between the hot plate and the lower substrate, the sheet is formed on the molding substrate side using at least one of the pressurizing unit and the depressurizing unit. And a step of moving toward the surface.

According to the thermoforming apparatus of the present invention, the upper frame and the lower frame are brought into close contact with each other, the sheet is sandwiched between the lower end of the frame peripheral portion of the upper frame and the upper end of the frame peripheral portion of the lower frame, When the sheet is heated by the hot plate in a state where the lower support portion is in contact with the up and down direction, and when the sheet is softened, the pressurizing means and the depressurization are performed in the space between the hot plate and the lower base material. By using at least one of the means, the sheet is moved toward the forming substrate, whereby the sheet can be molded or adhered to the forming substrate.
In the present invention, it is possible to always maintain a certain clearance between the hot plate and the molded base material held by the lower base material in a state where the upper support portion and the lower support portion are in contact with each other in the vertical direction. . Therefore, the hot plate and the molding substrate held by the lower substrate do not interfere with each other, and the clearance can be reduced to the thickness of the sheet, so that the printing position accuracy can be improved. .

  According to the thermoforming apparatus and the thermoforming method of the present invention, by eliminating the interference between the hot plate and the lower base material, it is not necessary to confirm the synchronization of both, and it is possible to reduce labor and time associated with the confirmation work. it can.

It is a longitudinal cross-sectional view which shows the structure of the thermoforming apparatus by embodiment of this invention, Comprising: It is a figure which shows a 1st process and a 2nd process. It is the AA arrow directional view shown in FIG. 1, Comprising: It is the top view which looked at the lower frame from upper direction. It is the longitudinal cross-sectional view corresponding to FIG. 1 which showed the operation | work process of the thermoforming method using a thermoforming apparatus, Comprising: It is a figure which shows a 3rd process. It is the longitudinal cross-sectional view corresponding to FIG. 1 which showed the operation | work process of the thermoforming method using a thermoforming apparatus, Comprising: It is a figure which shows a 4th process. It is the longitudinal cross-sectional view corresponding to FIG. 1 which showed the operation | work process of the thermoforming method using a thermoforming apparatus, Comprising: It is a figure which shows a 4th process.

  Hereinafter, embodiments of a thermoforming apparatus and a thermoforming method according to the present invention will be described with reference to the drawings. The drawings used in the following description are schematic, and the length, width, thickness ratio, and the like are not necessarily the same as the actual ones, and can be changed as appropriate.

  As shown in FIG. 1, the thermoforming apparatus 1 of the present embodiment employs a hot plate heating method, and a sheet S heated and softened by the hot plate 7 is disposed in the chamber 2 </ b> A of the lower frame 20. It is an apparatus for coating the surface of the molded base material U. FIG. 1 shows a state in which the sheet S is set in the thermoforming apparatus 1, and shows a state before the sheet S is heated and before the sheet S is coated on the forming substrate U.

Here, examples of the thermoformed product include parts having front and back surfaces such as automobile parts, and the like, by adsorbing and covering the sheet S softened by heating on the surface of the resin molded base U. This is a thermoformed product. The molding substrate U of the present embodiment has a shape that forms a top cylinder.
A direction in which the upper frame 10 and the lower frame 20 are sealed and opened is referred to as a device axis, and the device axis coincides with the vertical direction.

The thermoforming apparatus 1 is provided in the lower frame 20, the upper frame 10, the lower frame 20 having a space (chamber 2 </ b> A) in which the molding substrate U can be accommodated, the hot plate 7 disposed in the upper frame 10, and the lower frame 20. The lower base member 8, the upper bar 3 (upper support portion) that is fixed to the hot plate and is movable relative to the upper frame 10 in the vertical direction, and the lower frame fixed to the lower base member 8. 20 and a lower bar 4 (lower support portion) provided so as to be movable relative to the vertical direction.
Further, the thermoforming apparatus 1 has an upper table 5 for fixing the upper frame 10 and a lower table 6 for fixing the lower frame 20, and the upper table 5 is lifted with respect to the lower table 6 by a lifting means (not shown). It can be moved up and down.

The upper table 5 is fixed to the upper end of the column 51 by a fixing nut 52, and the upper frame 10 is fixed by a first fixing bolt 53 that protrudes downward from the table lower surface 5a. The column 51 is supported so as to be vertically movable with respect to the lower table 6 by a moving means (not shown). The support column 51 is located on the outside so as not to interfere with the upper frame 10, the lower frame 20, the upper bar 3, and the lower bar 4 in plan view. The lower frame 20 is fixed to the lower table 6 by a second fixing bolt 61 on the table upper surface 6a side. Further, the lower table 6 incorporates a lifting device 44 to be described later at a central portion in plan view.
The upper table 5 to which the upper frame 10 is fixed has a position (sealing position) where the upper frame 10 contacts the lower frame 20 fixed to the lower table 6 to seal the inside of the upper and lower frames 10 and 20, The upper frame 10 moves upward with respect to the lower frame 20 and is moved between positions where the upper and lower frames 10 and 20 are opened (open position).

  The distance between the lower frame 20 and the upper frame 10 when the upper and lower frames are opened is such that the molding substrate U can be taken in and out of the chamber 2 </ b> A in the lower frame 20, and the sheet S is placed between both the frames 10 and 20. It is set as the dimension which can be arrange | positioned. For example, although not illustrated in the present embodiment, when the lower frame 20 is configured to be slidable laterally with respect to the upper frame 10 when viewed from above, the upper frame 10 when viewed from above. The lower frame can be arranged at a position deviated from the position, and the molding substrate U can be taken in and out of the chamber 2A of the lower frame 20 at that position. Therefore, the distance between the lower frame 20 and the upper frame 10 when the upper and lower frames 10 and 20 are opened may be a dimension that allows the sheet S to be disposed between the frames 10 and 20.

  The upper bar 3 is provided as a part of the upper support 30 that is movable in the vertical direction with respect to the upper table 5 and the upper frame 10. That is, as shown in FIG. 2, the upper support 30 includes a rectangular flat plate-like upper base 31 having an outer shape larger than that of the upper frame 10 in a plan view and four corners of the lower surface 31 a of the upper base 31. And the upper bar 3 provided at the top. The lower end surface 3a of the upper bar 3 is a plane orthogonal to the apparatus axis.

A through hole 32 through which the first bolt 53 is slidably inserted is formed in the central portion of the upper base 31. A spring member 33 that biases the upper support 30 downward is provided between the upper base 31 and the upper table 5. That is, the upper end of the spring member 33 is supported by the table lower surface 5 a of the upper table 5, and the lower end thereof supports the upper surface 31 b of the upper base 31.
Further, a heat plate 7 disposed on the inner side of the upper frame 10 is fixed to the lower surface 41 b of the upper base 31 via the first connecting rod 71.

The lower bar 4 is provided as a part of a lower support 40 that can move in the vertical direction with respect to the lower table 6 and the lower frame 20. That is, as shown in FIG. 2, the lower support 40 includes a rectangular flat plate-like lower base 41 having a larger outer shape than the lower frame 20 in a plan view, and an upper surface 41 a of the lower base 41. And the lower bar 4 provided at the bottom. The upper end surface 4a of the lower bar 4 is a plane orthogonal to the apparatus axis.
The lower bar 4 is provided at a position coaxial with the upper bar 3 in a top view. That is, the upper bar 3 and the lower bar 4 are close to and away from each other, and the lower end surface 3a and the upper end surface 4a can contact each other in the vertical direction.

In the central portion of the lower surface 41b of the lower base 41, an elevating device 44 for driving the lower support 40 to move up and down is provided. The lifting device 44 includes a cylinder 44A provided on the lower table 6 and a rod 44B extending upward from the cylinder 44A. The upper end of the rod 44B is fixed to the lower base 41.
Further, the lower base material 8 disposed on the inner side of the lower frame 20 is fixed to the upper surface 41 a of the lower base 41 via the second connecting rod 81.

  The upper frame 10 is a casing of the thermoforming apparatus 1 and includes a frame top wall portion 11 and a frame peripheral wall portion 12. The frame top wall 11 is formed with an insertion hole 11a through which the first connecting rod 71 is slidably inserted in an airtight state. A heat plate 7 is disposed in the space inside the upper frame 10. The height of the frame peripheral wall portion 12 (the internal height of the upper frame 10) is set to be larger than the plate thickness of the hot plate 7. That is, the hot plate 7 is movable in the vertical direction within the range of the height of the frame peripheral wall portion 12.

  The hot plate 7 has a flat plate shape having a smooth heating surface 7a and is formed in the same shape as the lower base material 8 in the lower frame 20 described later in plan view. And since the heat plate 7 is being fixed to the upper support body 30, it is provided so that it can move up and down with the upper support body 30, and it moves to the direction which approaches / separates with respect to the lower base material 8 arrange | positioned below. . The heating plate 7 has a heating surface 7 a slightly above the lower end 12 a of the frame peripheral wall portion 12 of the upper frame 10 at the lowermost position. That is, in a state where the sheet S is set between the upper frame 10 and the lower frame 20, the sheet S does not contact the heating surface 7a.

  A plurality of heaters (not shown) are provided on the upper surface side of the hot plate 7. The hot plate 7 is formed with a plurality of ventilation holes (not shown) that open to the heating surface 7a at predetermined intervals. Each of these vent holes is connected to a vacuum tank (not shown) provided with a vacuum pump for vacuum suction on the heating surface 7a side, and a pressurized tank (not shown) for storing compressed air by a compressor.

  The lower frame 20 is a casing of the thermoforming apparatus 1 and includes a frame bottom portion 21 and a frame peripheral wall portion 22. The frame bottom portion 21 is formed with an insertion hole 21a through which the second connecting rod 81 is slidably inserted in an airtight state. The lower base material 8 is disposed in the chamber 2 </ b> A of the lower frame 20. The height of the frame peripheral wall portion 22 (the internal height of the lower frame 20) is set to be larger than the plate thickness of the lower base material 8. That is, the lower base material 8 can move in the vertical direction within the range of the height h <b> 2 of the frame peripheral wall portion 22.

The lower base material 8 holds the molding base material U from below, is fixed to the upper end of the second connecting rod 81, and the second connecting rod 81 slides in an airtight manner with respect to the frame bottom 21 of the lower frame 20. It is inserted freely. The lower base material 8 is provided such that the outer peripheral edge 8a is in close contact with the inner peripheral surface 22b of the frame peripheral wall portion 22 of the lower frame 20 and is movable up and down with respect to the frame peripheral wall portion 22 by driving of the lifting device 44. Yes.
And since the lower base material 8 is being fixed to the lower support body 40, it can move up and down with the lower support body 40, and moves to the direction which approaches / separates with respect to the hot platen 7 arrange | positioned upwards. In the lower base material 8, the held molding base material U is located slightly below the upper end 22 a of the frame peripheral wall portion 22 of the lower frame 20 at the lowermost position. That is, in a state where the sheet S is set between the upper frame 10 and the lower frame 20, the sheet S does not come into contact with the forming substrate U.
In addition, a cutout portion 8b is formed on the outer peripheral edge of the lower surface of the lower base member 8 with an interval in the circumferential direction.

  The frame peripheral wall portion 22 of the lower frame 20 is provided with a stopper 82 that engages with the cutout portion 8 b of the lower base material 8 and can protrude toward the center of the lower frame 20. The stopper 82 is fixed to the tip of the cylinder 83 and is moved forward and backward in the lower frame 20 by driving the cylinder 83. When the stopper 82 is in a position in contact with the frame peripheral wall portion 22 side, the downward movement of the lower base material 8 is restricted by engaging with the notch portion 8b. Further, as shown in FIGS. 4 and 5, the stopper 82 is protruded so as to be separated from the frame peripheral wall portion 22 at an appropriate timing when the lower substrate 8 is pushed upward, and the lower surface 8 c side of the lower substrate 8. The lower base material 8 is regulated from being lowered by being positioned in the position.

  The frame peripheral wall portion 12 of the upper frame 10 and the frame peripheral wall portion 22 of the lower frame 20 have the same outer shape in plan view, and the lower end 12a of each frame peripheral wall portion 12 and the upper ends 22a of the frame peripheral wall portion 22 are airtight. The inside of the upper frame 10 and the lower frame 20 is sealed when they are in close contact with each other. At the time of molding, the sheet S is sandwiched between the upper frame 10 and the lower frame 20 with no gap between the upper frame 10 and the lower frame 20 without any slack.

As the molding substrate U, for example, a thermoplastic resin such as a polypropylene resin or a polyethylene resin of a molded product can be adopted, or a material to which an adhesive layer can be applied such as a thermosetting resin, iron, stone, or the like can be adopted. It is possible and is not limited to these materials.
Moreover, the shape of the molding base U is not particularly limited, but the height dimension of the molding base U is set smaller than the height dimension of the lower frame 20 above the lower base 8.

  The sheet S is a known multilayer sheet having, for example, a printing layer and a protective film or carrier film provided on the front side of the printing layer, and an adhesive layer provided on the back side of the printing layer. The material of the film or layer is heated by coming into contact with the heating surface 7a of the hot plate 7, has flexibility and adhesiveness, and can be coated on the surface of the molding substrate U when cooled. If it is, it will not be restrict | limited in particular.

  In the thermoforming apparatus 1, a vacuum vent (not shown) that communicates with the chamber 2 </ b> A in the lower frame 20 and penetrates the lower frame 20 is formed. A vacuum pump or the like (not shown) is connected to the vacuum vent. The number of vacuum vents is not particularly limited, but at least one vacuum vent may be formed.

  In the thermoforming apparatus 1 configured in this manner, the sheet S softened by being heated by the hot plate 7 is molded with respect to the forming substrate U accommodated in the chamber 2A, or the forming substrate is formed. The sheet S can be adhered to the surface of U.

  Next, a thermoforming method using the thermoforming apparatus 1 will be described. The thermoforming method of the present embodiment is a method for forming a sheet S that has been softened by heating with respect to the forming substrate U, or bonding the sheet S to the forming substrate U. Specifically, the thermoforming method of the present embodiment has at least the steps described below.

  As shown in FIG. 1 and FIG. 3 to FIG. 5, the thermoforming method of the present embodiment includes a first step of holding a forming substrate U with a lower substrate 8 in a lower frame 20, an upper frame 10 and a lower frame. A second step in which the sheet S is sandwiched between the lower end 12a of the frame peripheral portion 12 of the upper frame 10 and the upper end 22a of the frame peripheral portion 22 of the lower frame 20, and the upper bar 3 and the lower bar 4; In the space between the hot plate 7 and the lower base material 8 when the sheet S is softened, and the third step of heating the sheet S with the hot plate 7 in a state where the plate is in contact in the vertical direction. And a fourth step of moving the sheet S toward the forming substrate U using at least one of the decompression means.

(First step)
In the first step, as shown in FIG. 1, the molded base U is held by the lower base 8 and the molded base U is accommodated inside the lower frame 20.
Specifically, first, the upper table 5 is separated upward together with the support column 51 with respect to the lower table 6 by driving means (not shown), and the upper support 30 and the upper frame 10 mounted on the lower side of the upper table 5 are moved upward. Move to. Thereby, the space between the lower frame 20 and the upper frame 10 is opened. And after making the base material 8 hold | maintain to the lower base material 8 of the lower frame 20, the sheet | seat S is arrange | positioned at the upper end 22a of the frame surrounding wall part 22 of the lower frame 20. FIG. For the sheet S arrangement operation, for example, a sheet feeding device (not shown) that can move the sheet S between the lower frame 20 and the upper frame 10 can be adopted. At this time, the lower support body 40 and the lower frame 20 are mounted on the lower table 6, and the rod 44B of the elevating device 44 is in the most contracted position.

(Second step)
In the second step, as shown in FIG. 1, the upper frame 10 and the lower frame 20 are brought into close contact with each other, and the sheet is formed by the lower end 12a of the frame peripheral portion 12 of the upper frame 10 and the upper end 22a of the frame peripheral portion 22 of the lower frame 20. S is pinched.
Specifically, the upper table 5 is lowered to the original predetermined position (initial position), and the sheet S is placed between the lower end 12 a of the frame peripheral wall portion 12 in the upper frame 10 and the upper end 22 a of the frame peripheral wall portion 22 in the lower frame 20. The upper frame 10 and the lower frame 20 are sealed in an airtight state while being sandwiched. And the sheet | seat S is clamped between the upper frame 10 and the lower frame 20 in the tension | tensile_stretched state. At this initial position, the upper support 30 and the hot plate 7 fixed to the upper base 31 of the upper support 30 are in a state of being biased downward by the spring member 33. That is, the upper base 31 is in contact with the upper frame 10 from above. At this time, the lower end surface 3a of the upper bar 3 and the upper end surface 4a of the lower bar 4 are in a separated state.

(Third step)
In the third step, as shown in FIG. 3, the sheet S is heated by the hot plate 7 in a state where the upper bar 3 and the lower bar 4 are in contact with each other in the vertical direction.
Specifically, the lifting device 44 is driven to extend the rod 44B, the lower support 40 is moved upward, and the upper end surface 4a of the lower bar 4 is brought into contact with the lower end surface 3a of the upper bar 3. Furthermore, the lower base material 8 attached to the lower base 41 of the lower support body 40 via the second connecting rod 81 is also raised in the lower frame 20. At this time, the forming substrate U is positioned close to the lower side of the sheet S.

Subsequently, the sheet S is heated by the hot plate 7. At the time of this heating, as a first heating stage, the pressure is reduced by suction from the hot plate 7 on the upper side of the sheet S to be in a vacuum state, and the lower side of the sheet S is in a slightly pressurized air state. Further, as the second heating stage, the pressure is reduced by suction from the hot plate 7 on the upper side of the sheet S to be in a vacuum state, and the lower side of the sheet S is also vacuumed by the pressure reduction. That is, the heating plate 7 is heated by the heater, the vacuum tank (not shown) is opened, and the sheet S is moved to the heating surface 7 a side of the heating plate 7 through a vent hole (not shown) provided in the heating plate 7. Vacuum. Thereby, the sheet S is adsorbed on the heating surface 7a of the hot plate 7, and the adsorbed sheet S is heated.
In this step, it is preferable to start the vacuum suction so that the vacuum tank connected to the vent hole is operated and the upper frame 10 has a predetermined degree of vacuum.

(4th process)
In the fourth step, as shown in FIGS. 4 and 5, when the sheet S is softened, in the first space P <b> 1 between the hot plate 7 and the lower base material 8, at least the pressurizing unit and the depressurizing unit are used. Using one means, the sheet S is moved toward the forming substrate U side.

  Specifically, as shown in FIG. 4, when the rod 44 </ b> B is further extended by driving the elevating device 44, the upper bar 3 and the lower bar 4 are in contact with each other. Let That is, the upper base 31 moves upward against the bias of the spring member 33. Then, inside the upper frame 10 and the lower frame 20, the hot plate 7 and the lower base material 8 rise while maintaining the same clearance.

  Subsequently, the first space P1 on the upper side (the hot plate 7 side) of the sheet S is in a high vacuum state, and the sheet S exhibits flexibility and adhesiveness by heating with the hot plate 7, so The sheet S moves downward and covers the surface of the molding base U by exhausting the air in the first space P1 and releasing the air to the atmosphere. At this time, the raised position of the lower base material 8 is a position above the stopper 82.

  Thereafter, as shown in FIG. 5, the stopper 82 provided on the lower frame 20 is caused to protrude by being driven by the cylinder 83 so as to be positioned in the second space P <b> 2 below the lower base material 8. Thereby, the lower base material 8 will be in the state by which the downward movement was controlled by the stopper 82. That is, in the present embodiment, when pressure is applied from the hot plate 7 using the pressurizing means in the space between the hot plate 7 and the lower base material 8, the lower base 8 and the frame bottom 21 of the lower frame 20 By interposing the stopper 82 therebetween, the lower base material 8 can regulate the movement of the lower frame 20 toward the frame bottom 21 and the distance between the hot plate 7 and the lower base material 8 is kept constant. be able to.

Next, the sheet S can be more closely attached to the forming substrate U by setting the space between the sheet S and the hot plate 7 to be compressed.
Through the above steps, a molded product of the molding substrate U is completed, and a series of thermoforming operations is completed.

  As described above, according to the thermoforming device 1 of the present embodiment, the upper frame 10 and the lower frame 20 are brought into close contact with each other, and the lower end 12a of the frame peripheral portion 12 of the upper frame 10 and the frame peripheral portion 22 of the lower frame 20 are. When the sheet S is sandwiched between the upper bar 22 and the upper bar 3 and the lower bar 4 in the vertical direction, the sheet S is heated by the hot plate 7 and the sheet S is softened. In the space between the hot plate 7 and the lower substrate 8, the sheet S is moved toward the forming substrate U by using at least one of the pressurizing unit and the decompressing unit. Molding can be performed, or the sheet S can be adhered to the molding substrate U.

  In the present embodiment, a constant clearance is always maintained between the hot plate 7 and the molding substrate U held by the lower substrate 8 in a state where the upper bar 3 and the lower bar 4 are in contact with each other in the vertical direction. Can keep. Therefore, the hot plate 7 and the forming base U held by the lower base 8 do not interfere with each other, and the clearance can be reduced to the thickness of the sheet S, thereby improving the printing position accuracy. Can be made.

  As described above, according to the thermoforming apparatus and the thermoforming method of the present embodiment, by eliminating the interference between the hot plate 7 and the lower base material 8, it is not necessary to confirm the synchronization of both, Time can be reduced.

  The embodiments of the thermoforming apparatus and the thermoforming method according to the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the spirit of the present invention.

  For example, in the present embodiment, the upper bar 3 is employed as the upper support portion and the lower bar 4 is employed as the lower support portion. However, it may be a frame shape that is continuous in the circumferential direction. In short, it is only necessary that the hot plate 7 is configured to be separated from the molding substrate U held by the lower substrate 8 in a state where the upper support portion and the lower support portion are in contact with each other in the vertical direction. It is.

  In addition, the upper support 30 is configured to be biased by the spring member 33 as an example with respect to the upper table 5, but is not limited to the spring member 33, and is biased by, for example, hydraulic pressure of a cylinder or the like. It does not matter even if it is the structure which does.

In this embodiment, the thermoforming method for covering and adhering the sheet S to the forming substrate U is targeted. However, not only in the case of such lamination molding, the carrier film of the uppermost layer of the sheet is formed by transfer trimless. It also includes a case where only the decorative layer (corresponding to the sheet of the present invention) is transferred to the molding substrate by peeling.
Furthermore, although the present embodiment is directed to a thermoforming method in which the sheet S softened by the hot plate 7 is coated on the forming substrate U, the present invention is not limited to sheet coating. For example, it is also possible to mold a thermoformed product intended for mold shaping in which the sheet S softened by heating the hot plate 7 is shaped using the lower substrate 8 as a mold. Also in the case of this mold shaping, the thermoforming method can be performed by the same method as the embodiment described above.

Also, the configuration of the upper table 5, the lower table 6, the upper support 30, the lower support 40, the upper frame 10, the lower frame 20, the hot plate 7, and the lower base material 8, such as the shape, dimensions, arrangement, quantity, etc. Can be set.
For example, in the present embodiment, the stopper 82 is provided on the lower frame 20, but the stopper 82 can be omitted.

  In addition, it is possible to appropriately replace the components in the above-described embodiments with known components without departing from the spirit of the present invention.

1 Thermoforming device 3 Upper bar (upper support)
3a Lower end face 4 Lower bar (lower support part)
4a upper end surface 5 upper table 6 lower table 7 hot plate 7a heating surface 8 lower base material 10 upper frame 12 frame peripheral wall portion 12a lower end 20 lower frame 22 frame peripheral wall portion 22a upper end 30 upper support 33 spring member 40 lower support 82 stopper S sheet U Molding base

Claims (2)

A thermoforming apparatus for molding a sheet softened by heating a molding substrate, or for bonding the sheet to the molding substrate,
Upper frame,
A lower frame having a space capable of accommodating the molding substrate by forming a sealed space with the upper frame;
A hot plate disposed in the upper frame;
A lower substrate provided in the lower frame and holding the molding substrate from below;
An upper support portion fixed to the heat plate and provided so as to be relatively movable in the vertical direction with respect to the upper frame;
A lower support portion fixed to the lower base material and provided so as to be relatively movable in the vertical direction with respect to the lower frame;
With
The sheet is sandwiched between the lower end of the frame peripheral edge of the upper frame and the upper end of the frame peripheral edge of the lower frame,
In a state where the upper support portion and the lower support portion are in contact with each other in the vertical direction, the hot plate is separated from the molding base material held by the lower base material,
In the space between the hot plate and the lower base material, at least one of a pressurizing means for compressing air from the hot plate side and a depressurizing means for sucking from the lower base material is provided. Molding equipment. A thermoforming method using the thermoforming apparatus according to claim 1 to mold a sheet softened by heating the forming substrate, or to adhere the sheet to the forming substrate. ,
Holding the molded substrate with the lower substrate in the lower frame;
A step of closely contacting the upper frame and the lower frame, and sandwiching the sheet by a lower end of a frame peripheral portion of the upper frame and an upper end of the frame peripheral portion of the lower frame;
Heating the sheet with the hot plate in a state where the upper support portion and the lower support portion are in contact with each other in a vertical direction;
When the sheet is softened, in the space between the hot plate and the lower substrate, the sheet is directed toward the forming substrate using at least one of the pressurizing unit and the depressurizing unit. The process of moving
A thermoforming method characterized by comprising:

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